CN201007721Y - Semiconductor component testing table with ventiduct cooling device - Google Patents
Semiconductor component testing table with ventiduct cooling device Download PDFInfo
- Publication number
- CN201007721Y CN201007721Y CN 200620049612 CN200620049612U CN201007721Y CN 201007721 Y CN201007721 Y CN 201007721Y CN 200620049612 CN200620049612 CN 200620049612 CN 200620049612 U CN200620049612 U CN 200620049612U CN 201007721 Y CN201007721 Y CN 201007721Y
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- semiconductor component
- air channel
- semiconductor
- air
- tester table
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Abstract
The utility model discloses a testing bench of semiconductor elements with an air-duct radiating device. Through design of air-duct and space between bottom surface of the radiating device and top surface of semiconductor components, radiating air flow from an air supply device is forced to blow through the space, and the air-duct radiating device is driven by an actuating device to move relative to a loading bench and to automatically hold the semiconductor elements under test tightly to a connector, thereby enabling complete automation of testing process. Further because the size of the space is far smaller than that of the semiconductor elements, gradient of temperature difference of the bottom surface of the radiating device and the top surface of semiconductor components is obviously increased compared with existing technology, thereby achieving that radiating effect is raised greatly and radiating problem in process of automatic test is efficiently solved. In particular, further through controlling size of the space, hypothermia environment of different degree can be accurately provided, and the test accuracy is greatly increased.
Description
Technical field
The utility model relates to a kind of semiconductor component tester table, especially a kind of semiconductor component tester table that is provided with the air duct radiation device.
Background technology
With the aggregationization day by day of semiconductor subassembly, the circuit of being integrated in the single semiconductor subassembly is complicated day by day, and power consumption and thermal value are all unprecedented soaring.On the other hand, in case the temperature of operating environment surpasses more than 120 degree Celsius approximately, not only the material of silicon itself may be impaired, being responsible for also will be because of arriving the melting point fusion with semiconductor subassembly electrically connect to the scolding tin of circuit board, thereby causes trouble such as conduction problem and circuit board pollution between semiconductor subassembly and circuit board.
Therefore, no matter need adopt the place of high-efficiency semiconductor assembly at motherboard, image display card or other, as shown in Figure 1, at semiconductor subassembly 10 end faces coating one deck heat-conducting glue 14, for pasting a radiating fin 16 is set, even further on radiating fin 16, set up a radiator fan 18, and use heat that semiconductor subassembly 10 is produced and derive through radiating fin 16 conduction and cross-ventilation, cause damaging in order to avoid accumulate on the semiconductor subassembly 10.
In addition, as Fig. 2 is example with the chip package, because dynamical semiconductor subassembly 10 has hundreds of groups easily as the projection 100 that connects the end, the spacing of each projection 100 is quite trickle, need utilize accurate circuit board 12 as bridge, with its upper surface 122 each connection pads each projection 100 corresponding to semiconductor subassembly 10 bottoms, and via the wiring of this circuit board 12, form the corresponding tin ball 120 that more disperses on the space at circuit board 12 lower surfaces 124, be provided as contact site and the corresponding one by one miniature terminal that is linked to a connector.For purposes of illustration, below the foregoing circuit plate is called lead wire circuit plate 12, and above-mentioned semiconductor subassembly 10 is collectively referred to as semiconductor member 1 together with a lead wire circuit plate 12, and these semiconductor subassembly 10 top flat surface are called end face 102, the bottom is provided with projection 100 places and is called basal plane 104.
In the QC testing process of semiconductor component, for judging its quality, must be via energising and input signal test, as if only tens of seconds of test duration, the overheated problem of still unlikely generation; On the contrary, when reaching more than several minutes, semiconductor subassembly will heat up gradually in that the test duration is long, in case heat dissipation design is bad, even may cause semiconductor subassembly to surpass allowable temperature undermining inner structure or cause problem such as lead wire circuit plate below tin ball fusion.Be that please semiconductor component to be measured needs to differentiate earlier the real solid welding of quality ability to circuit board, can't directly fix radiating fin and fan on it this moment.Therefore, how on the semiconductor component tester table, allow tested semiconductor component guarantee that in tested process heat radiation is good, need well-designed undoubtedly.
Present tester table is that semiconductor member connector is set on testing circuit board, member to be measured is inserted in the connector, with being about to that loam cake presses down and as shown in Figure 3, the downward part 225 of utilizing loam cake bottom surface 224 is semiconductor component 1 downward packing to be measured, guarantees that the conduction of itself and connector feet position links; Loam cake 22 central authorities then are formed with always to put on covers 22 broad passage 223, and loam cake bottom surface 224 and 102 of semiconductor component end faces to be measured also leave an open air channel.In the test process, can be with air at room temperature in a large number through this passage and air channel perfusion, by heat loss through convection.
Be to simplify computation process, as shown in Figure 4, the temperature of loam cake 22 bottom surfaces 224 is decided to be feeds gas temperature T
1, semiconductor subassembly end face 102 temperature are operational temperature T
2, semiconductor subassembly 10 and loam cake 22 bottom surfaces 224 temperature difference T=T
2-T
1, air channel height H, semiconductor subassembly 10 boundary length L, component table area L
2At this moment, heat flux dQ=-λ dA (dt/dh); Wherein, λ is that (W/m * K), dA is a heat-conducting area to coefficient of heat conductivity, the temperature gradient that dt/dh then changes with height dh for the temperature difference dt that is close to the assembly surface place.So heat flux is with air mass flow, temperature gradient dt/dh, and component table area L
2Parameters such as size are just becoming; Wherein, component table area L
2For control become because of.
When generally meeting with this problem, the most direct reaction is to manage to reduce feeding gas temperature T
1Thereby, increase temperature difference Δ T.But on the one hand, reduce the feeding gas temperature and will cause the saturated vapour drops, originally interspersing among airborne hydrone partly is forced to be condensed in the air channel with little water droplet kenel, make semiconductor component to be measured face the unnecessary risk of moisture attack, avoid this problem to take place, then to allow the air of cooling usefulness be dried one step ahead, make operating process obviously complicated; Secondly, reduce the feeding gas temperature and need wasteful energy; Moreover the operating temperature of generally expecting semiconductor subassembly with the about 40 degrees Centigrade of the temperature difference of room temperature, reduces Celsius twenty degree even will feed gas temperature about 60 to 70 degree Celsius, institute's temperature difference scaling up that causes only 50%.
If can need not reduce under the feeding gas temperature condition, promote heat dissipation, not only can guarantee test process smoothly, avoid unnecessary power consumption and humidity problem, more can allow the designs simplification of board own, effectively increase the market acceptance of tester table, also increase the economic benefit of using this kind board.
Especially, part semiconductor assembly is under different operating temperature environment, has different signal treatment effeciencies, this kind information has considerable reference value for the circuit designers of selecting semiconductor subassembly for use, how can be in testing process, providing the different operating environment temperature with simple structure and cheap cost, also is to be worth dropping into the problem of going into seriously.
The utility model content
At the above-mentioned deficiency of prior art, technical problem to be solved in the utility model provides a kind ofly can promote significantly that cooling is renderd a service, simple in structure, the gas flow-disturbing problem of can avoiding dispelling the heat, can adjust the semiconductor component tester table with air duct radiation device of control cooling degree.
In order to solve the problems of the technologies described above, a kind of semiconductor component tester table that the utility model proposes with air duct radiation device, this semiconductor component comprises: one has end face and is provided with the semiconductor subassembly that plural number connects the end basal plane; One side is installed and is electrically connected this semiconductor subassembly and connects end, opposite side guiding and be extended with lead wire circuit plate to plural contact site that should link portion;
This tester table comprises:
One microscope carrier, this microscope carrier comprises a testing circuit board, and one be installed on this testing circuit board, in order to carrying and electrically connect the connector of the tool plural number electrode of this semiconductor component contact site;
One activates device;
One feeder;
One is subjected to this actuating device to drive heat abstractor with the tool air channel of moving relative to this microscope carrier, and this heat abstractor comprises:
One has the body of bottom surface, wherein is formed with the air channel of running through this body;
One extends from this body bottom surface, for compressing this semiconductor component lead wire circuit plate, makes this lead wire circuit plate contact site push the pushing portion of the electrode of this connector of contact;
One is arranged on the other end place that this body forms this air channel, connects the joint of this feeder.By this, pass this air channel from the gas of this feeder and blow to this semiconductor subassembly.
As optimal technical scheme, the above-mentioned air channel of the present invention one end preferably extends from this bottom surface, preferably extends from these bottom surface central authorities or near a side edge.
As another optimal technical scheme, the heat abstractor pushing portion height in the above-mentioned tool of the present invention air channel makes when this lead wire circuit plate contact site pushes the electrode of this connector of contact, this body bottom surface and the length of side of this semiconductor subassembly end face spacing to be measured much smaller than this semiconductor subassembly end face; Above-mentioned body bottom surface preferably can be moved relative to this pushing portion, adjusts the spacing of this body bottom surface and this semiconductor subassembly end face to be measured by this; Above-mentioned body bottom surface is preferably by the dip plane of the bottom surface of locating away from this air channel towards tilting away from this air channel, making near this place, air channel near this microscope carrier.
With respect to prior art, the utility model is by selecting reduction body bottom surface and semiconductor subassembly end face spacing, not only still keep original operator scheme, roughly keep original simple structure, and allow the gradient of temperature difference increase suddenly immediately, need not reduce fully under the condition that feeds gas temperature, reach simultaneously and promote semiconductor component cooling efficient, avoid unnecessary energy resource consumption, even can regulate and control the cooling degree by this, the operating environment of semiconductor component different temperatures to be measured is provided, with the corresponding forms of acquisition temperature with arithmetic speed, also can plan the heat radiation gas flow direction and not give birth to flow-disturbing, solve aforementioned technical problem really.
Description of drawings
Fig. 1 is that the conventional semiconductors component groups is located at board state synoptic diagram (semiconductor component being described when application state, with the relation of circuit board, heating radiator);
Fig. 2 is traditional chip package semiconductor component schematic side view;
Fig. 3 is the part enlarged diagram of conventional manual tester table;
Fig. 4 is the perspective diagram (Temperature Distribution and structural relation are described in the test process) of conventional semiconductors member built-in test board;
Fig. 5 is the schematic perspective view of the utility model first preferred embodiment;
Fig. 6 is that the part of Fig. 5 is amplified schematic perspective view;
Fig. 7 is that Fig. 5 is the side of user mode cross-sectional schematic (washing in the bright test process Temperature Distribution and structural relation);
Fig. 8 is the body bottom surface elevational schematic view (tool air duct radiation bottom of device structure is described) of Fig. 5;
Fig. 9 is the cross-sectional schematic of the utility model second preferred embodiment;
Figure 10 is the cross-sectional schematic of the utility model the 3rd preferred embodiment.
Wherein: 1 is semiconductor component; 3 is the component testing board; 10 is semiconductor subassembly; 12 is circuit board; 14 is heat-conducting glue; 16 is radiating fin; 18 is radiator fan; 22 is loam cake; 30 is microscope carrier; 31 is test port; 32 is conveying device; 33 is that testing circuit board 34 is mechanical arm; 35 is tool air duct radiation device; 100 is projection; 102 is end face; 104 is basal plane; 120 is the tin ball; 122 is upper surface; 124 is lower surface; 223 is broad passage; 224, be the bottom surface 354,354 ', 354 "; 225 is downward part; 330 is connector; 350 is body; 351 is holder; 352 is joint; 353, be the air channel 353 ', 353 "; 355,355 ' is pushing portion; 356,356 ' is the exhaust breach; 357 is suction nozzle; 358 ' is piezoelectric element; 3530,3530 " be openend.
Embodiment
Aforementioned and other technology contents, characteristics and effect about the utility model in the detailed description of conjunction with figs. and preferred embodiment, can clearly present.For purposes of illustration, in following examples still with the semiconductor component 1 of chip package as shown in Figure 2 as determinand, be not as limit certainly.
As shown in Figure 5, the semiconductor component tester table 3 that the utility model first preferred embodiment provides with air duct radiation device, comprise a microscope carrier 30 as the basis, in the present embodiment, dispose six groups of test ports 31 on the microscope carrier 30, and supply the conveying device 32 that semiconductor component that semiconductor component to be measured enters each test port 31 and carry test to finish breaks away from; Putting on each test port 31 has a testing circuit board 33, and is respectively arranged with a mechanical arm that moves up and down 34 as actuating device, and the lower end of each mechanical arm 34 then respectively is provided with a tool air duct radiation device 35; Board also is provided with the feeder (not indicating among the figure) that is linked to each tool air duct radiation device 35 respectively.
When semiconductor component to be measured is when being used for motherboard, this testing circuit board 33 can be selected public plate, if semiconductor component to be measured is that this testing circuit board 33 is promptly selected the display card of removal semiconductor component when for example being used for display card; The position that semiconductor component is installed on each testing circuit board is originally installed the connector 330 of carrying semiconductor component to be measured respectively, and each connector 330 has plural electrode respectively, all corresponding contact sites of this semiconductor component of power supply property connection.
In the present embodiment, this has air duct radiation device 35 and has a body 350 as Figure 6 and Figure 7, the side of body 350 is provided with two groups of holders 351, for it is assembled to mechanical arm 34 lower ends, then be formed with an air channel of running through among the body 350, air channel one end is formed with a joint 352 that is exposed to body one side, and to connect feeder, the gas that allows feeder provide enters in the air channel 353.
As shown in Figure 8, partly form another openend 3530 in air channel 353 in the present embodiment in body 350 bottom center,, will blow out from body 350 bottom center so enter the gas in air channel 353 by feeder; The edge of body bottom surface 354 extends four groups of pushing portions 355 downwards, feed to down the lead wire circuit plate 12 that compresses semiconductor component 1, guarantee that the contact site of lead wire circuit plate 12 is connected to the electrode of connector 330, and 355 of pushing portions leave exhaust breach 356, allow 353 blow gas in air channel wait breach 356 to cubic loss thus; And also be formed with an air intake passage in the body 350, and be provided with the two place's suction nozzles 357 that link air intake passage in body bottom surface 354, so that before test and after finishing test, bleeding in this applies negative pressure and draws and move tested semiconductor component 1.
Owing to the distance h of 102 of body bottom surface 354 and semiconductor subassembly end faces significantly is reduced in the present embodiment a length of side L much smaller than semiconductor subassembly 10, that is, allow that the cross section that feeding gas is passed through is significantly reduced, so the air quantity that is fed by feeder in the unit interval is constant, the wind speed of this moment must speed; In addition, because spacing h dwindles, significantly improve with the h contravariant with semiconductor subassembly end face 102 temperature gradient dt/dh body bottom surface 354.Thus, do not changing under other any condition situation, only body bottom surface 354 need changed into semiconductor subassembly end face 102 spacing h and plan spacing half (H/2), can radiating efficiency improved about 100% easily; If be reduced to and plan 1/3 of spacing, more can promote radiating efficiency to surpassing twice.
Certainly, can understand easily in this operator,, also do not have any reason during actual the manufacturing and must not limit and be located at the position that pushes semiconductor subassembly though pushing portion is to push in the lead wire circuit Board position in the present embodiment as ripe; And this spacing reduction model system is with respect to one of prior art simplified model, and owing to feed gas by mediad four directions loss, in the position of semiconductor subassembly end face over against the air channel opening, very easily produce flow-disturbing, so the semiconductor component tester table with air duct radiation device that the utility model second preferred embodiment provides as shown in Figure 9, extend from bottom surface 354 ' near a side edge in air channel 353 ', and only be formed with exhaust breach 356 ' in opposite sides, therefore the gas nature that is fed by air channel 353 ' is flowed towards opposite edges by air channel openend 3530 ', further solves the flow-disturbing problem.
And in the present embodiment, between body bottom surface 354 ' and pushing portion 355 ', more be provided with plural piezoelectric element 358 ', put on voltage on the piezoelectric element 358 ' by control, between regulation and control body bottom surface 354 ' and the semiconductor subassembly end face 102 apart from h ', after progressively fine setting is tested, the cooling efficient referential data forms in the time of more can setting up different spacing, gas with various flow one by one, make all test conditions be defined by clear, with the cool effect quantification for the influence of cooling.In other words, in case semiconductor component to be measured can be with operating environment temperature difference, and produce arithmetic speed showing variation the time, this board can be according to tester's demand, pilot-gas flow and spacing, thus accurate control determines the operating environment temperature, meets tester's demand.
Moreover, because feeding the temperature of heat radiation gas can raise gradually with passing through distance, the semiconductor component tester table with air duct radiation device that the utility model the 3rd preferred embodiment provides as shown in figure 10, by control body bottom surface 354 " near this air channel 353 " openend 3530 " towards away from air channel 353 " opening part tilts, makes away from air channel 353 " bottom surface 354 located " more allow h near the end face 102 of semiconductor subassembly "＞h ' "; In other words,, and guarantee temperature gradient dt ' by the reduction of the control spacing reduction compensation temperature difference "/dh ' " unlikely than dt "/dh " significantly reduce, allow semiconductor subassembly 10 not can because of with air channel 353 " the opening distance differs the problem that causes radiating effect to successively decrease.
The utility model the foregoing description is by forming the air channel in body, and allows tool air duct radiation device be subjected to the driving of actuating device and move relative to microscope carrier, so that tested semiconductor component packing is electrically connected on connector, reaches the robotization of test; Simultaneously significantly reduce tool air duct radiation device body bottom surface and semiconductor subassembly end face spacing, temperature gradient is being shown promote, thereby the radiating efficiency that feeds gas heightens; Especially by this spacing of control, make the cooling degree of operational testing environment by quantification, one of industry technology great change especially.
Claims (7)
1. semiconductor component tester table with air duct radiation device is characterized in that this semiconductor component comprises: one has end face and is provided with the semiconductor subassembly that plural number connects the end basal plane; One side is installed and is electrically connected this semiconductor subassembly and connects end, opposite side guiding and be extended with lead wire circuit plate to plural contact site that should link portion;
This tester table comprises:
One microscope carrier, this microscope carrier comprises a testing circuit board, and one be installed on this testing circuit board, in order to carrying and electrically connect the connector of the tool plural number electrode of this semiconductor component contact site;
One activates device;
One feeder;
One is subjected to this actuating device to drive heat abstractor with the tool air channel of moving relative to this microscope carrier, and this heat abstractor comprises:
One has the body of bottom surface, wherein is formed with the air channel of running through this body;
One extends from this body bottom surface, for compressing this semiconductor component lead wire circuit plate, makes this lead wire circuit plate contact site push the pushing portion of the electrode of this connector of contact;
One is arranged on the other end place that this body forms this air channel, connects the joint of this feeder.
2. the semiconductor component tester table with air duct radiation device according to claim 1 is characterized in that, this air channel one end extends from this bottom surface.
3. the semiconductor component tester table that is provided with tool air duct radiation device according to claim 2 is characterized in that, extend from these bottom surface central authorities in this air channel.
4. the semiconductor component tester table with air duct radiation device according to claim 2 is characterized in that, extend from this bottom surface near a side edge in this air channel.
5. the semiconductor component tester table with air duct radiation device according to claim 1, it is characterized in that, the heat abstractor pushing portion height in this tool air channel makes when this lead wire circuit plate contact site pushes the electrode of this connector of contact, this body bottom surface and the length of side of this semiconductor subassembly end face spacing to be measured much smaller than this semiconductor subassembly end face.
6. the semiconductor component tester table with air duct radiation device according to claim 5 is characterized in that this body bottom surface can be moved relative to this pushing portion, adjusts the spacing of this body bottom surface and this semiconductor subassembly end face to be measured by this.
7. the semiconductor component tester table with air duct radiation device according to claim 5 is characterized in that, this body bottom surface is by the dip plane of the bottom surface of locating away from this air channel towards tilting away from this air channel, making near this place, air channel near this microscope carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620049612 CN201007721Y (en) | 2006-12-27 | 2006-12-27 | Semiconductor component testing table with ventiduct cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620049612 CN201007721Y (en) | 2006-12-27 | 2006-12-27 | Semiconductor component testing table with ventiduct cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201007721Y true CN201007721Y (en) | 2008-01-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620049612 Expired - Lifetime CN201007721Y (en) | 2006-12-27 | 2006-12-27 | Semiconductor component testing table with ventiduct cooling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN201007721Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608507A (en) * | 2011-12-09 | 2012-07-25 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN103901359A (en) * | 2012-12-31 | 2014-07-02 | 致茂电子(苏州)有限公司 | Test platform with dry environment |
| CN105307458A (en) * | 2015-11-06 | 2016-02-03 | 上海斐讯数据通信技术有限公司 | Test fixture with radiating function and radiating method |
| TWI561836B (en) * | 2016-06-24 | 2016-12-11 | ||
| CN109521356A (en) * | 2018-11-16 | 2019-03-26 | 歌尔股份有限公司 | Radio frequency testing device and radio frequency test method |
| TWI769627B (en) * | 2020-12-18 | 2022-07-01 | 鴻勁精密股份有限公司 | Temperature controlling unit and operating apparatus using the same |
| TWI803004B (en) * | 2021-09-24 | 2023-05-21 | 伊士博國際商業股份有限公司 | Supplied with convection test socket |
-
2006
- 2006-12-27 CN CN 200620049612 patent/CN201007721Y/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102608507A (en) * | 2011-12-09 | 2012-07-25 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN102608507B (en) * | 2011-12-09 | 2015-06-03 | 致茂电子(苏州)有限公司 | Temperature control system and automatic semiconductor testing table with temperature control system |
| CN103901359A (en) * | 2012-12-31 | 2014-07-02 | 致茂电子(苏州)有限公司 | Test platform with dry environment |
| CN103901359B (en) * | 2012-12-31 | 2016-06-29 | 致茂电子(苏州)有限公司 | There is the test platform of dry environment |
| CN105307458A (en) * | 2015-11-06 | 2016-02-03 | 上海斐讯数据通信技术有限公司 | Test fixture with radiating function and radiating method |
| CN105307458B (en) * | 2015-11-06 | 2018-01-30 | 上海斐讯数据通信技术有限公司 | A kind of measurement jig and heat dissipating method with heat sinking function |
| TWI561836B (en) * | 2016-06-24 | 2016-12-11 | ||
| CN109521356A (en) * | 2018-11-16 | 2019-03-26 | 歌尔股份有限公司 | Radio frequency testing device and radio frequency test method |
| TWI769627B (en) * | 2020-12-18 | 2022-07-01 | 鴻勁精密股份有限公司 | Temperature controlling unit and operating apparatus using the same |
| TWI803004B (en) * | 2021-09-24 | 2023-05-21 | 伊士博國際商業股份有限公司 | Supplied with convection test socket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080116 |
|
| EXPY | Termination of patent right or utility model |