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CN201041909Y - 电连接器 - Google Patents

电连接器 Download PDF

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Publication number
CN201041909Y
CN201041909Y CNU2007200352824U CN200720035282U CN201041909Y CN 201041909 Y CN201041909 Y CN 201041909Y CN U2007200352824 U CNU2007200352824 U CN U2007200352824U CN 200720035282 U CN200720035282 U CN 200720035282U CN 201041909 Y CN201041909 Y CN 201041909Y
Authority
CN
China
Prior art keywords
insulating body
chip module
elastic cantilever
elastic
electric connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007200352824U
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English (en)
Inventor
廖芳竹
张俊毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Priority to CNU2007200352824U priority Critical patent/CN201041909Y/zh
Priority to US12/075,154 priority patent/US7654862B2/en
Application granted granted Critical
Publication of CN201041909Y publication Critical patent/CN201041909Y/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

本实用新型公开一种电连接器,用于电性连接晶片模块至印刷电路板,其包括绝缘本体及收容于绝缘本体内的若干导电端子,绝缘本体包括基体及基体周围的四个侧壁,侧壁上设有抵接芯片模块的弹性悬臂,其中,弹性悬臂底部设有若干支柱,以防止其在垂直方向上受到过大压力而产生断裂。

Description

电连接器
【技术领域】
本实用新型关于一种电连接器,尤其是一种电性连接芯片模块至电路板的电连接器。
【背景技术】
平面栅格阵列电连接器已广泛应用于电子领域,其可用于两电子设备间的高密度、高速率的信号传输。如中国专利公告第2687881号、第2674713号揭示的与本实用新型相关的电连接器。
参阅图1及图2所示,一种与本实用新型相关的电连接器,可用以电性连接芯片模块(未图示)与电路板(未图示),该电连接器包括:绝缘本体2及收容于绝缘本体2内的若干导电端子3,该绝缘本体2设有基体21及四个侧壁22,侧壁22上设有弹性悬臂221,基体21及四个侧壁22共同围成一用于收容芯片模块的收容空间23,基体21设有导电区,该导电区设有成矩阵排列的端子收容槽(未标号),组合时,将芯片模块压入导电区,实现芯片模块和电连接器的电性导通,再将电连接器焊接于电路板上,实现芯片模块和电路板的电性连接。
然而,由于将芯片模块压入导电区时,其会对绝缘本体2侧壁22上的弹性悬臂221施加一定压力,弹性臂221将会向下和向靠近侧壁22的两个方向产生弹性变形,在弹性臂221向下发生弹性变形时,可能整个弹性臂221会顶住电路板,由于弹性臂221高度方向过厚可能会造成弹性臂221弹力不足;如果弹性臂221高度方向过薄,又可能会造成弹性臂221往下过度变形,产生断裂。
鉴于此,实有必要提供一种改进的电连接器,以克服上述电连接器的缺陷。
【实用新型内容】
本实用新型所解决的技术问题是提供一种防止弹性悬臂受压后,于垂直方向上变形断裂的电连接器。
为解决上述技术问题,本实用新型提供一种电连接器,用于电性连接晶片模块至印刷电路板,其包括绝缘本体及收容于绝缘本体内的若干导电端子,绝缘本体包括基体及基体周围的四个侧壁,侧壁上设有抵接芯片模块的弹性悬臂,其中,弹性悬臂底部设有若干支柱,以防止其在垂直方向上受到过大压力而产生断裂。
与相关技术相比,本实用新型具有以下优点:弹性悬臂底部设置若干支柱之后,弹性悬臂在受到垂直方向的压力后,支柱抵靠于电路板上,避免弹性悬臂过度下压变形,而造成断裂。
【附图说明】
图1是一种现有的电连接器的立体分解图。
图2是图1所示电连接器另一视角的立体图。
图3是本实用新型电连接器的立体分解图。
图4是本实用新型电连接器另一视角的立体图。
图5是本实用新型导电端子的立体图。
【具体实施方式】
请参阅图3至图5所示,本实用新型为一种用于电性连接芯片模块(未图示)与电路板(未图示)的电连接器,包括:绝缘本体7及收容于绝缘本体7内的若干导电端子8。
绝缘本体7包括基体71及基体71周围的四个侧壁72,基体71及四个侧壁72共同围成一个收容芯片模块的收容空间73,基体7设有导电区,导电区内设有成矩阵排列的端子收容槽(未标号),侧壁72上设有若干凸块75,凸块75的设置使得芯片模块组装于绝缘本体7的收容空间73后,芯片模块对绝缘本体7的侧壁72的挤压力被分散抵消。绝缘本体7的侧壁72上还设有若干弹性悬臂76,该弹性悬臂76与侧壁72之间留有一定间隙77,其可在间隙77内发生弹性变形,弹性悬臂76的端部凸设有抵接芯片模块侧边的接触部761,弹性悬臂76底部还设有若干支柱762,参阅图4所示,该支柱762可作为弹性悬臂76在垂直方向上遭遇过压时的阻挡。绝缘本体7底面设有若干将其定位于电路板的安装柱78。
导电端子8包括主体部81、位于主体部81两侧的用于将导电端子8固持于端子收容槽内的固持部82、主体部81向上延伸的一对第一弹性臂83及主体部81向下延伸的一对第二弹性臂84,所述第一弹性臂83及第二弹性臂84两端设有与芯片模块和电路板电性接通的导接部831、841。
将芯片模块自上而下组装于绝缘本体7的收容空间73时,芯片模块的侧边将挤压绝缘本体7的四个侧壁72,弹性悬臂76受到挤压后将会向两个方向产生弹性变形,一个水平弹性变形,一个垂直弹性变形,弹性悬臂76受到挤压后会向间隙77内产生弹性变形,通过弹力使弹性悬臂76的接触部761抵接在芯片模块的侧边上,以将芯片模块准确定位,同时由于芯片模块组装时会产生一个向下的力,使得弹性悬臂76会向电路板的方向发生弹性变形,由于弹性悬臂76底部设有若干支柱762,所以弹性悬臂76在芯片模块组装过程中产生垂直向下的推力时,支柱762抵住电路板,避免弹性悬臂76往下过度变形而造成断裂。
以上仅为本实用新型的优选实施方案,其它在本实施方案基础上所做的任何改进变换也应当不脱离本实用新型的技术方案。

Claims (3)

1.一种电连接器,用于电性连接晶片模块至印刷电路板,其包括绝缘本体及收容于绝缘本体内的若干导电端子,绝缘本体包括基体及基体周围的四个侧壁,侧壁上设有用于抵接芯片模块的弹性悬臂,其特征在于:弹性悬臂底部设有若干支柱,以防止其在垂直方向上受到过大压力而变形断裂。
2.如权利要求1所述的电连接器,其特征在于:所述弹性悬臂端部凸设有抵接芯片模块的接触部。
3.如权利要求1所述的电连接器,其特征在于:所述绝缘本体侧壁上还设有若干凸块。
CNU2007200352824U 2007-03-09 2007-03-09 电连接器 Expired - Lifetime CN201041909Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2007200352824U CN201041909Y (zh) 2007-03-09 2007-03-09 电连接器
US12/075,154 US7654862B2 (en) 2007-03-09 2008-03-10 IC package having improved structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200352824U CN201041909Y (zh) 2007-03-09 2007-03-09 电连接器

Publications (1)

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CN201041909Y true CN201041909Y (zh) 2008-03-26

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US (1) US7654862B2 (zh)
CN (1) CN201041909Y (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM350887U (en) * 2008-06-30 2009-02-11 Hon Hai Prec Ind Co Ltd Electrical connector
TWM367467U (en) * 2009-04-13 2009-10-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7871275B1 (en) * 2009-12-04 2011-01-18 Tyco Electronics Corporation Interposer frame assembly for mating a circuit board with an interposer assembly
KR20120060299A (ko) * 2010-12-02 2012-06-12 삼성전자주식회사 테스트 소켓
TWI543451B (zh) * 2013-07-30 2016-07-21 鴻海精密工業股份有限公司 電連接器及其組合
CN107565237B (zh) * 2017-05-12 2020-04-24 番禺得意精密电子工业有限公司 电连接器
CN114552251A (zh) * 2020-11-26 2022-05-27 莫列斯有限公司 端子及插座连接器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5066245A (en) * 1990-11-09 1991-11-19 Amp Incorporated Retention device for flat pack sockets
US6796805B2 (en) * 2002-08-05 2004-09-28 Tyco Electronics Corporation Surface mount technology land grid array socket
TW558099U (en) * 2003-01-22 2003-10-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
US7128580B2 (en) * 2004-04-09 2006-10-31 Hon Hai Precision Ind. Co., Ltd. Socket connector with supporting housing protrusions

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US7654862B2 (en) 2010-02-02
US20080220627A1 (en) 2008-09-11

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Granted publication date: 20080326