CN200993959Y - Device for planting solder balls - Google Patents

Abstract

A solder ball planting device mainly comprises: a base, the surface of which is provided with a first grid comprising a plurality of meshes; a ball dropping part which is provided with a hollow concave part with a window at the bottom surface, wherein a second grid comprising a plurality of meshes is arranged in the window; and the positioning piece is provided with a positioning area. The solder balls can be positioned and dropped in the first grid through the first grid arranged on the base and the second grid of the ball dropping piece, then the chip with the solder paste is contacted with the solder balls in the first grid through the positioning area of the positioning piece, and then the solder paste is formed into a solder ball grid array on the surface of the chip by utilizing a high-temperature reflow process after the positioning piece is removed, so that the problem that the solder paste cannot be positioned and formed by the surface tension of the solder ball due to the difficulty in melting when the solder paste with a high tin proportion is reflowed at high temperature in the prior art is solved.

Description

Device for planting solder balls

technical field

The utility model relates to a technique for planting solder balls, more specifically, a device for planting solder balls.

Background technique

At present, due to the emergence of BGA technology (Ball Grid Array Package), that is, ball grid array packaging technology, it has become the best choice for high-density, high-performance, multi-pin packages such as CPUs, motherboards, and north-south bridge chips.

However, the operation flow of the current ball grid array packaging technology is shown in Figure 1. A layer of solder paste layer 131 is printed on the surface of the chip 13 in advance, and the chip 13 is placed and fixed on the surface of the bottom plate 11, and the solder paste layer will be printed One side of the chip 13 of 131 faces upward, and then the solder ball net 17 is covered on the bottom plate 11 on which the chip 13 is placed, and the solder ball 15 is corresponding to the solder ball 15 through the solder ball area 171 of the solder ball net 17. The chip 13 on the surface of the bottom plate 11 is dropped, and then the dropped solder ball net 17 is removed, and finally the bottom plate 11 and the chip 13 are reflowed at high temperature, and the solder balls of the same shape are formed by the surface tension of the melted solder paste. On the chip 13 side, a ball grid array is formed.

It is feasible to apply the solder paste with a tin-lead ratio of 63/37 in the above existing ball grid array formation technology. However, for high-tin solder balls with a tin-lead ratio of 90/10, since the solder balls will not melt, the surface tension formed in the high-temperature reflow process cannot be relied on to position the solder balls into shape, resulting in planted Solder balls are shifted, and even cause a short circuit to cause the failure of the ball grid array package.

Therefore, how to design a device for planting solder balls to solve the shortcomings of existing solder paste with a high proportion of tin that cannot be positioned and formed by its own surface tension due to the difficulty of melting solder balls during high-temperature reflow soldering is an urgent need at present. solved problem.

Utility model content

In view of the above-mentioned defects in the prior art, the utility model provides a device for planting solder balls, which can solve the problem that the existing solder paste with a high proportion of tin cannot rely on its own surface tension due to the difficulty of melting the solder balls during high-temperature reflow soldering. Positioning the problem of shaping.

The solder ball planting device of the present utility model comprises: a base, the surface of which is provided with a first grid for positioning solder balls and including a plurality of mesh holes; A window, the window is provided with a second grid for penetrating solder balls in the first grid and including a plurality of mesh holes; The solder ball is located on the corresponding position on the first grid so that the solder paste is in contact with the solder ball.

According to an aspect of the present invention, the number and size of the meshes of the first grid and the meshes of the second grid are equal.

According to one aspect of the present invention, the surface of the base is provided with a plurality of the first grids, and the bottom surface of the hollow concave part of the ball dropping part is provided with a plurality of windows, and each of the windows is provided with a hole for penetrating the solder balls. For the second grid of the first grid, the surface of the positioning member is provided with a plurality of positioning areas.

According to one aspect of the present invention, the surface of the base is also provided with a plurality of positioning columns, and the ball drop member is provided with a plurality of first positioning parts corresponding to the positioning columns provided on the surface of the base. There are a plurality of second positioning portions corresponding to the positioning columns.

According to one aspect of the present invention, the base also has a plurality of fixing columns, the first grid has a fixing portion corresponding to the fixing columns of the base so that the first grid is positioned on the base, and the falling The solder ball part has a plurality of first fixing parts corresponding to the fixing columns of the base, and the positioning part has a plurality of second fixing parts corresponding to the fixing columns of the base, through the first and second fixing parts to The ball dropping part and the positioning part are positioned on the base.

According to an aspect of the present invention, the corner edge of the hollow concave portion of the ball dropper is provided with an exhaust portion communicating with the outside.

Compared with the existing solder ball planting device, the solder ball planting device of the utility model evenly drops the solder balls on the first grid on the surface of the base through the second grid on the surface of the solder ball dropping part, and can pass through the positioning The solder leakage hole formed between the part and the base will pour out the redundant solder balls falling on the first grid on the surface of the base, and then the positioning part will position the chip with solder paste on the first grid for high temperature Melting the solder balls and solder paste to form a plurality of solder balls with the same shape, positioning the solder balls through the first grid so that they are evenly distributed on the surface of the chip to form a solder ball grid array, thereby solving the problem that the solder balls cannot be melted due to melting. Relying on its surface tension to straighten the solder balls, resulting in offset of the planted solder balls, even causing short circuit problems, and at the same time improving the efficiency of the ball planting process.

Description of drawings

FIG. 1 is a schematic diagram of the existing solder ball planting technology;

Fig. 2 is a structural exploded view of the solder ball planting device of the present invention; and

FIG. 3 is an enlarged schematic diagram of the chip and the base when the solder ball planting device of the present invention forms solder balls.

Description of main component symbols

11 Bottom plate

13 chips

131 solder paste

15 solder balls

17 Drop ball net

21 base

215 First Grid

216 mesh

217 positioning post

218 fixed part

216 fixed column

24 drop solder balls

230 hollow recess

233 second grid

234 mesh

233 First Positioning Department

236 The first fixed part

237 windows

238 Exclusion Department

26 positioning parts

251 positioning area

254 The second positioning department

255 Second fixed part

3 chips

4 solder balls

Detailed ways

The implementation of the present utility model is described below through specific examples, and those skilled in the art can easily observe other advantages and effects of the present utility model from the content disclosed in this specification. The utility model can also be implemented or applied through other different specific examples, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the utility model.

Please refer to FIG. 2 , which is an exploded schematic diagram of the structure of the solder ball planting device of the present invention. In an embodiment of the present invention, the chip can be a high-density, high-performance, multi-pin chip such as a CPU, a motherboard, a north-south bridge chip, etc., and the technology of forming a solder ball grid array on the chip surface through the solder ball planting device It is the ball grid array packaging technology (BGA technology), but it does not limit the solder ball planting device of the present invention.

As shown in Figure 2, the solder ball planting device of the present utility model includes a base 21 whose surface is provided with three first grids 211 for positioning solder balls and including a plurality of mesh holes 212; The ball part 23 has a hollow recess 230, and the bottom surface of the hollow recess 230 is provided with three windows 237, and the window 237 is provided with a plurality of mesh holes 232 including a plurality of mesh holes 212 respectively corresponding to the three first grids 211 Three second grids 231 for penetrating solder balls in the first grid 211; and a positioning member 25, which is provided with three positioning areas 251, and the positioning areas 251 are used to position the chip with solder paste on Drop the corresponding position on the first grid 211 with the solder ball, and make the solder paste contact with the solder ball.

In the embodiment of the present utility model, the meshes 212 of the first grid 211 and the meshes 232 of the second grid 231 are equal in number and size, so that a plurality of meshes passing through the second grid 231 The holes 232 and the penetrating solder balls are all in the corresponding plurality of mesh holes 212 of the first grid 211 .

In addition, a plurality of positioning posts 213 and a plurality of fixing posts 215 are disposed on the surface of the base 21 . In contrast, the first grid 211 has a fixing portion 214 corresponding to the fixing column 215 of the base 21 , so that the first grid 211 is positioned on the base 21 .

Moreover, the solder ball dropping part 23 is provided with a plurality of first positioning parts 233 corresponding to the positioning posts 213 provided on the surface of the base 21 , and the positioning part 25 is provided with a plurality of positioning parts 233 corresponding to the positioning posts 213 . The second positioning part 253.

On the other hand, the solder ball dropping part 23 has a plurality of first fixing portions 235 corresponding to the fixing columns 215 of the base 21 , and the positioning member 25 has a plurality of first fixing portions 235 corresponding to the fixing columns 215 of the base 21 . The two fixing parts 255 pass through the first fixing part 235 and the second fixing part 255 to position the solder ball dropping part 23 and the positioning part 25 respectively on the base 21 .

Preferably, the corner edge of the hollow concave portion 230 of the ball dropping member 23 is provided with an exhaust portion 238 communicating with the outside. The removing part 238 is used to discharge the solder balls not positioned on the first grid 211 from the ball dropping part 23 when the solder balls are placed in the first grid 211 of the base 21 through the ball dropping part 23 23, thereby avoiding the inconvenience of picking solder balls that are not positioned on the first grid 211.

In the process of actually using the solder ball planting device of the present invention to place solder balls on the chip. First, the base 21 is placed horizontally, so that the first grid 211 has a fixing portion 214 corresponding to the fixing column 215 of the base 21 and is sleeved on a plurality of fixing columns 215 corresponding to the base 21, so that the first grid 211 A grid 211 is positioned on the base 21 .

Next, align the first positioning portion 233 and the first fixing portion 235 of the solder ball drop 23 with the positioning column 213 and the fixing column 215 of the base 21, and make the first positioning portion 233 pass through the positioning column 213, thereby The ball dropping part 23 is covered on the surface of the base 21 so that the second grid 231 disposed on the ball dropping part 23 is aligned with the first grid 211 on the surface of the base 21 . Afterwards, solder balls can be inserted into the second grid 231 of the solder ball dropping part 23, so that the solder balls can drop from the mesh holes 232 of the second grid 231 to the net of the first grid 211. holes 212, and position the solder balls through the mesh holes 212, and when solder balls fall in each mesh hole 212, remove the solder ball dropping member 23. As mentioned above, when the ball dropping member 23 is removed, the solder balls left in the hollow portion 230 of the ball dropping member 23 can be discharged to the outside of the ball dropping member 23 through the removing portion 238 .

Next, align the second positioning part 253 and the second fixing part 255 of the positioning part 25 with the positioning column 213 and the fixing column of the base 21 respectively according to the way that the ball dropping part 23 is covered on the surface of the base 21 as described above. 215 , cover the positioning member 25 on the surface of the base 21 , so that the positioning area 251 of the positioning member 25 is aligned with the first grid 211 of the base 21 on which solder balls fall. After that, put the chip with solder paste in advance into the positioning area 251, and put the side of the chip with solder paste into the first grid 211 corresponding to the solder ball, and pass through the positioning area of the positioning member 25. The positioning function of 251, when positioning the chip on the first grid 211, removes the positioning member 25. At this time, the solder paste on the surface of the chip is pasted on the solder balls in the first grid 211 .

Furthermore, perform heating manufacturing methods such as high-temperature reflow on the base 21 to melt the solder balls falling in the first mesh holes of the first grid 211 and the solder paste on the surface of the chip 3 at a high temperature, so that the solder balls After melting with the solder paste at high temperature, solder balls 4 are formed and adhered to the surface of the chip 3 .

As shown in FIG. 3 , the solder balls and the solder paste are melted at high temperature to form solder balls 4 and pasted on the surface of the chip 3 , and the formed solder balls 4 are evenly distributed on the first grid 211 on the surface of the base 21 Among them, the solder balls 4 are uniformly separated by the first grid 211 , so that the solder balls 4 are evenly attached to the surface of the chip 3 , that is, a solder ball grid array is formed on the surface of the chip 3 . As mentioned above, in this embodiment, since the mesh holes 212 of the first grid 211 have the same size, the solder balls 4 formed in the first mesh holes also have the same size.

In addition, in this embodiment, when the solder balls and the solder paste are melted at high temperature to form solder balls 4, the solder balls 4 formed at high temperature are evenly distributed on the The surface of the chip 3 solves the problem in the prior art that the solder balls 4 cannot be straightened by their surface tension because some solder balls will not melt, which leads to the offset of the solder balls 4 formed after the solder balls and solder paste are melted at high temperature. The adhesion of the position on the surface of the chip 3 , or even the connection between the two solder balls 4 causes a short circuit and causes the ball grid array package to fail.

To sum up, compared with the prior art, the solder ball planting device of the present utility model evenly drops solder balls in the first grid on the surface of the base through the second grid on the surface of the solder ball dropping part, and can pass through the second grid on the surface of the solder ball dropping part. The solder leak hole formed between the positioning piece and the base will pour out the redundant solder balls falling on the first grid on the surface of the base, and then the positioning piece will position the chip with solder paste on the first grid for The solder balls and solder paste are melted at high temperature to form multiple solder balls with the same shape, and the solder balls are positioned by the first grid so that they are evenly distributed on the surface of the chip to form a solder ball grid array, thereby solving the problem of inability to melt due to solder balls. Relying on the surface tension to straighten the solder balls, the planted solder balls will be shifted, and even short circuit will be caused, and the efficiency of the ball planting method can be improved.

Claims (8)

1. A device for planting solder balls, characterized in that it comprises: a base, the surface of which is provided with a first grid for positioning solder balls and including a plurality of mesh holes; A solder ball drop piece has a hollow recess, a window is opened on the bottom surface of the hollow recess, and a second grid including a plurality of mesh holes is provided in the window for penetrating solder balls into the first grid; and The surface of the positioning member is provided with a positioning area for positioning the chip with the solder paste on the corresponding position on the first grid on which the solder ball falls, so that the solder paste contacts the solder ball. 2 . The solder ball planting device according to claim 1 , wherein the number and size of the meshes of the first grid and the meshes of the second grid are equal. 3 . 3. The solder ball planting device according to claim 1, wherein a plurality of first grids are provided on the surface of the base, a plurality of windows are provided on the bottom surface of the hollow concave part of the solder ball dropping part, and each of the The window is provided with a second grid for penetrating solder balls onto the first grid, and the surface of the positioning member is provided with a plurality of positioning areas. 4 . The solder ball planting device according to claim 1 , wherein a plurality of positioning posts are further provided on the surface of the base. 5. The solder ball planting device according to claim 4, wherein the solder ball dropping part is provided with a plurality of first positioning parts corresponding to the positioning columns provided on the surface of the base, and the positioning part is provided with A plurality of second positioning parts corresponding to the positioning column. 6. The solder ball planting device according to claim 1, wherein the base further has a plurality of fixing columns, and the first grid has a ground corresponding to the fixing columns of the base so as to position the first grid. Set on the fixed part of the base. 7. The solder ball planting device according to claim 6, characterized in that, the solder ball dropping part has a plurality of first fixing parts corresponding to the fixing columns of the base, and the positioning part has a plurality of fixing columns corresponding to the base The second fixing portion corresponding to the fixing column is positioned on the base through the first and second fixing portions to position the solder ball drop piece and the positioning piece. 8 . The solder ball planting device according to claim 1 , characterized in that, the corner edge of the hollow concave portion of the solder ball dropping member is provided with an exhaust portion communicating with the outside. 8 .

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