CN201038144Y - 一种led散热结构 - Google Patents
一种led散热结构 Download PDFInfo
- Publication number
- CN201038144Y CN201038144Y CNU2007201036646U CN200720103664U CN201038144Y CN 201038144 Y CN201038144 Y CN 201038144Y CN U2007201036646 U CNU2007201036646 U CN U2007201036646U CN 200720103664 U CN200720103664 U CN 200720103664U CN 201038144 Y CN201038144 Y CN 201038144Y
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- Prior art keywords
- heat
- heat dissipation
- emitting diode
- loop
- positive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005855 radiation Effects 0.000 title claims 2
- 230000017525 heat dissipation Effects 0.000 claims abstract description 64
- 239000004020 conductor Substances 0.000 claims abstract description 39
- 230000004888 barrier function Effects 0.000 claims 4
- 238000009413 insulation Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 abstract description 11
- 238000010276 construction Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 6
- 238000003466 welding Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 8
- 238000002955 isolation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000003822 epoxy resin Chemical group 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Chemical group 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
Description
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201036646U CN201038144Y (zh) | 2007-02-16 | 2007-02-16 | 一种led散热结构 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201036646U CN201038144Y (zh) | 2007-02-16 | 2007-02-16 | 一种led散热结构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201038144Y true CN201038144Y (zh) | 2008-03-19 |
Family
ID=39210664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201036646U Expired - Fee Related CN201038144Y (zh) | 2007-02-16 | 2007-02-16 | 一种led散热结构 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201038144Y (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102142508A (zh) * | 2010-12-16 | 2011-08-03 | 西安炬光科技有限公司 | 一种高功率高亮度led光源封装结构及其封装方法 |
| CN102207245A (zh) * | 2010-03-30 | 2011-10-05 | 上海三思电子工程有限公司 | 一种led照明单元 |
| CN109727962A (zh) * | 2018-12-29 | 2019-05-07 | 莆田市城厢区福瑞科技电子有限公司 | 一种led鞋灯的封装结构及封装方法 |
| CN109790971A (zh) * | 2016-09-12 | 2019-05-21 | 朗德万斯公司 | 紧凑型led发光装置及其制造方法 |
-
2007
- 2007-02-16 CN CNU2007201036646U patent/CN201038144Y/zh not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102207245A (zh) * | 2010-03-30 | 2011-10-05 | 上海三思电子工程有限公司 | 一种led照明单元 |
| CN102207245B (zh) * | 2010-03-30 | 2015-07-22 | 上海三思电子工程有限公司 | 一种led照明单元 |
| CN102142508A (zh) * | 2010-12-16 | 2011-08-03 | 西安炬光科技有限公司 | 一种高功率高亮度led光源封装结构及其封装方法 |
| CN109790971A (zh) * | 2016-09-12 | 2019-05-21 | 朗德万斯公司 | 紧凑型led发光装置及其制造方法 |
| CN109727962A (zh) * | 2018-12-29 | 2019-05-07 | 莆田市城厢区福瑞科技电子有限公司 | 一种led鞋灯的封装结构及封装方法 |
| CN109727962B (zh) * | 2018-12-29 | 2020-09-29 | 莆田市城厢区福瑞科技电子有限公司 | 一种led鞋灯的封装结构及封装方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHANGSHU HONGBANG NEW ENERGY CO., LTD. Free format text: FORMER OWNER: GUAN YOUZHAN; PATENTEE Effective date: 20080328 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080328 Address after: No. 3, Jianye Road, hi tech Industrial Park, Changshu Economic Development Zone, Jiangsu, Changshou City: 215500 Patentee after: Changshu CGPower Energy Corporation Address before: Postcode of Hsinchu County, Taiwan province: Co-patentee before: Qiu Baidong Patentee before: Official occupation |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 |