CN201129679Y - LED lamp panel structure with patch type support - Google Patents
LED lamp panel structure with patch type support Download PDFInfo
- Publication number
- CN201129679Y CN201129679Y CNU2007200615143U CN200720061514U CN201129679Y CN 201129679 Y CN201129679 Y CN 201129679Y CN U2007200615143 U CNU2007200615143 U CN U2007200615143U CN 200720061514 U CN200720061514 U CN 200720061514U CN 201129679 Y CN201129679 Y CN 201129679Y
- Authority
- CN
- China
- Prior art keywords
- led lamp
- led
- positive
- led wafer
- binding post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H10W72/00—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
技术领域:Technical field:
本实用新型涉及发光二极管(LED)技术领域,特指一种具有贴片式支架的LED灯板结构。The utility model relates to the technical field of light-emitting diodes (LEDs), in particular to an LED lamp board structure with patch brackets.
背景技术:Background technique:
发光二极管(LED)是一种半导体固体发光器件,它是利用固体半导体晶片作为发光材料,当两端加上正向电压,半导体中的载流子发生复合引起光子发射而产生光,是当今最热门的光源技术,LED光源的特点是:节能:消耗能量较同光效的白炽灯减少80%;使用低压电源(在6-24V之间),安全性好;体积小,可以制备成各种形状的器件;寿命长;响应时间快:白炽灯的响应时间为毫秒级,LED灯的响应时间为纳秒级;无有害金属汞对环境的污染等,随着大功率LED灯的开发应用,LED灯已从点光源向功能性照明的方向发展,发展前景无比广阔。Light-emitting diode (LED) is a semiconductor solid light-emitting device. It uses a solid semiconductor wafer as a light-emitting material. When a forward voltage is applied to both ends, the carriers in the semiconductor recombine to cause photon emission to generate light. It is the most The popular light source technology, the characteristics of LED light source are: energy saving: energy consumption is reduced by 80% compared with incandescent lamps with the same light effect; using low voltage power supply (between 6-24V), good safety; small size, can be prepared into various Shaped devices; long life; fast response time: the response time of incandescent lamps is milliseconds, and that of LED lamps is nanoseconds; no harmful metal mercury pollutes the environment, etc. With the development and application of high-power LED lamps, LED lights have developed from point light sources to functional lighting, and the development prospects are extremely broad.
参见图1,目前的发光二极管或称LED灯,是由两条腿式的支架1(或正负极插脚)及设于支架1上的碗杯中的晶片2,覆盖晶片2上的荧光粉4和封装晶片2的环氧树脂5组成,晶片2通过其正负极引线3与支架1分别连接,其缺点:一是支架1为线材支架,其导热性差,晶片2发出的光和热使得荧光粉4加速老化,导致白光二极管的色温稳定性变差、产品使用寿命降低;二是不能实现机械化生产,一般的LED灯板都是由多个LED灯单体组成,生产LED灯板时,需要先将LED灯单体的正负极插脚1(两根或四根)用手工插入电路板的插孔内,再人工进行焊接,这样的生产方法,易导致产品质量不稳定,成品率低,生产效率低,生产成本高;三是在支架1上的正负极连接处,为了焊接质量及导热好而设置有镀金层,但是终因支架1的散热面积有限,使得散热效果不好,镀金层使生产成本进一步提高。Referring to Fig. 1, the current light-emitting diode or LED lamp is composed of a two-legged support 1 (or positive and negative pins) and a
发明内容:Invention content:
本实用新型的目的是提供一种散热良好、产品质量稳定、生产成本低、可机械化生产的具有贴片式支架的LED灯板结构。The purpose of the utility model is to provide an LED lamp panel structure with a chip-type bracket that has good heat dissipation, stable product quality, low production cost and can be mechanized.
本实用新型是这样实现的:具有贴片式支架的LED灯板结构,其特征在于将两片互不电连接的金属板作为LED灯的正负极接线端子,设置在同一平面内,在其中一片极板上居中设置有碗杯状凹槽,凹槽的底部可有一贯通孔或无贯通孔,LED晶片设置在凹槽的中部,LED晶片的正负极分别与金属板的接线端子电连接,在LED晶片的外侧设置一层实心或中空的透明罩,在LED晶片与透明罩之间可以设置、也可以不设置一层荧光粉,LED灯的LED晶片部分设置在基板上的通孔的中心后,将LED灯的正负极接线端子与基板的PCB线路的正负极金属层电连接。The utility model is realized in the following way: the structure of the LED lamp board with a patch type bracket is characterized in that two metal plates that are not electrically connected to each other are used as the positive and negative terminals of the LED lamp, and are arranged in the same plane. There is a cup-shaped groove in the center of a plate, and the bottom of the groove may have a through hole or no through hole. The LED chip is set in the middle of the groove, and the positive and negative poles of the LED chip are electrically connected to the terminals of the metal plate. A solid or hollow transparent cover is arranged on the outside of the LED chip, a layer of phosphor powder may or may not be provided between the LED chip and the transparent cover, and the LED chip part of the LED lamp is arranged in the through hole on the substrate. After centering, electrically connect the positive and negative terminals of the LED lamp to the positive and negative metal layers of the PCB circuit on the substrate.
上述的冲制有碗杯状凹槽的金属板上的凹槽附近及其另一块金属板靠近凹槽的部分,向上设置为凸台,LED晶片的正负极连接在凸台上。The vicinity of the groove on the above-mentioned metal plate punched with a cup-shaped groove and the part of another metal plate close to the groove are set upward as a boss, and the positive and negative poles of the LED chip are connected to the boss.
上述的两片金属板接线端子可以分别向外侧延伸成正负极单接线端子,也可以将两片金属板接线端子的每片接线端子分别向两侧延伸成正极双接线端子和负极双接线端子。The above-mentioned two-piece metal plate terminal can be extended to the outside to form a positive and negative single terminal, or each terminal of the two metal plate terminals can be extended to both sides to form a positive double terminal and a negative double terminal. .
上述的金属板是用铜材或其它散热好的金属材质制成的,所述的基板是用金属材质或普通的PVC材料制成的。The metal plate above is made of copper or other metal materials with good heat dissipation, and the substrate is made of metal or common PVC material.
上述的透明罩是用透明的塑料、环氧树脂、硅胶、玻璃、陶瓷材料之一制造的。Above-mentioned transparent cover is made of one of transparent plastics, epoxy resin, silica gel, glass, pottery material.
上述的在每个凹槽的中部设置的LED晶片至少有一个,所述的基板上的通孔至少有两个,在基板的每个通孔上的正面或正反两面上设置有LED灯形成LED灯板。There is at least one LED chip arranged in the middle of each groove, there are at least two through holes on the substrate, and LED lamps are arranged on the front or both sides of each through hole of the substrate to form LED light board.
上述的碗杯状凹槽的底部有一贯通孔时,则贯通孔的两侧均设置成碗杯状凹槽。When there is a through-hole at the bottom of the above-mentioned bowl-cup-shaped groove, both sides of the through-hole are provided with a bowl-cup-shaped groove.
本实用新型可用于制作发光灯具、光源模块、LCD液晶显示器背光源。The utility model can be used for making light-emitting lamps, light source modules, and backlight sources for LCD liquid crystal displays.
本实用新型相比现有技术突出的优点是:Compared with the prior art, the outstanding advantages of the utility model are:
1、本实用新型将两片金属板作为LED的正负极接线端子20、30,由于金属板的焊接面积大,LED晶片的热量可迅速导入PCB线路板散热,属于直接散热,散热效果极佳,可大幅度降低晶片热量及增加LED灯的光通量及使用寿命。1. The utility model uses two metal plates as the positive and
2、本实用新型的贴片式LED支架可焊接于双面线路PCB上使其在基板的双面发光,也可焊接于单面线路PCB上使其在基板的单面发光。2. The SMD LED bracket of the present invention can be welded on a double-sided circuit PCB to make it emit light on both sides of the substrate, and can also be welded on a single-sided circuit PCB to make it emit light on one side of the substrate.
3、将支架上的碗杯状凹槽的底面冲制成有贯通孔的碗杯,将LED晶片封装于该碗杯的中心位置并焊接于有通孔的PCB上后,也可以使其在基板的双面发光。3. Punch the bottom surface of the cup-shaped groove on the bracket to make a cup with a through hole. After packaging the LED chip in the center of the cup and soldering it to the PCB with a through hole, it can also be used in the Both sides of the substrate emit light.
4、在将LED灯单体焊接到PCB线路板上之前,可用分光机进行分光,将接近同一光波或同一颜色的LED灯单体根据需要焊接在PCB线路上,使LED灯板的色温的一致性好。4. Before soldering the LED lamp unit to the PCB circuit board, a spectrometer can be used to split the light, and the LED lamp unit that is close to the same light wave or the same color is welded on the PCB circuit as needed, so that the color temperature of the LED lamp board is consistent. Good sex.
5、用贴片式支架制作的LED灯单体可用自动插件机及自动焊接机制作LED灯板,可实现LED灯板的自动化、批量化生产,产品质量优良、稳定。5. The LED light unit made of patch bracket can be used to make LED light boards with automatic plug-in machine and automatic welding machine, which can realize the automation and mass production of LED light boards, and the product quality is excellent and stable.
6、本实用新型可作为新一代LED光源应用在各种发光灯具上,也可以制成各种光源模块及LCD液晶显示器之背光源。6. The utility model can be used as a new generation of LED light source in various lighting fixtures, and can also be made into various light source modules and backlight sources for LCD liquid crystal displays.
附图说明:Description of drawings:
图1是现有技术的结构剖视图;Fig. 1 is a structural sectional view of the prior art;
图2是本实用新型实施例1中当金属板接线端子向外侧分别延伸成正负极单接线端子碗杯状凹槽的底部没有贯通孔时的支架结构正面的立体图;Fig. 2 is a perspective view of the front of the bracket structure when the metal plate terminals extend outwards respectively into positive and negative single terminal bowl cup-shaped grooves with no through holes in the bottom of the
图3是本实用新型实施例1的背面立体图;Fig. 3 is the rear perspective view of the
图4是本实用新型实施例1的主视图;Fig. 4 is the front view of the
图5是图4的A-A向剖视图;Fig. 5 is the A-A direction sectional view of Fig. 4;
图6是本实用新型实施例2中当金属板接线端子分别向两侧延伸成正极双接线端子和负极双接线端子、碗杯状凹槽的底部没有贯通孔时的支架结构正面的立体图;Fig. 6 is a perspective view of the front of the bracket structure when the metal plate terminals extend to both sides to form a positive double terminal and a negative double terminal respectively, and there is no through hole at the bottom of the cup-shaped groove in the second embodiment of the utility model;
图7是本实用新型实施例2的背面立体图;Fig. 7 is the rear perspective view of the
图8是本实用新型实施例2的主视图;Fig. 8 is the front view of the
图9是图8的A-A向剖视图;Fig. 9 is a sectional view along A-A direction of Fig. 8;
图10是本实用新型实施例3中当金属板接线端子向外侧分别延伸成正负极单接线端子、碗杯状凹槽的底部有一贯通孔时的支架结构正面的立体图;Fig. 10 is a perspective view of the front of the bracket structure when the metal plate terminals extend to the outside to form positive and negative single terminals respectively, and there is a through hole at the bottom of the cup-shaped groove in
图11是本实用新型实施例3的背面立体图;Fig. 11 is the rear perspective view of the
图12是本实用新型实施例3的主视图;Fig. 12 is the front view of the
图13是图12的A-A向剖视图;Fig. 13 is a sectional view along A-A of Fig. 12;
图14是本实用新型实施例3的剖视图;Fig. 14 is a sectional view of
图15是本实用新型实施例1的成品立体示意图之一;Fig. 15 is one of the three-dimensional schematic diagrams of the finished product of
图16是本实用新型实施例1的成品立体示意图之二;Fig. 16 is the second three-dimensional schematic diagram of the finished product of
图17是本实用新型实施例2的成品立体示意图之一;Fig. 17 is one of the three-dimensional schematic diagrams of the finished product of
图18是本实用新型实施例2的成品立体示意图之二;Fig. 18 is the second three-dimensional schematic diagram of the finished product of
图19是本实用新型的工艺流程简图;Fig. 19 is a schematic diagram of the technical process of the present utility model;
图20是本实用新型的生产工艺中支架的主视图;Fig. 20 is the front view of the support in the production process of the present utility model;
图21是本实用新型的生产工艺中支架的右视图;Fig. 21 is the right side view of the bracket in the production process of the present utility model;
图22是本实用新型的生产工艺中支架的仰视图;Fig. 22 is the bottom view of the support in the production process of the present utility model;
图23是本实用新型的生产工艺中模板的主视图;Fig. 23 is the front view of the template in the production process of the present utility model;
图24是本实用新型的生产工艺中模板的右视图;Fig. 24 is the right side view of template in the production process of the present utility model;
图25是本实用新型的生产工艺中模板的仰视图;Fig. 25 is the bottom view of the template in the production process of the present utility model;
图26是本实用新型制作的背光板的立体示意图;Fig. 26 is a three-dimensional schematic diagram of a backlight panel made by the utility model;
图27是本实用新型制作的单面发光的LED灯板的立体示意图;Fig. 27 is a three-dimensional schematic diagram of a single-sided light-emitting LED lamp panel produced by the utility model;
图28是本实用新型制作的双面发光的LED灯板的立体示意图。Fig. 28 is a three-dimensional schematic diagram of a double-sided light-emitting LED lamp panel produced by the present invention.
具体实施方式:Detailed ways:
下面以具体实施例对本实用新型作进一步描述:The utility model is described further below with specific embodiment:
实施例1:参见图2-5、图15-16:具有贴片式支架的LED灯板结构,其特征在于将两片互不电连接的金属板作为LED灯的正负极接线端子20、30,设置在同一平面内,在其中的一片极板20上居中设置有碗杯状凹槽101,LED晶片50设置在凹槽101的中部,LED晶片50的正负极51分别与金属板接线端子20、30电连接,在LED晶片50的外侧设置一层实心或中空的透明罩40,在LED晶片50与透明罩40之间可以设置、也可以不设置一层荧光粉,LED灯的LED晶片50部分设置在基板60上的通孔61的中心后,将LED灯的正负极接线端子20、30与基板60的PCB线路的正负极金属层电连接,在LED晶片50与透明罩40之间设置一层荧光粉时,则可成为发白光的LED灯,在LED晶片50与透明罩40不设置一层荧光粉时,则可视电流的大小成为不同颜色的LED灯。Embodiment 1: Refer to Fig. 2-5, Fig. 15-16: LED lamp board structure with patch bracket, which is characterized in that two metal plates that are not electrically connected to each other are used as the positive and
上述的冲制有碗杯状凹槽101的金属板20上的凹槽101附近及其另一块金属板30靠近凹槽101的部分,向上设置为凸台,LED晶片50的正负极51连接在凸台上。The vicinity of the
上述的两片金属板接线端子20、30可以分别向外侧延伸成正负极单接线端子20、30,这样可制作大、中、小功率的LED灯。The above-mentioned two pieces of metal
上述的金属板20、30是用铜材制成的,铜材的导电性及散热效果好,当然,也可以用其它散热好的金属材质制作,上述的基板60是用铝材制成的,铝材的价格便宜,当然,也可以用其它金属材料或普通的PVC材料制作。The above-mentioned
上述的透明罩40是用透明的塑料、环氧树脂、硅胶、玻璃、陶瓷材料之一制造的。The above-mentioned
上述的在每个凹槽101的中部设置的LED晶片50至少有一个,所述的基板60上的通孔61至少有两个,在基板60的每个通孔61上的正面或正反两面上设置有LED灯形成单面或双面LED灯板。There is at least one
具有贴片式支架的LED灯板的用途,可用于制作发光灯具(例如:图27为单面发光的LED灯板的立体示意图,图28是双面发光的LED灯板的立体示意图),光源模块、LED液晶显示器背光源(参见图26)。The purpose of the LED light board with patch bracket can be used to make light-emitting lamps (for example: Figure 27 is a three-dimensional schematic diagram of an LED light board that emits light on one side, and Figure 28 is a three-dimensional schematic diagram of an LED light board that emits light on both sides), the light source module, LED LCD backlight (see Figure 26).
实施例2:参见图6-9、图17-18:本实施例的基本结构、生产工艺及产品的用途与实施例1相同,不同点在于将两片金属板接线端子的每片接线端子20、30分别向两侧延伸成正极双接线端子20和负极双接线端子30,该结构适用于制造中功率或大功率LED灯或灯板,因为正极双接线端子20和负极双接线端子30与基板60焊接后,便于更大量的将LED晶片50工作时所发出的热量快速散去,以保持产品的稳定、长效的工作状态。Embodiment 2: Refer to Fig. 6-9, Fig. 17-18: the basic structure, production process and product use of this embodiment are the same as those of
实施例3:参见图10-14、图19-25:本实施例的基本结构、生产工艺及产品的用途与实施例1相同,不同点在于在碗杯状凹槽101的底部冲制成一贯通孔102,并将贯通孔102的两侧均设置成碗杯状凹槽,这样,将LED晶片50封装在有贯通孔102的碗杯状凹槽101上后,LED晶片50在凹槽101的两面均可发光,即可制成双面发光的LED灯70及LED灯板80,该结构为大、中、小功率的双面发光的LED灯70或LED灯板80。Embodiment 3: See Figures 10-14 and Figures 19-25: the basic structure, production process and product usage of this embodiment are the same as those of
将实施例3中的两片金属板接线端子的每片接线端子20、30分别向两侧延伸成正极双接线端子20和负极双接线端子30,则可制造成中功率或大功率的LED灯70或LED灯板80。Extend each piece of
本实用新型的生产工艺:参见图19-25:,包括有如下步骤:The production process of the present utility model: referring to Fig. 19-25:, includes the following steps:
1、在冲制成型的支架的碗杯状凹槽101上固定LED晶片50,并将LED晶片50的正负极51分别焊接在两片金属板20、30的凸台上;1. Fix the
2、在LED晶片50的单面或双面点制荧光粉,将第一步制作完成的带有LED晶片50的支架(参见图20-22)设置在专用模条(参见图23-25)上,灌注透明胶形成单面或双面透明罩40;2. Dot phosphor powder on one side or both sides of the
3、将第二步制作完成的LED灯单体70(参见图15-18)利用分光机进行分光,并按接近同一光波或同一颜色的LED灯单体70集中放置;3. Use a spectrometer to split the light of the LED lamp monomers 70 (see Figures 15-18) produced in the second step, and place them together according to the
4、利用SMT自动插件机将第三步分拣出的LED灯单体70(设计的波长或颜色)的正负极20、30自动焊接在基板60的PCB线路的正负极金属层上,形成LED灯板80。4. Use the SMT automatic plug-in machine to automatically weld the positive and
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200615143U CN201129679Y (en) | 2007-12-10 | 2007-12-10 | LED lamp panel structure with patch type support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200615143U CN201129679Y (en) | 2007-12-10 | 2007-12-10 | LED lamp panel structure with patch type support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201129679Y true CN201129679Y (en) | 2008-10-08 |
Family
ID=40017529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200615143U Expired - Fee Related CN201129679Y (en) | 2007-12-10 | 2007-12-10 | LED lamp panel structure with patch type support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201129679Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922627A (en) * | 2010-06-08 | 2010-12-22 | 珠海市经典电子有限公司 | Metal base LED unit assembled lamp panel technology and lamp panel device |
| CN104218142A (en) * | 2014-09-11 | 2014-12-17 | 朱衡 | Direct inserting type packaging structure for LED lamp bead |
| CN105914132A (en) * | 2016-03-14 | 2016-08-31 | 王志敏 | Paster diode gluing technology |
| CN106025044A (en) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | Wavelength conversion device, backlight unit, and display device |
| CN106500005A (en) * | 2016-10-31 | 2017-03-15 | 中山市荣亮照明有限公司 | mirror headlight |
| CN107208843A (en) * | 2014-12-31 | 2017-09-26 | 首尔伟傲世有限公司 | Board mounting type LED light source device |
| CN110286520A (en) * | 2019-05-29 | 2019-09-27 | 深圳市赛时达光电科技有限公司 | Quantum dot backlight and display device with it |
-
2007
- 2007-12-10 CN CNU2007200615143U patent/CN201129679Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922627A (en) * | 2010-06-08 | 2010-12-22 | 珠海市经典电子有限公司 | Metal base LED unit assembled lamp panel technology and lamp panel device |
| CN101922627B (en) * | 2010-06-08 | 2011-12-21 | 珠海市经典电子有限公司 | Metal base LED unit assembled lamp panel technology and lamp panel device |
| CN104218142A (en) * | 2014-09-11 | 2014-12-17 | 朱衡 | Direct inserting type packaging structure for LED lamp bead |
| CN104218142B (en) * | 2014-09-11 | 2017-06-20 | 朱衡 | A kind of direct insertion LED lamp bead encapsulating structure |
| CN107208843A (en) * | 2014-12-31 | 2017-09-26 | 首尔伟傲世有限公司 | Board mounting type LED light source device |
| CN105914132A (en) * | 2016-03-14 | 2016-08-31 | 王志敏 | Paster diode gluing technology |
| CN105914132B (en) * | 2016-03-14 | 2018-11-16 | 王志敏 | A kind of photoresist coating process of stamp-mounting-paper diode |
| CN106025044A (en) * | 2016-04-19 | 2016-10-12 | 苏州星烁纳米科技有限公司 | Wavelength conversion device, backlight unit, and display device |
| CN106025044B (en) * | 2016-04-19 | 2019-07-26 | 苏州星烁纳米科技有限公司 | Wavelength conversion devices, back light unit and display device |
| CN106500005A (en) * | 2016-10-31 | 2017-03-15 | 中山市荣亮照明有限公司 | mirror headlight |
| CN110286520A (en) * | 2019-05-29 | 2019-09-27 | 深圳市赛时达光电科技有限公司 | Quantum dot backlight and display device with it |
| CN110286520B (en) * | 2019-05-29 | 2022-11-25 | 深圳赛时达科技有限公司 | Quantum dot backlight source and display device with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101187458A (en) | LED lamp panel structure with patch type support and production process thereof | |
| CN201129679Y (en) | LED lamp panel structure with patch type support | |
| CN202546668U (en) | Lighting device and driving structure thereof | |
| WO2014106462A2 (en) | Welding-free smd led light fixture structure | |
| CN103904071B (en) | A kind of manufacturing process of transparency carrier LED lamp bar | |
| CN107289342A (en) | Light-emitting diode bulb | |
| CN104110598A (en) | Flexible led light source | |
| CN112366201B (en) | High-power light source packaging structure and manufacturing method thereof | |
| CN107331756A (en) | A kind of radiator and chip integrative packaging light-source structure | |
| CN203309586U (en) | LED (Light Emitting Diode) light source module based on printed circuit board | |
| CN106895282A (en) | Fluorescence membrane is used for the method that LED filament makes bulb lamp | |
| CN216958028U (en) | Side-emitting thermoelectric separation LED assembly | |
| CN102364684A (en) | LED (Light-Emitting Diode) module and manufacturing process thereof | |
| CN201584409U (en) | Light-emitting diode chip carrier structure | |
| CN204099939U (en) | Flexible LED light source and use the light fixture of this light source | |
| CN104235663A (en) | Production process of flexible LED (Light Emitting Diode) strip lamp | |
| CN213692046U (en) | A high-power light source package structure | |
| CN103307483A (en) | LED light source module based on printed circuit board | |
| CN208794073U (en) | LED filament and lamps and lanterns | |
| KR101278835B1 (en) | Led pcb substrate, pcb, led unit, lighting and its manufacture | |
| CN103872032B (en) | Three-dimensional LED illuminator and its processing method | |
| TW200941753A (en) | LED light panel structure having a patch bracket | |
| CN207438198U (en) | LED Filament Lamp | |
| CN107394033A (en) | LED filament manufacturing process and LED filament | |
| CN207097866U (en) | Light-emitting diode chip for backlight unit module and lamp device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081008 Termination date: 20111210 |