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CN201117002Y - High-flatness capacitive touch panel - Google Patents

High-flatness capacitive touch panel Download PDF

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Publication number
CN201117002Y
CN201117002Y CNU2007201940185U CN200720194018U CN201117002Y CN 201117002 Y CN201117002 Y CN 201117002Y CN U2007201940185 U CNU2007201940185 U CN U2007201940185U CN 200720194018 U CN200720194018 U CN 200720194018U CN 201117002 Y CN201117002 Y CN 201117002Y
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electrode
hole
guide line
conductive
conductive layer
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黄威龙
陈志荣
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Mildex Optical Inc
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Mildex Optical Inc
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Abstract

The utility model discloses a high flatness capacitive touch panel, the bottom surface of conducting layer forms relative alternately electrode with the top surface of conducting layer once on one to the bottom surface of conducting layer is provided with a plurality of guide lines under this, makes the first end of each guide line correspond the first end of each electrode respectively, and the conducting layer corresponds the first end of each guide line and forms the through hole that the holding led electrical pillar down, and each leads electrical pillar and can connect each guide line and each electrode respectively, makes the bottom surface of flexible circuit board lug connection conducting layer down, so, the utility model discloses need not press from both sides between the conducting layer under/and establish this flexible circuit board, can effectively improve the flatness of conducting layer under/.

Description

高平坦度电容式触控面板 High flatness capacitive touch panel

技术领域 technical field

本实用新型涉及一种全平面触控面板,尤其涉及一种具有高平坦度的全平面电容式触控面板。The utility model relates to a full-plane touch panel, in particular to a full-plane capacitive touch panel with high flatness.

背景技术 Background technique

请参阅图10所示,目前使用的触控面板是由一上导电层70、一下导电层80及一基板90所组成,以电容式触控面板为例加以说明,该上导电层70的底面形成有若干列电极71,各列电极71分别连接一上引导线72的第一端,各上引导线72的第二端则一同延伸至该上导电层70的一侧边;该下导电层80的顶面形成有若干行电极81,各行电极81分别连接一下引导线82的第一端,各下引导线82的第二端则一同延伸至对应上引导线72第二端的位置,组装时是让上/下导电层70、80对向设置,再在其间设有光学胶,并将一软性电路板50c的导脚与上/下导电层70、80的引导线72、82的第二端接触,构成电性连接;组合后的上/下导电层70、80再设置在前述基板90上,以构成一触控面板。Please refer to FIG. 10, the currently used touch panel is composed of an upper conductive layer 70, a lower conductive layer 80 and a substrate 90. Taking a capacitive touch panel as an example for illustration, the bottom surface of the upper conductive layer 70 A plurality of column electrodes 71 are formed, and each column electrode 71 is respectively connected to a first end of an upper lead wire 72, and the second end of each upper lead wire 72 extends to one side of the upper conductive layer 70 together; the lower conductive layer The top surface of 80 is formed with a plurality of row electrodes 81, and each row electrode 81 is respectively connected to the first end of the lower lead wire 82, and the second end of each lower lead wire 82 then extends to the position corresponding to the second end of the upper lead wire 72. When assembling The upper/lower conductive layers 70, 80 are arranged facing each other, and optical glue is arranged therebetween, and the guide pins of a flexible circuit board 50c are connected to the first lead wires 72, 82 of the upper/lower conductive layers 70, 80. The two terminals are in contact to form an electrical connection; the combined upper/lower conductive layers 70 and 80 are further disposed on the aforementioned substrate 90 to form a touch panel.

由上述可知,触控面板的软性电路板是夹设于上/下导电层之间。但是触控面板制程良率高低与上/下导电层的透明导电材料是否涂布均匀有关,因此当透明导电材料涂布完成后还需印刷导线、上胶及压合软性电路板,如此均会使得原本精密涂布的透明导电材料厚度发生改变,从而造成整体的平坦度不佳。再者,上/下导电层的平坦度除了受到软性电路板夹设厚度的影响外,其上/下引导线是集中延伸至导电层的一侧边位置,以供软性电路板连接接触用,因此也对平坦度产生负面影响;因此,不论是软性电路板或是引导线均会使触控面板的平坦度受到影响。From the above, it can be seen that the flexible circuit board of the touch panel is sandwiched between the upper and lower conductive layers. However, the yield rate of the touch panel process is related to whether the transparent conductive material of the upper/lower conductive layer is evenly coated. Therefore, after the transparent conductive material is coated, it is necessary to print wires, glue and press the flexible circuit board. It will change the thickness of the originally precision-coated transparent conductive material, resulting in poor overall flatness. Furthermore, in addition to the flatness of the upper/lower conductive layer being affected by the thickness of the flexible circuit board, the upper/lower lead wires extend to one side of the conductive layer in a concentrated manner for the connection and contact of the flexible circuit board Therefore, both the flexible circuit board and the lead wire will affect the flatness of the touch panel.

发明内容Contents of the invention

有鉴于上述缺点,本实用新型提供一种高平坦度电容式触控面板,其具有较佳的平坦度,有效提高触控面板良率及准确度。In view of the above disadvantages, the present invention provides a high-flatness capacitive touch panel, which has better flatness and effectively improves the yield and accuracy of the touch panel.

欲达到上述目的,所使用的主要技术手段是令该高平坦度电容式触控面板包含有:To achieve the above purpose, the main technical means used is to make the high-flatness capacitive touch panel include:

一上导电层,具有一顶面及一底面,其底面形成有若干并排的上电极,各上电极具有一第一端;An upper conductive layer has a top surface and a bottom surface, the bottom surface is formed with a plurality of side-by-side upper electrodes, and each upper electrode has a first end;

一下导电层,具有一顶面、一底面及若干贯穿孔,其顶面形成有若干下电极,且各下电极具有一第一端,且与前述上电极呈相对交叉;该底面则形成有若干第一引导线与若干第二引导线,均各具有一前端及一末端,第一引导线的前端分别对应前述上电极第一端,第二引导线的前端分别对应下电极的第一端,而第一引导线的末端与第二引导线的末端则一同延伸至下导电层的一侧边;各贯穿孔对应各上电极与下电极的第一端位置而贯通下导电层的顶面与底面;The lower conductive layer has a top surface, a bottom surface and a number of through holes, a number of lower electrodes are formed on the top surface, and each lower electrode has a first end, and is relatively crossed with the aforementioned upper electrode; the bottom surface is formed with a number of The first guiding line and the plurality of second guiding lines each have a front end and an end. The front ends of the first guiding lines correspond to the first ends of the upper electrodes respectively, and the front ends of the second guiding lines correspond to the first ends of the lower electrodes respectively. The end of the first lead wire and the end of the second lead wire extend to one side of the lower conductive layer together; each through hole corresponds to the first end position of each upper electrode and lower electrode and penetrates the top surface of the lower conductive layer and the first end of the lower electrode. bottom surface;

若干第一导电柱与若干第二导电柱,容置于各贯穿孔内,各具有一底端与一顶端,各第一导电柱的底端分别连接下导电层的第一引导线,各第一导电柱的顶端则分别凸出于贯穿孔而延伸连接至各上电极;各第二导电柱的底端分别连接下导电层的第二引导线,各第二导电柱的顶端则分别凸出于贯穿孔而延伸连接至各下电极。A plurality of first conductive pillars and a plurality of second conductive pillars are accommodated in each through hole, and each has a bottom end and a top end. The top ends of the first conductive posts protrude from the through holes respectively and are extended and connected to the upper electrodes; The through holes are extended and connected to the lower electrodes.

本实用新型可进一步包含至少一中导电层,该中导电层设于上导电层与下导电层之间,以降低上导电层与下导电层之间的电磁干扰。The utility model may further include at least one middle conductive layer, and the middle conductive layer is disposed between the upper conductive layer and the lower conductive layer to reduce electromagnetic interference between the upper conductive layer and the lower conductive layer.

本实用新型触控面板主要是在该下导电层的底面设置若干引导线,令各引导线的第一端分别对应上/下导电层的上/下电极的第一端,该下导电层对应各引导线的第一端而形成贯穿孔,以供导电柱穿经;故当上/下导电层及基板相互贴合后,对应各电极第一端位置的导电柱会分别连接各引导线与各电极,故可将上/下电极的信号传送至下导电层的底面,使得软性电路板可直接连接于下导电层的底面;因此,本实用新型上/下导电层相对应的表面仅需形成电极而不必形成引导线,且软性电路板非夹设于上/下导电层间而直接与下导电层的底面连接,故本实用新型触控面板的平坦度能被控制得更精准。The touch panel of the utility model mainly arranges several guide wires on the bottom surface of the lower conductive layer, so that the first ends of each guide wire respectively correspond to the first ends of the upper/lower electrodes of the upper/lower conductive layer, and the lower conductive layer corresponds to The first end of each guide line forms a through hole for the conductive column to pass through; so when the upper/lower conductive layer and the substrate are bonded to each other, the conductive column corresponding to the first end of each electrode will be connected to each guide line and the substrate respectively. Each electrode, so the signal of the upper/lower electrode can be transmitted to the bottom surface of the lower conductive layer, so that the flexible circuit board can be directly connected to the bottom surface of the lower conductive layer; therefore, the corresponding surface of the upper/lower conductive layer of the utility model is only It is necessary to form electrodes instead of lead wires, and the flexible circuit board is not sandwiched between the upper/lower conductive layers but directly connected to the bottom surface of the lower conductive layer, so the flatness of the touch panel of the present invention can be controlled more precisely .

附图说明 Description of drawings

图1是本实用新型第一实施例的立体分解图;Fig. 1 is a three-dimensional exploded view of the first embodiment of the utility model;

图2是本实用新型第一实施例的组合外观图;Fig. 2 is a combined appearance diagram of the first embodiment of the utility model;

图3是本实用新型第一实施例的导电柱连接至上电极的局部放大剖视图;Fig. 3 is a partially enlarged cross-sectional view of the conductive column connected to the upper electrode in the first embodiment of the utility model;

图4是本实用新型第一实施例的导电柱连接至下电极的局部放大剖视图;Fig. 4 is a partially enlarged cross-sectional view of the conductive column connected to the lower electrode in the first embodiment of the present invention;

图5是本实用新型第二较佳实施例的立体分解图;Fig. 5 is a three-dimensional exploded view of a second preferred embodiment of the present invention;

图6是本实用新型第二实施例的组合外观图;Fig. 6 is a combined appearance diagram of the second embodiment of the utility model;

图7是本实用新型第二实施例的导电柱连接至下电极的局部放大剖视图;Fig. 7 is a partially enlarged cross-sectional view of the conductive column connected to the lower electrode in the second embodiment of the present invention;

图8是本实用新型第二实施例的导电柱连接至中电极的局部放大剖视图;Fig. 8 is a partial enlarged cross-sectional view of the second embodiment of the utility model in which the conductive column is connected to the middle electrode;

图9是本实用新型第二实施例的导电柱连接至上电极的局部放大剖视图;以及Fig. 9 is a partial enlarged cross-sectional view of the conductive column connected to the upper electrode in the second embodiment of the present invention; and

图10是现有的一触控面板立体分解图。FIG. 10 is an exploded perspective view of a conventional touch panel.

具体实施方式 Detailed ways

首先请参阅图1、2所示,是本实用新型第一实施例的分解图与组合图,本实用新型可应用于一电容式触控面板,其包含有:First please refer to Figures 1 and 2, which are an exploded view and an assembled view of the first embodiment of the present invention. The present invention can be applied to a capacitive touch panel, which includes:

一上导电层10,具有一顶面及一底面,其底面形成有若干上电极11,在本实施例中是若干并排的列电极,各上电极11具有一第一端110;An upper conductive layer 10 has a top surface and a bottom surface, and a plurality of upper electrodes 11 are formed on the bottom surface, in this embodiment, a plurality of column electrodes arranged side by side, and each upper electrode 11 has a first end 110;

一下导电层20,设于上导电层10下方,具有一顶面、一底面及若干贯穿孔22,其顶面形成有若干下电极21,在本实施例中是若干并排的行电极,且各下电极21具有一第一端210,且与前述上电极11呈相对交叉;该底面形成有若干第一引导线23a及第二引导线23b,第一引导线23a与第二引导线23b都分别具有一前端230a、230b及一末端231a、231b,其中各第一引导线23a的前端230a分别对应前述上电极11的第一端110;各第二引导线23b的前端230b分别对应下电极21的第一端210,而第一引导线23a与第二引导线23b的末端231a、231b则一同延伸至下导电层20的一侧边,以连接一软性电路板50a;各贯穿孔22对应各上电极11的第一端110与下电极21的第一端210位置而贯通下导电层20的顶面与底面;The lower conductive layer 20, located below the upper conductive layer 10, has a top surface, a bottom surface and a plurality of through holes 22, and a plurality of lower electrodes 21 are formed on the top surface, which in this embodiment are row electrodes arranged side by side, and each The lower electrode 21 has a first end 210, and is opposite to the upper electrode 11; the bottom surface is formed with a plurality of first guiding lines 23a and second guiding lines 23b, and the first guiding lines 23a and the second guiding lines 23b are respectively It has a front end 230a, 230b and an end 231a, 231b, wherein the front end 230a of each first guiding line 23a corresponds to the first end 110 of the aforementioned upper electrode 11 respectively; The first end 210, and the ends 231a, 231b of the first lead wire 23a and the second lead wire 23b extend to one side of the lower conductive layer 20 together to connect to a flexible circuit board 50a; each through hole 22 corresponds to each The positions of the first end 110 of the upper electrode 11 and the first end 210 of the lower electrode 21 penetrate through the top surface and the bottom surface of the lower conductive layer 20;

若干第一导电柱24a及若干第二导电柱24b,请参考图3所示,第一导电柱24a分别位于对应上电极11第一端110的贯穿孔22内,具有一底端与一顶端,各底端分别连接下导电层20的第一引导线23a,顶端则分别凸出于贯穿孔22而延伸连接至各上电极11的第一端110;请参考图4所示,第二导电柱24b分别位于对应下电极21第一端210的贯穿孔22内,具有一底端与一顶端,各底端分别连接下导电层20的第二引导线23b,顶端则分别凸出于贯穿孔22而延伸连接至各下电极21的第一端210。A plurality of first conductive columns 24a and a plurality of second conductive columns 24b, please refer to FIG. Each bottom end is respectively connected to the first lead wire 23a of the lower conductive layer 20, and the top end protrudes from the through hole 22 to extend and connect to the first end 110 of each upper electrode 11; please refer to FIG. 4, the second conductive column 24b are respectively located in the through holes 22 corresponding to the first ends 210 of the lower electrodes 21, and have a bottom end and a top end. And the extension is connected to the first end 210 of each lower electrode 21 .

本实施例中可进一步包含一下基板40,通过光学胶夹设于上导电层10与下导电层20之间,其对应上电极11的第一端110位置形成若干贯孔41,各贯孔41对应下导电层20的贯穿孔22,使第一导电柱24a得穿经该下基板40的贯孔41而连接至上电极11。In this embodiment, a lower substrate 40 may be further included, which is interposed between the upper conductive layer 10 and the lower conductive layer 20 through optical glue, and a plurality of through holes 41 are formed corresponding to the first end 110 of the upper electrode 11, and each through hole 41 Corresponding to the through hole 22 of the lower conductive layer 20 , the first conductive column 24 a passes through the through hole 41 of the lower substrate 40 to be connected to the upper electrode 11 .

如图3及图4所示,当上/下导电层10、20及下基板40贴合时,第一导电柱24a与第二导电柱24b的顶端会分别与上电极11与下电极21接触,而第一导电柱24a底端则分别与下导电层20的第一引导线23a连接;如此即将上电极11的信号通过第一导电柱24a传送至下导电层20底面的第一引导线23a,再传至与第一引导线23a末端231a连接的软性电路板50a;同样地,第二导电柱24b底端则分别与下导电层20的第二引导线23b连接;如此即将下电极21的信号通过第二导电柱24b传送至下导电层20底面的第二引导线23b,再传至与第二引导线23b末端231b连接的软性电路板50a。因此,软性电路板50a可直接设置在下导电层20底面,对应连接至第一引导线23a与第二引导线23b而取得或提供上/下电极11、21的信号。As shown in FIG. 3 and FIG. 4, when the upper/lower conductive layers 10, 20 and the lower substrate 40 are bonded together, the tops of the first conductive pillar 24a and the second conductive pillar 24b will contact the upper electrode 11 and the lower electrode 21 respectively. , and the bottom ends of the first conductive pillars 24a are respectively connected to the first lead wires 23a of the lower conductive layer 20; thus, the signal of the upper electrode 11 is transmitted to the first lead wires 23a on the bottom surface of the lower conductive layer 20 through the first conductive pillars 24a , and then transmitted to the flexible circuit board 50a connected to the end 231a of the first lead wire 23a; similarly, the bottom ends of the second conductive pillars 24b are respectively connected to the second lead wire 23b of the lower conductive layer 20; thus, the lower electrode 21 The signal is transmitted to the second lead wire 23b on the bottom surface of the lower conductive layer 20 through the second conductive pillar 24b, and then to the flexible circuit board 50a connected to the end 231b of the second lead wire 23b. Therefore, the flexible printed circuit board 50a can be directly disposed on the bottom surface of the lower conductive layer 20, and correspondingly connected to the first lead wire 23a and the second lead wire 23b to obtain or provide signals of the upper/lower electrodes 11, 21.

请参考如图5、6所示,为本实用新型第二实施例的分解图与组合图,与第一实施例不同处在于,第二实施例进一步包含:一中导电层60,通过光学胶夹设于上导电层10与下基板40之间,具有一顶面、一底面及若干贯孔62,该底面形成有一对应上/下电极11、21的中电极61,该中电极61具有一第一端610,各贯孔62对应上电极11的第一端110而与下导电层20的贯穿孔22对合,使第一导电柱24a得以经过各贯孔62而连接至上电极11。Please refer to Figures 5 and 6, which are an exploded view and an assembled view of the second embodiment of the present invention. The difference from the first embodiment is that the second embodiment further includes: a conductive layer 60, which is passed through an optical glue Interposed between the upper conductive layer 10 and the lower substrate 40, it has a top surface, a bottom surface and a plurality of through holes 62. The bottom surface is formed with a middle electrode 61 corresponding to the upper/lower electrodes 11, 21. The middle electrode 61 has a The first end 610 and each through-hole 62 correspond to the first end 110 of the upper electrode 11 and are aligned with the through-hole 22 of the lower conductive layer 20 , so that the first conductive pillar 24 a is connected to the upper electrode 11 through each through-hole 62 .

比照前述上/下电极11、21,该下导电层20同样对应该中电极61的第一端610而形成对应的贯穿孔22并在底面形成对应的一第三引导线23c,并于对应的贯穿孔22内设置有第三导电柱24c,使中电极61的信号也可经由第三导电柱24c传至下导电层20底面,该第三导电柱24c的底端还连接第三引导线23c以进一步将信号传至一软性电路板50b。Compared with the aforementioned upper/lower electrodes 11, 21, the lower conductive layer 20 also forms a corresponding through hole 22 corresponding to the first end 610 of the middle electrode 61 and forms a corresponding third lead line 23c on the bottom surface, and on the corresponding A third conductive column 24c is arranged in the through hole 22, so that the signal of the middle electrode 61 can also be transmitted to the bottom surface of the lower conductive layer 20 through the third conductive column 24c, and the bottom end of the third conductive column 24c is also connected to the third lead wire 23c To further transmit the signal to a flexible circuit board 50b.

依次参考图7、图8及图9所示,依次为第二实施例的第二、第三及第一导电柱24b、24c、24a连接至下电极21、中电极61与上电极11的局部剖视图,可以看出除了下电极21形成于下导电层20的顶面,中电极61与上电极11均分别形成于中导电层60与上导电层10的底面,各电极并分别由第二、第三及第一导电柱24b、24c、24a连接至下导电层20底面。所以,只需设置软性电路板50b于下导电层20底面并与下导电层20的第一、第二及第三引导线23a、23b、23c连接,即可取得或提供上/下/中电极11、21、61的信号。Referring to FIG. 7, FIG. 8 and FIG. 9 in sequence, the second, third and first conductive columns 24b, 24c, and 24a of the second embodiment are connected to the lower electrode 21, the middle electrode 61 and the upper electrode 11 in sequence. From the cross-sectional view, it can be seen that except that the lower electrode 21 is formed on the top surface of the lower conductive layer 20, the middle electrode 61 and the upper electrode 11 are respectively formed on the bottom surfaces of the middle conductive layer 60 and the upper conductive layer 10, and each electrode is formed by the second, second, and upper electrodes respectively. The third and first conductive pillars 24 b , 24 c , 24 a are connected to the bottom surface of the lower conductive layer 20 . Therefore, only need to arrange the flexible circuit board 50b on the bottom surface of the lower conductive layer 20 and connect with the first, second and third lead wires 23a, 23b, 23c of the lower conductive layer 20 to obtain or provide upper/lower/middle Signals from electrodes 11, 21, 61.

综上所述,本实用新型触控面板是将原先各导电层上的引导线均形成于最下方导电层的底面,各引导线并通过导电柱分别连接至各导电层的电极,使得软性电路板不再夹设于各导电层之间。因此,本实用新型的导电层组合后的平坦度能被控制在最佳状态,呈现一全平面的触控面板。To sum up, the touch panel of the present utility model forms the guide wires on the original conductive layers on the bottom surface of the lowermost conductive layer, and each guide wire is connected to the electrodes of each conductive layer through conductive columns, so that the flexible The circuit board is no longer sandwiched between the conductive layers. Therefore, the combined flatness of the conductive layers of the present invention can be controlled in an optimal state, presenting a fully flat touch panel.

Claims (8)

1. a high flat degree capacitance type touch-control panel is characterized in that: comprise
Conductive layer on one has an end face and a bottom surface, and its bottom surface is formed with some top electrodes, and each top electrode has one first end;
One lower conductiving layer has an end face, a bottom surface and some through holes, and its end face is formed with some bottom electrodes, and each bottom electrode has one first end, and is relative with aforementioned top electrode and intersects; This bottom surface then is formed with some first guide lines and some second guide lines, all respectively have a front end and an end, the front end of first guide line is corresponding aforementioned top electrode first end respectively, the front end of second guide line is first end of corresponding bottom electrode respectively, and the end of the end of first guide line and second guide line then together extends to a side of lower conductiving layer; First end position of corresponding each top electrode of each through hole and bottom electrode and connect the end face and the bottom surface of lower conductiving layer; And
Some first conductive poles and some second conductive poles, be placed in each through hole, respectively have a bottom and a top, the bottom of each first conductive pole connects first guide line of lower conductiving layer respectively, and the top of each first conductive pole then protrudes from through hole respectively and extends and be connected to each top electrode; The bottom of each second conductive pole connects second guide line of lower conductiving layer respectively, and the top of each second conductive pole then protrudes from through hole respectively and extends and be connected to each bottom electrode.
2. high flat degree capacitance type touch-control panel as claimed in claim 1 is characterized in that: very some row electrodes side by side that power on of conductive layer on this; The bottom electrode of this lower conductiving layer is some column electrodes side by side.
3. high flat degree capacitance type touch-control panel as claimed in claim 1, it is characterized in that: further comprise an infrabasal plate, this infrabasal plate is to be located between conductive layer and the lower conductiving layer by optical cement, and at the position of corresponding top electrode first end formation perforation, the through hole of the involutory lower conductiving layer of each perforation.
4. high flat degree capacitance type touch-control panel as claimed in claim 3 is characterized in that: each guide line end is connected to a flexible circuit board.
5. high flat degree capacitance type touch-control panel as claimed in claim 3, it is characterized in that: can further comprise conductive layer in, be located between conductive layer and the infrabasal plate by optical cement, have a bottom surface and some perforations, its bottom surface is formed with at least one middle electrode; First end of the corresponding top electrode of each perforation and involutory with the through hole of lower conductiving layer.
6. high flat degree capacitance type touch-control panel as claimed in claim 5 is characterized in that: electrode has one first end in this; This infrabasal plate further to should in first end of electrode be formed with perforation; This lower conductiving layer further to should in first end of electrode be formed with through hole; The bottom surface of this lower conductiving layer further forms a pair of the 3rd guide line that should through hole.
7. high flat degree capacitance type touch-control panel as claimed in claim 6, it is characterized in that: be equipped with one the 3rd conductive pole in this correspondence in the through hole of electrode first end, the bottom of the 3rd conductive pole connects the front end to the 3rd guide line that should through hole, the perforation that passes electrode first end in the infrabasal plate correspondence is then extended on the 3rd conductive pole top, and then is connected to first end of middle electrode.
8. high flat degree capacitance type touch-control panel as claimed in claim 7 is characterized in that: the 3rd guide line that the 3rd conductive pole of electrode is connected in this connection, its terminal flexible circuit board that connects.
CNU2007201940185U 2007-11-02 2007-11-02 High-flatness capacitive touch panel Expired - Fee Related CN201117002Y (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102200865A (en) * 2010-03-25 2011-09-28 柏腾科技股份有限公司 Molded case with functions of preventing electromagnetic interference and capacitive trackpad and preparation method thereof
CN102473064A (en) * 2009-07-01 2012-05-23 松下电器产业株式会社 Touch panel
CN102656545A (en) * 2009-10-15 2012-09-05 Lg伊诺特有限公司 Touch panel and manufacturing method thereof
CN103268164A (en) * 2013-05-13 2013-08-28 深圳市百川海奇科技有限公司 Method for manufacturing one-chip type touch panel
CN103345346A (en) * 2013-07-19 2013-10-09 信利光电股份有限公司 Capacitive touch screen and method for binding flexible circuit board thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102473064A (en) * 2009-07-01 2012-05-23 松下电器产业株式会社 Touch panel
CN102656545A (en) * 2009-10-15 2012-09-05 Lg伊诺特有限公司 Touch panel and manufacturing method thereof
US9400577B2 (en) 2009-10-15 2016-07-26 Lg Innotek Co., Ltd. Capactive touch panel
CN102200865A (en) * 2010-03-25 2011-09-28 柏腾科技股份有限公司 Molded case with functions of preventing electromagnetic interference and capacitive trackpad and preparation method thereof
CN102200865B (en) * 2010-03-25 2013-06-12 柏腾科技股份有限公司 Molded case with functions of preventing electromagnetic interference and capacitive trackpad and preparation method thereof
CN103268164A (en) * 2013-05-13 2013-08-28 深圳市百川海奇科技有限公司 Method for manufacturing one-chip type touch panel
CN103345346A (en) * 2013-07-19 2013-10-09 信利光电股份有限公司 Capacitive touch screen and method for binding flexible circuit board thereof

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