CN201197255Y - Cross inserting fin type radiator - Google Patents
Cross inserting fin type radiator Download PDFInfo
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- CN201197255Y CN201197255Y CNU2008201127635U CN200820112763U CN201197255Y CN 201197255 Y CN201197255 Y CN 201197255Y CN U2008201127635 U CNU2008201127635 U CN U2008201127635U CN 200820112763 U CN200820112763 U CN 200820112763U CN 201197255 Y CN201197255 Y CN 201197255Y
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- fin
- radiating fin
- recess
- copper material
- fins
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims description 13
- 238000009833 condensation Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 8
- 238000005452 bending Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 abstract 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 38
- 238000001816 cooling Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 210000005069 ears Anatomy 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及一种交叉插片式散热器。The utility model relates to a cross-inserted radiator.
背景技术 Background technique
目前,随着集成电路设计和晶片工艺的进步,使集成电路体积缩小,更多的晶体管和更紧密的蚀刻线,也令其运算速度倍增,尤其是一些高端的电子产品,如CPU、GPU及主板等,它们产生的热源相对集中,而且温升的速度又特别快,为了满足这些集成电路的散热需求,就必须加装散热器。通常散热器由一块集热板和由若干平行间隔排布的散热鳍片连接而成的散热器所构成,散热器锡膏焊接在集热座上;为了加快散热及增强散热效果,散热片组内还会穿接导热管与集热板连接。现有的散热鳍片的材质通常为铝材,也有用铜材,因为铜材的集热和散热性能优于铝材,但是铜材的价格比铝材高很多,如果散热鳍片组完全由铜材来制作,则散热器的制造成本较高。At present, with the advancement of integrated circuit design and chip technology, the volume of integrated circuits has been reduced, and more transistors and tighter etching lines have also doubled their computing speed, especially for some high-end electronic products, such as CPU, GPU and Motherboards, etc., the heat sources generated by them are relatively concentrated, and the temperature rises very fast. In order to meet the heat dissipation requirements of these integrated circuits, a radiator must be installed. Usually, the radiator is composed of a heat collecting plate and a radiator connected by a number of cooling fins arranged in parallel at intervals. The solder paste of the radiator is welded on the heat collecting seat; The heat pipe will also be connected inside to connect with the heat collecting plate. The existing heat dissipation fins are usually made of aluminum, and copper is also used, because the heat collection and heat dissipation performance of copper is better than that of aluminum, but the price of copper is much higher than that of aluminum. If the heat dissipation fin group is completely made of If it is made of copper, the manufacturing cost of the radiator is relatively high.
发明内容 Contents of the invention
本实用新型目的是:提供一种铜材散热鳍片和铝材散热鳍片交叉间隔排布的交叉插片式散热器,不仅降低制造成本,且制造简单,并具有较好的散热性能。The purpose of the utility model is to provide a cross-inserted radiator in which copper heat dissipation fins and aluminum heat dissipation fins are arranged at intervals, which not only reduces the manufacturing cost, but also is easy to manufacture and has better heat dissipation performance.
本实用新型的技术方案是:一种交叉插片式散热器,包括集热座、连接在集热座上的散热片组和穿设于散热片组内并连接集热座的导热管;所述散热片组由若干铜材散热鳍片和若干铝材散热鳍片交叉平行间隔排布而成。The technical scheme of the utility model is: a cross-inserted fin radiator, including a heat collecting seat, a heat sink group connected to the heat collecting seat, and a heat conduction pipe that is installed in the heat sink group and connected to the heat collecting seat; The heat dissipation fin group is formed by a plurality of copper heat dissipation fins and a plurality of aluminum heat dissipation fins arranged in parallel and at intervals.
本实用新型中所述每片铜材散热鳍片中部开有向下的第一凹口,第一凹口的底部向铜材散热鳍片的一侧延伸有朝下弯曲的第一托沿;而所述每片铝材散热鳍片中部开有向上的第二凹口,第二凹口的底部向铝材散热鳍片的一侧延伸有朝上弯曲的第二托沿;所有第一托沿和所有第二托沿在铜材散热鳍片和铝材散热鳍片的间隙内组成长通孔,容纳导热管的冷凝端。并且所述每片铜材散热鳍片的两侧和顶部均成型有扣点,用来和CPU、GPU或者主板基座上的托架配合连接固定。In the utility model, the middle part of each piece of copper heat dissipation fin is provided with a downward first notch, and the bottom of the first notch extends to one side of the copper heat dissipation fin with a downwardly curved first supporting edge; And the middle part of each aluminum heat dissipation fin has an upward second notch, and the bottom of the second notch extends to one side of the aluminum heat dissipation fin with an upwardly curved second support edge; all the first support The edge and all the second support edges form a long through hole in the gap between the copper heat dissipation fin and the aluminum heat dissipation fin to accommodate the condensation end of the heat pipe. And the two sides and the top of each copper cooling fin are formed with buckle points, which are used to cooperate with the CPU, GPU or the bracket on the motherboard base to connect and fix.
当然本实用新型中,也可以在铝材散热鳍片上开设向下的第一凹口,而在铜材散热鳍片上开设向上的第二凹口,其技术方案变成如下:所述每片铜材散热鳍片中部开有向下的第一凹口,第一凹口的底部向铜材散热鳍片的一侧延伸有朝下弯曲的第一托沿;而所述每片铝材散热鳍片中部开有向上的第二凹口,第二凹口的底部向铝材散热鳍片的一侧延伸有朝上弯曲的第二托沿;所有第一托沿和所有第二托沿在铜材散热鳍片和铝材散热鳍片的间隙内组成长通孔,容纳导热管的冷凝端。并且所述每片铜材散热鳍片的两侧和顶部均成型有扣点,用来和CPU、GPU或者主板基座上的托架配合连接固定。并且所述每片铝材散热鳍片的两侧和顶部均成型有扣点,用来和CPU、GPU或者主板基座上的托架配合连接固定。Of course, in the present utility model, a downward first notch can also be provided on the aluminum heat dissipation fin, and an upward second notch can be provided on the copper heat dissipation fin, and its technical scheme becomes as follows: each piece of copper There is a downward first notch in the middle part of the heat dissipation fin made of aluminum material, and the bottom of the first notch extends to one side of the heat dissipation fin of copper material with a first supporting edge bent downward; and each piece of heat dissipation fin of aluminum material There is a second upward notch in the middle of the sheet, and the bottom of the second notch extends to the side of the aluminum heat dissipation fin with an upwardly curved second support edge; all first support edges and all second support edges are made of copper A long through hole is formed in the gap between the material cooling fins and the aluminum material cooling fins to accommodate the condensation end of the heat pipe. And the two sides and the top of each copper cooling fin are formed with buckle points, which are used to cooperate with the CPU, GPU or the bracket on the motherboard base to connect and fix. And the two sides and the top of each aluminum heat dissipation fin are formed with buckle points, which are used to cooperate with the CPU, GPU or the bracket on the motherboard base to connect and fix.
本实用新型中的所述导热管的冷凝端进一步位于中部,而冷凝端的两端向下折弯连接两个蒸发端,每个蒸发端为异形截面,同集热座上的异形槽匹配且固定。The condensing end of the heat pipe in the utility model is further located in the middle, and the two ends of the condensing end are bent downward to connect two evaporating ends, and each evaporating end has a special-shaped section, which is matched and fixed with the special-shaped groove on the heat collecting seat .
本实用新型优点是:The utility model advantage is:
1.本实用新型交叉插片式散热器中,铜材散热鳍片和铝材散热鳍片交叉间隔排布,相比目前完全由铜材散热鳍片构成的散热器,降低了制造成本,但保持了较好的散热性能,并且结构简单,便于制造。1. In the cross-inserted radiator of the utility model, the copper heat dissipation fins and the aluminum heat dissipation fins are arranged at intervals at intervals, which reduces the manufacturing cost compared with the current radiator completely composed of copper heat dissipation fins, but Good heat dissipation performance is maintained, and the structure is simple and easy to manufacture.
附图说明 Description of drawings
下面结合附图及实施例对本实用新型作进一步描述:Below in conjunction with accompanying drawing and embodiment the utility model is further described:
图1为本实用新型具体实施例的主视图;Fig. 1 is the front view of the specific embodiment of the utility model;
图2为图1实施例的俯视图;Fig. 2 is the top view of Fig. 1 embodiment;
图3为图1实施例的立体结构示意图;Fig. 3 is the three-dimensional structure schematic diagram of Fig. 1 embodiment;
图4为图1实施例的装配示意图。Fig. 4 is a schematic diagram of assembly of the embodiment in Fig. 1 .
其中:1、集热座;11、异形槽;2、导热管;21、冷凝端;22、蒸发端;3、铜材散热鳍片;31、第一凹口;32、第一托沿;33、扣点;4、铝材散热鳍片;41、第二凹口;42、第二托沿;5、弹簧螺钉。Among them: 1. Heat collecting seat; 11. Special-shaped groove; 2. Heat pipe; 21. Condensation end; 22. Evaporation end; 3. Copper cooling fins; 31. The first notch; 33. Buckle point; 4. Aluminum cooling fin; 41. The second notch; 42. The second support edge; 5. Spring screw.
具体实施方式 Detailed ways
实施例:结合图1、图2、图3和图4所示为本实用新型交叉插片式散热器的一种具体实施方式:它包括集热座1、连接在集热座1上的散热片组和穿设于散热片组内并连接集热座1的导热管2;所述散热片组由若干铜材散热鳍片3和若干铝材散热鳍片4交叉平行间隔排布而成。铜材散热鳍片3和铝材散热鳍片4均通过常规的锡膏焊接方式连接在集热座1上。Embodiment: Combined with Fig. 1, Fig. 2, Fig. 3 and Fig. 4, it shows a specific embodiment of the cross-insert radiator of the present invention: it includes a
本实施例中所述每片铜材散热鳍片3中部开有向下的第一凹口31,第一凹口31的底部向铜材散热鳍片3的一侧延伸有朝下弯曲的第一托沿32;而所述每片铝材散热鳍片4中部开有向上的第二凹口41,第二凹口41的底部向铝材散热鳍片4的一侧延伸有朝上弯曲的第二托沿42;所有第一托沿32和所有第二托沿42在铜材散热鳍片3和铝材散热鳍片4的间隙内组成长通孔,容纳导热管2的冷凝端21。所述每片铜材散热鳍片3的两侧和顶部均成型有扣点33。而所述导热管2的冷凝端21位于中部,冷凝端21的两端向下折弯连接两个蒸发端22,每个蒸发端22为异形截面,同集热座1上的异形槽11匹配且固定。In this embodiment, the middle part of each copper
本实施例可以用在CPU、GPU以及主板上,具体装配同现有技术一样,集热座1通过其上的若干连接耳穿接弹簧螺钉5同CPU或者GPU或者主板这些机构上的基座连接固定,而所述每片铜材散热鳍片3的两侧和顶部均成型有扣点33,用来和CPU、GPU或者主板基座上的托架配合连接固定。This embodiment can be used on CPU, GPU and main board, and specific assembly is the same as prior art, and
本实施例交叉插片式散热器中,铜材散热鳍片3和铝材散热鳍片4交叉间隔排布,相比目前完全由铜材散热鳍片构成的散热器,降低了制造成本,但保持了较好的散热性能,并且结构简单,便于制造。In the intersecting-fin radiator of this embodiment, the
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201127635U CN201197255Y (en) | 2008-05-15 | 2008-05-15 | Cross inserting fin type radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201127635U CN201197255Y (en) | 2008-05-15 | 2008-05-15 | Cross inserting fin type radiator |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103822515A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Bayonet-tube type fluid heat exchanger and manufacturing method thereof |
| CN104329847B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | A kind of semiconductor freezer and installation method thereof |
| TWI593935B (en) * | 2015-11-10 | 2017-08-01 | 奇鋐科技股份有限公司 | Assembling structure of heat dissipation device |
| US9909815B2 (en) | 2015-12-01 | 2018-03-06 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
| CN109332574A (en) * | 2018-10-12 | 2019-02-15 | 山东临朐恺强模具有限公司 | A kind of press machine of energy rapid cooling |
| US11293700B2 (en) * | 2019-10-25 | 2022-04-05 | Cooler Master Co., Ltd. | Multi-thermal characteristic heat sink fin |
-
2008
- 2008-05-15 CN CNU2008201127635U patent/CN201197255Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103822515A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Bayonet-tube type fluid heat exchanger and manufacturing method thereof |
| CN104329847B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | A kind of semiconductor freezer and installation method thereof |
| TWI593935B (en) * | 2015-11-10 | 2017-08-01 | 奇鋐科技股份有限公司 | Assembling structure of heat dissipation device |
| US9909815B2 (en) | 2015-12-01 | 2018-03-06 | Asia Vital Components Co., Ltd. | Assembling structure of heat dissipation device |
| CN109332574A (en) * | 2018-10-12 | 2019-02-15 | 山东临朐恺强模具有限公司 | A kind of press machine of energy rapid cooling |
| US11293700B2 (en) * | 2019-10-25 | 2022-04-05 | Cooler Master Co., Ltd. | Multi-thermal characteristic heat sink fin |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090218 Termination date: 20110515 |