CN201204201Y

CN201204201Y - Ultra-high-power LED die set light source bracket

Info

Publication number: CN201204201Y
Application number: CNU2008200436839U
Authority: CN
Inventors: 陈德华; 欧发文; 束红运
Original assignee: DONGGUAN CLED OPTOELETRONIC TECHNOLOGY Co Ltd
Current assignee: Dongguan Cled Optoelectronic Technology Co., Ltd.
Priority date: 2008-01-31
Filing date: 2008-01-31
Publication date: 2009-03-04
Anticipated expiration: 2018-01-31

Abstract

An ultra-high-power LED light source module bracket of the utility model includes a substrate, a plastic piece, and an electrode layer, which is characterized in that the plastic piece contains the electrode layer and the plastic piece is fastened together to the substrate. A chip placing zone in the substrate of the module bracket is in a plane structure or cavernous structure, a structure that has silver plating processing or equipped with a silver thread layer is provided in the zone, and a plurality of power type LED chips can be simultaneously arranged inside to realize the packaging of the ultra-high-power LED light source. The utility model is suitable for the packaging of the ultra-high-power LED, resolves the problem that the single LED package has small power because its difficult to make an LED chip with large self power, accelerates the pace of universal solid-state lighting, and has higher practicability and economic benefits.

Description

Ultra-high-power LED die set light source bracket

Technical field

The present invention relates to a kind of led light source support, particularly a kind of illumination level ultra-high-power LED die set light source bracket.

Background technology

At present, worldwide energy shortage has caused the great attention of various countries to power-saving technology, is developing energetically such as solar energy, and in the time of renewable and clean energy resources such as wind energy, various countries also utilize in rational and effective and strengthened dynamics aspect the energy.Being reflected in the illumination aspect is exactly constantly weeding out the old and bring forth the new and extensive use of various new light sources.This wherein, long and its high reliability has caused concern more and more widely and progressively has been applied to lighting field light-emitting diode with its low energy consumption, high light efficiency, life-span.Owing to be subjected to the restriction of led chip making technology, chip size is difficult to do greatly, thereby make led chip power do not quite (generally below 5W), therefore single chips encapsulated LED is difficult to realize the demand of throwing light on, in order to cater to the demand of super-high-power LED encapsulation, the spy has invented this ultra-high-power LED die set light source bracket.

Summary of the invention

The objective of the invention is in order to cater to the demand of solid-state illumination, be difficult to do greatly at led chip power, single LEDs brightness is difficult to realize that illumination level requires and many application are difficult to solve that ghost image problem and outward appearance are difficult for being accepted by the consumer and a kind of super-high-power LED encapsulation module support of designing.

Ultra-high-power LED die set light source bracket of the present invention comprises substrate, plastic parts, and electrode layer three parts is characterized in that: include electrode layer in the plastic parts, plastic parts and substrate tighten together.The chip rest area is planar structure or cavernous structure in the substrate of this module support, and does silver-plated processing in this regional extent or be provided with silver-colored line layer structure, interiorly can arrange many power-type LED chips simultaneously to realize encapsulation ultra-large type power LED light source.

Super-high-power LED light source module group type support of the present invention, its substrate (1) is made by copper, aluminium or the good material of other heat conductivility.Substrate shape is indefinite, can be squarely, also can be circle or ellipse.Chip put area area is bigger, and its size is between 5-10000 square millimeters.In order to strengthen the heat-conductive characteristic of led chip and substrate, the substrate chip put area can be planar structure, also can be cellular type structure (placing chip in the hole).Substrate surface chip rest area is done silver-plated processing or is provided with silver-colored line layer structure, and its thickness can be in 0.01-10 millimeters scopes.The top of substrate is provided with plastic parts (4), and it is made by high temperature resistant PPA material or pottery, and plastic parts and substrate tighten together with the form of rivet or nut, and driving fit place has higher air-tightness.Be provided with electrode layer in the plastic parts, electrode layer comprises (3), (6), (8), (9), can be by copper or other electric conductivity good metal material processing procedures, and plastic parts and electrode layer air-tightness are fabulous.

Super-high-power LED light source module group type support of the present invention is applicable to the power-type LED product encapsulation that 5W is above, more is applicable to the power-type LED encapsulation more than 15 watts.

The invention has the beneficial effects as follows:

Super-high-power LED module group type light source bracket of the present invention, be applicable to the super-high-power LED encapsulation, solved because of led chip self power is difficult to do greatly and caused the little problem of single LEDs package power, accelerated the paces that solid-state illumination is popularized, had advantages of high practicability and economic benefit.

Description of drawings

The invention will be further described below in conjunction with accompanying drawing, but embodiments of the present invention are not limited thereto.

Fig. 1, substrate punching pattern pack support schematic diagram

Fig. 2, substrate punching pattern pack support profile

Fig. 3 base plate pattern pack support schematic diagram

Fig. 4, base plate pattern pack support profile

Among the figure: led support substrate (1), support install and fix hole (2), the wire welding area of interior electrode layer (3) (6), plastic parts (4), chip rest area (5), outer electrode fairlead (7), outer electrode is (8) just, and outer electrode is born (9), silver coating structure or silver-colored line layer structure (10).

Embodiment

Ultra-high-power LED die set light source bracket of the present invention, substrate punching pattern pack support as illustrated in fig. 1 and 2 is chip rest area (5) in the plastic parts (4), in stent substrate (1) punching position, is the LED anchor point.After the substrate punching, can adopt rivet to tighten together plastic parts and being connected of substrate, silver-plated processing promptly gets ultra-high-power LED die set light source bracket product of the present invention.

Its plastic parts, substrate and electrode layer all can be taked punching press, extruding or die cast mode processing procedure, and the silver coating processing can be adopted prior art to operate and realize.Plastic parts tightens together with adopting the mode of rivet mode or screw and nut being connected of substrate.

Claims

1, a kind of ultra-high-power LED die set light source bracket, comprise substrate, plastic parts, electrode layer, it is characterized in that: the solid chip area of substrate is provided with and is no less than a power-type LED chip with the arrangement of VLA form, electrode layer, plastic parts, and plastic parts and substrate are tightened to integral structure.

2, ultra-high-power LED die set light source bracket according to claim 1 is characterized in that: its substrate is made by copper or aluminium.

3, ultra-high-power LED die set light source bracket according to claim 1, it is characterized in that: the solid chip area of its substrate surface is the plane, and the surface is done silver-plated processing or is arranged with silver-colored line layer structure, and its silver layer or silver-colored line spreading depth are in 0.01-10 millimeters scopes.

4, ultra-high-power LED die set light source bracket according to claim 1, it is characterized in that: the solid chip area of its substrate is provided with array format room structure, and silver coated structure or be placed with silver-colored line structure in its room, its silver layer or silver-colored line spreading depth are in 0.01-10 millimeters scopes.