CN201075390Y - Photosensitive chip packaging module - Google Patents

Abstract

The utility model belongs to the technical field of electronic devices, and relates to a photosensitive chip packaging module for packaging a photosensitive chip. It solves the problems in the prior art that the gold wires are too long and protrude upwards, and adjacent gold wires are easily deformed, damaged, and short-circuited. The photosensitive chip packaging module includes a package body (1), a cavity (2) arranged on the package body (1), a photosensitive chip (3) arranged in the cavity (2), and an upper surface (4) of the photosensitive chip ) has a photosensitive area (5) and a welding pad (6), the top surface (7) of the package body located at the periphery of the concave cavity is provided with a plurality of welding pieces (8), and the bottom surface of the package body is pasted with electrode pieces electrically connected to the welding pieces (9), the depth of the concave cavity is set so that the upper surface of the photosensitive chip therein is flush with most of the soldering chips, and the welding pad corresponding to the soldering chip and the photosensitive chip is provided with parallel welding metal wires (10), and the outer peripheral surface of the photosensitive area is provided with Viscose (11), the viscose is provided with a light-transmitting sheet covering the photosensitive area.

Description

Photosensitive chip packaging module

technical field

The utility model belongs to the technical field of electronic devices, and relates to a photosensitive chip packaging module for packaging a photosensitive chip.

Background technique

In the Chinese patent literature, Patent No. 200420065567.9, the utility model patent specification for the structure of integrated circuit chips discloses a structure of integrated circuit chips, which discloses that before the application, as shown in Fig. The structure of the integrated circuit chip is equipped with a carrier 1, a chamber 2, the chamber has an opening 3, and the periphery of the opening 3 is provided with a plurality of welding pads 4; a chip 5 is fixed in the chamber 2 A plurality of welding wires 6 are respectively electrically connected to the pads 4 on the carrier and the chip 5; an adhesive 7 is arranged on the periphery of the opening 3; a cover 8 is fixedly connected to the adhesive 7 and can close the The opening 3 of the chamber 2; because the welding pads 4 for each of the bonding wires 6 are moved from the interior of the chamber 2 to the periphery of the opening 3 of the chamber 2, the chamber 2 no longer needs to be prepared for the wire bonding machine. The operation space is reserved, so the size of the construction structure can be reduced. However, when the cover 8 is used to seal the chamber opening 3 in this design, the bonding wire 6 and the welding pad 4 will be directly contacted and squeezed by the covering 8, causing the bonding wire to be damaged or the bonding wire 6 to fall off from the bonding pad 4, causing the chip 5 It cannot operate normally, which reduces the yield of the structure and leads to an increase in production costs.

The improvement of its utility model is only to add a support body on the basis of the prior art. The support body is sandwiched between some non-welded areas on the top surface of the carrier and the cover, and an adhesive is distributed on the cover. and the junction of the carrier.

As shown in Figures 2 and 3, the structure 10 of the integrated circuit chip mainly includes a carrier 1, a chip 12, a plurality of bonding wires 13, a cover 14, a support 15, an adhesive 16 and a Connecting device 17, wherein: the carrier 11 can be made of insulating materials such as plastic, glass fiber, reinforced plastic, ceramics, etc., and has a top surface 11a, a bottom surface 11b and a chamber 11c, the chamber 11c It has a bottom 11d and a side wall 11e, the side wall 11e surrounds the periphery of the bottom 11d, and an opening 11f is formed above the top surface 11a, the periphery of the opening 11f is divided into a plurality of welding areas 11g and a plurality of non- The welding areas 11h, the welding areas 11g and the non-welding areas 11h are arranged adjacently, and each of the above-mentioned welding areas 11g can be a welding pad. The chip 12 is adhesively fixed to the bottom 11d of the chamber 11c, and the surface of the chip 12 has a plurality of soldering pads 12a. Each of these bonding wires 13 is made of metal materials with good conductivity such as aluminum or gold, and it utilizes a wire bonding machine (not shown in the figure) to be connected to the bonding pad 12a of the chip with its one end, and then the The other end is connected to the welding area 11g of the carrier 11 in a horizontally extending manner.

The cover 14 has a top surface 14a and a bottom surface 14b for closing the opening 11f of the chamber 11c, so as to protect the wafer 12 from being damaged by external force or polluted by sundries. The support body 15 is integrally formed and protruded on the periphery of the bottom surface 14b of the cover 14. When the cover 14 closes the opening 11f of the chamber 11c, the support body 15 is attached to a number of non-contact parts on the periphery of the opening 11f with its lower end. on the welding area 11h.

By the above combination, when the integrated circuit chip is assembled, when the cover 14 closes the opening 11f, the isolation of the support body 15 can prevent the cover 14 from directly pressing the joints of the bonding wires 13 and the bonding regions 11g. Destruction of their connection causes each of the welding wires 13 to break away from each of the welding areas 11g, and the support body 15 creates a gap between the cover 14 and the periphery of the opening 11f, which can be filled and sealed by the adhesive 16 to maintain the container. Sealing effect of chamber 11c.

According to the prior art disclosed above, it can be seen that in the packaging process, the cause of chip damage is that the bonding wire, that is, the gold wire, is connected to the bonding area 11g on the top surface 11a of the carrier 11 and the bonding pad 12a on the surface of the chip 12. The top surface 11a of the carrier 11 is higher than the surface of the wafer 12, and the heights of the two are inconsistent, so that the middle part of the gold wire needs to be raised 100 when connecting and then connected downwards to the solder pad 12a to bypass the upper corner 200 of the wafer to prevent The upper corner 200 cuts the middle part of the gold wire.

In the packaging process of the photosensitive chip, since the photosensitive chip is square, its external dimension is very small. If the diagonal line is 1/4, 1/8, 1/11 inch, the thickness is about 0.2-0.7 mm. Therefore, the length of the gold wire used is also very thin and very short. It is very difficult to control the height of all the gold wires to be consistent during the welding process, and uneven height will inevitably occur.

As a result, the gold wire is too long, and the cost of manufacturing materials is greatly increased. Moreover, since the gold wire protrudes upward, when the cover is pressed on it, the gold wire will be deformed and damaged or the contact between adjacent gold wires will be short-circuited, which will seriously affect the package. pass rate. This structure also needs to be soldered to the printed circuit board during use, so the connecting device 17 of this structure is arranged on the periphery of the carrier 11. Once the connecting device 17 of this structure is touched during use, it will cause The separation between the carrier 11 and the connection device 17 can easily lead to damage to the bonding wire 13 between the bonding region 11g on the top surface 11a of the carrier 11 and the bonding pad 12a on the surface of the chip 12, resulting in an open circuit and unusable.

Utility model content

The purpose of the utility model is to provide a simple and reliable electrical connection between the package body and the photosensitive chip. The photosensitive chip packaging module is firmly fixed on the packaging body and is convenient for packaging.

To achieve the purpose of the present utility model, the photosensitive chip package module includes a package body, a cavity arranged on the package body, a photosensitive chip arranged in the cavity, and an upper surface of the photosensitive chip There are photosensitive areas and welding pads, and the package body is located on the top surface of the concave cavity with a plurality of welding pieces, and the bottom surface of the package body is pasted with electrode pieces that are electrically connected to the welding pieces. The depth of the concave cavity is set so that the upper surface of the photosensitive chip therein is flush with the plurality of soldering sheets, and the welding pads corresponding to the soldering chips and the photosensitive chip are provided with parallel welding metal wires. Adhesive is provided on the outer peripheral surface of the area, and a light-transmitting sheet covering the photosensitive area is arranged on the adhesive.

Since the upper surface of the photosensitive wafer is nearly flush with the plurality of soldering pads, the metal wires can be welded on the pads and the soldering pads nearly horizontally. At this time, the metal wires will not bulge upwards, and a lot of metal wires can be saved. During the welding operation of this structure, as long as the metal wires in the gold wire machine (not shown in the figure) are first spot-welded on one side, then they are translated to the other end and then spot-welded. And needn't like above-mentioned prior art which, after making gold wire machine spot-weld at one end, move upwards and the other side again, after metal wire extends upwards, spot-welds downwards again, forms a protuberance and goes to avoid photosensitive top corner of the chip. However, this patent makes the welding operation process simple and reliable, and because the metal wire has no raised part, even if the metal wire is pressed flat on an object at this time, it will hardly deform and the metal wires will contact and short-circuit each other. . Since the electrode sheet is pasted on the bottom surface of the package body, the area of the bottom surface of the package body can be fully utilized by the electrode sheet. Attach the electrode pads as large as possible to a solid base and hold them securely. Such an electrode sheet will not be deformed due to external touch, and is convenient to be flat-bonded and welded on the circuit board during use.

The light-transmitting sheet is directly covered on the photosensitive area by glue, so that the space formed in the packaging module is greatly reduced, and the problem of affecting the imaging quality of the photosensitive area due to the large space filled with impurities such as dust and water vapor is avoided. question. Moreover, in the packaging process of the prior art, glue application needs to be performed on the bonding wires, which may cause the bonding wires to be easily damaged or deformed to cause short circuits and the like.

Description of drawings

The descriptions of the attached drawings are as follows:

Figure 1 is a schematic diagram of a commonly used integrated circuit chip.

FIG. 2 is an improvement diagram of the existing patent on the basis of the conventional integrated circuit chip structure in FIG. 1 .

FIG. 3 is a top view of FIG. 2 .

Fig. 4 is an exploded cross-sectional view of the photosensitive chip package module according to Embodiment 1 of the present invention before assembly.

FIG. 5 is a cross-sectional view of the photosensitive chip packaging module after assembly.

Fig. 6 is a perspective view viewed obliquely from the bottom in Embodiment 1 of Fig. 5 .

Fig. 7 is a perspective view viewed obliquely from the top in Embodiment 1 of Fig. 5 .

FIG. 8 is a perspective view of a photosensitive chip packaging module according to Embodiment 2 of the present invention.

FIG. 9 is an exploded cross-sectional view of the photosensitive chip package module in FIG. 8 before assembly.

FIG. 10 is a cross-sectional view of the assembled photosensitive chip package module in FIG. 9 .

Detailed ways

Below in conjunction with the accompanying drawings, the specific embodiments of the photosensitive chip packaging module of the present invention are further described in detail:

Embodiment 1, as shown in Figures 4 to 7, the photosensitive chip package module described in the utility model includes a package body 1, a cavity 2, a photosensitive chip 3, an upper surface 4, a photosensitive area 5, a welding pad 6, a top Surface 7, welding sheet 8, electrode sheet 9, metal wire 10, glue 11, light-transmitting sheet 12, insulating glue 13, side surface 14, and side wall 15.

As shown in Figures 4 and 7, the package body 1 is in the shape of a square block, and a square cavity 2 is arranged on the package body 1, and the package body 1 is located on the edge of the cavity 2 A plurality of soldering pads 8 are provided on the top surface 7 , and electrode pads 9 correspondingly electrically connected to the soldering pads 8 are pasted on the bottom surface of the package body 1 .

As shown in FIGS. 4 and 5 , the photosensitive wafer 3 is in the shape of a square, and its upper surface 4 has a photosensitive area 5 and welding pads 6 . The photosensitive wafer 3 is arranged in the concave cavity 2 , and the depth of the concave cavity 2 is set so that the upper surface 4 of the photosensitive wafer 3 therein is flush with the plurality of welding pieces 8 .

Parallel soldered metal wires 10 are provided on the solder pads 6 corresponding to the solder pads 8 and the photosensitive wafer 3 . The metal wire 10 electrically connects the solder pad 8 to the solder pad 6 , and leads the electrical connection to the solder pad 6 of the photosensitive chip 3 to the package body 1 . The metal wire 10 is a gold wire, and a layer of gold-plated layer is provided on the surface of the corresponding welding piece 8, so that the gold wire and the welding piece 8 can be bonded together by welding. Adhesive 11 is provided on the outer peripheral surface of the photosensitive area 5 , and a light-transmitting sheet 12 covering the photosensitive area 5 is provided on the adhesive 11 . On the one hand, the light-transmitting sheet 12 protects the photosensitive area 5 from falling dust, and on the other hand, allows the reflected light of the scene to enter the photosensitive area 5 for imaging.

The side 14 of the photosensitive wafer 3 and the side wall 15 of the cavity 2 are arranged close to a slit 16, the smaller the slit 16, the better, which can reduce the space in the cavity 2, so that the welded metal wire 10 can The shorter the length, the better the strength correspondingly, and the smaller the space for deformation, thereby greatly reducing the chance of short circuit caused by contact between adjacent metal wires 10 due to extrusion deformation.

The package body 1 is a double-sided or multilayer printed circuit board. In this embodiment, a double-sided printed circuit board can be used, wherein a square hole that can accommodate the photosensitive chip 3 is opened in the middle of a single-layer printed circuit board. The square hole Copper foils arranged at intervals according to needs are provided on the top surface 7 of the periphery, and the soldering sheet 8 is the copper foil attached to the top surface 7 . On the bottom surface of another single-layer printed circuit board, there are also copper foils arranged at intervals as required. The electrode sheet 9 is copper foil attached to the bottom surface. Once the two layers are compounded, the insulating layer becomes the package body 1 with the above structure, the upper copper foil is the soldering sheet 8 , and the lower copper foil is the electrode sheet 9 . Using a double-sided or multi-layer printed circuit board as the package body 1 can not only make the welding pad 8 and the electrode pad 9 firmly attached to the package body 1, but also facilitate the use of the double-sided or multi-layer printed circuit board manufacturing process, so that the welding The sheet 8 and the electrode sheet 9 are connected in the insulating layer, even the photosensitive chip 3 is accommodated in the printed circuit board, and various SMD electronic components are directly welded on the package body 1, which is convenient to use in various small spaces.

Embodiment 2, as shown in Figures 8 to 10, the photosensitive chip package module described in the utility model includes a package body 1, a cavity 2, a photosensitive chip 3, an upper surface 4, a photosensitive area 5, a welding pad 6, a top Surface 7, welding sheet 8, electrode sheet 9, metal wire 10, light-transmitting sheet 12, side surface 14, side wall 15, gap 16, glue 11.

The photosensitive chip packaging module includes a package body 1, a cavity 2 arranged on the package body 1, a photosensitive chip 3 arranged in the cavity 2, and an upper surface 4 of the photosensitive chip 3 There are photosensitive areas 5 and welding pads 6, and the top surface 7 of the package body 1 located at the periphery of the cavity 2 is provided with a plurality of welding pieces 8, which are characterized in that the bottom surface of the package body 1 is pasted with the welding pieces 8 corresponds to the electrode sheet 9 that is electrically connected, and the depth of the concave cavity 2 is set so that the upper surface 4 of the photosensitive wafer 3 therein is flush with the plurality of welding sheets 8, and the welding sheet 8 and the above-mentioned The welding pad 6 corresponding to the photosensitive chip 3 is provided with a metal wire 10 welded in parallel, and the top surface 7 is coated with an adhesive 11, and the adhesive 11 is provided with a cover covering the photosensitive area 5. The translucent sheet 12. Since the upper surface 4 is flush with the welding piece 8, the metal wire 10 is placed flat and welded between the welding piece 8 and the welding pad 6. At this time, the metal wire 10 is basically in a straight state and is not afraid of pressure. When pressing on most of the metal wires 10, they will be erected by the metal wires 10. Since the glue 11 is coated between the top surface 7 and the light-transmitting sheet 12, the glue 11 will occupy a certain space and also make the light-transmitting The sheet 12 is erected, so the extrusion of the light-transmissive sheet 12 on the metal wire 10 can be reduced during packaging. This structure can effectively avoid the short circuit and disconnection of the metal wire 10, and can improve the qualified rate of packaging.

The side surface 14 of the photosensitive wafer 3 and the side wall 15 of the cavity 2 are adjacently arranged to form a gap 16 . The smaller the gap 16, the more sufficient the space occupied by the photosensitive chip 3 in the cavity 2 is, and the space in the cavity 2 sealed by the light-transmissive sheet 12 is also smaller, which can greatly reduce the space due to packaging. The amount of impurities and the amount of water vapor trapped in it. During use, the photosensitive chip encapsulation module is heated and welded to the circuit board to be installed, which can avoid the volatilization and expansion of impurities and water vapor in the space in the concave cavity 2 due to a sudden increase in temperature, which will cause the light-transmitting sheet 12 to burst. damage. At the same time, the reduction of the space can reduce the movement of impurities therein, greatly reducing the possibility that the photosensitive region 5 is polluted by impurities. In this embodiment, the space of the concave cavity is set close to the shape of the photosensitive chip, which reduces the redundant space of the concave cavity, so the package body is greatly reduced in height and plane size compared with the existing package body, which is more in line with the development of camera products. The trend is more convenient and widely used.

The package body 1 is a double-sided or multi-layer printed circuit board, the solder pad 8 is copper foil attached to the top surface 7, and the electrode pad 9 is copper foil attached to the bottom surface. The package body 1 is manufactured by using a double-sided or multi-layer printed circuit board, and the beneficial technical effects produced by it have been described above, and will not be repeated here.

Claims (6)

1. A photosensitive chip package module, comprising a package body (1), a cavity (2) arranged on the package body (1), a photosensitive chip (3) arranged in the cavity (2) ), the upper surface (4) of the photosensitive chip (3) has a photosensitive area (5) and a welding pad (6), and the top surface (7) of the package body (1) located at the periphery of the cavity (2) is set There are many welding pieces (8), which are characterized in that the bottom surface of the package (1) is pasted with electrode pieces (9) correspondingly electrically connected to the welding pieces (8), and the concave cavity (2) The depth is set so that the upper surface (4) of the photosensitive wafer (3) therein is flush with the plurality of soldering sheets (8), and the soldering sheet (8) corresponds to the photosensitive wafer (3) The welding pad (6) is provided with parallel welding metal wires (10), the outer peripheral surface of the photosensitive area (5) is provided with glue (11), and the glue (11) is provided with a cover on the The light-transmitting sheet (12) on the photosensitive region (5). 2. The photosensitive chip packaging module according to claim 1, characterized in that the side surface (14) of the photosensitive chip (3) is close to the side wall (15) of the cavity (2) and is arranged to form a gap ( 16). 3. The photosensitive chip package module according to claim 1 or 2, characterized in that the package (1) is a double-sided or multi-layer printed circuit board, and the soldering piece (8) is attached to the top surface (7) the copper foil on the top, and the electrode sheet (9) is the copper foil attached to the bottom surface. 4. A photosensitive chip package module, comprising a package body (1), a cavity (2) arranged on the package body (1), a photosensitive chip (3) arranged in the cavity (2) ), the upper surface (4) of the photosensitive chip (3) has a photosensitive area (5) and a welding pad (6), and the top surface (7) of the package body (1) located at the periphery of the cavity (2) is set There are many welding pieces (8), which are characterized in that the bottom surface of the package (1) is pasted with electrode pieces (9) correspondingly electrically connected to the welding pieces (8), and the concave cavity (2) The depth is set so that the upper surface (4) of the photosensitive wafer (3) therein is flush with the plurality of soldering sheets (8), and the soldering sheet (8) corresponds to the photosensitive wafer (3) The welding pad (6) is provided with metal wires (10) close to parallel welding, the top surface (7) is coated with glue (11), and the glue (11) is provided with a cover on the The light-transmitting sheet (12) on the photosensitive area (5) mentioned above. 5. The photosensitive chip package module according to claim 4, characterized in that the side (14) of the photosensitive chip (3) is close to the side wall (15) of the cavity (2) to form a gap ( 16). 6. The photosensitive chip package module according to claim 4 or 5, characterized in that the package (1) is a double-sided or multi-layer printed circuit board, and the soldering piece (8) is attached to the top surface (7) the copper foil on the top, and the electrode sheet (9) is the copper foil attached to the bottom surface.

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