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CN201087784Y - Hybrid packaged light emitting device - Google Patents

Hybrid packaged light emitting device Download PDF

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Publication number
CN201087784Y
CN201087784Y CNU2007201744762U CN200720174476U CN201087784Y CN 201087784 Y CN201087784 Y CN 201087784Y CN U2007201744762 U CNU2007201744762 U CN U2007201744762U CN 200720174476 U CN200720174476 U CN 200720174476U CN 201087784 Y CN201087784 Y CN 201087784Y
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emitting device
light
package type
type light
hybrid package
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钟建兴
胡迪生
吴明昌
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Abstract

The utility model relates to a mix encapsulation type illuminator, it mainly comprises a luminescence unit and a control and drive circuit module or chip, this control and drive circuit module have the effect of carrying out secondary stabilized voltage and electric current, especially be applicable to the visible light and the invisible light LED chip that have high sensitivity to the electrical property, and, it also can drive luminescence unit and produce required light source according to the demand, its finished product can be used as the illumination, or as an electron device's backlight or as light source signal transmission.

Description

混合封装型发光装置 Hybrid Packaged Light-Emitting Device

技术领域technical field

本实用新型涉及的是一种混合封装型发光装置,尤指一种将一控制和驱动电路模块以及一发光单元封装在同一基板,以使电源进入发光单元前,可进行二次稳定电压与电流的作用的混合封装型发光装置。The utility model relates to a hybrid packaging type light-emitting device, in particular to a control and drive circuit module and a light-emitting unit packaged on the same substrate, so that before the power supply enters the light-emitting unit, the secondary voltage and current can be stabilized. The role of the hybrid package type light emitting device.

背景技术Background technique

随着环保与节能的意识抬头,目前各类型电子装置的发展方向,也逐渐朝向符合环保与节能的需求而进行,其中,尤以照明与光源需求为最甚,主要的原因在于照明实于是人类生活中不可或缺的需求,再者,只要有关显示的电子装置,也均需要光源的配合,方可使显示之内容有效呈现,举凡液晶电视、具显示屏的通讯装置、计算机用的液晶显示屏等,都离不开光源的应用,又,目前为达到符合环保与节能的需求,传统的灯管、灯泡等类型的发光装置,已逐渐被发光二极管(LED)所取代,例如目前应用在照明的MR16LED灯即是一例,又例如早期液晶显示屏的背光源,是应用CCFL(冷阴极射线管),其造价昂贵,且其制成的材质有造成环境污染的问题,目前,也逐渐被发光二极管(LED)取代;在应用上,发光二极管(LED)确实可达到符合环保与节能的要求,唯,发光二极管(LED)是以芯片作为发光的实体,其对电性的敏感程度相当高,若在电流或电压不稳定的供电条件中,发光二极管(LED)很容易就会产生损坏,例如芯片烧毁、光衰减、闪烁等问题;请参阅图1,图中所示为现有的电性环境示图,如图中所示,当一电源10被输入至一使用区域时,是会先经过一稳压装置101,利用此稳压装置101进行电流的稳流与稳压,以使进入使用区域的电流呈现稳定状态,再输送至如插座102或灯座103,如此,需用电的电子装置104,则可利用电性接头插置在插座102使用,或一发光装置105则可插置在灯座103,以达到产生发光的功用,唯,如前所述,若电子装置104或发光装置105是有应用到发光二极(LED)作为应用光源,则因应其电性敏感的特性,则电流传输稳定度的要求则需要还高,否则,即可能造成电子装置104或发光装置105的加速损坏,唯,以现时的使用环境而言,使用者若为防止此问题,则仅能自行再增设一稳压装置,以使电流与所使用的电子装置或发光装置产生导通前,再经过一次稳压与稳流的过程,此举无疑增添了使用者的应用成本以及不便性,尤其若所使用的电子装置为携带式的电子装置时,则还显不便。With the rise of awareness of environmental protection and energy saving, the current development direction of various types of electronic devices is gradually moving towards meeting the needs of environmental protection and energy saving. Among them, the demand for lighting and light sources is the most important. The main reason is that lighting is actually a human being. Indispensable needs in daily life. Moreover, as long as the electronic devices related to the display also need the cooperation of the light source, the content of the display can be effectively presented. For example, LCD TVs, communication devices with display screens, and liquid crystal displays for computers Screens, etc., are inseparable from the application of light sources. In addition, in order to meet the needs of environmental protection and energy saving, traditional lighting devices such as lamp tubes and bulbs have gradually been replaced by light-emitting diodes (LEDs). For example, they are currently used in The MR16 LED lamp for lighting is an example. Another example is the backlight of the early liquid crystal display, which uses CCFL (cold cathode ray tube). Light-emitting diodes (LEDs) are replaced; in terms of applications, light-emitting diodes (LEDs) can indeed meet the requirements of environmental protection and energy saving. However, light-emitting diodes (LEDs) use chips as light-emitting entities, and their sensitivity to electricity is quite high , if the current or voltage is unstable in the power supply condition, the light-emitting diode (LED) will easily be damaged, such as chip burnout, light attenuation, flicker, etc.; please refer to Figure 1, which shows the existing power supply As shown in the figure, when a power supply 10 is input to a use area, it will first pass through a voltage stabilizing device 101, and the voltage stabilizing device 101 is used to stabilize the current and stabilize the voltage, so that The current entering the use area is in a stable state, and then sent to the socket 102 or the lamp holder 103. In this way, the electronic device 104 that needs electricity can be plugged into the socket 102 for use by using an electrical connector, or a light emitting device 105 can be used. Inserted in the lamp holder 103 to achieve the function of generating light. However, as mentioned above, if the electronic device 104 or the light emitting device 105 is applied to the light emitting diode (LED) as the application light source, it should be electrically sensitive characteristics, the current transmission stability needs to be higher, otherwise, it may cause accelerated damage to the electronic device 104 or the light emitting device 105. However, in terms of the current use environment, if the user wants to prevent this problem, only A voltage stabilizing device can be added on its own, so that the current can go through a process of stabilizing the voltage and current before it conducts with the electronic device or light-emitting device used. This will undoubtedly increase the application cost and inconvenience of the user , especially if the electronic device used is a portable electronic device, it is inconvenient.

发明内容Contents of the invention

有鉴于上述的问题与需求,本实用新型的目的在于,提供一种混合封装型发光装置,用以克服上述缺陷。In view of the above problems and needs, the purpose of the present utility model is to provide a hybrid packaging type light emitting device to overcome the above defects.

为实现上述目的,本实用新型采用的技术方案在于,提供一种混合封装型发光装置,其经电源导通后可产生光源,其包括:In order to achieve the above purpose, the technical solution adopted by the utility model is to provide a hybrid packaging type light emitting device, which can generate a light source after the power supply is turned on, which includes:

一发光单元,是由一个以上的发光二极管芯片作为发光源,所述的发光单元封装在一基板上;A light-emitting unit is composed of more than one light-emitting diode chip as a light-emitting source, and the light-emitting unit is packaged on a substrate;

一控制和驱动电路模块,封装在所述的基板上,与所述的发光单元完成电连接,所述的控制和驱动电路模块是由一控制单元、一驱动单元与一电流/电压稳定单元电连接组构而成,用以控制与驱动所述的发光单元;以及A control and drive circuit module, packaged on the substrate, and electrically connected to the light emitting unit, the control and drive circuit module is composed of a control unit, a drive unit and a current/voltage stabilization unit connected and formed to control and drive the light-emitting unit; and

以环氧树脂将所述的控制和驱动电路模块,以及所述的发光二极管芯片完整包覆。The control and driving circuit module and the LED chip are completely covered with epoxy resin.

与现有技术比较本实用新型的有益效果在于,是具有稳定电压、电流的作用,可使进入发光装置的电源得到二次稳压与稳流的效果,其也可进一步组设有一控制装置,以改变电压与电流,以控制发光装置的光色变化,以增加其实用性。Compared with the prior art, the utility model has the beneficial effects of stabilizing the voltage and current, enabling the power supply entering the light-emitting device to obtain the effect of secondary voltage stabilization and current stabilization, and it can also be further equipped with a control device, The voltage and current can be changed to control the light color change of the light-emitting device, so as to increase its practicability.

附图说明Description of drawings

图1为现有的电性环境示图;Figure 1 is a diagram of the existing electrical environment;

图2为本实用新型的组成单元与电路布设示意图;Fig. 2 is a schematic diagram of the composition unit and circuit layout of the utility model;

图3为本实用新型的一较佳实施例示意图(一);Fig. 3 is a schematic diagram (1) of a preferred embodiment of the utility model;

图4为本实用新型另一较佳实施例(二)的组成单元与电路布设示意图;Fig. 4 is the constituent unit and circuit layout schematic diagram of another preferred embodiment (two) of the utility model;

图5为本实用新型的另一较佳实施例(三);Fig. 5 is another preferred embodiment (three) of the utility model;

图6为本实用新型的另一较佳实施例(四)。Fig. 6 is another preferred embodiment (four) of the present utility model.

附图标记说明:10-电源;101-稳压装置;102-插座;103-灯座;104-电子装置;105-发光装置;20-发光装置;201-控制和驱动电路模块;2011-控制单元;2012-驱动单元;2013-电流/电压稳定单元;202-发光单元;202’-发光单元;203-控制装置;204-感应驱动装置;30  -发光装置;301-控制和驱动电路模块;302-发光二极管芯片;303-基板;304-环氧树脂;305-萤光层;306-镀膜层;307-散热片;40-发光装置;401-基板;402-发光二极管芯片;403-控制和驱动电路模块;404-光学透镜。Description of reference signs: 10-power supply; 101-voltage stabilizing device; 102-socket; 103-lamp holder; 104-electronic device; 105-lighting device; 20-lighting device; 201-control and drive circuit module; 2011-control Unit; 2012-drive unit; 2013-current/voltage stabilization unit; 202-light-emitting unit; 202'-light-emitting unit; 203-control device; 204-inductive drive device; 30-light-emitting device; 302-light-emitting diode chip; 303-substrate; 304-epoxy resin; 305-fluorescent layer; 306-coating layer; 307-heat sink; 40-light-emitting device; 401-substrate; 402-light-emitting diode chip; and drive circuit module; 404-optical lens.

具体实施方式Detailed ways

以下结合附图,对本新型上述的和另外的技术特征和优点作更详细的说明。The above-mentioned and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

请参阅图2,图中所示为本实用新型的组成单元与电路布设示意图,如图中所示,本实用新型所揭的发光装置20主要是由一控制和驱动电路模块201,以及一发光单元202所组成,其中,控制和驱动电路模块201也可为一控制和驱动芯片,其是利用控制和驱动电路模块和LED芯片混合封装成一个发光装置的方式,使控制和驱动电路模块201,被组设在发光装置20的基板的电路结构中(本示意图中尚未绘示基板),并与发光单元202完成电连接,本实用新型所称的发光装置20是泛指以芯片作为发光源,经由电流导通后可产生光亮的发光二极管芯片(LED),也可为一由复数个发光二极管(LED)所组构而成的灯组或发光源(如面发光源、背光、侧光),或为一单颗发光二极管(LED)均属的;请再参阅图中所示,控制和驱动电路模块201为一种模拟型电路模块或芯片,主要是由一控制单元2011、一驱动单元2012以及一电流/电压稳定单元2013所组构而成,其中,控制单元2011是可接收讯号的输入,驱动单元2012则可依传输入的讯号,驱动发光单元202,又,在发光单元202的前端,是组设有一电流/电压稳定单元2013,主要是使电流在传导至发光单元202前,可经过再一次的整流与稳压,如此,可确保传导至发光单元202的电流呈稳定状态;如上,由于电流/电压稳定单元2013已被整合在发光装置20的电路布设中,故发光装置20本身即具有整流与稳定电压的作用,且,是使电流经过再次整流与稳定电压后,再传导至发光单元202,如此,可有效提升电流至最稳定的状的状态,也即,可符合发光二极管对电性高敏度的需求。Please refer to Fig. 2, which is a schematic diagram of the composition unit and circuit layout of the present utility model. As shown in the figure, the light emitting device 20 disclosed in the present utility model is mainly composed of a control and driving circuit module 201, and a The control and driving circuit module 201 can also be a control and driving chip, which uses the method of mixing and packaging the control and driving circuit module and the LED chip into a light-emitting device, so that the control and driving circuit module 201, It is assembled in the circuit structure of the substrate of the light-emitting device 20 (the substrate is not shown in this schematic diagram), and is electrically connected with the light-emitting unit 202. The light-emitting device 20 referred to in the present invention generally refers to a chip as a light source. A light-emitting diode chip (LED) that can produce light after current conduction, or a light group or light source (such as a surface light source, backlight, side light) composed of a plurality of light-emitting diodes (LED) , or a single light-emitting diode (LED); please refer to the figure again, the control and drive circuit module 201 is an analog circuit module or chip, mainly composed of a control unit 2011, a drive unit 2012 and a current/voltage stabilizing unit 2013, wherein the control unit 2011 can receive the input signal, and the driving unit 2012 can drive the light emitting unit 202 according to the input signal, and, in the light emitting unit 202 The front end is equipped with a current/voltage stabilizing unit 2013, mainly to make the current be rectified and stabilized again before being transmitted to the light-emitting unit 202, so that the current transmitted to the light-emitting unit 202 can be guaranteed to be in a stable state; As above, since the current/voltage stabilizing unit 2013 has been integrated in the circuit layout of the light emitting device 20, the light emitting device 20 itself has the function of rectifying and stabilizing the voltage, and the current is rectified and the voltage is stabilized again before conduction To the light-emitting unit 202 , in this way, the current can be effectively increased to the most stable state, that is, it can meet the requirement of high electrical sensitivity of the light-emitting diode.

请参阅图3,图中所示为本实用新型的一较佳实施例(一),如图中所示的混合封装型发光装置30,其是将控制和驱动电路模块301,以及发光二极管芯片302封装在一基板303,并以环氧树脂304将控制和驱动电路模块301以及发光二极管芯片302完整包覆,又,环氧树脂304是可直接制成一光学透镜或一光罩装置,以使包覆或盖覆后,增加发光二极管芯片302的发光效率,又,可以一透光的塑料材料取代;另,环氧树脂304中,可添加有萤光粉,以使发光二极管芯片302发光后,可产生混色效果,另,也可在环氧树脂304表面,涂布有一萤光层305,也可达到混色的效果,以及,也可在环氧树脂层304的表面镀上一层可防静电的镀膜层306,以提升其实用性,再者,基板303底部是连接有一散热片307,以使发光二极管芯片302所产生的热能,可以被快速的发散;再请参阅图中所示,控制和驱动电路模块301是具有如同图2中所示的控制单元、驱动单元以及一电流/电压稳定单元,其作用也相同,在此不再赘述。Please refer to Fig. 3, shown in the figure is a preferred embodiment (1) of the present utility model, as shown in the figure, the hybrid packaging type light-emitting device 30, which will control and drive the circuit module 301, and the light-emitting diode chip 302 is packaged on a substrate 303, and the control and drive circuit module 301 and the light emitting diode chip 302 are completely covered with epoxy resin 304. Moreover, the epoxy resin 304 can be directly made into an optical lens or a photomask device to After covering or covering, the luminous efficiency of the LED chip 302 can be increased, and it can be replaced by a light-transmitting plastic material; in addition, phosphor powder can be added to the epoxy resin 304 to make the LED chip 302 emit light. Finally, the color mixing effect can be produced. In addition, a fluorescent layer 305 can be coated on the surface of the epoxy resin 304, which can also achieve the color mixing effect. An anti-static coating layer 306 is used to enhance its practicability. Moreover, a heat sink 307 is connected to the bottom of the substrate 303, so that the heat energy generated by the LED chip 302 can be quickly dissipated; please refer to the figure again The control and driving circuit module 301 has a control unit, a driving unit and a current/voltage stabilization unit as shown in FIG.

请参阅图4,图中所示为本实用新型另一较佳实施例(二)的组成单元与电路布设示意图,其是进一步以一控制装置203连结至控制单元2011,以调整控制单元2011所输出的讯号,以使驱动单元2012依所输出的讯号驱动发光单元202,唯电流传导至发光单元202前,仍会经过电流/电压稳定单元2013,以确保输出的电流呈稳定状态;或另如图中所示,可以一感应驱动装置204连结至控制单元2011,此感应驱动装置204是可依需求作选用,例如为可感应温度变化、或湿度变化、或光的变化、或声音等的感应驱动装置,利用所感应到环境变化作为驱动控制单元2011的讯号,以提升其实用性。Please refer to Fig. 4, shown in the figure is another preferred embodiment of the utility model (two) component unit and circuit layout schematic diagram, it is further connected to the control unit 2011 with a control device 203, to adjust the control unit 2011 The output signal, so that the driving unit 2012 drives the light emitting unit 202 according to the output signal, but before the current is transmitted to the light emitting unit 202, it will still pass through the current/voltage stabilization unit 2013 to ensure that the output current is in a stable state; or another example As shown in the figure, an inductive driving device 204 can be connected to the control unit 2011, and the inductive driving device 204 can be selected according to requirements, for example, it can sense temperature changes, or humidity changes, or light changes, or the induction of sound, etc. The driving device uses the sensed environmental changes as a signal to drive the control unit 2011 to improve its practicability.

请参阅图5,图中所示为本实用新型的另一较佳实施例(三)的组成单元与电路布设示意图,如图中所示的发光单元202’,其为一个由多芯片组成的发光二极管(LED),本图实施例中所揭为R、G、B三色的三个芯片,其主要是可经由电压的调变,而使三个芯片可分别发出R(Red)、G(Green)、B(Blue)三种颜色的光源,以产生混色的作用,且,经由不同电压的输出,可使三个芯片产生不同混色程度的光,通过混色程度的变化,达到产生所需的光色;实施时,是可由调整控制装置203,使控制单元2011进行电压的调变,故当电流进入时,是依电压调变的程度,产生特定的电压值,并由驱动单元2012进行驱动本实施例中的发光单元202’,又,电流进入发光单元前,是经电流/电压稳定单元2013进行二次整流与稳压,以确保输出的电流与电压呈稳定状态;或另如图中所示,可以一感应驱动装置204连结至控制单元2011,此感应驱动装置204是可依需求作选用,例如为可感应温度变化、或湿度变化、或光的变化、或声音等的感应驱动装置,利用所感应到环境变化作为驱动控制单元2011的讯号,以提升其实用性。Please refer to Fig. 5, which shows a schematic diagram of the composition unit and circuit layout of another preferred embodiment (3) of the present utility model, the light-emitting unit 202' as shown in the figure, which is a multi-chip Light-emitting diodes (LEDs), three chips of R, G, and B colors disclosed in the embodiment of this figure, mainly can be modulated by voltage, so that the three chips can emit R (Red), G, respectively. (Green), B (Blue) light sources of three colors to produce the effect of color mixing, and, through the output of different voltages, the three chips can produce light of different color mixing degrees, through the change of color mixing degree, to achieve the required During implementation, the control unit 2011 can adjust the voltage by adjusting the control device 203, so when the current enters, it will generate a specific voltage value according to the degree of voltage modulation, and the drive unit 2012 will perform the modulation. To drive the light-emitting unit 202' in this embodiment, and before the current enters the light-emitting unit, the current/voltage stabilization unit 2013 performs secondary rectification and voltage stabilization to ensure that the output current and voltage are in a stable state; or as shown in the figure As shown in , an inductive driving device 204 can be connected to the control unit 2011, and the inductive driving device 204 can be selected according to requirements, such as inductive driving that can sense temperature changes, or humidity changes, or light changes, or sound, etc. The device uses the sensed environmental change as a signal to drive the control unit 2011 to improve its practicability.

请参阅图6,图中所示为本实用新型的另一较佳实施例(四),如图中所示的发光装置40,其是应用了本实用新型所揭,将一控制和驱动电路模块(403)整合在发光装置40的电路结构中,如图,发光装置40的基板401上,是电性布设了复数个发光二极管芯片402,经电流导通后,可产生发光,又,利用控制和驱动电路模块(403)作为电压升降的控制以及驱动发光二极管芯片402产生发光,另,是在发光二极管芯片402的上方,成型有一光学透镜404(或光罩装置),以提升其发光效率,另,也可在光学透镜404(或光罩装置)表面成型一镀膜层,以使其具有防止静电或防外力破坏的作用;再者,此光学透镜404(或光罩装置)是可以环氧树脂成型,或进一步以环氧树脂混合萤光层成型,除提升其发光效率,也可利用萤光层产生混色作用,以发出所需要的光色;又,发光二极管芯片(SMDLED)402可为单晶或多晶型式,且其表面也可涂布有一层萤光层,以搭配各色芯片进行混色,使其可达到全彩发光。。Please refer to Fig. 6, another preferred embodiment (four) of the utility model is shown in the figure, the light emitting device 40 shown in the figure, it is to apply the disclosure of the utility model, a control and drive circuit The module (403) is integrated in the circuit structure of the light emitting device 40, as shown in the figure, on the substrate 401 of the light emitting device 40, a plurality of light emitting diode chips 402 are electrically arranged, and after the current conduction, it can generate light. The control and drive circuit module (403) controls the voltage rise and fall and drives the light-emitting diode chip 402 to generate light. In addition, an optical lens 404 (or mask device) is formed on the top of the light-emitting diode chip 402 to improve its luminous efficiency. , In addition, a coating layer can also be formed on the surface of the optical lens 404 (or mask device), so that it has the effect of preventing static electricity or preventing external force damage; moreover, this optical lens 404 (or mask device) can be ring-shaped Oxygen resin molding, or further molding with epoxy resin mixed with the fluorescent layer, in addition to improving its luminous efficiency, the fluorescent layer can also be used to produce color mixing to emit the required light color; in addition, the light-emitting diode chip (SMDLED) 402 can be It is a single crystal or polycrystalline type, and its surface can also be coated with a layer of fluorescent layer to match the color chips of various colors for color mixing, so that it can achieve full-color luminescence. .

如上所述,本实用新型其据以实施后,是使应用发光二极管的发光装置的损坏率还低,利用封装的方式,使一控制和驱动模块或控制和驱动芯片被封装在发光装置的电路结构中,以使进入的电流受到二次整流与稳压后,再进入到发光二极管芯片,如此,经整流与稳压后的电流是呈还为稳定的状态,以符合发光二极高敏感电性的要求,又,利用此一控制和驱动电路模块,可进行电压的调变,也可符合多晶的发光二极管混色的要求,以产生全彩的光色,再者,也可在芯片表面涂布有萤光层,以使混色后的全彩效果还佳;综上所述,本实用新型其据以实施后,确实可以达到提供一种自身即具有稳定电压功能的发光装置,或具全彩与多彩表现效能的发光装置的目的。As mentioned above, after the utility model is implemented, the damage rate of the light-emitting device using the light-emitting diode is still low, and a control and driving module or a control and driving chip is packaged in the circuit of the light-emitting device by packaging. structure, so that the incoming current is subjected to secondary rectification and voltage stabilization, and then enters the light-emitting diode chip. In this way, the current after rectification and voltage stabilization is still in a stable state, in order to meet the high sensitivity of light-emitting diodes. In addition, using this control and drive circuit module, voltage modulation can be performed, and it can also meet the color mixing requirements of polycrystalline light-emitting diodes to produce full-color light colors. Furthermore, it can also be used on the chip surface Coated with a fluorescent layer, so that the full-color effect after color mixing is better; in summary, after the utility model is implemented, it can indeed provide a light-emitting device that itself has a stable voltage function, or has The purpose of a light-emitting device with full-color and multi-color performance performance.

唯,以上所述者,仅为实用新型的较佳的实施例而已,并非用以限定本实用新型实施的范围;任何熟习此技艺者,在不脱离本实用新型的精神与范围下所作的均等变化与修饰,都应涵盖在本实用新型的专利范围内。Only, the above-mentioned ones are only preferred embodiments of the utility model, and are not intended to limit the scope of the utility model; any person familiar with the art can do equal work without departing from the spirit and scope of the utility model. Changes and modifications should be covered within the patent scope of the present utility model.

Claims (20)

1. hybrid package type light-emitting device, it can produce light source behind power turn-on, it is characterized in that: it comprises:
One luminescence unit, be by more than one light-emitting diode chip for backlight unit as light emitting source, described luminescence unit is encapsulated on the substrate;
One control and drive circuit module, be encapsulated on the described substrate, finish with described luminescence unit and to be electrically connected, described control and drive circuit module are to be electrically connected the group structure with a current/voltage stabilization element and to be formed by a control module, a driver element, in order to control and the described luminescence unit of driving; And
With epoxy resin with described control and drive circuit module, and the complete coating of described light-emitting diode chip for backlight unit.
2. hybrid package type light-emitting device according to claim 1 is characterized in that: described cyclic group mixed with resin has phosphor powder.
3. hybrid package type light-emitting device according to claim 1 is characterized in that: described light-emitting diode chip for backlight unit surface is coated with a fluorescent layer.
4. hybrid package type light-emitting device according to claim 1 is characterized in that: described molding for epoxy resin is an optical lens.
5. hybrid package type light-emitting device according to claim 4 is characterized in that: be mixed with phosphor powder in the described epoxy resin.
6. hybrid package type light-emitting device according to claim 4 is characterized in that: described optical lens surface is coated with a fluorescent layer.
7. hybrid package type light-emitting device according to claim 4 is characterized in that: described optical lens surface is coated with a plated film layer.
8. hybrid package type light-emitting device according to claim 1 is characterized in that: described molding for epoxy resin is a light shield device.
9. hybrid package type light-emitting device according to claim 8 is characterized in that: be mixed with phosphor powder in described epoxy resin.
10. hybrid package type light-emitting device according to claim 8 is characterized in that: described light shield apparatus surface is coated with a fluorescent layer.
11. hybrid package type light-emitting device according to claim 8 is characterized in that: described light shield apparatus surface is coated with a plated film layer.
12. hybrid package type light-emitting device according to claim 1 is characterized in that: described control and drive circuit module are a control and drive chip.
13. hybrid package type light-emitting device according to claim 1, it is characterized in that: described control module is electrically connected with a control device.
14. hybrid package type light-emitting device according to claim 1 is characterized in that: described control module is electrically connected with an induction drive unit.
15. hybrid package type light-emitting device according to claim 14 is characterized in that: described induction drive unit is a temperature sense drive unit.
16. hybrid package type light-emitting device according to claim 14 is characterized in that: described induction drive unit is a humidity inductive drive unit.
17. hybrid package type light-emitting device according to claim 14 is characterized in that: described induction drive unit is a photoinduction drive unit.
18. hybrid package type light-emitting device according to claim 14 is characterized in that: described induction drive unit is a sound induction drive unit.
19. hybrid package type light-emitting device according to claim 1, it is characterized in that: described substrate connects a fin.
20. hybrid package type light-emitting device according to claim 1 is characterized in that: described epoxy resin is that the plastic material of a printing opacity replaces.
CNU2007201744762U 2007-09-26 2007-09-26 Hybrid packaged light emitting device Expired - Fee Related CN201087784Y (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101619814B (en) * 2009-07-24 2011-01-19 重庆大学 Direct-embedded high-power LED lighting module
CN102386155A (en) * 2010-08-27 2012-03-21 台湾积体电路制造股份有限公司 Semiconductor device and method for forming light emitting diode element
CN102606917A (en) * 2012-02-28 2012-07-25 苏州东亚欣业节能照明有限公司 Led lamp
CN102606916A (en) * 2012-02-28 2012-07-25 苏州东亚欣业节能照明有限公司 LED lamp
CN102644904A (en) * 2011-02-21 2012-08-22 柏友照明科技股份有限公司 Mixed light polycrystalline packaging structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101619814B (en) * 2009-07-24 2011-01-19 重庆大学 Direct-embedded high-power LED lighting module
CN102386155A (en) * 2010-08-27 2012-03-21 台湾积体电路制造股份有限公司 Semiconductor device and method for forming light emitting diode element
CN102644904A (en) * 2011-02-21 2012-08-22 柏友照明科技股份有限公司 Mixed light polycrystalline packaging structure
CN102606917A (en) * 2012-02-28 2012-07-25 苏州东亚欣业节能照明有限公司 Led lamp
CN102606916A (en) * 2012-02-28 2012-07-25 苏州东亚欣业节能照明有限公司 LED lamp

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