CN201113136Y - Chip Module Combination - Google Patents
Chip Module Combination Download PDFInfo
- Publication number
- CN201113136Y CN201113136Y CNU2007200447561U CN200720044756U CN201113136Y CN 201113136 Y CN201113136 Y CN 201113136Y CN U2007200447561 U CNU2007200447561 U CN U2007200447561U CN 200720044756 U CN200720044756 U CN 200720044756U CN 201113136 Y CN201113136 Y CN 201113136Y
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- Prior art keywords
- chip module
- side wall
- sidewall
- insulating body
- elastic arm
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Abstract
一种芯片模块组合,包括芯片模块与可将芯片模块连接至电路板的电连接器,电连接器包括容设有若干导电端子的绝缘本体,绝缘本体设有大致成平板状的底壁以及沿底壁垂直向上延伸的侧壁,侧壁进一步设有第一侧壁、与第一侧壁相对的第三侧壁、与第一侧壁相邻的第二侧壁及第四侧壁,第一侧壁与第三侧壁设有弹性臂,弹性臂设有抵接部,芯片模块设有靠近侧壁的边缘区,边缘区对应所述抵接部设有凹槽,所述凹槽内设有断差部,其中,芯片模块安装至绝缘本体后,抵接部抵靠于断差部上方从而将芯片模块限位于绝缘本体内。
A chip module combination, including a chip module and an electrical connector capable of connecting the chip module to a circuit board. The electrical connector includes an insulating body accommodating a plurality of conductive terminals. The bottom wall is a side wall extending vertically upwards, the side wall is further provided with a first side wall, a third side wall opposite to the first side wall, a second side wall adjacent to the first side wall, and a fourth side wall, the second side wall The one side wall and the third side wall are provided with an elastic arm, the elastic arm is provided with an abutment portion, the chip module is provided with an edge area close to the side wall, and the edge area is provided with a groove corresponding to the abutment portion, and the inside of the groove A gap portion is provided, wherein, after the chip module is mounted on the insulating body, the abutting portion abuts against the gap portion so as to limit the chip module in the insulating body.
Description
【技术领域】 【Technical field】
本实用新型是关于一种芯片模块组合,尤其是一种用于电性连接芯片模块至电路板的芯片模块组合。The utility model relates to a chip module combination, in particular to a chip module combination for electrically connecting the chip module to a circuit board.
【背景技术】 【Background technique】
中国专利号CN2612096Y公开了一种电连接器组件,用以电性连接芯片模块与电路板,包括有固设于电路板上的基体,该基体设有一承载芯片模块的承载区,该承载区包括由若干内侧壁及一底面围设而成的收容空间,各个内侧壁上分别设有向承载区收容空间凸设的凸块,且至少一个内侧壁上设有至少两个相互分离且凸伸出该内侧壁相同高度的凸块,凸块的设置可将芯片模块定位于绝缘本体的收容空间内。Chinese Patent No. CN2612096Y discloses an electrical connector assembly for electrically connecting a chip module and a circuit board, including a substrate fixed on the circuit board, the substrate is provided with a bearing area for carrying the chip module, and the bearing area includes The storage space is surrounded by a number of inner walls and a bottom surface. Each inner wall is provided with a protrusion protruding from the storage space of the bearing area, and at least one inner wall is provided with at least two mutually separated and protruding blocks. The bumps on the inner sidewall have the same height, and the arrangement of the bumps can position the chip module in the accommodation space of the insulating body.
图1所示是另一种与本实用新型相关的电连接器,可用于将芯片模块(未图示)电性连接至电路板(未图示),其主要包括绝缘本体10及容设于绝缘本体10内的导电端子(未图示),绝缘本体10包括导电区101以及围设于导电区101外部的侧壁102,侧壁102向导电区101延伸设有弹性臂103以及固定凸块104,将芯片模块装入绝缘本体10时,弹性臂103与固定凸块104将抵靠在芯片模块的侧面从而将芯片模块定位于上述电连接器中。Figure 1 shows another electrical connector related to the utility model, which can be used to electrically connect a chip module (not shown) to a circuit board (not shown), which mainly includes an
然而,上述电连接器通过侧壁102上设置的弹性臂103与固定凸块104抵靠于芯片模块的侧面从而将芯片模块固持并定位于其中,存在由于稳定性不够,而发生芯片模块从电连接器内脱离的情况。However, the above-mentioned electrical connector holds and positions the chip module in the
鉴于此,实有必要对上述电连接器进行改良以克服以上弊端。In view of this, it is necessary to improve the above electrical connector to overcome the above drawbacks.
【实用新型内容】【Content of utility model】
本实用新型的目的在于提供一种芯片模块组合,尤指一种可稳定固持芯片模块并防止其与电连接器脱离的芯片模块组合。The purpose of the utility model is to provide a chip module combination, especially a chip module combination that can stably hold the chip module and prevent it from being separated from the electrical connector.
本实用新型的目的是这样实现的:一种芯片模块组合,包括芯片模块与可将芯片模块连接至电路板的电连接器,电连接器包括容设有若干导电端子的绝缘本体,绝缘本体设有大致成平板状的底壁以及沿底壁垂直向上延伸的侧壁,侧壁进一步设有第一侧壁、与第一侧壁相对的第三侧壁、与第一侧壁相邻的第二侧壁及第四侧壁,第一侧壁与第三侧壁设有弹性臂,弹性臂设有抵接部,芯片模块设有靠近侧壁的边缘区,边缘区对应所述抵接部设有凹槽,所述凹槽内设有断差部,其中,芯片模块安装至绝缘本体后,抵接部抵靠于断差部上方从而将芯片模块限位于绝缘本体内。The purpose of this utility model is achieved as follows: a chip module combination, including a chip module and an electrical connector that can connect the chip module to a circuit board, the electrical connector includes an insulating body that accommodates several conductive terminals, and the insulating body is designed There is a flat bottom wall and a side wall extending vertically upward along the bottom wall, and the side wall is further provided with a first side wall, a third side wall opposite to the first side wall, and a third side wall adjacent to the first side wall. The second side wall and the fourth side wall, the first side wall and the third side wall are provided with an elastic arm, the elastic arm is provided with an abutment portion, the chip module is provided with an edge area close to the side wall, and the edge area corresponds to the abutment portion A groove is provided, and a gap portion is provided in the groove, wherein, after the chip module is mounted on the insulating body, the abutting portion abuts against the gap portion so as to limit the chip module in the insulating body.
与现有技术相比较,本实用新型有如下优点:本实用新型芯片模块安装至电连接器后,弹性臂的抵接部抵靠于芯片模块边缘区的断差部之上,因此,可有效防止芯片模块脱离绝缘本体。Compared with the prior art, the utility model has the following advantages: after the chip module of the utility model is installed on the electrical connector, the abutment part of the elastic arm is against the gap part of the edge area of the chip module, therefore, it can effectively Prevent the chip module from detaching from the insulating body.
【附图说明】 【Description of drawings】
图1是与本实用新型相关的电连接器的绝缘本体的立体图。FIG. 1 is a perspective view of an insulating body of an electrical connector related to the present invention.
图2是本实用新型芯片模块组合的绝缘本体与芯片模块的立体分解图。Fig. 2 is a three-dimensional exploded view of the insulating body and the chip module of the chip module combination of the present invention.
图3是本实用新型芯片模块组合的绝缘本体与芯片模块的立体组合图。Fig. 3 is a three-dimensional combination diagram of the insulating body and the chip module of the chip module combination of the present invention.
【具体实施方式】 【Detailed ways】
请参阅图2及图3所示,本实用新型关于一种芯片模块组合,包括芯片模块20与可将芯片模块20连接至电路板的电连接器,电连接器包括绝缘本体30及容设于绝缘本体30内的导电端子(未图示)。Please refer to FIG. 2 and FIG. 3 , the utility model relates to a chip module combination, including a
绝缘本体30为大致成方形的塑胶构造,其主要设有底壁301以及垂直底壁301向上延伸的侧壁302,其中底壁301设有承接芯片模块20的承接面3011、与承接面3011相对的安装面3012以及贯穿承接面3011至安装面3012的若干端子槽(未图示),侧壁302进一步设有第一侧壁3021、与第一侧壁3021相对的第三侧壁3023、与第一侧壁3021相邻的第二侧壁3022及第四侧壁3024。其中第一侧壁3021与第三侧壁3023分别设有弹性臂3025,于弹性臂3025末端设有突出延伸设置的抵接部3026,抵接部3026呈半圆柱状,其任意一点的高度高于底壁301,第二侧壁3022与第四侧壁3024设有相对的拾取槽3027,底壁301与抵接部3026相对应位置设有贯穿底壁的逃料孔3028。The
如图2所示,芯片模块20大致成平板状,其设有靠近绝缘本体30的侧壁302的边缘区201,其中边缘区201设有与上述抵接部3026对应的凹槽2011,凹槽2011大致为形状与抵接部3026相对应的半圆柱体形状,凹槽2011内设有断差部2012。As shown in FIG. 2 , the
安装上述芯片模块20至绝缘本体30时,芯片模块20的断差部2012挤压弹性臂3025的抵接部3026使弹性臂3025朝远离底壁301的方向运动,芯片模块20边缘区201设置的凹槽2011可使芯片模块20顺利通过第一侧壁3021与第三侧壁3023上设置的弹性臂的抵接部3026,安装完成后,弹性臂3026回复至安装芯片模块前的位置,抵接部3025收容于凹槽2011内,且抵接部3026抵靠于断差部2012之上,从而达到将芯片模块20稳定固持于绝缘本体30内的目的。When the above-mentioned
需要说明的是,以上所述实施例仅为本实用新型的优选实施方案,其它在本实施方案基础上进行的任何改进变换也应当不脱离本实用新型的技术方案。本领域普通技术人员通过阅读本实用新型说明书而对本实用新型的技术方案采取的任何等效的变化,均为本实用新型权利要求所涵盖。It should be noted that the above-mentioned embodiments are only preferred implementations of the present invention, and any improvements and transformations based on this embodiment should not deviate from the technical solution of the present invention. Any equivalent changes to the technical solution of the utility model adopted by persons of ordinary skill in the art by reading the description of the utility model are covered by the claims of the utility model.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200447561U CN201113136Y (en) | 2007-10-26 | 2007-10-26 | Chip Module Combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200447561U CN201113136Y (en) | 2007-10-26 | 2007-10-26 | Chip Module Combination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201113136Y true CN201113136Y (en) | 2008-09-10 |
Family
ID=39964878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200447561U Expired - Lifetime CN201113136Y (en) | 2007-10-26 | 2007-10-26 | Chip Module Combination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201113136Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532359A (en) * | 2015-09-15 | 2017-03-22 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
-
2007
- 2007-10-26 CN CNU2007200447561U patent/CN201113136Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106532359A (en) * | 2015-09-15 | 2017-03-22 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN106532359B (en) * | 2015-09-15 | 2019-12-27 | 富士康(昆山)电脑接插件有限公司 | Electrical connector |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080910 |
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| CX01 | Expiry of patent term |