CN201018750Y - Fin ring array type heat radiator - Google Patents
Fin ring array type heat radiator Download PDFInfo
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- CN201018750Y CN201018750Y CNU2007201413295U CN200720141329U CN201018750Y CN 201018750 Y CN201018750 Y CN 201018750Y CN U2007201413295 U CNU2007201413295 U CN U2007201413295U CN 200720141329 U CN200720141329 U CN 200720141329U CN 201018750 Y CN201018750 Y CN 201018750Y
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Abstract
Description
技术领域technical field
本实用新型涉及一种散热器有关,特别涉及一种可用以解决如CPU等电子发热组件所产生的热能问题的散热装置。The utility model relates to a heat sink, in particular to a heat dissipation device which can solve the problem of heat generated by electronic heating components such as CPUs.
背景技术Background technique
为解决如计算机的中央处理器(CPU)等高发热量的电子组件的散热问题,热管(Heat pipe)已成为现今散热装置上所不可或缺的构件之一。此外,为使得散热装置上的鳍片能与风扇所提供的风量产生良好的分布与配合,亦有将鳍片环设于一筒状的导热座上,犹如中国台湾公告第575154号「热管散热装置」的新型专利案即是。In order to solve the heat dissipation problem of high-heat-generating electronic components such as the central processing unit (CPU) of a computer, the heat pipe has become one of the indispensable components of the current heat dissipation device. In addition, in order to make the fins on the cooling device have a good distribution and cooperation with the air volume provided by the fan, the fin ring is also arranged on a cylindrical heat conduction seat, just like China Taiwan Announcement No. 575154 "Heat pipe heat dissipation The new type patent case of "device".
所述新型专利案揭露一种热管散热装置,是包括一平板状基座、一两端开口的圆柱状导热筒、多个热管及多个散热鳍片,其中的导热筒横置于基座上并与其结合一体,而热管则水平穿过基座并呈环路状结合于导热筒的筒壁上,鳍片以放射状分布于导热筒内部作接触,并可于导热筒内部装设一风扇,以令所述风扇可发挥最好的散热功效。The new patent discloses a heat pipe cooling device, which includes a flat base, a cylindrical heat conduction cylinder with openings at both ends, a plurality of heat pipes and a plurality of heat dissipation fins, wherein the heat conduction cylinder is placed horizontally on the base And integrated with it, while the heat pipe passes through the base horizontally and is combined on the wall of the heat conduction cylinder in a loop shape. The fins are radially distributed inside the heat conduction cylinder for contact, and a fan can be installed inside the heat conduction cylinder. So that the fan can play the best heat dissipation effect.
然而,上述热管散热装置虽可与风扇所提供的风量产生良好的分布与配合,但却忽视热管与鳍片间的接触面积过少、而无法有效发挥各热管的传热效果。盖因所述热管散热装置不仅以导热筒作为热管与鳍片间的导热介质,造成热能无法直接传递至鳍片上而影响传热效果,同时各热管与导热筒相接触而呈扁平状的部位上,更仅有单一的扁平面与导热筒作接触,而相对的另一扁平面则无连结任何鳍片或散热结构,是以造成热管于冷凝部位与散热结构相接触的面积较少,难以将其所传导的热能尽速驱离,如此即使得热管内的工作流体无法快速冷凝而回复成液态,自无法顺利进行热交换现象。However, although the above-mentioned heat pipe cooling device can produce good distribution and cooperation with the air volume provided by the fan, it ignores that the contact area between the heat pipe and the fins is too small to effectively exert the heat transfer effect of each heat pipe. Because the heat pipe cooling device not only uses the heat conduction cylinder as the heat conduction medium between the heat pipe and the fins, the heat energy cannot be directly transferred to the fins, which affects the heat transfer effect, and at the same time, each heat pipe is in contact with the heat conduction cylinder and is flat. , and only a single flat surface is in contact with the heat conduction tube, while the opposite flat surface is not connected with any fins or heat dissipation structure, so the contact area of the heat pipe at the condensing part and the heat dissipation structure is small, and it is difficult to The heat conducted by it is driven away as quickly as possible, so that the working fluid in the heat pipe cannot be quickly condensed and returned to a liquid state, and the heat exchange phenomenon cannot be carried out smoothly.
有鉴于此,本发明人为改善并解决上述的缺失,乃特潜心研究并配合学理的运用,终于提出一种设计合理且有效改善上述缺失的本实用新型。In view of this, the present inventor intends to improve and solve the above-mentioned shortcomings. Naite devoted himself to research and combined with the application of theories, and finally proposed a utility model with a reasonable design and effectively improved the above-mentioned shortcomings.
发明内容Contents of the invention
本实用新型的主要目的,在于可提供一种鳍片环列式散热装置,可增加热管冷凝段与各鳍片组间的接触面积,大幅提升传热效果。The main purpose of the present utility model is to provide a ring-type heat sink with fins, which can increase the contact area between the condensation section of the heat pipe and each fin group, and greatly improve the heat transfer effect.
为了达成上述的目的,本实用新型是提供一种鳍片环列式散热装置,包括一导热基座、二鳍片组及一热管;二鳍片组皆为一金属片以连续迂回折叠且呈环状排列所构成,另热管乃具有一受热段与一冷凝段,其受热段与导热基座作热传连结,而其冷凝段则由导热基座延伸而出,并进一步呈扁平状,且于其冷凝段呈扁平状的部位上形成二相背对的扁平面;其中,热管冷凝段的二扁平面是分别与二鳍片组相贴附而被夹置其中。In order to achieve the above-mentioned purpose, the utility model provides a ring-type fin cooling device, which includes a heat conduction base, two fin groups and a heat pipe; The heat pipe is composed of a ring arrangement, and the heat pipe has a heating section and a condensing section, the heating section is connected to the heat conducting base for heat transfer, and the condensing section is extended from the heat conducting base, and is further flattened, and Two opposite flat surfaces are formed on the flat portion of the condensing section; wherein, the two flat surfaces of the condensing section of the heat pipe are respectively attached to the two fin groups and sandwiched therein.
本实用新型具有的优点:其主要是以热管作为散热装置的导热基座与鳍片组间的传热组件,并令热管与鳍片组作热传连结的冷凝段呈扁平状,以便于为二或二二以上的鳍片组所夹置,如此即可增加热管冷凝段与各鳍片组间的接触面积,达到大幅提升传热效果的目的。The utility model has the advantages that the heat pipe is mainly used as the heat transfer component between the heat conduction base and the fin group of the heat dissipation device, and the condensation section where the heat pipe and the fin group are connected by heat transfer is flat, so as to facilitate Two or more fin groups are sandwiched, so that the contact area between the condensation section of the heat pipe and each fin group can be increased, and the heat transfer effect can be greatly improved.
附图说明Description of drawings
图1是本实用新型的立体分解图;Fig. 1 is a three-dimensional exploded view of the utility model;
图2是本实用新型的立体组合图;Fig. 2 is the three-dimensional assembly diagram of the present utility model;
图3是本实用新型的侧视平面图;Fig. 3 is a side plan view of the utility model;
图4是本实用新型于使用状态中的剖面示意图;Fig. 4 is a schematic cross-sectional view of the utility model in use;
图5是本实用新型另一实施例于使用状态中的剖面示意图;Fig. 5 is a schematic cross-sectional view of another embodiment of the utility model in use;
图6是本实用新型又一实施例于使用状态中的剖面示意图;Fig. 6 is a schematic cross-sectional view of another embodiment of the utility model in use;
图7是本实用新型再一实施例于使用状态中的剖面示意图。Fig. 7 is a schematic cross-sectional view of still another embodiment of the present invention in use state.
附图标记说明:导热基座1;底面10;顶部11;下凹槽110;散热器12;底部120;鳍片121;上凹槽122;鳍片组2;中空部位20;盖板21;热管3;受热段30;冷凝段31;扁平面310;电子发热组件4。Explanation of reference numerals:
具体实施方式Detailed ways
为了能更进一步了解本实用新型的特征及技术内容,请参阅以下有关本实用新型的详细说明与附图,然而所附图式仅提供参考与说明用,并非用来对本实用新型加以限制。In order to further understand the features and technical content of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.
请参阅图1及图2,是分别为本实用新型的立体分解图及立体组合图。本实用新型是提供一种鳍片环列式散热装置,包括一导热基座1、至少二鳍片组2及至少一热管3;其中:Please refer to FIG. 1 and FIG. 2 , which are respectively a three-dimensional exploded view and a three-dimensional assembled view of the present utility model. The utility model provides a ring-type fin cooling device, which includes a
所述导热基座1是以导热性良好的材质所制成,如铝、铜等,其底面10乃用以与一如中央处理器(CPU)等电子发热组件4(如图4所示)作贴合;而其顶部11则可进一步设置一散热器12。所述散热器12可为一铝挤型,其具有一与导热基座1相贴合而作热传连结的底部120、以及间隔成型于所述底部120上的多个鳍片121所构成,可进一步提供导热基座1作散热。The heat-conducting
所述鳍片组2是分别以一长条金属片连续迂回折叠后,再环绕弯曲而成环状排列,并彼此间隔相对而竖立于上述导热基座1及散热器12的上方处,而于环列成型后,即可于各鳍片组2所围绕的中心处形成一中空部位20,以便于作为外界空气的流通、或进一步提供风扇(图略)安置时的所需空间等。The
请一并参阅图3所示,各所述热管3皆至少具有一受热段30与一冷凝段31,用以热传连结于上述导热基座1与所述鳍片组2之间。在本实施例中,所述热管3的数量为多个,且以各热管3的二端部分别作为其受热段30与冷凝段31,并于导热基座1顶部11凹设有多个下凹槽110,而于散热器12底部120则凹设有分别与各下凹槽110相对应的多个上凹槽122,而当散热器12结合于导热基座1顶部11时,即可令各上、下凹槽122、110相合并以使各热管3的受热段30能插入其中,进而热传连结于导热基座1与散热器12之间。Please also refer to FIG. 3 , each of the
再如图3及图4所示,承上所述,各热管3亦可以交错排列方式令其冷凝段31由导热基座1相对应的二侧处向上延伸而出,且各热管3的冷凝段31进一步呈扁平状,并于冷凝段31呈扁平状的部位上形成二相背对的扁平面310,以分别与上述彼此间隔相对的二鳍片组2作贴附而被夹置其中,藉以增加冷凝段31与各鳍片组2相接触的表面积,进而达到热传连结与大幅提升热传效率,能有效发挥热管3的传热效果。此外,于最外侧的二鳍片组2外端面处,亦可各增加一环状的盖板21,各盖板21乃为导热性佳的材质所制,可进一步帮助鳍片组2进行散热。As shown in Figure 3 and Figure 4 again, as mentioned above, each
再者,如图4所示,上述各热管3的冷凝段31亦可进一步随着所述鳍片组2的环状排列而弯曲,且因各热管3交错排列而使任二相邻的热管3的冷凝段31可进一步于其末端处相对接触。Furthermore, as shown in Figure 4, the
另,如图5所示,为本实用新型另一实施例于使用状态中的剖面示意图。在本实施例中,所述热管3是以其中段部作为受热段30,并直接穿过导热基座1而令其二端部由所述导热基座1相对应的二侧处向上延伸而出,且所述热管3二端部则皆作为冷凝段31。In addition, as shown in FIG. 5 , it is a schematic cross-sectional view of another embodiment of the present invention in use. In this embodiment, the
又,如图6所示,为本实用新型又一实施例于使用状态中的剖面示意图。在本实施例中,所述热管3仍以其一端部作为受热段30、另一端部作为冷凝段31;然而,其冷凝段31皆仅由所述导热基座1的一侧处向上延伸而出,并无交错排列的设计。Moreover, as shown in FIG. 6 , it is a schematic cross-sectional view of another embodiment of the present invention in use. In this embodiment, one end of the
再,如图7所示,为本实用新型再一实施例于使用状态中的剖面示意图。在本实施例中,所述热管3是以其中段部作为冷凝段31,并相对位于导热基座1上方处,以令所述热管3二端部向下延伸而分别由导热基座1相对应的二侧处外向内穿入其中,且所述热管3的二受热段30彼此呈交错排列设置。Furthermore, as shown in FIG. 7 , it is a schematic cross-sectional view of another embodiment of the present invention in use. In this embodiment, the middle part of the
是以,通过上述的构造组成,即可得到本实用新型鳍片环列式散热装置。Therefore, through the above-mentioned structural composition, the ring-type fin cooling device of the present invention can be obtained.
综上所述,本实用新型实为不可多得的新型实用新型产品,其确可达到预期的使用目的,而解决现有的缺失。In summary, the utility model is a rare new utility model product, which can indeed achieve the expected purpose of use and solve the existing deficiencies.
以上所述仅为本实用新型的较佳可行实施例,非因此即拘限本实用新型的专利范围,故举凡运用本实用新型说明书及图式内容所为的等效结构变化,均同理皆包括于本实用新型的范围内。The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Therefore, all equivalent structural changes made by using the description of the utility model and the content of the drawings are all the same. included in the scope of the present utility model.
Claims (13)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201413295U CN201018750Y (en) | 2007-03-14 | 2007-03-14 | Fin ring array type heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2007201413295U CN201018750Y (en) | 2007-03-14 | 2007-03-14 | Fin ring array type heat radiator |
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| CN201018750Y true CN201018750Y (en) | 2008-02-06 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7515417B2 (en) * | 2005-04-11 | 2009-04-07 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
| CN102130075A (en) * | 2010-12-24 | 2011-07-20 | 东莞汉旭五金塑胶科技有限公司 | radial radiator |
| CN101765351B (en) * | 2008-12-22 | 2012-12-26 | 富准精密工业(深圳)有限公司 | Heat-dissipation device |
| CN110906293A (en) * | 2019-11-27 | 2020-03-24 | 特能热交换科技(中山)有限公司 | Heat radiator |
| CN113730942A (en) * | 2021-09-30 | 2021-12-03 | 深圳市银星智能科技股份有限公司 | Condensing device and cleaning equipment |
-
2007
- 2007-03-14 CN CNU2007201413295U patent/CN201018750Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7515417B2 (en) * | 2005-04-11 | 2009-04-07 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
| CN101765351B (en) * | 2008-12-22 | 2012-12-26 | 富准精密工业(深圳)有限公司 | Heat-dissipation device |
| CN102130075A (en) * | 2010-12-24 | 2011-07-20 | 东莞汉旭五金塑胶科技有限公司 | radial radiator |
| CN110906293A (en) * | 2019-11-27 | 2020-03-24 | 特能热交换科技(中山)有限公司 | Heat radiator |
| CN113730942A (en) * | 2021-09-30 | 2021-12-03 | 深圳市银星智能科技股份有限公司 | Condensing device and cleaning equipment |
| CN113730942B (en) * | 2021-09-30 | 2025-06-10 | 深圳银星智能集团股份有限公司 | Condensing unit and cleaning equipment |
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Granted publication date: 20080206 Termination date: 20100314 |