CN201138866Y - Silicon microphone with improved structure - Google Patents
Silicon microphone with improved structure Download PDFInfo
- Publication number
- CN201138866Y CN201138866Y CNU2007201596686U CN200720159668U CN201138866Y CN 201138866 Y CN201138866 Y CN 201138866Y CN U2007201596686 U CNU2007201596686 U CN U2007201596686U CN 200720159668 U CN200720159668 U CN 200720159668U CN 201138866 Y CN201138866 Y CN 201138866Y
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- CN
- China
- Prior art keywords
- wiring board
- silicon microphone
- microphone
- mems microphone
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 41
- 239000010703 silicon Substances 0.000 title claims abstract description 41
- 230000006872 improvement Effects 0.000 claims description 18
- 230000000994 depressogenic effect Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 206010061245 Internal injury Diseases 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a silicon microphone with an improved structure, which comprises two layers of circuit boards that are bonded together. One plate on one side of the bonding surface of a first circuit board is provided with a concave part; the edges of the first circuit board and a second circuit board are bonded together to form a packaging structure; the concave part and the inner surface of the second circuit board form a cavity; an MEMS microphone chip is arranged in the cavity; the packaging structure is provided with sound holes; a bonding pas is arranged outside the packaging structure. The silicon microphone not only has the advantages of simple structure and less processing procedures, but also can enhance the mechanical strength of the silicon microphone and better meet the requirements for thinning and miniaturizing the current silicon microphone.
Description
Technical field
The utility model relates to a kind of microphone packaging scheme.
Background technology
In recent years, utilize the integrated silicon microphone of MEMS (MEMS (micro electro mechanical system)) technology to begin to be applied in batches on the electronic products such as mobile phone, notebook, also begin to occur at the encapsulation technology of this product, for example the patent No. is the package design that the United States Patent (USP) of US6781231B2 has just embodied a kind of silicon microphone.This patent design utilizes the square cover of at least one conductive layer and a multilayer of a non-conductive layer composition; utilize conducting resinl to be bonded in and form a square cavity on the planar line plate; thereby the MEMS microphone chip that is installed on the cavity inside wiring board is played the environmental protection effect, can prevent that mechanical shock, hygrothermal environment destruction, electromagnetic interference etc. are bad to microphone generating.Yet, this design also is easy to generate some shortcomings, for example, the pad that MEMS microphone chip and being used to welds silicon microphone can only be installed in two faces of wiring board respectively, the flexibility of installation site is not enough, and the square cover of multilayer and wiring board are made by multiple different materials, and the different of material behavior are brought harmful effect to the assembling of silicon microphone and the reliability in the use easily.Simultaneously, a kind of silicon microphone encapsulation that all utilizes the wiring board material to make has also appearred, utilize promptly that three layers of wiring board is bonding forms a sandwich structure together, middle one deck wiring board hollow out, thereby form the cavity of silicon microphone inside, but because become a frame shape after middle one deck wiring board hollow out, the sidewall attenuation, thereby two-layer wiring board is bonding very difficult up and down, cause viscose to overflow easily in addition push-pull effort not strong, simultaneously, because the requirement of the anti-electromagnetic interference performance of silicon microphone and in order to guarantee the flexibility of MEMS microphone chip installation site, generally require three layers of wiring board conductive communication up and down, and the conductive communication up and down of this three layers of wiring board is also very difficult.
The utility model content
Technical problem to be solved in the utility model provides a kind of simple in structure, and can reach the silicon microphone of the high improvement structure of favorable mechanical Performance And Reliability.
For solving the problems of the technologies described above, the technical solution of the utility model is: the silicon microphone that improves structure, comprise the two-layer wiring board that is bonded together, wherein the plate body of the first wiring board adhesive surface, one side is provided with depressed part, the edge of described first wiring board and second wiring board bond together the encapsulating structure that forms silicon microphone, the inner surface of described depressed part and described second wiring board forms a cavity, the MEMS microphone chip is installed in the described cavity, described encapsulating structure is provided with hole, and described encapsulating structure outside is provided with pad.
As a kind of improvement, described MEMS microphone chip is installed in the depressed part inboard of described first wiring board.
As further improvement, described sound hole is located on described first wiring board and is corresponding with the position of described MEMS microphone chip; Described pad is located at described first wiring board outside.
As further improvement in the technical proposal, described sound hole comprises the horizontal component that is located at the described first wiring board inside.
As another kind of optimized technical scheme, described MEMS microphone chip is installed on described second wiring board.
As improvement of the technical scheme, described sound hole is located on described second wiring board and is corresponding with the position of described MEMS microphone chip, and described pad is located at described second wiring board outside.
As further improvement in the technical proposal, described sound hole comprises the horizontal component that is located at the described second wiring board inside.
As another optimized technical scheme, described sound hole comprises and is arranged on described first wiring board and the intrinsic passage of second wiring board, and an end of described passage is communicated to the MEMS microphone chip in the described cavity, and the other end of described passage is in communication with the outside.
As improvement of the technical scheme, described MEMS microphone chip is installed on described second wiring board, and the described second wiring board inside is provided with hole horizontal portion, and described first wiring board is provided with the sound hole vertical stretch that runs through described first wiring board.
As the further improvement of above-mentioned all technical schemes, the described first wiring board installed inside has metallic shield.
The profile of the silicon microphone of described improvement structure and the shape of described cavity preferably adopt square.
Owing to adopted technique scheme, improve the silicon microphone of structure, comprise the two-layer wiring board that is bonded together, wherein the plate body of the first wiring board adhesive surface, one side is provided with depressed part, the edge of described first wiring board and second wiring board bond together the encapsulating structure that forms silicon microphone, the inner surface of described depressed part and described second wiring board forms a cavity, the MEMS microphone chip is installed in the described cavity, described encapsulating structure is provided with hole, and described encapsulating structure outside is provided with pad; The utility model not only has characteristics simple in structure, that manufacturing procedure is few, but also can improve the mechanical strength of silicon microphone, can satisfy current demand to silicon microphone slimming and miniaturization preferably.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the structural representation of the utility model embodiment two;
Fig. 3 is the structural representation of the utility model embodiment three;
Fig. 4 is the structural representation of the utility model embodiment four;
Among the figure: 1. first wiring board; 2. second wiring board; 3. cavity; 4.MEMS microphone chip; Sound the hole; 51. sound hole horizontal portion; 52. sound hole vertical stretch; 61,62. metal wires; 71,72,73,74,75,76,77. plated-through holes; 81,82,83,84,85,86. pads.
Embodiment
Embodiment one: Fig. 1 is the structural representation of the implementation case, improve the silicon microphone of structure, comprise the first square wiring board 1 and second wiring board 2, first wiring board 1 and second wiring board 2 bond together, and the centre of first wiring board, 1 adhesive surface, one side is provided with a square depression, thereby first wiring board 1 and second wiring board 2 are in conjunction with forming a square cavity 3, the inside of cavity 3, the recess of first wiring board 1 is provided with a sound hole 5 and is used to receive the external sound signal, first wiring board, 1 inside of harmony hole 5 position correspondences is equipped with the external sound signal that a MEMS microphone chip 4 is used for receiving and is converted into the signal of telecommunication, each electrode on the MEMS microphone chip 4 is by a plurality of metal wires 61,62 are connected on first wiring board 1, the outside of second wiring board 2 is provided with a plurality of pads 81 and 82 and silicon microphone can be welded on the electronic product, and first wiring board 1 and second wiring board, 2 inside are provided with a plurality of plated-through holes 71,72 and 73 signals of telecommunication that are used for producing on the MEMS microphone chip 4 are transferred to pad.In the technical program, the structural principle of MEMS microphone chip 4 and the circuit communication technology on the wiring board all are known technologies, are not described in detail at this.First wiring board 1 and second wiring board 2 preferably use epoxide resin material to be base material.
The silicon microphone outer enclosure of the implementation case structure all adopts the wiring board material, and cloth circuits according to actual needs arbitrarily easily is so being provided with of the installation site of MEMS microphone chip and sound hole site can be easy to adjust; And adopt two-layer wiring board in conjunction with forming square encapsulation, compare the encapsulating structure of three layers of wiring board, the mechanical performance of encapsulation increases, and packaging efficiency improves, and effectively reduces the product height, has reduced the bad hidden danger that produces in installing and has reduced production cost; The MEMS microphone chip is installed in the dented space the inside of first wiring board in advance, is not easy to make the MEMS microphone chip to be subjected to physical damnification in the process of two-layer wiring board in conjunction with assembling.
Embodiment two: Fig. 2 is the structural representation of the implementation case, than case study on implementation one, the difference of the implementation case is, a plurality of pads 83 and 84 are arranged on the outside of first wiring board 1, the advantage of this case study on implementation is, signal of telecommunication transmission circuit between MEMS microphone chip 4 and a plurality of pad is comparatively simple, only plated-through hole 74 and 75 need be set at the depressed part of first wiring board 1, and the design difficulty of circuit reduces; And, sound hole 5 is provided with an elongated sound channel horizontal part 51 by the inside at first wiring board 1, the welding and the impurity such as dust in the use that can effectively prevent silicon microphone enter silicon microphone encapsulation internal injury MEMS microphone chip 4, and can regulate different sound effects by the size of regulating horizontal part 51.
Embodiment three: Fig. 3 is the structural representation of the implementation case, than case study on implementation one, the difference of the implementation case is, MEMS microphone chip 4 is installed on second wiring board, 2 medial surfaces, a plurality of pads 85 and 86 are arranged on second wiring board, 2 lateral surfaces, and sound hole 5 also is arranged on second wiring board 2 and MEMS microphone chip 4 corresponding positions.The advantage of this design is, the installation of MEMS microphone chip 4 is more or less freely, signal of telecommunication transmission circuit between MEMS microphone chip 4 and a plurality of pad is comparatively simple, only plated-through hole 74 and 75 need be set at the depressed part of first wiring board 1, and the design difficulty of circuit reduces; Simultaneously, sound hole 5 is provided with an elongated sound channel horizontal part 51 by the inside at first wiring board 1, the welding and the impurity such as dust in the use that can effectively prevent silicon microphone enter silicon microphone encapsulation internal injury MEMS microphone chip 4, and can regulate different sound effects by the size of regulating horizontal part 51.
Embodiment four: Fig. 4 is the structural representation of this enforcement four, than case study on implementation three, the difference of the implementation case is, second wiring board 2 and first wiring board, 1 bonding position are provided with a sound hole vertical stretch 52, sound hole vertical stretch 52 runs through second wiring board, 2 inside in vertical direction, one end of the sound channel horizontal part 51 that the inside of first wiring board 1 is provided with is communicated with the operatic tunes 3, other end harmony hole vertical stretch 52 is connected together in the bonding part of two wiring boards, and sound channel horizontal part 51 harmony hole vertical stretches 52 common composition sound holes 5 are used for being communicated with the operatic tunes 3 and silicon microphone package outside; The installed inside of first wiring board 1 has a metallic shield 9, and metallic shield 9 is bonded on second wiring board 2.This design has improved the convenience of sound hole opening direction, and utilizes the wiring board material can realize this design easily; Metallic shield 9 can play electromagnetic shielding action.
In general silicon microphone structure, standing have electronic devices and components such as signal amplifier, electric capacity to be used to realize functions such as amplifying signal, filtering, these type of components and parts have or not and the variation of installation site does not influence this novel creativeness, do not limit at this.
Claims (10)
1. improve the silicon microphone of structure, it is characterized in that: comprise the two-layer wiring board that is bonded together, wherein the plate body of the first wiring board adhesive surface, one side is provided with depressed part, the edge of described first wiring board and second wiring board bond together the encapsulating structure that forms silicon microphone, the inner surface of described depressed part and described second wiring board forms a cavity, the MEMS microphone chip is installed in the described cavity, and described encapsulating structure is provided with hole, and described encapsulating structure outside is provided with pad.
2. the silicon microphone of improvement structure as claimed in claim 1 is characterized in that: described MEMS microphone chip is installed in the depressed part inboard of described first wiring board.
3. the silicon microphone of improvement structure as claimed in claim 2 is characterized in that: described sound hole is located on described first wiring board and is corresponding with the position of described MEMS microphone chip; Described pad is located at described first wiring board outside.
4. the silicon microphone of improvement structure as claimed in claim 3 is characterized in that: described sound hole comprises the horizontal component that is located at the described first wiring board inside.
5. the silicon microphone of improvement structure as claimed in claim 1 is characterized in that: described MEMS microphone chip is installed on described second wiring board.
6. the silicon microphone of improvement structure as claimed in claim 5 is characterized in that: described sound hole is located on described second wiring board and is corresponding with the position of described MEMS microphone chip; Described pad is located at described second wiring board outside.
7. the silicon microphone of improvement structure as claimed in claim 6 is characterized in that: described sound hole comprises the horizontal component that is located at the described second wiring board inside.
8. the silicon microphone of improvement structure as claimed in claim 1, it is characterized in that: described sound hole comprises and is arranged on described first wiring board and the intrinsic passage of second wiring board, one end of described passage is communicated to the MEMS microphone chip in the described cavity, and the other end of described passage is in communication with the outside.
9. the silicon microphone of improvement structure as claimed in claim 8, it is characterized in that: described MEMS microphone chip is installed on described second wiring board, the described second wiring board inside is provided with hole horizontal portion, and described first wiring board is provided with the sound hole vertical stretch that runs through described first wiring board.
10. as the silicon microphone of the described improvement structure of the arbitrary claim of claim 1 to 9, it is characterized in that: the described first wiring board installed inside has metallic shield.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201596686U CN201138866Y (en) | 2007-12-24 | 2007-12-24 | Silicon microphone with improved structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201596686U CN201138866Y (en) | 2007-12-24 | 2007-12-24 | Silicon microphone with improved structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201138866Y true CN201138866Y (en) | 2008-10-22 |
Family
ID=40039545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201596686U Expired - Lifetime CN201138866Y (en) | 2007-12-24 | 2007-12-24 | Silicon microphone with improved structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201138866Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902678A (en) * | 2009-05-29 | 2010-12-01 | 美商通用微机电系统公司 | Silicon microphone package |
| CN101998752A (en) * | 2009-08-28 | 2011-03-30 | 欣兴电子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN103581814A (en) * | 2013-10-08 | 2014-02-12 | 歌尔声学股份有限公司 | Mems microphone |
| CN103607688A (en) * | 2013-11-19 | 2014-02-26 | 歌尔声学股份有限公司 | MEMS microphone making method |
| WO2014173362A1 (en) * | 2013-07-29 | 2014-10-30 | 中兴通讯股份有限公司 | Microphone encapsulation structure and terminal device |
| CN104220365A (en) * | 2012-03-29 | 2014-12-17 | 罗伯特·博世有限公司 | Cavity package design |
| CN105338455A (en) * | 2014-07-21 | 2016-02-17 | 美律电子（惠州）有限公司 | Micro-electro-mechanical-system microphone packaging structure possessing improved back cover and manufacturing method thereof |
| CN106878842A (en) * | 2017-04-27 | 2017-06-20 | 深圳市韶音科技有限公司 | A kind of wind resistance is made an uproar microphone structure |
-
2007
- 2007-12-24 CN CNU2007201596686U patent/CN201138866Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902678A (en) * | 2009-05-29 | 2010-12-01 | 美商通用微机电系统公司 | Silicon microphone package |
| US8571249B2 (en) | 2009-05-29 | 2013-10-29 | General Mems Corporation | Silicon microphone package |
| CN101902678B (en) * | 2009-05-29 | 2016-06-22 | 无锡芯奥微传感技术有限公司 | silicon microphone package |
| CN101998752A (en) * | 2009-08-28 | 2011-03-30 | 欣兴电子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN104220365A (en) * | 2012-03-29 | 2014-12-17 | 罗伯特·博世有限公司 | Cavity package design |
| CN104220365B (en) * | 2012-03-29 | 2016-08-17 | 罗伯特·博世有限公司 | Chamber encapsulation design |
| WO2014173362A1 (en) * | 2013-07-29 | 2014-10-30 | 中兴通讯股份有限公司 | Microphone encapsulation structure and terminal device |
| CN103581814A (en) * | 2013-10-08 | 2014-02-12 | 歌尔声学股份有限公司 | Mems microphone |
| CN103607688A (en) * | 2013-11-19 | 2014-02-26 | 歌尔声学股份有限公司 | MEMS microphone making method |
| CN105338455A (en) * | 2014-07-21 | 2016-02-17 | 美律电子（惠州）有限公司 | Micro-electro-mechanical-system microphone packaging structure possessing improved back cover and manufacturing method thereof |
| CN105338455B (en) * | 2014-07-21 | 2018-11-09 | 美律电子（惠州）有限公司 | Have the micro-electro-mechanical microphone packaging structure and its preparation method of Improvement type back-cover |
| CN106878842A (en) * | 2017-04-27 | 2017-06-20 | 深圳市韶音科技有限公司 | A kind of wind resistance is made an uproar microphone structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081022 |
|
| CX01 | Expiry of patent term |