CN201035106Y - test module - Google Patents
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- CN201035106Y CN201035106Y CNU2007200046481U CN200720004648U CN201035106Y CN 201035106 Y CN201035106 Y CN 201035106Y CN U2007200046481 U CNU2007200046481 U CN U2007200046481U CN 200720004648 U CN200720004648 U CN 200720004648U CN 201035106 Y CN201035106 Y CN 201035106Y
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- 238000012360 testing method Methods 0.000 title claims abstract description 59
- 239000004606 Fillers/Extenders Substances 0.000 claims 7
- 238000009434 installation Methods 0.000 claims 2
- 239000000523 sample Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- 238000004804 winding Methods 0.000 description 1
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Abstract
本实用新型提供一种测试模块,其可用于测试具有固定盖的电子装置。测试模块包括第一转接板,其可容置于固定盖内,第一转接板的其中一平面包括多个第一接触部,另一平面包括多个第二接触部,第一转接板内包括多个第一导线,各个多个第二接触部通过各个多个第一导线与各个多个第一接触部电连接,其中多个第二接触部之间距小于多个第一接触部之间距。
The utility model provides a test module, which can be used to test an electronic device with a fixed cover. The test module includes a first adapter board, which can be accommodated in the fixed cover, one plane of the first adapter board includes a plurality of first contact parts, and another plane includes a plurality of second contact parts, and the first adapter board includes a plurality of first wires, each of the plurality of second contact parts is electrically connected to each of the plurality of first contact parts through each of the plurality of first wires, wherein the distance between the plurality of second contact parts is smaller than the distance between the plurality of first contact parts.
Description
技术领域 technical field
本实用新型涉及一种测试模块,特别是涉及一种用于测试电子装置的测试模块。The utility model relates to a test module, in particular to a test module for testing electronic devices.
背景技术 Background technique
在现有技术中,中央处理器(CPU)是以其凸出的针脚插设固定于电脑的处理器插槽的电接点中。当欲测试处理器插槽的电接点的焊点问题(如空焊、短路)时,是先以测试用的转接板置于处理器插槽中,其中转接板的二平面都设有接触部,其中一平面接触处理器插槽的电接点,另一平面的上部再连接具有与处理器插槽同宽度的测试治具,测试治具的多个探针便可直接接触到转接板上的接触部作线路的连接,接着即可进行后续的ICT/ATE测试。由于此种形式的处理器插槽是通过水平方向力量将处理器的针脚固定于处理器插槽的电接点处。然而,此种形式的处理器插槽因其结构的关系,于运作时易产生杂讯,造成使用上的不便。In the prior art, the central processing unit (CPU) is inserted and fixed in the electrical contacts of the processor socket of the computer by its protruding pins. When it is desired to test the solder joint problems (such as empty soldering, short circuit) of the electrical contacts of the processor socket, the adapter board for testing is first placed in the processor socket, and the two planes of the adapter board are equipped with Contact part, one of the planes contacts the electrical contacts of the processor socket, and the upper part of the other plane is connected to a test fixture with the same width as the processor socket, so that multiple probes of the test fixture can directly contact the adapter The contact part on the board is used for the connection of the circuit, and then the subsequent ICT/ATE test can be carried out. Because of this type of processor socket, the pins of the processor are fixed to the electrical contacts of the processor socket by force in the horizontal direction. However, due to the structure of the processor socket in this form, noise is likely to be generated during operation, causing inconvenience in use.
为了改善上述处理器插槽结构所产生的缺点,因而产生另一形式的处理器容置槽结构。请参考图1,为现有技术的电子装置的处理器容置槽的示意图。处理器容置槽50包括固定盖90与电接点80,其中电接点80呈凸出状,处理器的接触点也呈凸出状。通过固定盖90提供一垂直方向的紧固力量施加于处理器,以便将处理器固定于处理器容置槽50。但由于固定盖90的周围局限部分探针可以植针的区域,使得处理器容置槽50外围的电接点80无法通过传统的测试治具测试到。In order to improve the disadvantages caused by the above-mentioned processor socket structure, another form of processor accommodating slot structure is produced. Please refer to FIG. 1 , which is a schematic diagram of a processor accommodating slot of an electronic device in the prior art. The
为了解决上述问题,现有技术的解决手段是将外型类似处理器的测试件内建测试电路,直接以数字运算的方式进行测试,虽然免除了因固定盖90阻挡测试的问题,然其成本高,且处理器容置槽50的电接点的覆盖率仅约90%,无法有效地将所有处理器容置槽50上的接点全面性地进行测试。In order to solve the above problems, the solution in the prior art is to build a test circuit in a test piece similar in appearance to a processor, and directly perform the test in a digital operation mode. Although the problem of blocking the test due to the
因此,有必要提供一种用于测试具有固定盖的电子装置的测试模块,解决因固定盖阻挡测试部分电接点的问题,以改善现有技术所存在的问题。Therefore, it is necessary to provide a test module for testing an electronic device with a fixed cover, which solves the problem that the fixed cover blocks the electrical contacts of the test part, so as to improve the existing problems in the prior art.
实用新型内容Utility model content
本实用新型的目的在于提供一种用于测试具有固定盖的电子装置的测试模块,以解决上述问题。The purpose of this utility model is to provide a test module for testing an electronic device with a fixed cover, so as to solve the above problems.
为达成上述的目的,测试模块包括第一转接板、导电片与第二转接板。其中,第一转接板可容置于固定盖内,第一转接板的其中一平面包括多个第一接触部,另一平面包括多个第二接触部,第一转接板内包括多个第一导线,各个多个第二接触部通过各个多个第一导线与各个多个第一接触部电连接,其中多个第二接触部的间距小于多个第一接触部的间距。导电片内包括多个导电部,至少一部分多个导电部可与多个第二接触部电连接。第二转接板置于导电片之上,第二转接板的其中一平面包括多个第三接触部,另一平面包括多个第四接触部,第二转接板内包括多个第二导线,各个多个第四接触部通过各个多个第二导线与各个多个第三接触部电连接,其中多个第四接触部的间距大于多个第三接触部的间距。To achieve the above purpose, the test module includes a first adapter board, a conductive sheet and a second adapter board. Wherein, the first adapter plate can be accommodated in the fixed cover, one plane of the first adapter plate includes a plurality of first contact portions, the other plane includes a plurality of second contact portions, and the first adapter plate includes A plurality of first wires, each of the plurality of second contact portions is electrically connected to each of the plurality of first contact portions through each of the plurality of first wires, wherein the pitch of the plurality of second contact portions is smaller than the pitch of the plurality of first contact portions. The conductive sheet includes a plurality of conductive parts, and at least a part of the plurality of conductive parts can be electrically connected to the plurality of second contact parts. The second adapter plate is placed on the conductive sheet, one of the planes of the second adapter plate includes a plurality of third contact portions, and the other plane includes a plurality of fourth contact portions, and the second adapter plate includes a plurality of first contact portions. Two wires, each of the plurality of fourth contact portions is electrically connected to each of the plurality of third contact portions through each of the plurality of second wires, wherein the distance between the plurality of fourth contact portions is greater than the distance between the plurality of third contact portions.
根据本实用新型的其中一实施方式,多个第一接触部的间距实质上等于多个第四接触部的间距。According to one embodiment of the present invention, the distance between the plurality of first contact portions is substantially equal to the distance between the plurality of fourth contact portions.
本实用新型的优点在于,其测试模块主要是先后利用两次转接,先通过第一转接板将接触部的间距缩小,再以第二转接板将接触部的间距放大,以避开固定盖的凸部所造成的阻挡的问题,且其所能测试的电接点的覆盖率可达100%,以有效地将所有的接点全面性地进行测试,而其成本不高。The utility model has the advantage that the test module mainly utilizes two transfers in succession, first the first transfer board is used to reduce the distance between the contact parts, and then the second transfer board is used to enlarge the contact part distance to avoid The blocking problem caused by the convex part of the fixed cover is fixed, and the coverage rate of the electrical contacts that can be tested can reach 100%, so as to effectively test all the contacts comprehensively, and the cost is not high.
附图说明 Description of drawings
图1为现有技术的电子装置的处理器容置槽的示意图;1 is a schematic diagram of a processor accommodating slot of an electronic device in the prior art;
图2为本实用新型测试模块的实施例的示意图。Fig. 2 is a schematic diagram of an embodiment of the test module of the present invention.
元件代表符号说明:Component representative symbol description:
测试模块1 第一转接板10Test module 1 first adapter board 10
第一接触部11 第二接触部12First contact part 11 Second contact part 12
第一导线13 第二转接板20First wire 13 Second adapter board 20
第三接触部21 第四接触部22Third contact part 21 Fourth contact part 22
第二导线23 导电片30Second wire 23 conductive sheet 30
导电部31 填充物32Conductive part 31 Filler 32
处理器容置槽50 连接线60
主机板70 电接点80Motherboard 70
固定盖90 凸部91Fixed
电子装置99 长度L1、L2
具体实施方式 Detailed ways
为让本实用新型的上述和其他目的、特征和优点能更明显易懂,下文特举出本实用新型的具体实施例,并配合所附图式,作详细说明如下。In order to make the above and other purposes, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are specifically listed below, together with the attached drawings, for a detailed description as follows.
请参考图2。图2是本实用新型测试模块的实施例的示意图。本实用新型的测试模块1可用于测试具有固定盖90与多个电接点80的电子装置(例如中央处理器模块),其中固定盖90包括凸部91,测试模块1主要是用以测试电子装置的各电接点的状态。本实用新型的测试模块1包括第一转接板10、导电片30与第二转接板20。在本实施例中,测试模块1用以测试中央处理器(CPU)模块的电接点的状态,以得知各个电接点是否有如空焊、短路等问题。Please refer to Figure 2. Fig. 2 is a schematic diagram of an embodiment of the test module of the present invention. The test module 1 of the present utility model can be used to test an electronic device (such as a CPU module) having a
其中,第一转接板10呈平板状,可容置于固定盖90内,当进行测试时,将第一转接板10置于处理器容置槽50,亦即置于中央处理器所应容置的位置。第一转接板10的其中一平面包括多个第一接触部11,第一接触部11的数量与间距相同于处理器插槽50的电接点80的数量,因此,多个第一接触部11即可与多个电接点80相接触,使二者之间电连接。Wherein, the first adapter board 10 is flat and can be accommodated in the
第一转接板10的另一平面包括多个第二接触部12,第一转接板10内包括多个第一导线13,各个第二接触部12通过各个第一导线13与各个第一接触部11电连接。第二接触部12的数量与多个第一接触部11的数量相同,其不同之处在于接触部的间距(pitch)。因固定盖90的凸部91阻挡了处理器容置槽50周围部分的空间,使得第一转接板10周围的第一接触部11无法直接垂直朝上传递出去。Another plane of the first adapter plate 10 includes a plurality of second contact portions 12, and the first adapter plate 10 includes a plurality of first wires 13, and each second contact portion 12 communicates with each first wire 13 through each first wire 13. The contacts 11 are electrically connected. The number of the second contact portions 12 is the same as the number of the plurality of first contact portions 11 , the difference lies in the pitch of the contact portions. Since the convex portion 91 of the
为了使所有第一接触部11的能顺利通过第一导线13传递至固定盖90外,必须将多个第一接触部11的间距缩小,亦即多个第二接触部12的间距小于多个第一接触部11的间距。此时,通过第一导线13将多个第一接触部11往内缩,使原来分布于长度L1的所有第一接触部11缩小其间距,其目的是将所有第二接触部12分布于较小的长度L2内。考量固定盖90的凸部91所遮蔽范围的比例,同时根据某种形式的处理器容置槽50的电接点80的间距为1.27mm,再加以考量不同规格的处理器容置槽50的形式,因此,具体而言,多个第二接触部12的间距的合理范围系介于0.6mm至1mm之间。In order to make the energy of all the first contact portions 11 pass through the first wire 13 to the outside of the
导电片30放置于第一转接板10之上。设置导电片30的目的在于填补固定盖90的凸部91的厚度,故其厚度必须至少为凸部91的厚度。导电片30内包括多个导电部31,其可将多个第二接触部12分别传递出去。导电部31的数量至少需等于第二接触部12的数量,因此,每一第二接触部12可接触到至少一导电部31,换句话说,至少一部分多个导电部31可与多个第二接触部12电连接,进一步地为了增进电接触的考量,可将第二接触部12的间距缩减至0.2mm至0.6mm之间,以确保每一第二接触部12可电连接至少两个导电部31。The conductive sheet 30 is placed on the first riser board 10 . The purpose of disposing the conductive sheet 30 is to fill the thickness of the protrusion 91 of the
在本实施例中,导电片30具有弹性的导电胶,其是由导电的导电部31与不导电的填充物32所构成。通过导电片30的弹性,可增加导电片30与其相接触的第一转接板10、第二转接板20之间的密合度,使各接点有效接触。其中,导电部31的间距可视实际需求选用不同的规格,且导电部31的材质也不限于上述。In this embodiment, the conductive sheet 30 has elastic conductive glue, which is composed of a conductive portion 31 and a non-conductive filler 32 . Through the elasticity of the conductive sheet 30 , the closeness between the conductive sheet 30 and the first adapter plate 10 and the second adapter plate 20 which are in contact with the conductive sheet 30 can be increased, so that the contacts can be effectively contacted. Wherein, the pitch of the conductive portion 31 can be selected in different specifications according to actual requirements, and the material of the conductive portion 31 is not limited to the above.
惟需注意的是,第一转接板10除了为本实施例中所述的呈平板状外,也可将第一转接板10设计为凸出状(例如本实施例中的第一转接板10加上导电片30的体积),此时即可不需导电片30。It should only be noted that, in addition to the flat plate shape described in this embodiment, the first adapter plate 10 can also be designed as a convex shape (such as the first adapter plate in this embodiment). connection board 10 plus the volume of the conductive sheet 30), the conductive sheet 30 can be unnecessary at this moment.
由于现有的测试治具的探针(也可为绕线或接点的接触形式)的间距是配合处理器容置槽50的接点所设计,为了能直接利用现有的测试治具,必须将已缩小间距的第二接触部12再加以放大为原第一接触部11的间距,因此另将第二转接板20放置于导电片30的上。第二转接板20呈平板状,其位于固定盖90外侧。在第二转接板20的其中一平面包括多个第三接触部21,第三接触部21的数量相同于处理器插槽的电接点80的数量,在本实施例中,多个第二接触部12的间距实质上等于多个第三接触部21的间距,多个第三接触部21可与多个导电部31电连接。Because the spacing of the probes of the existing test fixtures (which can also be in the form of winding or contact contacts) is designed to match the contacts of the
第二转接板20的另一平面包括多个第四接触部22,第二转接板20内包括多个第二导线23,各个多个第四接触部22通过各个多个第二导线23与各个多个第三接触部21电连接。多个第四接触部22的数量与多个第三接触部21的数量相同,其不同之处在于接触部的间距。为了使所有多个第三接触部21的间距能恢复为相同于处理器容置槽50的电接点80的间距,必须将多个第四接触部22的间距加大,亦即多个第四接触部22之间距大于多个第三接触部21的间距。在本实施例中,多个第一接触部11的间距实质上等于多个第四接触部22的间距,使得所有接点都避开受到阻挡的区域,在通过第二转接板20进行转接后,即可接续利用现有的测试治具进行后续作业。由于利用本实用新型的测试模块1的测试方式,其所能测试的电接点80的覆盖率可达100%。Another plane of the second adapter board 20 includes a plurality of fourth contact portions 22, the second adapter board 20 includes a plurality of second wires 23, and each of the plurality of fourth contact portions 22 passes through each of the plurality of second wires 23 It is electrically connected to each of the plurality of third contact portions 21 . The number of the plurality of fourth contact portions 22 is the same as the number of the plurality of third contact portions 21 , the difference lies in the pitch of the contact portions. In order to restore the spacing of all the third contact portions 21 to be the same as the spacing of the
惟需注意的是,如接续测试模块1的测试治具的探针的间距可配合于第二接触部12的间距时,此时也可不需第二转接板20将第三接触部21的间距放大,而直接将第一转接板10接续测试治具进行后续作业。此时由于间距较小,因此测试治具需使用更小的探针。However, it should be noted that if the pitch of the probes of the test fixture connected to the test module 1 can match the pitch of the second contact portion 12, the second adapter plate 20 may not be needed to connect the third contact portion 21 to the pitch of the second contact portion 12. The spacing is enlarged, and the first adapter board 10 is directly connected to the test fixture for subsequent operations. At this time, due to the smaller pitch, the test fixture needs to use smaller probes.
综合上述,本实用新型的测试模块1主要是先后利用两次转接,先通过第一转接板10将接触部的间距缩小,再以第二转接板20将接触部的间距放大,以避开固定盖90的凸部91所造成的阻挡的问题。To sum up the above, the test module 1 of the present utility model mainly utilizes two transfers successively, first the spacing of the contact parts is reduced by the first transfer board 10, and then the spacing of the contact parts is enlarged by the second transfer board 20, so as to The problem of blocking caused by the convex portion 91 of the fixed
综上所述,本实用新型无论就目的、手段及功效,在均显示其迥异于现有技术的特征。惟需注意,上述实施例仅为例示性说明本实用新型的原理及其功效,而非用于限制本实用新型的范围。任何熟于此项技术的人士均可在不违背本实用新型的技术原理及精神下,对实施例作修改与变化。本实用新型的权利保护范围应如所附的权利要求所述。In summary, the utility model shows its characteristics that are very different from the prior art in terms of purpose, means and efficacy. However, it should be noted that the above-mentioned embodiments are only illustrative to illustrate the principles and effects of the present invention, and are not intended to limit the scope of the present invention. Any person familiar with the technology can modify and change the embodiments without violating the technical principle and spirit of the present utility model. The scope of protection of the rights of the utility model should be described in the appended claims.
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| CN109298310A (en) * | 2017-07-25 | 2019-02-01 | 日本电产理德股份有限公司 | Link block, gauging fixture and base board checking device |
| CN112290338A (en) * | 2019-07-24 | 2021-01-29 | 庆鼎精密电子(淮安)有限公司 | How to make a switch board |
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2007
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| TWI453424B (en) * | 2010-03-30 | 2014-09-21 | Ngk Spark Plug Co | Jig of electric detection and method for manufacturing a wiring substrate |
| CN102881336A (en) * | 2011-07-14 | 2013-01-16 | 南亚科技股份有限公司 | Apparatus for testing memory modules |
| CN102881336B (en) * | 2011-07-14 | 2015-11-25 | 南亚科技股份有限公司 | Apparatus for testing memory modules |
| CN103207366A (en) * | 2012-01-13 | 2013-07-17 | 纬创资通股份有限公司 | Test system and test method of printed circuit board assembly |
| CN109298310A (en) * | 2017-07-25 | 2019-02-01 | 日本电产理德股份有限公司 | Link block, gauging fixture and base board checking device |
| CN109298310B (en) * | 2017-07-25 | 2023-10-27 | 日本电产理德股份有限公司 | Connection module, inspection jig, and substrate inspection device |
| CN107490745A (en) * | 2017-08-24 | 2017-12-19 | 蚌埠高华电子股份有限公司 | A kind of electrical measurement version of the small PITCH of high way based on alternating expression arrangement |
| CN112290338A (en) * | 2019-07-24 | 2021-01-29 | 庆鼎精密电子(淮安)有限公司 | How to make a switch board |
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Assignee: Latitude Xin Tong (Kunshan) Co., Ltd. Assignor: Weichuang Zitong Co., Ltd. Contract record no.: 2010990000402 Denomination of utility model: USB device testing module, USB device and testing method thereof Granted publication date: 20080312 License type: Exclusive License Record date: 20100622 |
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