CN201115145Y - Fastener for heat sink - Google Patents
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- CN201115145Y CN201115145Y CNU2007201749022U CN200720174902U CN201115145Y CN 201115145 Y CN201115145 Y CN 201115145Y CN U2007201749022 U CNU2007201749022 U CN U2007201749022U CN 200720174902 U CN200720174902 U CN 200720174902U CN 201115145 Y CN201115145 Y CN 201115145Y
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- 230000017525 heat dissipation Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种用于将散热片固定于芯片上的扣具,特别涉及一种更能确保该扣具完全扣合于芯片的结构。The utility model relates to a buckle for fixing a cooling fin on a chip, in particular to a structure which can ensure that the buckle is completely fastened to the chip.
背景技术Background technique
通常,计算机的芯片组,包括球状矩阵排列(Ball Grid Array,BGA)、四侧引脚扁平封装(Quad Flat Package,QFP)及中央处理器(Central ProcessingUnit,CPU)等,在启动运算时会产生高温,若不能将其及时排除,则会影响其性能,甚至烧毁,尤其运算速度愈快的芯片组所产生的热量愈高,其影响更为显著。因此,任何计算机主机均必须设有散热装置以排除芯片组所产生的热量。Generally, computer chipsets, including Ball Grid Array (BGA), Quad Flat Package (QFP) and Central Processing Unit (CPU), etc., will generate If the high temperature cannot be removed in time, it will affect its performance, or even burn it out. Especially, the faster the computing speed, the higher the heat generated by the chipset, the more significant the impact. Therefore, any computer host must be equipped with a cooling device to remove the heat generated by the chipset.
一般对于运算速度较快的芯片组均有散热装置设计,主要是直接在芯片组上设置具有多个鳍片的散热片,甚至于该散热片上设置风扇,该芯片组运算时所产生的大部份热量由该散热片吸收,而该芯片组在运算时同时启动风扇运转吹袭散热片而达到散热作用。Generally, chipsets with faster computing speeds are designed with heat sinks. The main method is to directly install a heat sink with multiple fins on the chipset, and even set a fan on the heat sink. Most of the heat generated by the chipset during operation Part of the heat is absorbed by the heat sink, and the chipset simultaneously starts the fan to blow the heat sink to achieve heat dissipation during operation.
较早期将散热片组合于芯片组上的方式,主要是利用金属弹片将散热片扣固于芯片基座(SOCKET),例如:中国台湾专利公告第316687号。然而,传统用以将散热片扣固于芯片组的金属弹片结构较为复杂,组装时较不便,制造成本较高,且容易弹性疲乏,使得计算机在运输起卸货时容易因振动而脱落,若操作不慎,施力过大时即很容易伤及精密且脆弱的芯片组;若是芯片组与主机板的结合没有基座(SOCKET),而是采用BGA基座或直接焊上时,则根本没有任何地方可扣住弹片。The earlier way of combining the heat sink on the chipset is mainly to fasten the heat sink to the chip base (SOCKET) by using a metal shrapnel, for example: Chinese Taiwan Patent Publication No. 316687. However, the metal shrapnel traditionally used to fasten the heat sink to the chipset has a complex structure, inconvenient assembly, high manufacturing cost, and easy elastic fatigue, which makes the computer easy to fall off due to vibration during transportation and unloading. Inadvertently, when the force is too large, it is easy to damage the delicate and fragile chipset; if there is no socket (SOCKET) for the combination of the chipset and the motherboard, but a BGA socket or direct soldering, there is no socket at all. The shrapnel can be snapped anywhere.
一般的芯片组接脚焊接设于主机板上时,该芯片组与主机板之间仅约0.25mm高度,由于空间十分有限,故之前从未有任何厂商思考如何利用该有限的空间去改良芯片的散热问题,而是仅采用黏胶式把散热胶布贴于散热片底部再黏于芯片上面,或是以螺丝锁于主机板,例如:中国台湾专利公告第257346号。但由于胶布遇高温后极易老化而脱落,因而有厂商请主机板制造商在主机板上预留孔位以便用螺丝固定,其效果虽然较散热胶布佳,但预留孔位有实际的困难,因为并非每种线路布局均能如愿,且并非每家主机板制造商均能配合预留孔位,又其组装成本高且费时,因而预留螺丝孔于主机板上与上述型式的散热片的流通性实有困难。Generally, when the chipset pins are soldered on the motherboard, the height between the chipset and the motherboard is only about 0.25mm. Because the space is very limited, no manufacturer has thought about how to use the limited space to improve the chip before. Instead, stick the thermal tape on the bottom of the heat sink and stick it on the chip, or lock it on the motherboard with screws, for example: China Taiwan Patent Publication No. 257346. However, since the tape is easy to age and fall off when exposed to high temperatures, some manufacturers ask the motherboard manufacturer to reserve holes on the motherboard for fixing with screws. Although the effect is better than heat dissipation tape, it is difficult to reserve holes. , because not every circuit layout can do what you want, and not every motherboard manufacturer can match the reserved holes, and its assembly cost is high and time-consuming, so screw holes are reserved on the motherboard and the above-mentioned types of heat sinks Circulation is really difficult.
因此,申请号为87217790的中国台湾申请针对上述传统芯片组与散热片在组装上的缺点加以改良,使其能适用于任何型式的主机板装设。该专利所提供的散热片固定座在中央设有一洞孔,其下面各端边分别向下延设有一侧板(共有四个侧板),并于侧板分别设有朝向内侧的扣钩;使散热片由下往上穿过该固定座的洞孔,并使散热片的板体挡住该洞孔的边缘,再使该固定座的扣钩迫合扣住该芯片组的相对二侧边缘,以防止散热片与固定座之间滑动而不能组合固定。Therefore, the Taiwan application with application number 87217790 improves the above-mentioned shortcomings in the assembly of the traditional chipset and heat sink, so that it can be applied to any type of motherboard installation. The heat sink fixing seat provided by this patent is provided with a hole in the center, and side plates (four side plates in total) are respectively extended downwards on the lower end edges thereof, and clasps facing inward are respectively provided on the side plates; Let the heat sink pass through the hole of the fixing seat from bottom to top, and make the plate body of the heat sink block the edge of the hole, and then force the buckle of the fixing seat to buckle the opposite two side edges of the chipset , in order to prevent sliding between the heat sink and the fixed seat and cannot be combined and fixed.
虽然前述专利的固定座可将散热片与芯片做结合固定,但由于散热片在制成过程中难免有些误差,以致于造成其底面并非十分平整,因而在与芯片接触时仍然无法完全密切地贴合,造成芯片所产生的热量无法快速地传导至散热片而影响散热效率。而且,由于该专利的固定座在四边均设有侧板,但仅利用其中的相对两侧板扣住芯片的两侧边且同时阻挡散热片的两边,其余的两边则跨在散热片上面,因此,必须在散热片上的鳍片开设横贯两侧的槽道,以供该相对的两侧板跨置在该槽道内;但是,又由于该固定座的四侧板均为相同高度,以致于在组装散热片与固定座时,必须在该散热片的槽道上先开设能让侧板穿过的槽孔,使得具有扣钩的侧板扣住芯片的两侧时,也同时让另外两侧板穿过该槽孔而将固定座完全地与散热片组合。但如此一来,散热片在开设槽孔后将会减少传热面积,因而降低散热效果。Although the fixing seat of the aforementioned patent can combine and fix the heat sink and the chip, due to some errors in the manufacturing process of the heat sink, the bottom surface of the heat sink is not very flat, so it still cannot be completely and closely attached to the chip when it is in contact with the chip. Combined, the heat generated by the chip cannot be quickly transmitted to the heat sink, which affects the heat dissipation efficiency. Moreover, since the fixing seat of this patent is provided with side plates on all four sides, only the opposite side plates are used to buckle the two sides of the chip and block the two sides of the heat sink at the same time, and the remaining two sides straddle the heat sink. Therefore, the fins on the heat sink must be provided with grooves across both sides, so that the opposite side plates can be straddled in the grooves; however, because the four side plates of the fixing seat are all of the same height, so that When assembling the heat sink and the fixing seat, it is necessary to open a slot on the channel of the heat sink to allow the side plate to pass through, so that when the side plate with the hook buckles the two sides of the chip, it also allows the other two sides to pass through. The plate passes through the slot to completely combine the fixing seat with the heat sink. But in this way, the heat transfer area will be reduced after the heat sink is opened with slots, thus reducing the heat dissipation effect.
申请号为880248的中国台湾专利提供的设计则针对前述的缺点加以改良,其结构如图9所示,包括一矩形框体1,该矩形框体的相对两侧下方分别向下垂直延设有一侧板11,该二侧板的相对内侧面下边分别形成有二个突出的扣钩111,该矩形框体的另外相对两侧的下方分别向下延设有凸柱,该矩形框体的内侧壁设有多个弹性杆,该弹性杆的下方设有突部。在组装时,将散热片的鳍片由下往上穿过该矩形框体的洞孔,再使该矩形框体相对二侧的扣钩迫合扣住芯片组的相对二侧边缘,而凸柱则穿过预先钻设于散热片的穿孔,并使该弹性杆下方的突部压掣于散热片上而固定。但是,该申请的缺点在于:其设在矩形框体相对两侧的扣钩共有四个,因此,在安装时,这些扣钩很容易和周边的电子组件产生干涉,或因组装时压力的问题而造成“假扣”,即没有将所有扣钩均完成扣固。Application No. 880248 is the design provided by Taiwan Patent of China, which improves the above-mentioned shortcomings.
实用新型内容Utility model content
为了解决上述公告第880248号专利的扣具存在的缺点,本实用新型提供了一种扣具,本实用新型的扣具根据所要安装散热模块的周边环境而改变前述扣钩在扣具两侧的位置,使在利用扣具将散热片安装于芯片组时,避免扣钩对周边的电子组件造成干涉与假扣的问题。In order to solve the shortcomings of the buckle of the above-mentioned announcement No. 880248 patent, the utility model provides a buckle. The buckle of the utility model changes the position of the aforementioned buckle on both sides of the buckle according to the surrounding environment where the heat dissipation module is to be installed. The position is so that when the heat sink is installed on the chipset with the fastener, the problem of interference and false fastener caused by the fastener to the surrounding electronic components is avoided.
本实用新型提供了一种散热片扣具,包括:一矩形框体,该矩形框体的相对两侧下方分别向下垂直延设有一侧板,该二侧板的相对内侧面下边分别形成有突出的扣钩,该矩形框体的另外相对两侧的下方分别向下延设有凸柱,该矩形框体的内侧壁设有多个弹性杆,该弹性杆的下方设有突部,所述二侧板的下边分别设置一个所述扣钩。The utility model provides a radiator fastener, which comprises: a rectangular frame body, one side plate is vertically extended downwards on the opposite sides of the rectangular frame body, and two side plates are respectively formed on the lower sides of the opposite inner sides of the two side plates. Protruding clasps, protruding columns are respectively extended downwards on the opposite sides of the rectangular frame body, a plurality of elastic rods are arranged on the inner side wall of the rectangular frame body, and protrusions are arranged under the elastic rods, so that The lower sides of the two side plates are respectively provided with one clasp.
所述两个扣钩分别位于该矩形框体两侧的中央相对称的位置。The two clasps are respectively located at symmetrical positions in the center of the two sides of the rectangular frame.
所述两个扣钩分别位于该矩形框体两侧的对角位置。The two clasps are respectively located at diagonal positions on both sides of the rectangular frame.
本实用新型提供进一步提供了一种散热片扣具,包括:一矩形框体,该矩形框体的相对两侧下方分别向下垂直延设有一侧板,该二侧板的相对内侧面下边分别形成有突出的扣钩,该矩形框体的另外相对两侧的下方分别向下延设有凸柱,该矩形框体的内侧壁设有多个弹性杆,该弹性杆的下方设有突部,所述其中一侧板的下边设置一个所述扣钩,另一侧板的下边设置二个所述扣钩,该三个扣钩在所述矩形框体的俯视投影平面上呈等腰三角形分布。The utility model further provides a heat sink fastener, comprising: a rectangular frame body, one side plate is vertically extended downwards at the lower sides of the opposite sides of the rectangular frame body, and the lower sides of the opposite inner sides of the two side plates are respectively Protruding clasps are formed, protruding columns are respectively extended downwards on the opposite sides of the rectangular frame body, a plurality of elastic rods are arranged on the inner side wall of the rectangular frame body, and protrusions are arranged under the elastic rods , one of the clasps is set on the lower side of one of the side plates, and two of the clasps are set on the lower side of the other side plate, and the three clasps are isosceles triangles on the top view projection plane of the rectangular frame distributed.
与现有技术相比,本实用新型具有以下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
(1)本实用新型可以依各种散热模块所要安装的环境预先设计这些扣钩的分布位置,以提供选取使用,避免安装时对其它电子组件造成干涉;(1) The utility model can pre-design the distribution positions of these hooks according to the environment where various heat dissipation modules are to be installed, so as to provide selection and use, and avoid interference with other electronic components during installation;
(2)且利用前述矩形框体两侧总数为两个或三个扣钩的设计,使得矩形框体在组扣于芯片时,能尽可能地将各个扣钩完全地扣住芯片边缘,使得一旦有一个扣钩未能扣固时,安装者可以轻易地感觉到摇晃,从而再将其稳固地安装。(2) and utilizing the design of two or three clasps in total on both sides of the aforementioned rectangular frame, when the rectangular frame is assembled to the chip, each clasp can be buckled as far as possible to the edge of the chip as much as possible, so that Once a clasp fails to fasten, the installer can easily feel the shaking, so as to install it firmly again.
附图说明Description of drawings
图1为本实用新型结构的扣具的第一实施例的结构的第一角度立体图;Fig. 1 is the perspective view of the first angle of the structure of the structure of the first embodiment of the buckle of the utility model structure;
图2为本实用新型结构的第二角度立体图;Fig. 2 is the second perspective view of the utility model structure;
图3为本实用新型具有三个扣钩的扣具,其三个扣钩分布呈等腰三角形的平面示意图;Fig. 3 is a buckle with three hooks of the present invention, a schematic plan view of which the three hooks are distributed in an isosceles triangle;
图4为本实用新型的扣具用于将散热片组合于芯片组的实施例立体分解图;Fig. 4 is a three-dimensional exploded view of an embodiment of the buckle of the present invention for combining the heat sink with the chipset;
图5为本实用新型的扣具用于将散热片组合于芯片组的第一平面动作图;Fig. 5 is the first plane action diagram of the buckle of the present invention for combining the heat sink with the chipset;
图6为本实用新型的扣具将散热片组合完成于芯片组的平面示意图;Fig. 6 is a schematic plan view of the combination of heat sinks and chipsets in the fastener of the present invention;
图7为本实用新型的扣具的第二实施例结构的立体图;Fig. 7 is a perspective view of the structure of the second embodiment of the buckle of the present invention;
图8为本实用新型的扣具的第三实施例结构的立体图;Fig. 8 is a perspective view of the structure of the third embodiment of the buckle of the present invention;
图9为现有的扣具结构立体图。Fig. 9 is a three-dimensional view of the existing buckle structure.
图中,In the figure,
1矩形框体1 rectangular frame
10洞孔10 holes
11侧板11 side panels
111扣钩111 clasp
12凸柱12 bosses
13弹性杆13 elastic rod
131突部131 protrusion
2散热片2 heat sinks
21板体21 plate body
22鳍片22 fins
23穿孔23 perforations
24槽道24 slots
3芯片组3 chipsets
31边缘31 edge
4电路板4 circuit boards
具体实施方式Detailed ways
以下结合附图对本实用新型的实施例做更详细的说明。Embodiments of the present utility model are described in more detail below in conjunction with the accompanying drawings.
如图1和图2所示,本实用新型提供的散热片扣具,其中一实施例的结构包括一矩形框体1,该矩形框体1中央形成有一矩形洞孔10,该矩形框体1的相对两侧分别向下垂直延设有一侧板11,其中一侧板的下边设置一个扣钩111,另一侧板的下边设置二个扣钩111,该三个扣钩111在所述矩形框体1的俯视投影平面上呈等腰三角形分布,如图3所示。该矩形框体的另外相对两侧的下方分别向下延设有圆形的凸柱12,且该凸柱12的长度不短于上述侧板11的高度,又于该矩形框体的内侧壁设有多个弹性杆13,该弹性杆13的下方设有突部131。在本实用新型的实施例中,该弹性杆13设于未设置侧板11的矩形框体1另外相对两内侧边,且使该弹性杆13垂直于该洞孔10的内侧壁。As shown in Fig. 1 and Fig. 2, the heat sink fastener provided by the utility model, the structure of one embodiment includes a
如图4所示,图中,用以配合在本实用新型的扣具的散热片2设有一比上述洞孔10大的矩形板体21,该板体21上面延设有多个鳍片22,该鳍片22并切割出有可容纳扣具的矩形框体1宽度的槽道24。另外,一般的芯片组3组装于电路板4上,由于焊接在电路板4上的芯片组3接脚具有一定高度,约0.25mm,因而使得该芯片组3与电路板4之间具有适当高度的空间(0.25mm);在组装时,只要将散热片2的鳍片由下往上穿过矩形框体1的洞孔10,并使散热片2的板体21挡住该洞孔10的边缘,再使该矩形框体1相对二侧的扣钩111迫合扣住该芯片组3的相对二侧边缘31,而这些凸柱12则穿过预先钻设于散热片2的槽道24上的穿孔23,并使该弹性杆13下方的突部131压掣于散热片2上即可快速地组合固定,如图5和图6所示。相反地,当欲卸下散热片2时,则只要将矩形框体1往上施力拔起,以使扣钩111脱离对芯片组3的卡掣即可。As shown in Figure 4, in the figure, the cooling
图7为本实用新型扣具的另一实施例,其结构基本上与图1和图2所示的实施例的结构相同,其区别在于,图7所示的实施例仅包含有两个扣钩111,该两个扣钩111分别设于该矩形框体1两二侧板的中央相对称的位置。Fig. 7 is another embodiment of the utility model buckle, its structure is basically the same as that of the embodiment shown in Fig. 1 and Fig. 2, the difference is that the embodiment shown in Fig. 7 only includes two
图8为本实用新型扣具的再一实施例,其结构基本上与图1、图2及图7所示的实施例的结构相同,其区别在于,图8所示包含有两个扣钩111的实施例,是将结合于两侧板11的两个扣钩111分别设于该矩形框体1的对角位置。Fig. 8 is yet another embodiment of the utility model buckle, its structure is basically the same as that of the embodiment shown in Fig. 1, Fig. 2 and Fig. 7, the difference is that Fig. 8 contains two clasps In the embodiment of 111 , the two
以上所述仅是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本实用新型的保护范围。The above is only a preferred embodiment of the utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the utility model, some improvements and modifications can also be made, these improvements and Retouching should also be regarded as the scope of protection of the present utility model.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201749022U CN201115145Y (en) | 2007-09-03 | 2007-09-03 | Fastener for heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201749022U CN201115145Y (en) | 2007-09-03 | 2007-09-03 | Fastener for heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201115145Y true CN201115145Y (en) | 2008-09-10 |
Family
ID=39966898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201749022U Expired - Lifetime CN201115145Y (en) | 2007-09-03 | 2007-09-03 | Fastener for heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201115145Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842545A (en) * | 2011-06-21 | 2012-12-26 | 恩佐科技股份有限公司 | Heat dissipation component and its combined structure with chipset |
| CN107104083A (en) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | Fastening components with low wind pressure loss, heat dissipation components and combined structure with chipset |
| CN111376283A (en) * | 2018-12-29 | 2020-07-07 | 深圳市远望工业自动化设备有限公司 | Lower clamp of typesetter |
| CN113543579A (en) * | 2020-11-10 | 2021-10-22 | 华为技术有限公司 | Heat dissipation assembly, electronic equipment and chip packaging structure |
-
2007
- 2007-09-03 CN CNU2007201749022U patent/CN201115145Y/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842545A (en) * | 2011-06-21 | 2012-12-26 | 恩佐科技股份有限公司 | Heat dissipation component and its combined structure with chipset |
| CN102842545B (en) * | 2011-06-21 | 2015-04-15 | 恩佐科技股份有限公司 | Heat dissipation component and its combined structure with chipset |
| CN107104083A (en) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | Fastening components with low wind pressure loss, heat dissipation components and combined structure with chipset |
| CN111376283A (en) * | 2018-12-29 | 2020-07-07 | 深圳市远望工业自动化设备有限公司 | Lower clamp of typesetter |
| CN113543579A (en) * | 2020-11-10 | 2021-10-22 | 华为技术有限公司 | Heat dissipation assembly, electronic equipment and chip packaging structure |
| WO2022100128A1 (en) * | 2020-11-10 | 2022-05-19 | 华为技术有限公司 | Heat dissipation assembly, electronic device, and chip package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080910 |