CN201206805Y - Lamp set - Google Patents
Lamp set Download PDFInfo
- Publication number
- CN201206805Y CN201206805Y CNU2008200933723U CN200820093372U CN201206805Y CN 201206805 Y CN201206805 Y CN 201206805Y CN U2008200933723 U CNU2008200933723 U CN U2008200933723U CN 200820093372 U CN200820093372 U CN 200820093372U CN 201206805 Y CN201206805 Y CN 201206805Y
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- Prior art keywords
- heat dissipation
- module
- light source
- heat
- source module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及一种灯具。The utility model relates to a lamp.
背景技术 Background technique
目前LED(Light Emitting Diode)已在灯具中得到广泛的应用,对于较小功率的灯具,其产生的热量少,不会影响灯具的正常工作。但是对于较大功率的LED工作时,会产生大量的热量,当热量在LED的引脚集聚后,若不及时发散,将会使LED灯烧坏,影响产品的寿命。At present, LED (Light Emitting Diode) has been widely used in lamps and lanterns. For smaller power lamps, it generates less heat and will not affect the normal operation of lamps. However, when working with a relatively high-power LED, a large amount of heat will be generated. If the heat is not dissipated in time after the heat accumulates on the pins of the LED, it will burn out the LED lamp and affect the life of the product.
目前市场上常见的灯具散热模组1,如图1所示,其包括基座11和散热片12,相邻散热片12之间构成宽度均匀的散热通道13。当LED产生的热量传导至基座11后,由基座11将热量传导至散热片12,通过散热片12的表面进行散热。这种散热模组的缺点在于,均匀的散热通道13与空气对流较差,对于热量较大时,无法及时降温,影响了散热效果。As shown in FIG. 1 , a common lamp
实用新型内容Utility model content
本实用新型要解决的技术问题是,提供一种能够增强散热效果的灯具。The technical problem to be solved by the utility model is to provide a lamp capable of enhancing heat dissipation effect.
为了解决上述技术问题,本实用新型提供一种灯具,包括外壳、光源模组和散热模组,所述外壳固定于散热模组上,所述光源模组位于外壳内且贴合于所述散热模组上。所述散热模组包括基座和数个散热片,所述散热片固定于基座的一侧,相邻的所述散热片之间形成散热通道,所述散热通道由底部至顶部开口处其宽度逐渐增大。In order to solve the above technical problems, the utility model provides a lamp, which includes a housing, a light source module and a heat dissipation module, the housing is fixed on the heat dissipation module, the light source module is located in the housing and attached to the heat dissipation module on the module. The heat dissipation module includes a base and several heat dissipation fins, the heat dissipation fins are fixed on one side of the base, and a heat dissipation channel is formed between adjacent heat dissipation fins, and the heat dissipation channel extends from the bottom to the top opening. The width gradually increases.
散热片构成的散热通道,其宽度由底部往顶部开口逐渐增大,使空气更容易进入散热通道,增加了空气的流动性。当热量传导至散热片后,由于空气与散热片接触,带走了散热片的热量,这样当空气的流动性增强后,使热量与外界的交换速度加快,增强了散热片的散热效果。因此,与现有技术相比较,灯具采用该散热模组后,使光源模组产生的热量更加容易散发,防止了热量集聚而影响光源模组的使用寿命。The width of the cooling channels formed by the cooling fins gradually increases from the bottom to the top opening, which makes it easier for air to enter the cooling channels and increases the fluidity of the air. When the heat is conducted to the heat sink, the heat of the heat sink is taken away due to the contact of the air with the heat sink, so that when the fluidity of the air is enhanced, the heat exchange speed with the outside world is accelerated, and the heat dissipation effect of the heat sink is enhanced. Therefore, compared with the prior art, after the lamp adopts the heat dissipation module, the heat generated by the light source module can be dissipated more easily, preventing heat accumulation from affecting the service life of the light source module.
附图说明 Description of drawings
图1是现有技术提供的一种散热模组结构示意图;Fig. 1 is a schematic structural diagram of a cooling module provided by the prior art;
图2是本实用新型实施例提供的一种灯具的结构示意图;Fig. 2 is a schematic structural diagram of a lamp provided by an embodiment of the present invention;
图3是图2的结构分解示意图。FIG. 3 is an exploded schematic diagram of the structure of FIG. 2 .
图4是本实用新型实施例提供的一种散热模组结构示意图;Fig. 4 is a schematic structural diagram of a heat dissipation module provided by an embodiment of the present invention;
图5是本实用新型实施例提供的另一种散热模组的结构示意图。Fig. 5 is a schematic structural diagram of another heat dissipation module provided by an embodiment of the present invention.
具体实施方式 Detailed ways
为了使本实用新型所要解决的技术问题、技术方案及有益效果更加清楚明白,以下结合附图及实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.
请参阅图2和图3,本实用新型实施例提供一种灯具,包括外壳21、光源模组22和散热模组23,外壳21固定于散热模组23上,光源模组22位于外壳21内,且散热模组23贴合于光源模组22上。Please refer to Fig. 2 and Fig. 3, the embodiment of the present utility model provides a lamp, including a
请一同参阅图4和图5,上述散热模组23包括导热块230、基座231和数个散热片232,散热片232固定于基座231上。相邻的散热片232之间形成散热通道233,其中散热通道233的宽度由底部往顶部开口逐渐增大,以使空气更容易进入散热通道233,增加空气的流动性。Please refer to FIG. 4 and FIG. 5 together. The
具体地,上述散热模组23由导热效果良好的铝材一体成型,以避免因散热模组23的材料不同而影响热传导效果。散热片232由基座231的下表面垂直向下延伸,相邻散热片232之间的间隔均匀(即热量通道233的宽度均匀)。为进一步增强散热效果,如图5所示,散热片232的两侧表面,在其高度方向上可呈波形,这样,可使散热片232的表面积增大,增加了空气流动时与散热片232的接触面积。Specifically, the above-mentioned
导热块230位于基座231上与散热片232相对的另一侧,其贴合在LED光源模组22的底面。当LED导通后,其产生的热量从光源模组22的底部传导至导热块230,通过导热块230将热量依次传导至基座231及散热片232。The
上述外壳21呈漏斗状,使外壳21的侧壁与底面形成一定的倾角,在本实施例中外壳21的横截面呈矩形。于矩形底面开设有与光源模组22形状相应的通孔211,光源模组22嵌于该通孔211内。为了使光源模组22的光源LED发出的光能够通过外壳21的侧壁产生更好的聚光效果,将光源模组22设置于外壳21底面的中央。The
于外壳21的侧壁开设有导线通孔212,该导线通孔212用于穿设导线(图中未示出),导线与光源模组22连接。这样,防止了导线因从光源模组22的底部穿出而使导线受到热量的影响,达到了热电分离的效果。A wire through
散热片232构成的散热通道233,其宽度由底部往顶部开口逐渐增大,使空气更容易进入散热通道233,增加了空气的流动性。当热量传导至散热片232后,由于空气与散热片232接触,带走了散热片232的热量,这样当空气的流动性增强后,使热量与外界的交换速度加快,增强了散热片232的散热效果。因此,与现有技术相比较,灯具采用该散热模组23后,使光源模组22产生的热量更加容易散发,防止了热量集聚而影响光源模组22的使用寿命。The width of the
以上所述仅为本实用新型的较佳实施例而已,并不用以限制本实用新型,凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200933723U CN201206805Y (en) | 2008-04-16 | 2008-04-16 | Lamp set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200933723U CN201206805Y (en) | 2008-04-16 | 2008-04-16 | Lamp set |
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| CN201206805Y true CN201206805Y (en) | 2009-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNU2008200933723U Expired - Lifetime CN201206805Y (en) | 2008-04-16 | 2008-04-16 | Lamp set |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112984412A (en) * | 2019-12-16 | 2021-06-18 | 上海航空电器有限公司 | LED landing lamp heat radiation structure |
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2008
- 2008-04-16 CN CNU2008200933723U patent/CN201206805Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112984412A (en) * | 2019-12-16 | 2021-06-18 | 上海航空电器有限公司 | LED landing lamp heat radiation structure |
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Granted publication date: 20090311 |
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