CN201001245Y - Integrated heat exchanger - Google Patents

Abstract

The utility model provides an integrated heat exchanger, which mainly integrates a heat exchange unit on a centrifugal fan, wherein, the heat exchange unit comprises a large number of radiating fins arranged inside the centrifugal fan and arranged at the periphery of fan blades and a heat pipe fixedly arranged on the base of the centrifugal fan; the heat dissipation fins have the function of flow guiding, and cooling media are filled in the heat pipes; therefore, the fluid to be radiated flows through the heat pipe, the high temperature of the heat pipe is conducted to the base and the radiating fins, and the centrifugal fan can lead cold air into the heat pipe and flow through the radiating fins and then flow out of the air outlet, so that the radiating requirement is met, and the heat exchanger has the advantages and the effects of reducing the volume of the heat exchanger and playing the best radiating effect.

Description

Integrated heat exchanger

technical field

The utility model relates to the research and development of an integrated heat exchanger, in particular to a new type of improved heat exchanger suitable for small electronic equipment. With the design of the new type, the overall volume of the heat exchanger can be reduced, and Greatly improve the cooling effect.

Background technique

Since the temperature of the electronic devices inside the general electronic equipment or computer system will rise during operation, and its temperature will increase significantly with the increase of data processing speed. A cooling device must be installed on the device to lower the operating temperature and prevent high heat from causing a short circuit, failure or even damage to the internal electronic device. It can be seen that the quality and heat dissipation effect of the cooling device will directly affect the service life of the electronic device, which cannot be ignored.

Generally speaking, the structure of a conventional heat dissipation device 10 is shown in FIG. 1 , which mainly includes an axial flow fan 1 and a heat sink 2, wherein the heat sink 2 is provided with a plurality of heat dissipation fins 22 protruding from a heat conduction substrate 21. As a result, an air outlet 23 is naturally formed between each cooling fin 22 . Moreover, the thermally conductive substrate 21 of the above-mentioned heat sink 2 is fixed on the electronic device 3 such as a chip or a central processing unit (CPU), so the high operating temperature generated by the electronic device 3 in the process of processing data can be transmitted to the heat conduction device through heat conduction. On the base plate 21 and each cooling fin 22; and the axial flow fan 1 is arranged at the position above the heat conduction base plate 21, when the motor 11 of the axial flow fan 1 controls the fan blade 12 to rotate, the cold air will be introduced into the inside of the fan blade 12 and then The heat dissipation fins 22 blowing downward, please refer to the second figure, so that the temperature of the heat dissipation fins 22 can be reduced and the working high temperature conducted to the heat dissipation fins 22 will be discharged through the air outlet 23, thereby reducing the temperature of the heat dissipation fins 22. The electronic device 3 operates at a high temperature.

However, due to the increasingly sophisticated technology of the current electronic industry, most electronic equipment is moving towards the goal of "light, thin, short, and small", so the volume of its internal electronic devices must be relatively smaller and smaller. However, it is obvious that because the heat sink 2 is arranged below the axial flow fan 1, the overall thickness of the heat sink 10 is too thick, the volume is too large, and the space is occupied. In addition, since the central position of the axial flow fan 1 is provided with a motor 11, and the fan blades 12 rotate to form a spiral air flow, therefore, the central position of the heat conduction substrate 21 is often unable to dissipate heat because the air flow cannot be blown. In other words, the heat dissipation degree of the existing heat dissipation device 10 is limited and cannot exert the best heat dissipation performance. In summary, it is obvious that the existing heat dissipation device 10 actually still has some points that need to be improved urgently.

Afterwards, although our inventors have researched and developed the above-mentioned cooling fan and have a new utility model of "high-efficiency multi-blade centrifugal computer fan" No. 091200303 in Taiwan, China, which has been issued to the market and granted a patent, it is still impossible to effectively solve the problem of excessive overall volume and The problem of inaccurate heat dissipation.

In view of this, our inventors are concentrating on further research on the cooling device and started to develop and improve it again, hoping to solve the above problems with a better design, and after continuous testing and modification, this new model came out.

Contents of the invention

Therefore, the purpose of this new model is to provide an integrated heat exchanger, which can mainly reduce the overall volume of the heat exchanger, and can greatly improve the heat conduction efficiency and heat dissipation effect of the heat exchanger, and then can exert the best heat exchange performance, etc. Advantages and efficacy.

In order to achieve the above purpose, the inventor specially designed an integrated heat exchanger, which mainly integrates a heat exchange unit on the centrifugal fan, wherein the heat exchange unit is arranged inside the centrifugal fan and arranged on A large number of heat dissipation fins on the periphery of the fan blades and a heat pipe fixed on the base of the centrifugal fan base; the heat dissipation fins also have a flow guiding effect and the inside of the heat pipe is filled with a cooling medium; Through the heat pipe, the high temperature of the heat pipe will be conducted to the base and the heat dissipation fins, while the centrifugal fan can introduce cold air into the heat dissipation fins and then flow out from the air outlet, achieving heat dissipation requirements and reducing the volume of the heat exchanger And play the advantages and effects of the best heat dissipation performance.

The present invention has the following advantages, summarized as follows:

1. Since this new model integrates the heat exchange unit directly on the centrifugal fan, it can greatly reduce the thickness of the heat exchanger and reduce the overall body to save space. Thin, short, and small" requirements, thereby improving the applicability of the new model (especially suitable for thin electronic devices).

2. This new design makes the connecting end of the heat pipe directly connected to the electronic device, which has the characteristics of directly absorbing high temperature, and uses the heat pipe to be arranged in an inclined shape and the principle of cold and heat convection, so that the cooling medium inside the heat pipe can automatically perform vaporization and condensation heat exchange work And generate convective action, and finally use the cold air inhaled by the centrifugal fan to cool the heat dissipation fins, that is, the centrifugal fan as a whole. With multiple heat exchange actions, it can really play the role of heat dissipation, and can exert excellent heat dissipation performance.

Description of drawings

FIG. 1 is a three-dimensional exploded schematic diagram of an existing heat dissipation device;

Fig. 2 is a schematic diagram of the use state of the existing cooling device;

Fig. 3 is a three-dimensional exploded schematic diagram of the first embodiment of the present invention;

Fig. 4 is a schematic bottom view of the centrifugal fan base of the first embodiment of the present invention;

Fig. 5 is a combined sectional schematic view of the first embodiment of the present invention;

Fig. 6 is a schematic diagram of the heat exchange state of the first embodiment of the present invention;

Fig. 7 is a three-dimensional exploded schematic view of the second embodiment of the present invention;

Fig. 8 is a combined sectional schematic view of the second embodiment of the present invention;

Fig. 9 is a three-dimensional exploded schematic view of the third embodiment of the present invention;

Fig. 10 is a three-dimensional exploded schematic view of the fourth embodiment of the present invention;

Fig. 11 is a three-dimensional exploded schematic view of the fifth embodiment of the present invention;

Fig. 12 is an exploded perspective view of the sixth embodiment of the present invention.

Explanation of reference signs

[Existing parts] 10 cooling device; 1 axial fan; 11 motor; 12 fan blade; 2 radiator;

[Parts of the new model] 4 centrifugal fan; 41 base; 411 slot; 42 outer cover; 421 air inlet; 43 air outlet; 44 motor; ; 52 heat pipes; 521 closed end; 522 link end.

Detailed ways

With regard to the inventor's technical means, several preferred embodiments are described below in detail with reference to the drawings.

First please refer to Fig. 3, shown in Fig. 4, the first embodiment of the present invention mainly comprises a centrifugal fan 4 and a heat exchange unit 5, wherein:

Centrifugal fan 4 has a volute base 41 and an outer cover 42, a ring slot 411 is formed on the bottom surface of the base 41, and an air inlet 421 is provided on the outer cover 42, and one side of the centrifugal fan 4 is extended to form a The air outlet 43 has a transmission motor 44 fixed inside, and a shaft sleeve 45 and a fan blade 46 are sheathed outside the motor 44, so that the fan blade 46 is arranged eccentrically inside the base 41;

The heat exchanging unit 5 includes heat dissipation fins 51 disposed inside the centrifugal fan 4 and arranged on the periphery of the fan blades 46 and a heat pipe 52 fixed on the base 41 of the centrifugal fan 4; the heat dissipation fins 51 also have Conduction function and is located above the embedded groove 411 of the base 41 of the centrifugal fan 4, and the heat pipe 52 is an arc-shaped hollow tube made of copper metal, so that the higher end of the heat pipe 52 is a closed end 521, and the lower end is a closed end 521. The end is the connection end 522 connecting the heat source (such as an electronic device or other heat generating device), and the heat pipe 52 is directly embedded in the embedded groove 411 on the bottom surface of the base 41 of the centrifugal fan 4 (as shown in FIG. 5 ). And the inside of the heat pipe 52 is first evacuated and then filled with a cooling medium. In this embodiment, water is used as the cooling medium in the heat pipe 52, and water is vaporized in a vacuum state (i.e. under a state lower than atmospheric pressure). Both the temperature and the condensation temperature will decrease, so that the cooling medium in the heat pipe 52 can quickly vaporize after absorbing the high temperature of the heat source, and then when the temperature is transmitted to the base 41 of the centrifugal fan 4, the outer cover 42 and the cooling fins 51 Rapid condensation, accelerate the absorption of high temperature from the heat source and accelerate the speed of heat dissipation.

Please refer to FIG. 6 for the use state of the heat exchange of the present invention. First, the connecting end 522 of the heat pipe 52 is connected to electronic devices (not shown in the figure) such as a chip or a central processing unit (CPU), so that the high temperature of the electronic device is passed through. The pipe wall of the connecting end 522 of the heat pipe 52 conducts to the internal cooling medium to increase its temperature. At this time, the cooling medium will quickly vaporize into air bubbles, and the air bubbles will rise because the closed end 521 of the heat pipe 52 is raised and the connecting end 522 is inclined downward. It is designed to flow upwards along the closed end 521 of the heat pipe 52, and gradually cools down and slowly condenses and returns to the cooling medium on the way of flowing toward the closed end 521, while the low-temperature cooling medium of the heat pipe 52 ascends the closed end 521 to follow the heat pipe 52 toward the closed end 521. The connecting end 522 flows downward and absorbs the high temperature of the electronic device at the connecting end 522 to gradually heat up and re-vaporize. In this way, the cooling medium can form cold and hot convection between the closed end 521 of the heat pipe 52 and the connecting end 522 state; in addition, in the flow process that the cooling medium is vaporized into bubbles and towards the closed end 521 of the heat pipe 52, the temperature at which the cooling medium is vaporized into bubbles will be conducted to the base 41, the outer cover 42 and the bottom of the centrifugal fan 4 through the heat pipe 52 tube walls. The cooling fins 51 on the inside absorb the high temperature of the cooling fins 51 by the cold air sucked in when the fan blades 46 rotate, and then are discharged by the air outlet 43 of the centrifugal fan 4 .

With the above design, the connection end 522 of the heat pipe 52 is directly connected to the electronic device to quickly and directly absorb the high temperature generated when the electronic device is in operation; and the heat pipe 52 absorbs the high temperature and rises in temperature, and the high-temperature cooling medium inside it flows to the raised closed end At the same time, the high temperature of the cooling medium will also be transmitted to the centrifugal fan 4 as a whole and the internal cooling fins 51 through the wall of the heat pipe 52 to rapidly cool down, and then the cooled cooling medium will flow back to the downward slope of the heat pipe 52 again. The connection end 522 absorbs the high temperature of the electronic device again, and repeats the above-mentioned cyclical heat exchange action of heating, convection, cooling and reflux; moreover, when the heat dissipation fin 51 and the centrifugal fan 4 absorb the high temperature of the heat pipe 52, it is used The centrifugal fan 4 inhales cold air from the air inlet 421 , and makes the cold air directly blow on the cooling fins 51 and the centrifugal fan 4 to dissipate heat, and finally blows out through the air outlet 43 of the centrifugal fan 4 .

Next, please refer to Fig. 7 and Fig. 8, the second embodiment of the present invention also includes a centrifugal fan 4 and a heat exchange unit 5, and the cooling fins 51 of the heat exchange unit 5 are also arranged around the periphery of the fan blade 46 However, the embedded groove 411 at the bottom of the base 41 is arranged around the periphery of the heat dissipation fins 51, so that the heat pipe 52 surrounds the outer ring of the heat dissipation fins 51; thus, the high temperature absorbed by the heat pipe 52 can also be conducted to the heat dissipation fins The sheet 51 and the centrifugal fan 4 are integrated to achieve the purpose and demands of heat exchange.

Furthermore, except that the heat pipe 52 of the present invention can be arranged on the bottom of the base 41 of the centrifugal fan 4, of course it can also be arranged inside the centrifugal fan 4. Please refer to FIG. 9, the third embodiment of the present invention For example, the heat pipe 52 is directly installed on the cooling fins 51, and the connection end 522 of the heat pipe 52 can be connected to the heat source after passing through the base 41 of the centrifugal fan 4; or as shown in Figure 10, the present invention In the fourth embodiment of the present invention, the heat dissipation fins 51 are respectively straddled on the heat pipes 52 inside the centrifugal fan 4; in addition, the heat pipes 52 of the present invention can also adopt a two-stage design, please refer to Fig. 11 and No. 12 of Fig. 12 As shown in the fifth and sixth embodiments, the heat pipe 52 is mainly changed to a two-stage structure, which can also achieve excellent and high-efficiency heat exchange.

The above are only several preferred embodiments of the present model, and should not limit the scope of the present model implementation with this, that is, all equivalent changes and modifications made according to the claims of the present model and the content of the new description should still be regarded as Within the scope covered by this patent.

Claims (5)

1, a kind of integrated heat exchanger, it is characterized in that: be that a heat exchange unit is integrated on the centrifugal fan, wherein, described heat exchange unit comprises that the radiating fin and that is arranged at centrifugal fan inside and is arranged in the fan blade periphery is fixedly arranged on the heat pipe on the centrifugal fan base; Inside heat pipe is to be filled with coolant.

2, integrated according to claim 1 heat exchanger is characterized in that: described heat pipe is the loop of a sealing, or the two-part structure for not communicating.

3, integrated according to claim 1 heat exchanger is characterized in that: described heat pipe is to be arranged at the centrifugal fan below, and described base forms towards the caulking groove with the storing heat pipe of base depression.

4, as integrated heat exchanger as described in the claim 3, it is characterized in that: the fin in the described centrifugal fan is the caulking groove top that directly is arranged at the centrifugal fan base, the outer or inner edge of groove before perhaps being arranged on.

5, integrated according to claim 1 heat exchanger, it is characterized in that: described heat pipe is arranged at centrifugal fan inside, and makes its connecting end pass the centrifugal fan base connecting pyrotoxin outward; And described road heat pipe is directly to be arranged on the radiating fin lamellar body, and perhaps radiating fin is directly striden and is located on the heat pipe.

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