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CN201123130Y - Sheet type internal coating electret microphone - Google Patents

Sheet type internal coating electret microphone Download PDF

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Publication number
CN201123130Y
CN201123130Y CNU2007201593086U CN200720159308U CN201123130Y CN 201123130 Y CN201123130 Y CN 201123130Y CN U2007201593086 U CNU2007201593086 U CN U2007201593086U CN 200720159308 U CN200720159308 U CN 200720159308U CN 201123130 Y CN201123130 Y CN 201123130Y
Authority
CN
China
Prior art keywords
circuit board
supporter
electret
base
undercoating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007201593086U
Other languages
Chinese (zh)
Inventor
赵笃仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Gettop Acoustic Co Ltd
Original Assignee
WEIFANG GONGDA TELECOMMUNICATIONS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WEIFANG GONGDA TELECOMMUNICATIONS CO Ltd filed Critical WEIFANG GONGDA TELECOMMUNICATIONS CO Ltd
Priority to CNU2007201593086U priority Critical patent/CN201123130Y/en
Application granted granted Critical
Publication of CN201123130Y publication Critical patent/CN201123130Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a chip internal coating electret microphone, which comprises a base seat and a circuit board, wherein a supporting body is connected between the base seat and the circuit board, an inner cavity is arranged on the supporting body, a parallel plate capacitor is installed in the inner cavity, a polar plate of the parallel plate capacitor comprising a back polar plate and an electret film fixed and connected with the back polar plate, and the other polar plate comprising a vibrating membrane and a metallic coating fixed and connected with the vibrating membrane form two polar plates of the parallel plate capacitor and are electrically connected with a field effect transistor through the respective conducting circuits. The chip internal coating electret microphone is structurally characterized in that the base seat, the circuit board and the supporting body all present square piece shapes, the inner cavity of the supporting body is the center hole arranged at the central part of the supporting body, and a metal conducting layer and an insulating inner coating are fixed and connected on the hole wall of the center hole in sequence. The chip internal coating electret microphone has the advantages that the positioning is easy during the assembly process, the placement is convenient, the production efficiency is high, the product realizes ultra-thin miniaturization, and the microphone is suitable for the complete machine equipment with smaller inner space.

Description

Chip undercoating electret microphone
Technical field
The utility model relates to a kind of electret microphone, particularly a kind of chip undercoating electret microphone.
Background technology
Electret microphone is a kind of sound a---power conversion device, is used for voice signal is converted to the signal of telecommunication, is widely used in mobile phone, computer, telephone set, earphone, intercom, radio-cassette player or other whole set equipment.Traditional electret microphone, its shape is cylindrical.Demand and development of technology along with market, electret microphone develops towards the direction of miniaturization, and overall dimension is very little, and traditional electret microphone is because cylindrical, its drawback is: 1, location difficulty when microphone and whole set equipment assembling is prone to the not corresponding or skew short circuit of pad; 2, be respectively each monomer to be assembled separately and edge sealing when making, efficient is low.
Summary of the invention
The purpose of this utility model provides a kind of chip undercoating electret microphone easy, that production efficiency is high of locating.
In order to realize above-mentioned purpose, the chip undercoating electret microphone that is provided, comprise base that has base sound hole and the circuit board that has field effect transistor, between base and circuit board, be connected with supporter, one inner chamber is arranged on the supporter, plane-parallel capacitor is housed in the inner chamber, a pole plate of this plane-parallel capacitor includes back pole plate and the electret film that in advance be filled with electric charge affixed with back pole plate, another pole plate includes the vibrating diaphragm and the coat of metal affixed with vibrating diaphragm, the galvanic circle that two pole plates of formation plane-parallel capacitor pass through respectively separately is electrically connected with the field effect transistor formation, wherein a galvanic circle is connected with the grid of field effect transistor, another galvanic circle is connected with the source electrode of field effect transistor, back pole plate is provided with the backplane plate hole, electret film is provided with the electret film hole, its design feature is a base, circuit board and supporter are to be square shape sheet, the inner chamber of described supporter is the centre bore that is provided with in the centre of supporter, be connected with metal conducting layer and insulation undercoating on the hole wall of this centre bore successively, in two galvanic circles, wherein one is polar ring, another is by electric conductor, base and metal conducting layer constitute, and are provided with the conduction body opening on electric conductor.
For the associated components that is contained in two conductive paths of formation in the supporter inner chamber is closely connected, above-mentioned electric conductor is an elastic electric conductor, and this elastic electric conductor can be a spring pad, also can be other metallic elastic body.
To be fixed together in order making between base, supporter, the circuit board three, to be provided with the glue-line that is fixed on the supporter lateral surface between base and the circuit board.
The operation principle of chip undercoating electret microphone provided by the utility model is: the sound wave of sound is through base sound hole, the conduction body opening enters the centre bore of supporter, sound wave makes the vibrating diaphragm vibration, change the distance between plane-parallel capacitor two parallel-plates, make the change of capacitance correspondence, because electret film is filled with stable electric charge in advance, the change of capacitance causes the change of the voltage value correspondence at plane-parallel capacitor two ends, the coat of metal is passed through in the change of voltage value, polar ring and electric conductor, base, two galvanic circles of metal conducting layer are added between the grid and source electrode of field effect transistor, field effect transistor work, after field effect transistor was amplified, signal was delivered to whole set equipment from the output of microphone.
Chip undercoating electret microphone provided by the utility model, because base, circuit board and supporter are to be square shape sheet, its beneficial effect is: 1, locate easily, conveniently mount when assembling, the not corresponding or skew short circuit of pad can not occur; 2, can on a big substrate, unify to assemble, bonding, cut apart, be easy to realize in enormous quantities, high density production by automatic production line, improved production efficiency; 3, product has been realized ultra-thin microminiaturization, is applicable to the whole set equipment that the inner space is littler.
Description of drawings
Embodiment of the present utility model is illustrated in conjunction with the accompanying drawings, wherein:
Fig. 1 is the perspective view of the described chip undercoating of embodiment electret microphone;
Fig. 2 is the A-A cutaway view Amplified image of Fig. 1.
Among the figure: 1 is base sound hole, and 2 is base, and 3 is circuit board, 4 is supporter, and 5 is centre bore, and 6 is metal conducting layer, 7 are the insulation undercoating, and 8 is back pole plate, and 9 is electret film, 10 is pad, and 11 is vibrating diaphragm, and 12 is the coat of metal, 13 is polar ring, and 14 is the backplane plate hole, and 15 is the electret film hole, 16 is electric conductor, and 17 are the conduction body opening, and 18 is glue-line.
Embodiment
With reference to accompanying drawing, chip undercoating electret microphone, comprise base 2 that has base sound hole 1 and the circuit board 3 that has field effect transistor, between base 2 and circuit board 3, be connected with supporter 4, supporter 4 usefulness insulating material are made, base 2, circuit board 3 and supporter 4 are to be square shape sheet, be provided with centre bore 5 in the centre of supporter 4, this centre bore 5 can be a circular hole, it also can be square hole, be connected with metal conducting layer 6 and insulation undercoating 7 on the hole wall of this centre bore 5 successively, according to base 2 to the trend of circuit board 3 back pole plate 8 is housed successively in the centre bore 5, pad 10, vibrating diaphragm 11 and polar ring 13, vibrating diaphragm 11 is affixed with polar ring 13, wherein be connected with the electret film 9 that is filled with electric charge in advance on the back pole plate 8, be connected with the coat of metal 12 on the vibrating diaphragm 11, back pole plate 8 and electret film 9, the vibrating diaphragm 11 and the coat of metal 12 constitute two pole plates of plane-parallel capacitor respectively, the position of these two pole plates can exchange, the coat of metal 12 is electrically connected with the grid or the source electrode formation of field effect transistor by polar ring 13, back pole plate 8 is provided with backplane plate hole 14, back pole plate 8 is by an electric conductor 16, base 2 and metal conducting layer 6 are electrically connected with the source electrode or the grid formation of field effect transistor, on electric conductor 16, be provided with conduction body opening 17, electric conductor 16 is elastic electric conductors, this elastic electric conductor can be a spring pad, it also can be other metallic elastic body, that accompanying drawing draws is the former, and electret film 9 is provided with electret film hole 15.
To be fixed together in order making between base 2, supporter 4, circuit board 3 threes, to be provided with the glue-line 18 that is fixed on supporter 4 lateral surfaces between base 2 and the circuit board 3.

Claims (4)

1, a kind of chip undercoating electret microphone, comprise base (2) that has base sound hole (1) and the circuit board (3) that has field effect transistor, between base (2) and circuit board (3), be connected with supporter (4), supporter has an inner chamber on (4), plane-parallel capacitor is housed in the inner chamber, a pole plate of this plane-parallel capacitor includes back pole plate (8) and the electret film that in advance be filled with electric charge (9) affixed with back pole plate (8), another pole plate includes the vibrating diaphragm (11) and the coat of metal (12) affixed with vibrating diaphragm (11), the galvanic circle that two pole plates of formation plane-parallel capacitor pass through respectively separately is electrically connected with the field effect transistor formation, wherein a galvanic circle is connected with the grid of field effect transistor, another galvanic circle is connected with the source electrode of field effect transistor, back pole plate (8) is provided with backplane plate hole (14), electret film (9) is provided with electret film hole (15), it is characterized in that base (2), circuit board (3) and supporter (4) are to be square shape sheet, the inner chamber of described supporter (4) is the centre bore (5) that is provided with in the centre of supporter (4), be connected with metal conducting layer (6) and insulation undercoating (7) on the hole wall of this centre bore (5) successively, in two galvanic circles, wherein one is polar ring (13), another is by electric conductor (16), base (2) and metal conducting layer (6) constitute, and are provided with conduction body opening (17) on electric conductor (16).
2, chip undercoating electret microphone according to claim 1 is characterized in that electric conductor (16) is an elastic electric conductor.
3, chip undercoating electret microphone according to claim 2 is characterized in that this elastic electric conductor is a spring pad.
4,, it is characterized in that being provided with the glue-line (18) that is fixed on supporter (4) lateral surface between base (2) and the circuit board (3) according to claim 1,2 or 3 described chip undercoating electret microphones.
CNU2007201593086U 2007-12-07 2007-12-07 Sheet type internal coating electret microphone Expired - Lifetime CN201123130Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007201593086U CN201123130Y (en) 2007-12-07 2007-12-07 Sheet type internal coating electret microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007201593086U CN201123130Y (en) 2007-12-07 2007-12-07 Sheet type internal coating electret microphone

Publications (1)

Publication Number Publication Date
CN201123130Y true CN201123130Y (en) 2008-09-24

Family

ID=40010370

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007201593086U Expired - Lifetime CN201123130Y (en) 2007-12-07 2007-12-07 Sheet type internal coating electret microphone

Country Status (1)

Country Link
CN (1) CN201123130Y (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 69, Longquan street, Fangzi District, Shandong, Weifang Province, 261206

Patentee after: Shandong Gettop Acoustic Co.,Ltd.

Address before: 69, Longquan street, Fangzi District, Shandong, Weifang Province, 261206

Patentee before: Weifang Gongda Telecommunications Co., Ltd.

C56 Change in the name or address of the patentee

Owner name: SHANDONG GONGDA ELECTROACOUSTIC CO., LTD.

Free format text: FORMER NAME: WEIFANG GONGDA TELECOMMUNICATION CO., LTD.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20080924