CN201031253Y - Cooling device of sputtering machine - Google Patents

Abstract

A cooling device for a sputtering machine is designed to solve the problem of deformation and defective products caused by high temperature accumulation during the sputtering process. A detachable cooling device is installed in a conveyor belt structure or/and an anti-plate structure in a direction different from the sputtering zone. The cooling device can be water-cooled, liquid-cooled or heat-pipe-cooled. The high temperature is reduced by the cooling device, thereby slowing down the process speed, shortening the process length and improving the yield.

Description

Cooling device for sputtering machine

technical field

The utility model provides a part structure of a sputtering machine, in particular to a cooling device of a sputtering machine.

Background technique

Referring to Figure 1, it is a schematic cross-sectional view of a conventional sputtering machine. The structure of the sputtering machine mainly includes:

A sputtering source 10, based on the principle of ion sputtering, the sputtering source 10 first uses an electric field to generate electrons between the two electrodes, and these accelerated electrons will collide with the inert gas pre-filled in the vacuum chamber to make it positively charged. The positively charged particles will be attracted by the cathode (target) and hit the cathode. The incident ions are subjected to the action of the electric field to gain momentum and hit the atoms on the surface of the target. The atoms on the surface of the target receive the momentum of the incident ions, causing the atoms under the target surface to be squeezed and displaced. The extrusion of the multi-layer atoms under the target surface will generate a force perpendicular to the target surface and the Atoms are collided, and these collided atoms are finally deposited on the object to be plated 15 to complete sputtering;

An anti-impact plate structure 11, the anti-impact plate structure 11 is located on both sides of the guide rail structure 12, and the anti-impact plate structure 11 prevents atoms from being deposited on other positions of the machine except the storage plate 14;

A guide rail structure 12, the guide rail structure 12 is arranged on both sides of the conveyor belt structure 13, to guide the moving direction of the storage plate 14;

A conveyor belt structure 13, the conveyor belt structure 13 conveys the storage plate 14 through the sputtering source 10;

A number of storage boards 14 provide the objects to be plated 15 to place;

Through the above composition, the object to be plated 15 is placed on the storage plate 14 , and then the storage plate 14 is placed on the conveyor belt structure 13 , guided by the guide rail structure 12 , and sputtered through the sputtering source 10 to complete sputtering.

But, its above-mentioned conventional sputtering machine still has following deficiency:

1. The sputtering process of the sputtering source 10 will generate waste heat, and the vacuum chamber will have the problem of heat accumulation. The conventional sputtering machine can only use the metal machine to conduct heat and dissipate heat naturally, but the process is quite slow, resulting in high temperature If not, it will affect problems such as deformation of the object to be plated 15 due to excessive temperature, resulting in an increase in defective products.

2. Because the object 15 to be plated cannot withstand high temperature, the usual method is to speed up the speed of the conveyor belt to shorten the time for the object 15 to be plated to be in a high temperature environment, but the sputtering cannot be completed in a short time, so the sputtering machine process is increased Sputtering is completed, but not only the cost of the machine is increased, but also the length of the process is longer, and a larger place is required for installation.

Therefore, in view of the problems existing in the above-mentioned conventional structures, how to develop a more ideal and practical innovative structure is what consumers are eagerly looking forward to, and it is also the goal and direction that related companies must strive to develop breakthroughs.

In view of this, the creator has been engaged in the manufacture, development and design of related products for many years. After detailed design and careful evaluation for the above-mentioned goals, he finally obtained a practical utility model.

Contents of the invention

The purpose of the utility model is to provide a cooling device for a sputtering machine, so as to overcome the defects of the above-mentioned traditional structure, achieve the practical effect of reducing the high temperature of the process, slowing down the process speed, shortening the process length, and improving the yield rate.

Technical features to solve the problem: provide a cooling device for a sputtering machine, including:

A sputtering source for sputtering operations, an anti-plate structure, a conveyor belt structure for transporting the storage board through the sputtering source, and several storage boards for placing the plated objects; it is characterized in that,

The anti-impact plate structure is located on both sides of the conveyor belt structure;

The surface of the anti-impact plate structure or/and conveyor belt structure different from the direction of the sputtering zone is locked with a detachable cooling device for cooling the waste heat of sputtering, and the cooling device includes a control structure for controlling the cooling efficiency.

Wherein, the cooling device is a liquid circulation cooling device.

Wherein, the cooling device is a water circulation cooling device.

Wherein, the cooling device is a heat pipe cooling device.

Wherein, the control structure is a pump device.

Wherein, the control structure is a compressor device.

Wherein, the control structure is a fan device.

Wherein, the anti-attaching plate structure includes more than two anti-attaching plates, the anti-attaching plates are locked on both sides of the conveyor belt structure of the sputtering machine, and the cooling device is locked on the two anti-attaching plates which are different from the sputtering area. surface.

Wherein, the conveyor belt structure includes a partition plate, and the cooling device is installed on the surface of the partition plate which is different from the sputtering area.

Efficacy compared to previous techniques:

1. The poor cooling of the conventional sputtering machine causes deformation of the object to be plated that cannot withstand high temperature, and the defect rate remains high. The cooling device of the utility model can be forced to cool and control the cooling efficiency, so the object to be plated will not be damaged In the case of deformation caused by high temperature, the yield rate can be improved.

2. The sputtering process of the conventional sputtering machine is high temperature, so in order not to deform the object to be plated, the speed of the conveyor belt needs to be accelerated, but this will cause incomplete sputtering, and the cooling device of the utility model can control and reduce sputtering Waste heat, so the process speed can be slowed down, and the sputtering can meet the demand.

3. The sputtering process of the conventional sputtering machine is high temperature, so in order not to deform the plated object, it is necessary to speed up the conveyor belt, but this will cause incomplete sputtering, and the process equipment, process length and cost must be increased, and the site must also be increased. To match the increase, the control of the utility model reduces the waste heat of the process, so the process speed can be slowed down, and the process can also be shortened.

About technology, means and effect thereof that the present utility model adopts, hereby give a preferred embodiment and coordinate drawing in detail in the back, believe that the above-mentioned purpose of the present utility model, structure and feature, when can get a deep and specific from it understanding.

Description of drawings

Figure 1: is a schematic cross-sectional view of a conventional sputtering machine.

Fig. 2: It is a schematic cross-sectional view of a sputtering machine according to one embodiment of the present invention.

Fig. 3: It is a three-dimensional schematic diagram of a cooling device for preventing plate locking according to an embodiment of the present invention.

Fig. 4: It is a schematic plan view of a sputtering machine according to one embodiment of the present invention.

Fig. 5: It is a schematic flow chart of the measuring and plating machine of one embodiment of the utility model.

Detailed ways

Referring to Fig. 2, shown in Fig. 3, the utility model provides a kind of cooling device of sputtering machine, and one embodiment thereof comprises:

A sputtering source 20, based on the principle of ion sputtering, the sputtering source 20 uses an electric field to generate electrons between the two electrodes, and these accelerated electrons will collide with the inert gas pre-filled in the vacuum chamber to make it positively charged. The positively charged particles will be attracted by the cathode (target) and hit the cathode. The incident ions are subjected to the action of the electric field to gain momentum and hit the atoms on the surface of the target. The atoms on the surface of the target receive the momentum of the incident ions, causing the atoms under the target surface to be squeezed and displaced. The extrusion of the multi-layer atoms under the target surface will generate a force perpendicular to the target surface and the Atoms are collided, and these collided atoms are finally deposited on the object to be plated 25 to complete sputtering. The process will generate waste heat and accumulate in the vacuum chamber;

An anti-impact plate structure 21, the anti-impact plate structure 21 is arranged on both sides of the conveyor belt structure 23, the anti-impact plate structure 21 prevents atoms from being deposited on other positions of the machine other than the storage plate 24, and the anti-impact plate structure 21 needs to be disassembled when necessary Come down and do the necessary cleaning action;

a conveyor belt structure 23, the conveyor belt structure 23 transports the storage plate 24 past the sputtering source 20;

A number of storage boards 24 provide the object to be plated 25 to place;

The main reason is that: the structure 21 of the anti-impact plate is different from the surface 211 of the anti-impact plate in the direction of the sputtering area 26, and a fixed and detachable cooling device 40 is locked and fixed. The cooling device 40 can be water-cooled, liquid-cooled or heat pipe-cooled, etc. In addition to natural heat dissipation In addition to forced heat dissipation, the cooling device 40 can reduce the waste heat accumulated in the sputtering process in the vacuum chamber, so that the process speed can be slowed down, the process length can be shortened, and the yield rate can also be improved.

On the other hand, the conveyor belt structure 23 includes a partition plate 232 provided between the conveyor wheels 231, and the partition plate 232 is only used for a part of the wheel surface of the conveyor wheel 231 to pass through, so that the partition plate 232 separates the sputtering area. 26 and the transmission area, the partition plate 21 is different from the direction surface 233 of the sputtering area 26, and a fixed and detachable cooling device 41 is locked. This cooling device 41 can be water-cooled, liquid-cooled or heat pipe cooling, etc. except for natural heat dissipation. Forced heat dissipation, the cooling device 41 can reduce the waste heat accumulated in the sputtering process in the vacuum chamber, so that the process speed can be slowed down, the process length can be shortened, and the yield rate can also be improved.

The cooling device 40 or 41 further includes a control structure 50 to control the cooling efficiency of the cooling device 40 or 41. The control structure 50 can be a pump device, a compressor device, or a fan device.

Through the above composition, the object to be plated 25 is placed on the storage plate 24 , and then the storage plate 24 is placed on the conveyor belt structure 23 , and is guided to pass through the sputtering source 20 to complete the sputtering.

Referring to Fig. 4 and Fig. 5, the utility model provides a cooling device for a sputtering machine, and the process of one embodiment includes:

The object to be plated 25 is placed on the object plate 24, and the object plate 25 is placed on the conveyor belt structure 23. The object plate 25 is first sent into the sputtering machine through the input device 31 of the sputtering machine, and then cleaned The device 32 will definitely clean the object 25 to be plated, so as to facilitate the adhesion of sputtering. After cleaning, it enters the first buffer device 33 for buffering for a period of time, and then sends the object plate 24 together with the object 25 to be plated into the sputtering device 34 for sputtering. After the plating is completed, after being buffered by the second buffer device 35 for a period of time, the output device 36 sends out the object plate 24 together with the object to be plated 25, and finally completes all the sputtering processes.

The sputtering device 34 , buffer device 33 or 35 can be increased according to requirements.

The foregoing is a specific description of the technical features of the utility model for the preferred embodiment of the utility model; however, those who are familiar with this technology can change and modify the utility model without departing from the spirit and principles of the utility model , and these changes and modifications should all be covered in the scope defined by the patent scope of this application.

Claims (9)

1. the refrigerating unit of a sputter machine includes:

The one sputter source, that is used to carry out the sputter operation is preventing that plate structure, is used to carry the glove plate through the conveyer belt structure in sputter source and be used for several glove plates that plated body is placed; It is characterized in that,

This is preventing that plate structure is positioned at the conveyer belt structure both sides;

This is preventing plate structure or/and conveyer belt structure differs from the surface of sputter district direction, and locking has the lower the temperature refrigerating unit of sputter used heat of detachable being used to, and this refrigerating unit includes the control texture of a controlled chilling efficient.

2. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this refrigerating unit is a liquid circulation type cooling system.

3. the refrigerating unit of sputter machine as claimed in claim 2 is characterized in that, this refrigerating unit is the water circulation type refrigerating unit.

4. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this refrigerating unit is a heat pipe cooling device.

5. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this control texture is a pumping unit.

6. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this control texture is a compressor set.

7. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this control texture is a fan assembly.

8. the refrigerating unit of sputter machine as claimed in claim 1, it is characterized in that, this is preventing that plate structure includes more than two and is preventing plate, and this is preventing that plate is locked on the conveyer belt structure both sides of sputter machine, and refrigerating unit then is locked on two surfaces that differ from the sputter district of preventing plate.

9. the refrigerating unit of sputter machine as claimed in claim 1 is characterized in that, this conveyer belt structure includes one and separates plate, and refrigerating unit is installed in the surface that differs from the sputter district that separates plate.

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