CN201230434Y - Heat radiating construction - Google Patents
Heat radiating construction Download PDFInfo
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- CN201230434Y CN201230434Y CNU2008201174072U CN200820117407U CN201230434Y CN 201230434 Y CN201230434 Y CN 201230434Y CN U2008201174072 U CNU2008201174072 U CN U2008201174072U CN 200820117407 U CN200820117407 U CN 200820117407U CN 201230434 Y CN201230434 Y CN 201230434Y
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
Description
技术领域 technical field
本实用新型系为一种散热结构,尤其是一种应用于电子设备机壳之散热结构。The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure applied to electronic equipment casings.
背景技术 Background technique
现阶段之各种电子设备,尤其为计算机主机,因内部安装了各种高速运算功能的外围设备,如CPU、各种适配卡、高容量记忆单元(硬式磁盘驱动器)、DVD、刻录机及电源供应器等,再加上这些计算机主机基本上都是采用似封闭状机壳,而电子组件与接口设备在运算作用时都会产生温度不等之热,特别是执行高速运算之CPU,更是最大之热源产生组件。所以如何将计算机主机内,尤其是CPU运算时所产生之热源有效的排除,实为现阶段待解决之最主要之课题之一,因此业者系在这些计算机主机或电子器物设备中多装设有散热装置,期以利用散热装置来降低计算机主机或电子器物设备内的组件及环境温度。Various electronic devices at this stage, especially computer hosts, are equipped with various peripheral devices with high-speed computing functions, such as CPUs, various adapter cards, high-capacity memory units (hard disk drives), DVDs, recorders and Power supplies, etc., plus these computer hosts are basically closed casings, and electronic components and interface devices will generate heat at different temperatures during calculations, especially CPUs that perform high-speed calculations. The largest heat generating component. Therefore, how to effectively remove the heat source generated in the host computer, especially when the CPU is operating, is one of the most important issues to be solved at this stage. The heat dissipation device is expected to use the heat dissipation device to reduce the temperature of the components and the environment in the computer mainframe or electronic equipment.
请参阅图1所示,系为已知技术之立体组合图,由图中可清楚看出,于已知技术中计算机机壳1内系设有一主机板2,并于该计算机机壳1后侧平面上开设有一出风孔11;主机板2上系置设有一发热源21,发热源21上系设有丨散热风扇22,当散热风扇22运转时可引导气流对发热源21进行冷却散热;因散热风扇22冷却发热源21后之气流持续于发热源21周围循环且距离出风孔11过远,故需于出风孔11上额外增设一通风风扇13将热源排出计算机机壳1。Please refer to shown in Fig. 1, it is the three-dimensional assembly diagram of known technology, can clearly find out from the figure, in known technology, computer case 1 is provided with a motherboard 2, and behind this computer case 1 An air outlet 11 is provided on the side plane; a heat source 21 is arranged on the main board 2, and a cooling fan 22 is arranged on the heating source 21. When the cooling fan 22 is running, the airflow can be guided to cool the heat source 21. Because the airflow after the cooling fan 22 cools the heat source 21 continues to circulate around the heat source 21 and is too far away from the air outlet 11, an additional ventilation fan 13 is required on the air outlet 11 to discharge the heat source from the computer case 1.
已知技术中计算机机壳中因外围设备与电子组件运作所产生的温度,不仅都聚集在计算机主机之机壳内,更因为在同一空间中存在有多数热源,造成热源在该空间内结合形成温室效应,故需额外增设通风风扇迫使内外气流产生对流,但增设通风风扇却需额外消耗计算机本身之电力,使内部供电系统电压不稳定之现象;故已知技术具有下列之缺点:In the known technology, the temperature generated by the operation of peripheral equipment and electronic components in the computer casing not only gathers in the casing of the computer mainframe, but also because there are many heat sources in the same space, causing the heat sources to combine in this space to form Due to the greenhouse effect, it is necessary to add an additional ventilation fan to force the internal and external airflow to convect, but the addition of a ventilation fan requires additional power consumption of the computer itself, making the voltage of the internal power supply system unstable; therefore, the known technology has the following disadvantages:
1.散热效果不佳;1. Poor cooling effect;
2.耗损电力;2. Consumption of electricity;
3.内外对流效果不佳;3. The effect of internal and external convection is not good;
实用新型内容Utility model content
本实用新型目的系于机壳上设置至少一个可自行运转并可对机壳作散热之散热装置,藉以达到省电与散热之效果;The purpose of this utility model is to install at least one cooling device on the casing that can run on its own and can dissipate heat to the casing, so as to achieve the effects of power saving and heat dissipation;
本实用新型目的可通过以下技术方案实现,一种散热结构,其特征在于,所述散热结构系包括:The purpose of the utility model can be achieved through the following technical solutions, a heat dissipation structure, characterized in that the heat dissipation structure system includes:
一机壳,具有一第一孔洞及一第二孔洞;A casing with a first hole and a second hole;
至少一免电能式散热装置,系对应装设于前述第一孔洞及第二孔洞其中任一。At least one energy-free cooling device is correspondingly installed in any one of the first hole and the second hole.
所述之散热结构中免电能式散热装置更包含有:The energy-free cooling device in the heat dissipation structure further includes:
一转动部,系为一中空罩体,且该转动部周侧系由复数片体呈半开放状并以相同间距排列所构成,该转动部下部系为一开放孔口;A rotating part is a hollow cover, and the surrounding side of the rotating part is composed of a plurality of semi-open pieces arranged at the same distance, and the lower part of the rotating part is an open hole;
一叶扇,设于上述转动部具有孔口之一端,并该叶扇具有复数片叶片,且于该叶扇中间部位系设有一孔洞;A leaf fan, which is provided at one end of the above-mentioned rotating part having an opening, and the leaf fan has a plurality of blades, and a hole is arranged in the middle part of the leaf fan;
一固定部,该固定部之一端延伸设有一轴杆,并该轴杆系穿设于上述叶扇之孔洞后与前述转动部枢接。A fixed part, one end of the fixed part is extended with a shaft rod, and the shaft rod is passed through the hole of the above-mentioned leaf fan and pivotally connected with the above-mentioned rotating part.
所述之散热结构,为使免电能式散热装置驱动该转换单元作能量转换以达到自行产生电能之效果,所述免电能式散热装置系可增设有转换单元。In the heat dissipation structure described above, in order to enable the energy-free heat dissipation device to drive the conversion unit for energy conversion to achieve the effect of generating electric energy by itself, the energy-free heat dissipation device can be additionally equipped with a conversion unit.
所述之散热结构中免电能式散热装置上设有一风罩。In the heat dissipation structure described above, a windshield is provided on the power-free heat dissipation device.
所述之散热结构中所述第一孔洞设于前述之机壳之上侧;前述第二孔洞,设于前述机壳后侧。In the heat dissipation structure, the first hole is arranged on the upper side of the aforementioned casing; the aforementioned second hole is arranged on the rear side of the aforementioned casing.
本实用新型具有下列之优点:The utility model has the following advantages:
1.节省电能;1. Save electricity;
2.散热效果较佳;2. Better cooling effect;
3.内外气流对流效率高。3. High convection efficiency of internal and external airflow.
附图说明 Description of drawings
图1系为已知技术之立体组合图。Fig. 1 is the three-dimensional assembly diagram of known technology.
图2系为本实用新型之较佳实施例之立体分解图。Fig. 2 is a three-dimensional exploded view of a preferred embodiment of the present invention.
图3系为本实用新型之较佳实施例之立体组合图。Fig. 3 is a three-dimensional assembly diagram of a preferred embodiment of the present utility model.
图4系为本实用新型之实施例之结构示意图。Fig. 4 is the structural representation of the embodiment of the utility model.
图4A系为本实用新型之实施例之结构局部放大图。Fig. 4A is a partially enlarged view of the structure of an embodiment of the present invention.
图5系为本实用新型之另一实施例之结构示意图。Fig. 5 is a structural schematic diagram of another embodiment of the present utility model.
图5A系为本实用新型之另一实施例之结构局部放大图。Fig. 5A is a partially enlarged view of another embodiment of the utility model.
图6系为本实用新型之另一实施例之机构分解图。Fig. 6 is an exploded view of another embodiment of the utility model.
主要组件符号说明:Description of main component symbols:
免电能式散热装置3、转动部31、孔口311、叶扇312、叶片3121、孔洞3122、固定部32、轴杆321、风罩4、转换单元5、导线51、电子设备机壳6、第一孔洞61、第一孔洞62、主机板7、发热源71、散热模块72、风扇721、热气流9。Energy-free
具体实施方式 Detailed ways
为达成上述目的及功效,本实用新型所采用之技术手段及构造,兹绘图就本实用新型较佳实施例详加说明其特征与功能如下,俾利完全了解。In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the utility model are hereby illustrated in detail with respect to the preferred embodiments of the utility model. Its features and functions are as follows, so as to fully understand it.
请参阅图2、图3、图4、图4A、图5、图5A、图6图所示,系于该电子设备机壳6上设有至少一个免电能式散热装置3与一可用来保护该散热装置3之风罩4,并透过该电子设备机壳6外部气流8驱动该免电能式散热装置3作转动,藉由该免电能式散热装置3转动后将外部之冷气流8带入机壳内部进行循环散热,以达到散热与省电之效果;故可藉由本实用新型之免电能式散热装置可解决已知技术中过度耗损电能与热能集中于机壳内部无法有效排出等问题;Please refer to Fig. 2, Fig. 3, Fig. 4, Fig. 4A, Fig. 5, Fig. 5A, shown in Fig. 6 figure, be provided with at least one energy-free
该免电能式散热装置3系由一转动部31、一固定部32所组成,该转动部31系为一中空罩体,且该转动部31周侧系由复数片体呈半开放状并以相同间距排列所构成,该转动部31下部系为一开放孔口311并设有一叶扇312,该叶扇312具有复数片叶片3121,且于该叶扇312中间部位系设有一孔洞3122;该固定部32上系延伸设有一轴杆321,该轴杆321系可藉由穿设过该孔洞3122后与转动部31枢接;The energy-
而前述之电子设备机壳6相对应于该散热装置3所设置之位置开设有一第一孔洞61,其后侧平面上另开设有至少一第二孔洞62,可供内部气流藉第二孔洞62排出电子设备机壳6;主机板7系容设于电子设备机壳6内部,其上具有一发热源71,发热源71上方设有一具风扇721之散热模块72;And the aforementioned
当发热源71产生热能时可,藉由设置于发热源71上方散热模块72之风扇721运转产生气流对发热源71进行散热;此时有二种途径散热循环,一是透过风罩4可将外部流动冷气流8作聚集,并使气流8驱动该免电能式散热装置3之转动部31作转动,再藉由转动部31之叶扇312转动后,再将气流8引导入该电子设备机壳6内部,该免电能式散热装置3不仅加速电子设备机壳6内部之热气流9流动,并加速驱使热气流9由第二孔洞62排出电子设备机壳6外,产生循环散热之效果,故电子设备机壳6内部之温度得以降低;另一途径则是藉由电子设备机壳6内部的发热源71及其它电子组件所产生较热气流上升,直接驱动该免电能式散热装置3之转动部31作转动,再藉由转动部31之叶扇312转动后,再将热气流引导向该电子设备机壳6外部,藉由该免电能式散热装置3不仅加速电子设备机壳6内部之热气流9流动,并加速驱使热气流9由第二孔洞62排出电子设备机壳6外,产生循环散热之效果,故电子设备机壳6内部之温度得以降低;When the
另者可设置一转换单元5于免电能式散热装置3上或自行独立设置于电子设备机壳6上,免电能式散热装置3运转时可驱动该转换单元5作转动,并将免电能式散热装置3转动时所产生之动能转换成为电能,并且透过导线51作连接将电力传输供给其它各部使用或作储存;可改善已知技术过动耗损电力之问题且可额外产生电力供给其它各部使用或作储存藉以达到省电之效果。In addition, a
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2008201174072U CN201230434Y (en) | 2008-05-25 | 2008-05-25 | Heat radiating construction |
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| CNU2008201174072U CN201230434Y (en) | 2008-05-25 | 2008-05-25 | Heat radiating construction |
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| CN201230434Y true CN201230434Y (en) | 2009-04-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548334A (en) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Container data center |
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- 2008-05-25 CN CNU2008201174072U patent/CN201230434Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548334A (en) * | 2010-12-08 | 2012-07-04 | 鸿富锦精密工业(深圳)有限公司 | Container data center |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20150525 |
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| EXPY | Termination of patent right or utility model |