CN201226360Y - High-power LED encapsulation structure - Google Patents
High-power LED encapsulation structure Download PDFInfo
- Publication number
- CN201226360Y CN201226360Y CNU2008200491130U CN200820049113U CN201226360Y CN 201226360 Y CN201226360 Y CN 201226360Y CN U2008200491130 U CNU2008200491130 U CN U2008200491130U CN 200820049113 U CN200820049113 U CN 200820049113U CN 201226360 Y CN201226360 Y CN 201226360Y
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- China
- Prior art keywords
- bracket
- colloid
- radiating block
- bowl
- cooling block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H10W90/756—
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- Led Device Packages (AREA)
Abstract
本实用新型提出一种可用于照明灯具、看板、展示照明、安防夜视监控、广告看板等的大功率LED封装结构，具有一支架散热块，至少一晶片，导线以及胶体，在支架散热块正面形成有可聚光且极光滑的碗形凹陷部，晶片置于支架散热块的碗形凹陷部内，并用导线配接于各电源接脚，胶体将导线、晶片及支架散热块的正面封固，而支架散热块的底面与电源接脚则外露于该胶体外，从而构成一大功率LED封装结构，藉由支架散热块的大面积，且底面可与其它散热块较大面积地接触，因此散热效果佳，根本性提高发光寿命，可长时间持续点亮，发光亮度强。
The utility model proposes a high-power LED packaging structure that can be used for lighting fixtures, kanbans, display lighting, security night vision monitoring, advertising kanbans, etc., which has a bracket cooling block, at least one chip, wires and colloids, on the front of the bracket cooling block A concentrating and extremely smooth bowl-shaped recess is formed. The chip is placed in the bowl-shaped recess of the heat sink of the bracket, and is connected to each power pin with a wire. The colloid seals the wire, the chip and the front of the heat sink of the bracket. The bottom surface of the cooling block of the bracket and the power supply pins are exposed outside the gel, thus forming a high-power LED packaging structure. With the large area of the cooling block of the bracket, the bottom surface can be in contact with other cooling blocks in a large area, so the heat dissipation The effect is good, the luminous life is improved fundamentally, it can be continuously lit for a long time, and the luminous brightness is strong.
Description
Technical field
The utility model relates to the LED encapsulating structure, refers in particular to the high-power LED encapsulation structure that a kind of thermal diffusivity is good, luminous efficiency is high.
Background technology
LED encapsulating structure in the known technology, structure generally adopt and form bowl portion on metallic supports, and it is luminous in bowl portion wafer to be set, and each power pin of anode and cathode is arranged, and two power pins are welded on the solder joint of circuit board again.This kind direct plug-in type light emitting diode only dispels the heat with an anode supply pin because of it, so radiating effect is poor; Because the quality of radiating effect is directly proportional with luminous efficiency, therefore caused the technological deficiency that direct plug-in type light emitting diode luminous efficiency is low, the life-span is short simultaneously.
Summary of the invention
The deficiency that the utility model is poor at present LED encapsulating structure radiating effect just, can not light lastingly, luminescent lifetime is short proposes a kind of reasonable in design, thermal diffusivity is good, luminescent lifetime is long LED encapsulating structure.
The utility model is achieved by following technical proposals: but be formed with optically focused and smooth bowl-type depressed part at the upper surface of support radiating block, wafer is positioned in the bowl-type depressed part of support radiating block, and be connected to each power pin with respective wire, the front of bowl-type colloid two sealing wafers, lead and support radiating block, the bottom surface of support radiating block and power pin expose to outside the colloid one.
Further technical measures are: the outboard peripheries of described support radiating block forms the arc-curved shapes that can firmly combine with colloid two, and the colloid that described colloid one constitutes for the PPA material, colloid two are the colloid of PC material formation.
Compared with prior art, the utlity model has following obvious improvement and outstanding characteristics: by the bigger area of dissipation of support radiating block, and the bottom surface can contact than large tracts of land with other radiating block, form better heat radiating effect, prolong luminescent lifetime, improve luminosity, have with low cost, member is simple, applied widely, technical advantage that promotional value is high, can be used for similar articles such as lighting, billboard, display lighting, security protection night vision monitoring, advertisement plate.
Description of drawings
The utility model will be further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic diagram of the utility model LED encapsulating structure.
Among the figure: 1, power pin, 2, colloid one, 3, bowl-type colloid two, 4, solder joint, 5, the bowl-type depressed part, 6, wafer, 7, lead, 8, the support radiating block.
Embodiment
Referring to shown in Figure 1, high-power LED encapsulation structure has the metallic support radiating block 8 of integrated molding, a wafer 6, be used for the lead 7 of connecting wafer 6 to power pin 1, and the colloid 23 that constitutes of the colloid 1 that constitutes of the PPA material that is used for the packaged LED main structure body and PC material, but the front of support radiating block 8 is formed with the bowl-type depressed part 5 of optically focused and dead smooth, wafer 6 is arranged at the inside of bowl-type depressed part 5, and utilize lead 7 to be coupled to power pin 1, bowl-type colloid 23 is with lead 7, the positive sealing of wafer 6 and support radiating block 8, the bottom surface of support radiating block 8 and power pin 1 then expose to outside the colloid 1, simultaneously the outboard peripheries of support radiating block 8 is designed to can with bowl-type colloid 23 arc-curved shape of firm combination mutually, improve the steadiness that engages, and support radiating block 8 is engaged on the circuit board by solder joint 4 with power pin 1, final formation one high-power LED encapsulation structure, the area of support radiating block 8 is significantly increased, and the bottom surface can contact more in large area with other radiating block, has excellent radiating effect, prolong luminescent lifetime, light in the time of can growing and improve luminosity, be applicable to lighting, billboard, display lighting, security protection night vision monitoring, similar articles such as advertisement plate, applied widely.
The foregoing description is only enumerated for explanation the utility model, is not to be used to limit the utility model, and the structure of any effects equivalent based on the conversion of the technical program institute all belongs to protection range of the present utility model.
Claims (2)
1, a kind of high-power LED encapsulation structure, comprise a support radiating block, at least one wafer, lead and colloid one, colloid two formations, it is characterized in that: but described support radiating block upper surface is formed with optically focused and smooth bowl-type depressed part, wafer is positioned in the bowl-type depressed part of support radiating block, and be connected to each power pin with respective wire, the front of bowl-type colloid two sealing wafers, lead and support radiating block, the bottom surface of support radiating block and power pin expose to outside the colloid one.
2, high-power LED encapsulation structure according to claim 1 is characterized in that: the outboard peripheries of described support radiating block forms the arc-curved shapes that can firmly combine with colloid two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200491130U CN201226360Y (en) | 2008-06-12 | 2008-06-12 | High-power LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200491130U CN201226360Y (en) | 2008-06-12 | 2008-06-12 | High-power LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201226360Y true CN201226360Y (en) | 2009-04-22 |
Family
ID=40599258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200491130U Expired - Fee Related CN201226360Y (en) | 2008-06-12 | 2008-06-12 | High-power LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201226360Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101924168B (en) * | 2009-06-15 | 2012-09-05 | 亿光电子工业股份有限公司 | A high power light emitting diode |
-
2008
- 2008-06-12 CN CNU2008200491130U patent/CN201226360Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101924168B (en) * | 2009-06-15 | 2012-09-05 | 亿光电子工业股份有限公司 | A high power light emitting diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20110612 |