CN201119247Y - Liquid-cooled auxiliary heat dissipation device - Google Patents

Abstract

A liquid-cooled auxiliary heat sink is suitable for connecting to a pipeline of a liquid-cooled heat sink system, the auxiliary heat sink includes a cooling box, a refrigeration wafer set on the cooling box, a second heat radiation fin set on the refrigeration wafer, the refrigeration wafer has a low temperature surface and a high temperature surface after being electrified, the low temperature surface is covered on the surface of the cooling box, and can provide a low-temperature cooling environment for the cooling box, the second heat radiation fin set is set on the high temperature surface of the refrigeration wafer, and is used for dissipating the heat of the high temperature surface to the external space, and the refrigeration wafer set on the cooling box and the second heat radiation fin set can more efficiently dissipate and lower the temperature of the cooling fluid stored in the cooling box, thereby improving the whole cooling efficiency.

Description

Liquid-cooled auxiliary cooling device

【Technical field】

The utility model relates to a heat dissipation device, in particular to a liquid-cooled auxiliary heat dissipation device.

【Background technique】

With the rapid advancement of electronic technology, the operating efficiency of electronic components has been greatly improved. Correspondingly, the heat energy generated during its operation has also increased significantly. In order to avoid damage or failure of electronic components due to high heat, in addition to general installation In addition to cooling fans on electronic components, there are also heat dissipation devices designed using the principle of liquid cooling on the market, such as water-cooled head devices that are generally installed directly on electronic components to dissipate heat.

As shown in Figure 1, it is an existing heat dissipation device for electronic components. The heat dissipation device for electronic components is used to install on an electronic component 41 of an electrical device 4 that generates high temperature during operation, so as to assist the electronic component. 41 heat dissipation, the heat dissipation device 1 includes a hollow heat absorbing element 11, a cooling fluid 2 that can circulate in the heat absorbing element 11, a first conduit 12 communicating with the heat absorbing element 11, and a first conduit 12 connected to the heat absorbing element 11 The second conduit 13 connected to the heat absorbing element 11, a condensing element 14 connected to the first and second conduits 12, 13, a fan 15 arranged on the electrical equipment 3 and connected to the condensing element 14, And a pumping member 16 arranged on the first conduit 12 . The condensing element 14 has a continuously bent condensing tube 141 communicating with the first and second conduits 12 , 13 , and a plurality of cooling fins 142 spaced between the condensing tubes 141 .

Compared with the existing water-cooled head device directly installed on the electronic components, the heat dissipation device of the above-mentioned electronic components can effectively lift the cooling fluid 2 to the heat dissipation device 1 by installing the pumping member 16 on the first conduit 12 The internal circulation efficiency can be overcome, and the influence of the condensation and evaporation of the cooling fluid 2 in the pipeline on the circulation flow direction can be overcome, and the installation restriction that the condensing element 14 of the existing heat dissipation device must be higher than the heat absorbing element 11 can be avoided .

However, although the above design can indeed improve the circulation efficiency of the cooling fluid 2 and accelerate the flow of the cooling fluid 2, relatively, the time for the cooling fluid 2 to pass through the condensation pipe 141 is also shortened, so , the cooling effect of the condensing pipe 141 on the passing cooling fluid 2 is also reduced, not only can not effectively reduce the cooling fluid 2 to a lower temperature when passing through the condensing pipe 141, but may cause the injection of the heat absorbing element The temperature of the cooling fluid 2 in 11 is too high, resulting in poor overall cooling efficiency.

【Content of utility model】

The purpose of the utility model is to provide a liquid-cooled auxiliary heat dissipation device which can improve heat dissipation efficiency to assist heat dissipation.

In order to achieve the above-mentioned purpose, the liquid-cooled auxiliary heat dissipation device of the present utility model can accommodate cooling fluid inside, including a cooling box, a cooling chip arranged on the cooling box, and a cooling chip arranged on the cooling chip. The second cooling fin set.

The cooling box has a box body that defines a circulation space for accommodating cooling fluid, and a first heat dissipation fin group arranged in the circulation space of the box body, the box body has a cooling fluid outlet and A cooling fluid injection port. After the cooling chip is electrified, it has a low-temperature surface and a high-temperature surface. The low-temperature surface is attached to the surface of the cooling box body and can cool the cooling fluid stored in the cooling box. The second cooling fin group is arranged on the high temperature surface of the cooling chip, and can dissipate the heat conducted by the high temperature surface to the external space.

The beneficial effects of the utility model are: by setting the cooling chip and the second cooling fin group on the cooling box, the cooling fluid injected into the cooling box can be cooled more efficiently. The liquid-cooled auxiliary heat dissipation device of the utility model is connected to the pipeline of other liquid-cooled heat dissipation systems, and can play an auxiliary heat dissipation function to improve the overall cooling efficiency.

【Description of drawings】

FIG. 1 is a schematic diagram illustrating a conventional liquid-cooled heat sink.

Fig. 2 is a three-dimensional exploded view illustrating the aspect of a preferred embodiment of the present invention.

FIG. 3 is a schematic perspective view with the top wall of the shell removed.

FIG. 4 is a schematic perspective view illustrating the usage of the preferred embodiment.

FIG. 5 is a schematic perspective view illustrating another arrangement of a fan in the preferred embodiment.

FIG. 6 is a schematic perspective view illustrating another configuration of the preferred embodiment with two fans.

【Detailed ways】

Below in conjunction with accompanying drawing and embodiment the utility model is described in detail. Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to Figures 2, 3, and 4, a preferred embodiment of the liquid-cooled auxiliary heat dissipation device 3 of the present invention is capable of accommodating the cooling fluid 2, and is used to install and communicate with a liquid-cooled heat dissipation system 5, so as to Assist in improving the cooling efficiency of the liquid-cooled heat dissipation system 5 . In addition, in this preferred embodiment, the cooling fluid 2 is taken as a refrigerant as an example. In addition, the cooling fluid 2 can also use water, liquid helium and other substances, instead of the specific examples mentioned in this preferred embodiment. limit.

The liquid-cooled auxiliary heat dissipation device 3 comprises a drawer-shaped housing part 36 with one end open, a cooling box 31 accommodated in the housing part 36 for the cooling fluid 2 to be accommodated, a cooling box 31 accommodated in the housing part 36 and communicated with the pump group 34 of the cooling box 31, a cooling chip 32 arranged on the cooling box 31, a second cooling fin group 33 installed on the cooling chip 32, and two The fan 35 is disposed on the cooling box 31 and adjacent to the second cooling fin set 33 . In addition, in the preferred embodiment, the appearance of the outer casing 36 is easy to be changed and used by those with background in related fields, so it should not be limited to what is disclosed in the preferred embodiment.

The cooling box 31 has a roughly rectangular box body 311 defining a circulation space 310 for accommodating the cooling fluid 2, and a first cooling fin group 312 arranged in the circulation space 310 of the box body 311, The box body 311 is arranged in the shell member 36, and has a cooling fluid discharge port 313 and a cooling fluid injection port 314, and a top wall 362 of the box body 311 is opened and closed for the cooling fluid 2 perfusion. The cooling fluid replenishment port 315.

The pump group 34 is communicated with the cooling box 31, and has a pump 341 located in the shell member 36 for circulating the cooling fluid 2, and a second pump 341 connected between the cooling fluid outlet 313 and the pump 341. A delivery pipe 342 and a second delivery pipe 343 connected to the pump 341 at one end for sending out the cooling fluid 2 pumped by the pump 341 .

The cooling chip 32 is electrically connected to a power supply (not shown), and has a low-temperature surface 321 and a high-temperature surface 322, and the low-temperature surface 321 is attached to the wall surface of the cooling box 31, so as to generate a lower temperature. temperature, to cool the cooling fluid 2 contained in the cooling box 31, and on the high temperature surface 322 of the cooling chip 32, the second cooling fin group 33 is arranged, whereby the cooling fluid 2 can be The heat generated by the high temperature surface 322 is conducted and dissipated outward.

The fan 35 is arranged on one side of the box body 311 of the cooling box 31, and is adjacent to the second cooling fin set 33, so as to remove the heat dissipated by the second cooling fin set 33. It is worth mentioning In this preferred embodiment, two fans 35 are set as an example, but as shown in FIG. A fan 35 is arranged at the sheet group 33 (not shown in the figure because of the viewing angle), or as shown in FIG. The second radiating fin group 33 (not shown in the figure due to viewing angle), and in accordance with the drafting requirements of the fan 35, the shell member 36 is changed to have openings at both ends corresponding to the installation positions of the fans 35 However, the configuration of the fan 35, in addition to the above-mentioned specific example, can also be adjusted according to actual needs, the number of configuration fans 35 and the installation position, so it should not be limited by the specific example of this preferred embodiment. limit.

Referring back to Figures 2, 3, and 4, when using the liquid-cooled auxiliary heat dissipation device 3 of the present invention and connecting it to the liquid-cooled heat dissipation system 5, the second delivery pipe 343 of the pump group 34 is connected to the An input pipeline 51 of the liquid-cooled heat dissipation system 5 is connected, and a delivery pipeline 52 of the liquid-cooled heat dissipation system 5 is communicated with the cooling fluid inlet 314 of the cooling box 31, so that the liquid-cooled heat dissipation The heat-absorbed cooling fluid 2 sent out by the system 5 can be injected into the cooling box 31 of the liquid-cooled auxiliary heat dissipation device 3 through the sending pipeline 52 for auxiliary cooling and heat dissipation, and then the cooled cooling fluid 2. Extracted by the pump group 34 and re-injected into the input pipeline 51 of the liquid-cooled heat dissipation system 5 through the second delivery pipe 343, so as to achieve the effect of further cooling the cooling fluid 2 in the liquid-cooled heat dissipation system 5 .

When the cooling fluid 2 is injected into the cooling box 31 by the liquid-cooled heat dissipation system 5, the heat of the cooling fluid 2 will be conducted to the first heat dissipation fin set 312, and through the first heat dissipation fin set 312 The setting makes the cooling fluid 2 circulate along the gaps of the first cooling fin group 312, and the return path of the cooling fluid 2 in the cooling box 31 is restricted, so that the cooling fluid 2 can stay in the cooling box 31 more Long time, to achieve better heat exchange effect; Simultaneously, the heat of the second heat dissipation fin group 33 is taken away by the drafting of the second heat dissipation fin group 33 by the fan 35, and, there is Different from existing heat sinks that can only provide heat dissipation and cooling at room temperature, the cooling chip 32 is electrically connected to the power supply (not shown), and can provide more cooling to the cooling box 31 through the low temperature surface 321. low-temperature cooling effect, and utilize the second cooling fin group 33 to dissipate the heat of the high-temperature surface 322 to the external space, therefore, even when the cooling fluid 2 passes through the pump group 34 to generate a faster flow cycle, it can When passing through the cooling box 31, it is cooled rapidly, and the overall heat dissipation efficiency can be improved to achieve the effect of assisting heat dissipation to the liquid-cooled heat dissipation system 5. In addition, when installed on the liquid-cooled heat dissipation system 5, Since the outer casing 36 is to pack the components such as the cooling box 31 inside, the liquid-cooled auxiliary heat dissipation device 3 can be set independently, and only needs to be kept in communication with the liquid-cooled heat dissipation system 5 to achieve auxiliary cooling. The effect of heat dissipation does not need to be directly adjacent to the electrical device to be radiated, as the liquid-cooled heat dissipation system 5 is.

To sum up, the liquid-cooled auxiliary cooling device 3 of the present invention can provide a low-temperature cooling environment for the cooling box 31 through the arrangement of the cooling chip 32 and the second cooling fin group 33, and The cooling fluid 2 injected into the cooling box 31 can be cooled more efficiently, and can play a better auxiliary heat dissipation function to improve the cooling efficiency of the liquid-cooled heat dissipation system 5, so the purpose of the utility model can indeed be achieved .

Claims (5)

1. a liquid-cooled auxiliary radiating device is used to be installed in a liquid-cooled radiating system, for putting cooling fluid in interior, it is characterized in that:

This liquid-cooled auxiliary radiating device comprises a cooling box, one pastes the cooling wafer that is arranged on this cooling box, and second a radiating fin group that is arranged on this cooling wafer, this cooling box has one and defines a box body for the cyclic space that puts cooling fluid, and first a radiating fin group that is arranged in the cyclic space of this box body, this box body has a cooling fluid outlet and a cooling fluid inlet, this cooling wafer has a low temperature face and a high temperature face, this low temperature face is to paste on the box surface that is arranged at this cooling box, be received in cooling fluid in this cooling box with cooling, this second radiating fin group is to be arranged on the high temperature face of this cooling wafer, and the heat loss that will be conducted by this high temperature face is to space outerpace.

2. liquid-cooled auxiliary radiating device as claimed in claim 1 is characterized in that: this liquid-cooled auxiliary radiating device also includes a pump group in order to cooling fluid is extracted out by this cooling fluid outlet and sent into toward this cooling fluid inlet direction that is arranged in this cooling box communicatively.

3. liquid-cooled auxiliary radiating device as claimed in claim 2, it is characterized in that: this pump group has a pump, and connects first feed tube between this cooling fluid outlet and this pump, and an end connects this pump and second feed tube in order to the cooling fluid of this pump extraction is sent.

4. as claim 2 or 3 described liquid-cooled auxiliary radiating devices, it is characterized in that: this liquid-cooled auxiliary radiating device also includes a vicinity and is arranged at the fan that this second radiating fin group is got rid of in order to the heat that this second radiating fin group is distributed.

5. liquid-cooled auxiliary radiating device as claimed in claim 4 is characterized in that: this liquid-cooled auxiliary radiating device also comprises an outer casing member, for ccontaining this cooling box, cooling wafer, the second radiating fin group, fan and pump group.

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