CN201142813Y - Heat sink with heat pipe extending laterally - Google Patents

Abstract

The utility model relates to a heat sink with heat pipes extending laterally, which comprises a heat-conducting base and a plurality of heat pipes connected with the heat-conducting base; each heat pipe is provided with a heated section and a heat dissipation section, the part connected to the heat conduction base is the heated section, and the heat dissipation sections respectively extend out of the heat conduction base; in the heat pipes, the heat dissipation section of at least one heat pipe extends outwards from one side of the heat conduction base in the transverse direction, the heat dissipation section of the heat pipe is positioned at a higher position than the heated section of the heat pipe, and a plurality of radiating fins are arranged on the heat dissipation section of the heat pipe in a penetrating manner. The heat absorbed by the heat conduction base is guided to one side through the heat pipe, so as to dissipate heat of the peripheral heat source.

Description

Radiator with heat pipe extending laterally

technical field

The utility model relates to a radiator for electronic components, in particular to a CPU cooling device.

Background technique

It is a well-known technology to use radiators as heat dissipation for electronic heating elements. The traditional heat sink is mainly composed of a heat conduction base used to contact the heat source, and several heat sinks arranged on the heat conduction base, and the overall heat dissipation area is increased by the surface area of each heat sink, and On the premise of materials with the same heat dissipation ratio, the more the number of heat sinks and the larger the heat dissipation area of a single heat sink, the better the heat dissipation effect that the heat sink can provide.

While adding heat sinks, there are also those who further use heat pipes to connect between the heat conduction base and several heat sinks. Due to the high heat conduction characteristics of the heat pipe, the heat absorbed by the heat conduction base can be quickly transferred to the heat sinks, so as to prevent the heat conduction base from accumulating too much heat and unable to absorb the heat generated by the heat source. In addition, in the past, when heat pipes were used to improve the heat transfer effect of the radiator, one end of the heat pipe was connected to the heat conduction base, and the other end was vertically extended from one side of the heat conduction base; the heat pipe was connected to the heat conduction base The upper portion is the heating section, and the vertically extending portion is the heat dissipation section. The radiating section of the heat pipe can be upright to directly connect the radiating fins in series; it can also be further bent laterally inward so that the radiating section of the heat pipe is located directly above the heated section, so that the heat pipe is in the shape of a "ㄈ". Then connect the cooling fins in series on the cooling section of the heat pipe.

However, this kind of radiator is to make the heat pipe extend or extend from the height direction. This design is mainly to facilitate the further installation of a fan on the heat sink, and the fan can provide cold airflow from top to bottom to increase the heat dissipation effect, but it can only Dissipate heat from a single heat source. Although a fan with a larger size can be used to increase the heat dissipation area blown by the airflow, it is still limited by the size of the fan, and cannot completely provide other electronic components such as the central processing unit, or even the computer motherboard. Heat dissipation requirements of heat sources such as memory sticks. Therefore, the purpose of integrating the heat dissipation requirements of each heat source on the computer motherboard cannot be achieved.

In view of this, the designer of this utility model is to improve and solve the above-mentioned deficiencies. Naite devoted himself to research and combined with the application of theories, and finally proposed a utility model with a reasonable design and effectively improved the above-mentioned deficiencies.

Contents of the invention

The main purpose of the present utility model is to provide a heat dissipation device with heat pipes extending laterally, which is to guide the heat generated by the heat source to the heat dissipation device through the lateral extension of the heat pipes. Laterally; in this way, heat dissipation can be provided for additional electronic components located around the main heat source or other related secondary heat sources, so that the heat dissipation device can provide the heat dissipation effect required by most heat sources at the same time.

For realizing above-mentioned object, the technical scheme that the utility model adopts is:

A heat dissipation device with heat pipes extending laterally, comprising:

a thermally conductive base; and

Several heat pipes all have a heating section and a cooling section, and the heating sections of the heat pipes are respectively connected to the heat conduction base, and the heat dissipation sections are respectively extended from the heat conduction base;

It is characterized in that: at least one heat dissipation section of the heat pipe extends laterally outward from one side of the heat conduction base, which is called a lateral heat pipe, and the heat dissipation section of the lateral heat pipe is located higher than the heat-receiving section. section position, and several cooling fins are pierced on the heat dissipation section of the lateral heat pipe.

Compared with the prior art, the utility model adopting the above-mentioned technical solution has the advantage that the heat absorbed by the heat-conducting base is guided to one side through the heat pipe, so as to achieve the above-mentioned purpose.

Description of drawings

Fig. 1 is the three-dimensional appearance schematic diagram of the utility model;

Fig. 2 is a three-dimensional appearance view of another viewing angle of the utility model;

Fig. 3 is a plane side view of the utility model;

Fig. 4 is the three-dimensional exploded view of the fan and wind cover of the utility model;

Fig. 5 is a schematic view of the use state according to Fig. 4 .

Explanation of reference numerals: 1 - heat conduction base; 2, 3 - heat pipe; 4 - heat sink; 5 - accommodation space; 6, 7 - fan; 8 - wind cover; 9 - electronic heating element.

Detailed ways

In order to enable your examiner to further understand the features and technical content of the utility model, please refer to the following detailed description and accompanying drawings of the utility model. be restricted.

Please refer to FIG. 1 and FIG. 2 , which are a schematic diagram of a three-dimensional appearance of the utility model and a three-dimensional appearance diagram of another viewing angle, respectively. The utility model provides a heat dissipation device with heat pipes extending laterally, which includes a heat conduction base 1 and several heat pipes 2 and 3 connected to the heat conduction base 1; wherein:

The heat-conducting base 1 is generally in the shape of a flat plate, which is made of a material with good thermal conductivity, such as aluminum, copper, and the like. The bottom surface of the heat conduction base 1 is used to bond with an electronic heating element 9 (as shown in FIG. 5 ) such as a central processing unit.

The heat pipes 2, 3 all have a heating section and a heat dissipation section, and the heating sections of each heat pipe 2, 3 are respectively connected to the above-mentioned heat conduction base 1 for heat transfer connection; and the heat dissipation sections of each heat pipe 2, 3 Depending on the different heat conduction paths, there are different bending patterns.

As shown in Figure 3, the utility model mainly makes the above-mentioned heat pipes 2, 3, at least one heat dissipation section of the heat pipe 2 extends laterally outward from the side of the heat conduction base 1, which is called a lateral heat pipe 2, and The radiating section of the lateral heat pipe 2 is pierced with several radiating fins 4 , and the position of the radiating section is higher than that of the heated section. And the radiating section of other heat pipe 3 is to vertically extend longitudinally, and the radiating fin 4 is pierced on the radiating section extending vertically. In the exemplary embodiment of the present utility model, the heat dissipation section is a heat pipe 3 extending vertically, which is bent into a "U" shape, so that these heat pipes 3 are at the two ends of the "U" shape. As the heat dissipation section, heat dissipation fins 4 are connected in series on each heat dissipation section, and an accommodating space 5 is formed between the heat dissipation fins 4 connected in series on the two heat dissipation sections.

Based on the above, as shown in Figure 4, in addition to setting up a fan 6 on the heat dissipation section of the lateral heat pipe 2 extending laterally outward, the utility model can also set up another fan in the aforesaid accommodating space 5 7. Provide cold air flow for the heat pipes 2 and 3 of different bending types to force heat dissipation, and cover the heat dissipation device with a windshield 8 . At the same time, the fan 6 mounted on the laterally outwardly extending lateral heat pipe 2 can not only be arranged above the heat sinks 4 of the lateral heat pipe 2 as shown in the figure, but can also be erected or located below. place (figure omitted), so as to be close to the surrounding heat source.

Accordingly, as shown in FIG. 5 , when the heat conduction base 1 of the heat dissipation device is attached to an electronic heating element 9 such as a central processing unit, the lateral heat pipe 2 extending laterally outward can be located on the Above the additional electronic components around the above-mentioned electronic heating element 9 or other related secondary heat sources, so as to provide heat dissipation requirements together. What's more, it can be further extended to the top of the memory bar of the computer motherboard (figure omitted), so as to provide the heat dissipation requirements of the computer central processing unit and its memory bar and other electronic heating elements through the heat dissipation device, so as to achieve integration. As well as the purpose of providing heat dissipation requirements of most heat sources at the same time.

By means of the above-mentioned structural composition, the heat dissipation device of the utility model with laterally extending heat pipes can be obtained.

The above description is only illustrative, rather than restrictive, of the present utility model. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined in the claims. But all will fall within the protection scope of the present utility model.

Claims (6)

1. A heat dissipation device with heat pipes extending laterally, comprising: a thermally conductive base; and Several heat pipes all have a heating section and a cooling section, and the heating sections of the heat pipes are respectively connected to the heat conduction base, and the heat dissipation sections are respectively extended from the heat conduction base; It is characterized in that: at least one heat dissipation section of the heat pipe extends laterally outward from one side of the heat conduction base, which is called a lateral heat pipe, and the heat dissipation section of the lateral heat pipe is located higher than the heat-receiving section. section position, and several cooling fins are pierced on the heat dissipation section of the lateral heat pipe. 2. The heat dissipation device with heat pipes extending laterally according to claim 1, characterized in that, except for the lateral heat pipes, the heat dissipation sections of other heat pipes extend vertically and vertically, and are also pierced with heat sink. 3. The heat dissipation device with heat pipes extending laterally according to claim 2, characterized in that: the heat dissipation section is a heat pipe extending vertically and vertically, which is bent in a "U" shape, and in the shape of An accommodating space is formed between the "U"-shaped heat pipes, and a fan is arranged in the accommodating space. 4. The heat dissipation device with laterally extending heat pipes according to claim 1, wherein a fan is provided above the heat dissipation section of the lateral heat pipes. 5. The heat dissipation device with laterally extending heat pipes according to claim 1, wherein a fan is provided below the heat dissipation section of the lateral heat pipes. 6. The heat dissipation device with heat pipes extending laterally according to claim 3, 4 or 5, further comprising a windshield covering the fan.

Images