CN201072409Y - Circuit board soldering point scanning and testing apparatus - Google Patents
Circuit board soldering point scanning and testing apparatus Download PDFInfo
- Publication number
- CN201072409Y CN201072409Y CNU2007201728149U CN200720172814U CN201072409Y CN 201072409 Y CN201072409 Y CN 201072409Y CN U2007201728149 U CNU2007201728149 U CN U2007201728149U CN 200720172814 U CN200720172814 U CN 200720172814U CN 201072409 Y CN201072409 Y CN 201072409Y
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- Prior art keywords
- circuit board
- camera
- solder joint
- slit
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005476 soldering Methods 0.000 title description 4
- 238000003466 welding Methods 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims description 42
- 238000001514 detection method Methods 0.000 claims description 21
- 230000000694 effects Effects 0.000 abstract description 6
- 238000007689 inspection Methods 0.000 abstract 5
- 238000000034 method Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 206010000234 Abortion spontaneous Diseases 0.000 description 1
- 206010061599 Lower limb fracture Diseases 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 208000015994 miscarriage Diseases 0.000 description 1
- 208000000995 spontaneous abortion Diseases 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model provides a welding spot scanning inspection apparatus of a circuit board, which comprises a conveyor belt, a motherboard, a camera and a computer; aperture that is vertical to the direction of the conveyor belt is arranged on the motherboard at the lower side of the conveyor belt; two sides of the aperture are provided with illuminating lamp groups; the camera is positioned at the lower side of the motherboard and used for shoot the light that passes through the aperture; the camera is electrically connected with the computer. The welding spot scanning inspection apparatus of the circuit board makes use of different light reflection effects of different welding spots to carry out inspection of the welding spots of the circuit board, which substitutes the current inspection with manual eye observation and effectively promotes the efficiency and correctness of welding inspection of the circuit.
Description
Technical field
The utility model relates to circuit board solder joint scanning detection apparatus, particularly a kind of solder joint state difference of utilizing, and the principle different to the light reflecting effect scans the device of detection to circuit board solder joint behind the wave-soldering.
Background technology
Along with the complexity increase of electronic product, the number of welds of circuit board and solder joint density also increase thereupon.Accordingly, the solder joint detection problem of circuit board also becomes problem that can not be ignored in the electronic product production.Particularly after considering to ban use of lead welding for environmental protection, because the tack and the surface tension of novel lead-free solder all are not so good as original lead welding, the solder joint problem that occurs in the circuit board is just more serious.
Yet the manufacturer of circuit board adopts artificial visually examine's method to carry out the detection of circuit board solder joint more at present.This method not only detection efficiency is low, detects the cost costliness, and the effect of its detection is also unsatisfactory, and main is that many solder joint problems can't detect by range estimation, cause product quality to have hidden danger.
In view of the foregoing, people are necessary that the solder joint checkout equipment that designs a kind of robotization substitutes the artificial visually examine's detection mode that falls behind.
Summary of the invention
Fundamental purpose of the present utility model is to provide a kind of solder joint state difference of utilizing, and the principle different to the light reflecting effect scans the device of detection to circuit board solder joint behind the wave-soldering.
The purpose of this utility model is achieved by following technical proposals:
Circuit board solder joint scanning detection apparatus is characterized in that: comprise travelling belt, base plate, camera and computing machine;
Offer a slit on the base plate of described travelling belt downside perpendicular to the travelling belt direction; Be provided with lighting lamp group in both sides, described slit; Described camera is positioned at the base plate downside, in order to take the light that sees through described slit; Described camera is electrically connected with described computing machine.
Described lighting lamp group is a LED lamp group.
Between described slit and camera, be provided with mirror surface, in order to will be reflected into described camera through the light in described slit.
The beneficial effects of the utility model are:
1, with this circuit board solder joint pick-up unit can detect the artificial visually examine the solder joint problem that can't detect.
2, substitute existing detection mode with this circuit board solder joint pick-up unit, effectively raise efficient and accuracy that the circuit board solder joint detects, the omission of having avoided human factor to cause by the artificial visually examine.
3, use this circuit board solder joint pick-up unit to be convenient to carry out extensive detection statistics, can be by statistics, the solder joint that is easy to go wrong in the cue circuit plate.
Description of drawings
Fig. 1 is the structural representation of circuit board solder joint scanning detection apparatus;
Fig. 2 is the vertical view of circuit board solder joint scanning detection apparatus.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Circuit board solder joint scanning detection apparatus of the present utility model is a kind of solder joint state difference of utilizing, the principle different to the light reflecting effect, and the principle of color contrast, the device that the bad solder joint in the wave-soldering circuit board is detected.As shown in Figure 1, 2, circuit board solder joint pick-up unit 1 is located at the back level of crest welder 2, transmits the good circuit board 4 of welding by travelling belt 3.The part surface 4a of circuit board 4 makes progress, and 4b is downward for the solder joint face.On the base plate 10 of travelling belt 3 downsides, offer a slit 5 perpendicular to travelling belt 3 directions.5 both sides are provided with the lighting lamp group 6 of up ligthing in the slit.5 downsides are provided with a mirror surface 7 in the slit.Side at this mirror surface 7 is provided with camera 8, makes the light that sees through slit 5 to go into camera 8 through mirror surface 7 projections.Camera 8 is electrically connected with computing machine 9, captured image is sent to computing machine 9 analyze.
This pick-up unit is by the solder joint face 4b of lighting lamp group 6 irradiation circuit boards.The reflection ray of solder joint face 4b through the slit 5, mirror surface 7 projections go into camera 8, take imagings by camera 8.Along with the drive of travelling belt 3, camera 8 scannings obtain the complete reflected image of this circuit board solder joint face 4b, and this reflected image is sent to computing machine 9.When detecting beginning, pick-up unit is the reflected image of a preferred circuit plate of scanning shoot at first, and this reflected image is stored in the computing machine 9 as the reference image.Because, in the circuit board as leak weldering, lack weldering, bad solder joints such as leg fractures, cavity, rosin joint are different with the reflection ray of normal solder joint, color is different, computing machine 9 can be judged circuit board to be detected and whether have bad solder joint through the reflected image and the described reference picture of circuit board to be detected are compared.
Wherein, uniform and stable for the irradiation light that guarantees lighting lamp group 6, the LED lamp group of lighting lamp group 6 that is adopted in the present embodiment for forming by some LED.
In addition, be provided with the reflective mirror 7 of reflection ray in the present embodiment between slit 5 and camera 8, purpose is to protect the camera lens of camera 8 not to be subjected to the influence of the dust and the impurity that drops.But obviously directly can also realize goal of the invention of the present utility model to slit 5 or with other light guidance mode replacement reflective mirror 7 with camera 8, also should be within the protection domain of this patent.
As seen, different and have or not solder joint color difference by the different solder joints of the circuit board solder joint pick-up unit utilization of said structure to the light reflecting effect, the circuit board solder joint is carried out the detection of robotization, substituted existing detection mode, effectively raised efficient and accuracy that the circuit board solder joint detects by the artificial visually examine.And, use sort circuit plate solder joint pick-up unit to be convenient to carry out extensive detection statistics, can may be because design reasons is easy to occur Welding Problems by some solder joint in the statistics cue circuit plate, carry out reference for the deviser; Also can point out which solder joint to be because the poor welding spots that miscarriage causes.
Claims (3)
1. circuit board solder joint scanning detection apparatus is characterized in that: comprise travelling belt, base plate, camera and computing machine;
Offer a slit on the base plate of described travelling belt downside perpendicular to the travelling belt direction; Be provided with lighting lamp group in both sides, described slit; Described camera is positioned at the base plate downside, in order to take the light that sees through described slit; Described camera is electrically connected with described computing machine.
2. circuit board welding scanning detection apparatus as claimed in claim 1, it is characterized in that: described lighting lamp group is a LED lamp group.
3. circuit board welding scanning detection apparatus as claimed in claim 1 is characterized in that: be provided with mirror surface between described slit and camera, in order to will be reflected into described camera through the light in described slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201728149U CN201072409Y (en) | 2007-08-27 | 2007-08-27 | Circuit board soldering point scanning and testing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201728149U CN201072409Y (en) | 2007-08-27 | 2007-08-27 | Circuit board soldering point scanning and testing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201072409Y true CN201072409Y (en) | 2008-06-11 |
Family
ID=39550967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201728149U Expired - Fee Related CN201072409Y (en) | 2007-08-27 | 2007-08-27 | Circuit board soldering point scanning and testing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201072409Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101887033A (en) * | 2009-05-13 | 2010-11-17 | 株式会社高永科技 | Method for measuring measurement target |
| CN102012607A (en) * | 2010-09-29 | 2011-04-13 | 卓盈微电子（昆山）有限公司 | Flexible circuit board imaging device |
| CN102539441A (en) * | 2011-12-29 | 2012-07-04 | 中国科学院长春光学精密机械与物理研究所 | Inspection method for inspecting welding correctness of the device of device on circuit board in batch |
| CN104101603A (en) * | 2013-04-12 | 2014-10-15 | 宝山钢铁股份有限公司 | Device and method for detecting surface defect on strip steel |
| CN104502360A (en) * | 2014-12-25 | 2015-04-08 | 中国科学院半导体研究所 | Chip appearance defect detection system |
| CN107024479A (en) * | 2017-04-12 | 2017-08-08 | 东莞市吉洋自动化科技有限公司 | A kind of wave-soldering on-line checking machine and its detection method |
| CN112051279A (en) * | 2019-06-06 | 2020-12-08 | 深圳市瑞微智能有限责任公司 | Circuit board welding quality detection method and assembly |
| CN116106980A (en) * | 2023-04-13 | 2023-05-12 | 江苏时代新能源科技有限公司 | Gap detection device and gap detection method |
| CN118130462A (en) * | 2024-04-10 | 2024-06-04 | 湖南信息学院 | Detection method, device, equipment, medium and detection equipment for circuit board |
-
2007
- 2007-08-27 CN CNU2007201728149U patent/CN201072409Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101887033A (en) * | 2009-05-13 | 2010-11-17 | 株式会社高永科技 | Method for measuring measurement target |
| CN101887033B (en) * | 2009-05-13 | 2014-07-09 | 株式会社高永科技 | The method of measuring the measurement target |
| CN102012607A (en) * | 2010-09-29 | 2011-04-13 | 卓盈微电子（昆山）有限公司 | Flexible circuit board imaging device |
| CN102012607B (en) * | 2010-09-29 | 2011-12-28 | 卓盈微电子（昆山）有限公司 | Flexible circuit board imaging device |
| CN102539441A (en) * | 2011-12-29 | 2012-07-04 | 中国科学院长春光学精密机械与物理研究所 | Inspection method for inspecting welding correctness of the device of device on circuit board in batch |
| CN104101603A (en) * | 2013-04-12 | 2014-10-15 | 宝山钢铁股份有限公司 | Device and method for detecting surface defect on strip steel |
| CN104502360A (en) * | 2014-12-25 | 2015-04-08 | 中国科学院半导体研究所 | Chip appearance defect detection system |
| CN107024479A (en) * | 2017-04-12 | 2017-08-08 | 东莞市吉洋自动化科技有限公司 | A kind of wave-soldering on-line checking machine and its detection method |
| CN112051279A (en) * | 2019-06-06 | 2020-12-08 | 深圳市瑞微智能有限责任公司 | Circuit board welding quality detection method and assembly |
| CN116106980A (en) * | 2023-04-13 | 2023-05-12 | 江苏时代新能源科技有限公司 | Gap detection device and gap detection method |
| CN116106980B (en) * | 2023-04-13 | 2024-02-20 | 江苏时代新能源科技有限公司 | Gap detection device and gap detection method |
| CN118130462A (en) * | 2024-04-10 | 2024-06-04 | 湖南信息学院 | Detection method, device, equipment, medium and detection equipment for circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080611 Termination date: 20130827 |