CN201116711Y - Heat dispersion device for LED lamp - Google Patents
Heat dispersion device for LED lamp Download PDFInfo
- Publication number
- CN201116711Y CN201116711Y CNU2007200602745U CN200720060274U CN201116711Y CN 201116711 Y CN201116711 Y CN 201116711Y CN U2007200602745 U CNU2007200602745 U CN U2007200602745U CN 200720060274 U CN200720060274 U CN 200720060274U CN 201116711 Y CN201116711 Y CN 201116711Y
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- Prior art keywords
- heat
- heat pipe
- led light
- light fixture
- fins
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000006185 dispersion Substances 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000009835 boiling Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000005855 radiation Effects 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000004411 aluminium Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 abstract 3
- 230000005540 biological transmission Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat dissipation device of a light emitting diode lamp, which substantially comprises a heat conduction seat, a heat tube and a cooling plate group, wherein the heat tube is equipped with a heat absorption end and a radiating end, the heat absorption end is connected with one end surface of the heat conduction seat, the other end surface of the heat conduction seat is closely contacted with a base plate of the light emitting diode lamp, and the cooling plate group is sleeved on the radiating end of the heat tube. The utility model is characterized in that the heat tube is a hollow structure, whose inner portion contains liquid whose boiling temperature is equal to the predetermined temperature of the light emitting diode lamp, and the liquid is arranged on the heat absorption end of the heat tube. The liquid in an inner cavity of the heat tube can be water, and the inner cavity of the heat tube is in a partial vacuum state. The gas which is evaporated by the liquid in the inner portion of the device is rapidly emanated on the end of the heat tube, and the heat is transfered and emanated through the cooling plate group which is sleeved on the radiating end of the heat tube. The utility model has the advantages of saving materials and reducing cost, simultaneously is capable of rapidly transferring and emanating the heat, thereby effectively prolonging the service life of the light emitting diode lamp.
Description
[technical field]
The utility model relates to a kind of heat abstractor of LED light fixture, relates to a kind of heat abstractor of the LED light fixture of being made up of a plurality of LED or high-capacity LED array specifically.
[background technology]
LED white-light illuminating lamp is compared with fluorescent lamp with conventional incandescent, has many-sided advantages such as power consumption is little, life-span length, environmental protection.The LED bulb power consumption of equal brightness has only 10% of incandescent lamp, and its life-span can reach 100,000 hours, than long 10 times of life-span of fluorescent lamp, than long 100 times of life-span of incandescent lamp.The luminous tungsten filament power consumption of incandescent lamp is big, the frangible and easy electric shock of bulb.Though fluorescent lamp is more unfavorable to people's eyesight than incandescent lamp electricity saving and energy saving, the mercury in the fluorescent tube also is harmful to human body and contaminated environment.LED white-light illuminating lamp can reflect the true colors of irradiating object better near daylight.From technical standpoint, LED white-light illuminating lamp is undoubtedly the ultra-modem technology in the LED series lamps.The application market of LED white-light illuminating lamp will be very extensive, certainly will replace incandescent osram lamp and fluorescent lamp.LED belongs to the total solids cold light source, and is littler, lighter, firmer, and operating voltage only has two volts, reaches more than ten years service life.According to common light efficiency definition, the luminous efficiency of LED lamp is not high, but because the spectrum of LED lamp almost all concentrates on visible light frequency band, efficient can reach 80%-90%, the incandescent lamp visual efficiency of equal light efficiency only is 10%-20%, the power of monomer LED lamp can meet the different needs by technical finesse generally at 0.05-3W.Because light emitting diode (LED) has above plurality of advantages, so be widely used on electronic installation or the lamp lighting, yet, consider single chip LED luminosity deficiency, in order to increase its range of exposures and brightness, be combined into LED lamp group by a plurality of light emitting diode matrixs usually.Along with the increase of light emitting diode quantity and High Power LED etc. are developed successively, the heat that the LED lamp group running after the array combination is produced is also progressively upwards soaring.Therefore, the radiator structure that provides the LED light fixture to use has become one of the important topic that the related personnel studied of being engaged in the sector now and technical barrier.
In the patent documentation of Chinese utility model patent Granted publication CN 200965215Y, a kind of many heat pipe heat radiations structure of LED light fixture is disclosed, this structure comprises be heated seat and a plurality of heat pipe, this be heated hot bottom surface and LED light fixture are fitted, its end face have with described heating surface back to radiating surface; Its heat pipe has heating end and away from the condensation end of heating end; Be heated the seat radiating surface be provided with quantity and the corresponding to a plurality of perforation of heat pipe quantity, the described heating end of each heat pipe penetrate respectively be heated the seat perforation in can heat conducting mode combining with perforation, the pipe shaft axis direction of the heating end of heat pipe is identical with the axis direction of its pairing perforation, and vertical with the radiating surface of the seat that is heated.When the led array some, need use a plurality of heat pipes could distribute heat, and in order to reach the effect of heat radiation, used heat pipe quantity is more, and the product cost of being produced simultaneously is corresponding also to rise thereupon; When array be high-capacity LED the time, the heat that high-capacity LED gives out is difficult to by a plurality of heat pipes the heat that sends in time to be distributed, and the LED of array is damaged, and influences the service life of LED.
In the patent documentation of Chinese utility model patent Granted publication CN 2934915Y, the multiple group type radiator structure that a kind of LED light fixture is used is disclosed, comprise a plurality of heat pipes equally, also comprise a plurality of radiators, when a plurality of LED of array or high-capacity LED, its heat that gives out is difficult in time by this radiator structure heat be distributed equally, simultaneously, exists complex manufacturing and cost to cross high shortcoming.
In the patent documentation of Chinese utility model patent Granted publication CN 2934916Y, the LED lamp cooling structure is disclosed, equally also comprise a plurality of heat pipes, notion with structural similarity described in the document of Granted publication CN 2934915Y, the heat that gives out when having a plurality of LED or high-capacity LED array equally can not in time distribute heat by this radiator structure, be easy to burn out LED, influence the service life of LED, equally, also exist above-mentioned described complex manufacturing and cost to cross high shortcoming.
[utility model content]
In order to overcome above-mentioned problems of the prior art, the purpose of this utility model is to provide a kind of good heat dissipation effect, cost is low, technology is simple and the heat abstractor of a kind of LED light fixture of can be in time the thermal source heat being distributed.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of heat abstractor of LED light fixture, mainly comprise heat-conducting seat, heat pipe and groups of fins, described heat pipe has heat absorbing end and radiating end, described heat absorbing end is connected with an end face of described heat-conducting seat, the other end of heat-conducting seat attaches on the contact LED lamp substrate, described groups of fins is socketed on the described heat pipe heat radiation end, it is characterized in that, described heat pipe is a hollow structure, its inside is loaded with the boiling temperature liquid suitable with LED light fixture predetermined temperature, and described liquid is arranged on the heat pipe heat absorbing end.
For the heat that makes the heat pipe heat absorbing end is delivered to the heat pipe heat radiation end as early as possible, in order to reach the predetermined temperature of LED light fixture, the liquid of splendid attire is water in the described heat pipe simultaneously, and the inner chamber of described heat pipe is pumped into the partial vacuum state.
Described groups of fins is formed by stacking by a plurality of fin, is provided with the gap between the fin, possesses the lamination of ventilation between the gap of described fin.In order better the heat that sends on the LED lamp substrate to be distributed, be provided with a fan in described groups of fins one side, described fan can be fixed on the holder of groups of fins both sides welding.
It is compacter for heat pipe is contacted with heat-conducting seat, the heat that sends on the LED lamp substrate is in time absorbed transmission by heat pipe, reach the fixedly position of heat pipe simultaneously, heat-conducting seat is provided with a recess, and described heat pipe heat absorbing end is fixed in the described recess by a heat transfer block; The recess that is provided with on the described heat-conducting seat is corresponding with the LED surface configuration of LED lamp substrate array, and described recess area is slightly larger than the area of described LED lamp substrate array LED.
Described heat-conducting seat and groups of fins are fixed by the metal bar that readily conducts heat, and described metal bar is aluminium bar or copper rod.
The utility model beneficial effect compared with prior art is: save material, reduce cost, simple in structure and good heat dissipation effect, simultaneously, also the heat that the LED lamp substrate can be given out in time distributes by the groups of fins that is nested with at the heat pipe heat radiation end, thereby has prolonged the service life of LED light fixture effectively.Now structure of the present utility model is done the further analysis of beneficial effect, described heat pipe is a hollow structure, its inside is loaded with the boiling temperature liquid suitable with LED light fixture predetermined temperature, this liquid is arranged on the heat pipe heat absorbing end, when the heat pipe heat absorbing end is connected with heat-conducting seat one end face, the heat that sends on the LED lamp substrate absorbs by the heat pipe heat absorbing end, the liquid of inside heat pipe splendid attire has low boiling, described liquid can be water, for reaching the low boiling of water, heat pipe can be pumped into the partial vacuum state, can reach the predetermined temperature of LED light fixture, when its internal temperature reaches 50 ℃ of left and right sides, can make the internal liquid explosive evaporation go out gas and distribute rapidly, can the heat transmission be distributed by the groups of fins that is nested with at the heat pipe heat radiation end, in order to accelerate radiating rate at the heat pipe heat radiation end, fix a radiator fan on groups of fins, the gas cooling of heat pipe heat radiation end becomes liquid and returns the heat pipe heat absorbing end.It is compacter for the heat pipe heat absorbing end is contacted with heat-conducting seat, the heat that sends on the LED lamp substrate is in time absorbed transmission by the heat pipe heat absorbing end, reach the fixedly position of heat pipe simultaneously, heat-conducting seat is provided with a recess, and the position that recess is provided with is corresponding with the LED surface configuration and the position of LED lamp substrate array.This structure has the heat pipe of saving quantity, and the heat that can apace the LED lamp substrate be distributed distributes by the groups of fins transmission that the heat pipe heat absorbing end is nested with; Heat-conducting seat and groups of fins can fix by metal aluminium bar or metal copper rod, so also another part heat on the heat-conducting seat can be distributed the heat transmission by metal aluminium bar or metal copper rod.
[description of drawings]
It is following that the utility model is described in further detail in conjunction with the accompanying drawings and embodiments.
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the three-dimensional decomposition chart of the utility model LED lamp substrate and heat abstractor.
Fig. 3 is a side view of the present utility model.
Fig. 4 is the side cutaway view of A-A direction shown in Figure 3.
Fig. 5 is the internal structure schematic diagram of heat pipe 30.
Fig. 6 is the amplification perspective view of fin 401.
The primary clustering symbol description is as follows:
Heat-conducting seat 20 recesses 201 fixing holes 205
Groups of fins 40 fin 401 flangings 402
Ventilating opening 405 heat transfer blocks 70 metal bars 75
Liquid 80 fans 90 holders 95
[specific embodiment]
In order further to understand feature of the present utility model and technology contents, with reference to the accompanying drawings the utility model is elaborated.
Fig. 1, Fig. 2 illustrates, the heat abstractor of the utility model LED light fixture mainly comprises heat-conducting seat 20, heat pipe 30 and groups of fins 40, heat pipe 30 has heat absorbing end 301 and radiating end 302, heat absorbing end 301 is connected with an end face of heat-conducting seat 20, the other end of heat-conducting seat 20 attaches on the contact LED lamp substrate 10, heat-conducting seat 20 is fixing by screw 102 with LED lamp substrate 10, groups of fins 40 is socketed on the heat pipe heat radiation end 302, heat pipe 30 is a hollow structure, its inside is loaded with the boiling temperature liquid 80 suitable with LED light fixture predetermined temperature, and liquid 80 is arranged on heat pipe heat absorbing end 302.Groups of fins 40 is formed by stacking by a plurality of fin 401, is provided with gap and ventilation lamination between the fin 401.For the heat that will send on the LED lamp substrate 10 distributes, in groups of fins 40 1 sides a radiator fan 90 is set, fan 90 is fixed on the holder 95 of groups of fins 40 both sides welding.In order to make the better ventilation and heat in stack back between the fin 401, can adopt surface configuration and the identical rectangle fin 401 of size, be provided with flanging 402 at 401 liang of opposite side of rectangle fin, the height of 401 liang of flangings 402 of each rectangle fin is identical, after forming each rectangle fin 401 lamination of flanging 402, form ventilation gap between its each fin 401, holder 95 is fixed on the both sides of fin 401 behind two conduplication sides, 402 laminations, and fan 90 is installed in ventilating opening 405 places of groups of fins 40.
Accompanying drawing 3, accompanying drawing 4 illustrate, in order to make heat pipe 30 contact compacter with heat-conducting seat 20, the heat that sends on the LED lamp substrate 10 is distributed by heat pipe 30 heat transfer in time, reach the fixedly position of heat pipe 30 simultaneously, heat-conducting seat 20 is provided with a recess 201, and heat pipe heat absorbing end 301 is fixed in the recess 201 by heat transfer block 70; The recess 201 that is provided with on the heat-conducting seat 20 is corresponding with the LED101 surface configuration of LED lamp substrate 10 arrays, and recess 201 areas that are provided with on the heat-conducting seat 20 are slightly larger than the area of LED lamp substrate 10 array LEDs 101.
Above-described LED lamp substrate 10, heat-conducting seat 20, fin 401 and heat transfer block 70 all are to adopt the metal material that readily conducts heat to make, the metal that readily conducts heat can adopt metal materials such as copper or aluminium to make, when using heat-transfer matcrial, can can adopt copper, aluminium or copper aluminium to intersect according to the demand of cost of manufacture, heat transfer and heat radiation as heat transfer medium.
Shown in Figure 5, the front view of heat pipe 30 is " U " font, its internal structure is the hollow closed state, the general metallic copper or the aluminum that readily conduct heat of adopting done, in order to make suction be delivered to heat pipe heat radiation end 302 as early as possible at the heat of heat pipe heat absorbing end 301, the position of its heat absorbing end 301 be with heat-conducting seat 20 position contacting be heat pipe heat absorbing end 301.Splendid attire water in heat pipe 30 inner chambers, the position of water are arranged on heat pipe heat absorbing end 301 places, and the capacity of its splendid attire water takes the cavity of heat pipe heat absorbing end 301, and preferably the height of water level of splendid attire is higher than the cavity of heat pipe heat absorbing end 301; Simultaneously heat pipe 30 inner chambers of splendid attire water are pumped into the partial vacuum state, the water generally boiling point under normal pressure is about 100 ℃, when water was pumped into the partial vacuum state in sealed hollow and with cavity, its back water that is heated promptly can seethe with excitement about 50 ℃ and evaporating gas in the inner chamber of sealing.The bottom of U font heat pipe 30, be that heat absorbing end 301 is fixing with heat-conducting seat 20 by heat transfer block 70, when heat pipe heat absorbing end 301 absorbs the heat that LED lamp substrate 10 distributes, when the temperature of heat pipe heat absorbing end 301 reaches 50 ℃ of left and right sides, can make the water boiling that is contained in heat pipe 30 and produce gas and rise to heat pipe heat radiation end 302, heat pipe heat radiation end 302 is subjected to the heat transmission of groups of fins 40 and the heat radiation of fan, gas cooling with heat pipe heat radiation end 302, turn back to heat absorbing end 301 places again thereby become liquid after the gas that rises to radiating end 302 is lowered the temperature, form circulation repeatedly.
The outer shape of above-mentioned heat pipe 30 not only is defined as the U font, also can be Y, Z, I, B, C, falls F, side to fall H, J, other shapes such as J, L and S of falling.The liquid 80 of splendid attire also is not limited to water in described heat pipe 30 inner chambers, also can be lower alcohol of boiling point or oils liquid.
Heat-conducting seat 20 and groups of fins 40 are fixing by the metal bar 75 that readily conducts heat, the metal bar 75 general metal aluminium bar or the copper rods that readily conduct heat of adopting are made, find by test, every fixing metal aluminium bar or metal copper rod can transmit, distribute LED lamp substrate 10 sends about 10% heat, metal bar 75 had both played the fixedly effect between the heat-conducting seat 20 and groups of fins 40, also the heat transmission of LED lamp substrate 10 parts can be distributed simultaneously.
The above embodiment that exemplifies is only in order to conveniently to illustrate and to understand the utility model; do not breaking away from creation spirit category of the present utility model; be familiar with the various covert and modification that the personage did of this technology, still should belong to the scope that technical solutions of the utility model are protected.
Claims (9)
1. the heat abstractor of a LED light fixture, mainly comprise heat-conducting seat (20), heat pipe (30) and groups of fins (40), described heat pipe (30) has heat absorbing end (301) and radiating end (302), described heat absorbing end (301) is connected with an end face of described heat-conducting seat (20), the other end of heat-conducting seat (20) attaches on the contact LED lamp substrate (10), described groups of fins (40) is socketed on the described heat pipe heat radiation end (302), it is characterized in that: described heat pipe (30) is a hollow structure, its inside is loaded with the boiling temperature liquid (80) suitable with LED light fixture predetermined temperature, and described liquid (80) is arranged on heat pipe heat absorbing end (301).
2. according to the heat abstractor of the described LED light fixture of claim 1, it is characterized in that the liquid (80) of splendid attire is water in described heat pipe (30) inner chamber, the inner chamber of described heat pipe (30) is the partial vacuum state.
3. according to the heat abstractor of the described LED light fixture of claim 1, it is characterized in that described groups of fins (40) is formed by stacking by a plurality of fin (401), fin is provided with the gap between (401).
4. according to the heat abstractor of claim 1 or 3 described LED light fixtures, it is characterized in that described groups of fins (40) one sides are provided with a fan (90).
5. according to the heat abstractor of the described LED light fixture of claim 4, it is characterized in that described groups of fins (40) both sides are welded with holder (95), described fan (90) is fixed on the holder (95).
6. according to the heat abstractor of the described LED light fixture of claim 1, it is characterized in that described heat-conducting seat (20) is provided with a recess (201), described heat pipe heat absorbing end (301) is fixed in the described recess (201) by a heat transfer block (70).
7. according to the heat abstractor of the described LED light fixture of claim 6, it is characterized in that, it is corresponding with LED (101) surface configuration of LED lamp substrate (10) array that described heat-conducting seat (20) is gone up the recess (201) that is provided with, and described recess (201) area is slightly larger than the area of described LED lamp substrate (10) array LED (101).
8. according to the heat abstractor of the described LED light fixture of claim 1, it is characterized in that described heat-conducting seat (20) and groups of fins (40) are fixing by the metal bar (75) that readily conducts heat.
9. the heat abstractor of described according to Claim 8 LED light fixture is characterized in that, described metal bar (75) is aluminium bar or copper rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200602745U CN201116711Y (en) | 2007-11-27 | 2007-11-27 | Heat dispersion device for LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200602745U CN201116711Y (en) | 2007-11-27 | 2007-11-27 | Heat dispersion device for LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201116711Y true CN201116711Y (en) | 2008-09-17 |
Family
ID=39991285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200602745U Expired - Fee Related CN201116711Y (en) | 2007-11-27 | 2007-11-27 | Heat dispersion device for LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201116711Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095115A (en) * | 2011-03-22 | 2011-06-15 | 东莞市科磊得数码光电科技有限公司 | Standardized light emitting diode (LED) light source assembly |
| CN103391664A (en) * | 2012-05-10 | 2013-11-13 | 海洋王（东莞）照明科技有限公司 | Water circulation automatic cooling system and temperature control device used for lamp burn-in |
| CN103411195A (en) * | 2013-07-29 | 2013-11-27 | 上海芯明光电科技有限公司 | High-efficiency heat dissipation proboscis projection lamp |
| CN103925575A (en) * | 2013-08-20 | 2014-07-16 | 杨顺 | Heat-tube type LED lamp |
| TWI593913B (en) * | 2011-02-18 | 2017-08-01 | 佛塞安科技股份有限公司 | Lighting module |
| CN115723330A (en) * | 2022-12-01 | 2023-03-03 | 深圳市创想三维科技股份有限公司 | Light source device and photocuring 3D printing apparatus |
| CN115962447A (en) * | 2023-01-10 | 2023-04-14 | 深圳市宇亮光电技术有限公司 | LED lamp with heat dissipation packaging structure |
-
2007
- 2007-11-27 CN CNU2007200602745U patent/CN201116711Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI593913B (en) * | 2011-02-18 | 2017-08-01 | 佛塞安科技股份有限公司 | Lighting module |
| CN102095115A (en) * | 2011-03-22 | 2011-06-15 | 东莞市科磊得数码光电科技有限公司 | Standardized light emitting diode (LED) light source assembly |
| CN103391664A (en) * | 2012-05-10 | 2013-11-13 | 海洋王（东莞）照明科技有限公司 | Water circulation automatic cooling system and temperature control device used for lamp burn-in |
| CN103391664B (en) * | 2012-05-10 | 2016-03-30 | 海洋王（东莞）照明科技有限公司 | The water circulation automatic radiating system aging for light fixture and attemperating unit thereof |
| CN103411195A (en) * | 2013-07-29 | 2013-11-27 | 上海芯明光电科技有限公司 | High-efficiency heat dissipation proboscis projection lamp |
| CN103925575A (en) * | 2013-08-20 | 2014-07-16 | 杨顺 | Heat-tube type LED lamp |
| CN115723330A (en) * | 2022-12-01 | 2023-03-03 | 深圳市创想三维科技股份有限公司 | Light source device and photocuring 3D printing apparatus |
| CN115962447A (en) * | 2023-01-10 | 2023-04-14 | 深圳市宇亮光电技术有限公司 | LED lamp with heat dissipation packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20091228 |