CN200994224Y - Printed circuit board medium structure - Google Patents
Printed circuit board medium structure Download PDFInfo
- Publication number
- CN200994224Y CN200994224Y CN 200620166145 CN200620166145U CN200994224Y CN 200994224 Y CN200994224 Y CN 200994224Y CN 200620166145 CN200620166145 CN 200620166145 CN 200620166145 U CN200620166145 U CN 200620166145U CN 200994224 Y CN200994224 Y CN 200994224Y
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipation
- circuit board
- printed circuit
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010410 layer Substances 0.000 claims abstract description 84
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 52
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 238000009413 insulation Methods 0.000 claims abstract description 9
- 239000012790 adhesive layer Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 238000007743 anodising Methods 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000002356 single layer Substances 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 description 37
- 230000005855 radiation Effects 0.000 description 25
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 239000003292 glue Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000011469 building brick Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 210000000981 epithelium Anatomy 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 150000001398 aluminium Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000005041 Mylar™ Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- -1 acyl ammonia Chemical compound 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000005297 material degradation process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
本实用新型公开了一种印刷电路板介质结构，其包括至少一导电层、至少一铝质散热层、一绝缘散热层、及一绝缘散热粘合胶层，是利用铝板的散热性、铝板经阳极处理后的绝缘性及铝板的安定性作为单层、多层或增层基板的中间材，各层板间再以具有绝缘性、散热性与粘着性等特性的有机、无机混合型粘合胶作为粘合的介质，可直接藉由现行印刷电路板的制程运用结合而制成，具有解决现行印刷电路板功能性缺点并可提高信赖性。
The utility model discloses a printed circuit board dielectric structure, which includes at least one conductive layer, at least one aluminum heat dissipation layer, an insulating heat dissipation layer, and an insulating heat dissipation adhesive layer. The heat dissipation property of the aluminum plate, the insulation property of the aluminum plate after anodizing, and the stability of the aluminum plate are used as the intermediate material of a single-layer, multi-layer or multi-layer substrate. The organic and inorganic mixed adhesive with the characteristics of insulation, heat dissipation and adhesion is used as the bonding medium between the layers. The structure can be directly manufactured by combining the current printed circuit board manufacturing process, and has the advantages of solving the functional shortcomings of the current printed circuit board and improving the reliability.
Description
Technical field:
The utility model relates to a kind of printed circuit board (PCB) dielectric structure, be the thermal diffusivity that utilizes aluminium sheet, aluminium sheet after anode treatment insulating properties and the stability of aluminium sheet as individual layer, multilayer or increase the intermediate wood of laminar substrate, between each laminate again with organic and inorganic mixed type adhesive glue with characteristics such as insulating properties, thermal diffusivity and adherences as bonding medium, can directly make, have the existing printed circuit board (PCB) functional disadvantage of solution and the raising reliability is arranged by the processing procedure utilization combination of existing printed circuit board (PCB).
Background technology:
Applied aspect of circuit board and field are quite wide at present, electronic building brick in the general electronic products all is inserted in the circuit board, and circuit board is the assembly that meets high power and high heat now, is all strengthening to some extent aspect the circuit board heat radiation, to improve its radiating efficiency high power.
Textural in known circuit board, because electronic building brick quantity and consumed power are low, the heat that electronic building brick produced mostly can conduct out by copper foil layer, directly dissipate in the surrounding air convection current and remove, yet electronic building brick power height of being laid on the circuit board and quantity are many again now, and incident problem is to increase with electric current, and the electrical power that is consumed increases, and produce the problem that amount of localized heat excessively raises, directly or indirectly influence assembly function and reduce.
The major function of printed circuit board (PCB) is: the protection and the combination of structure dress of electronic product are provided; The transmission of power and electric signal; The processing of electronic component thermal source is provided; And electronic building brick is connected with the circuit of whole electronic system.
Wherein the purpose of structure dress promptly is to protect assembly not to be subjected to the influence of external environment, and increases long reliability.Therefore, final purpose is being guaranteed the reliability of assembly, and increases the yield of product under the requirement of least cost.
Although the technology of printed circuit board (PCB) constantly develops, but still the subject under discussion that contains heat-resistingization, high thermal conductivityization etc. develops, thereby for preventing that temperature from rising and then cause that material degradation is the subject under discussion of must discretion facing, recently the thermal endurance macromolecular material of industry develop actively, inanimate matter material-organic polymer composite, metal-organic polymer composite etc. be at the countermeasure of dispelling the heat require develop.
Known technology is made insulating substrate with epoxy resin and glass fabric its surperficial applying Copper Foil is called the FR-4 substrate as conductive layer, is made into single printed circuit board (PCB) to multilayer through interior laminated film, exposure, development, etching, black brown, pressing, boring, plating, outer-layer circuit making, anti-welding green lacquer, modes such as spray tin, moulding and text printout again.
Because base material promotes its functional limited being difficult to the restriction of making flow process, especially limited in response to emphasizing high speed, high heat radiation, high power, high voltage and high frequency or the like application product future.Be to make insulating substrate based on known FR-4 substrate again with epoxy resin and glass fabric, so its heat conductivity with high voltage withstanding insulating properties all far inferior to aluminium sheet with ceramic, and the thermal coefficient of expansion of traditional F R-4 base material is big, meets that heat easily causes the hole wall be full of cracks and the reliability that influences PCB.
The printed circuit board (PCB) dielectric structure of this creation is poor for improving the existing poor radiation and the proof voltage of the single or multiple lift printed circuit board (PCB) (PCB) that epoxy resin and glass fabric do insulation of only using, dimensional stability is poor, etc. problem, the structure-improved that is proposed, wherein utilize the thermal diffusivity of aluminium sheet, insulating properties and the stability of aluminium sheet after anode treatment, the insulating properties of organic-inorganic mixed type adhesive glue, thermal diffusivity and adherence etc., processing procedure utilization be combined into by printed circuit board (PCB), has the existing printed circuit board (PCB) functional disadvantage of solution, and the advantage that improves reliability is arranged, only make the shortcoming of insulating substrate with epoxy resin and glass fabric with the known FR-4 substrate of effective improvement.
The utility model content:
The technical problem that the utility model solved is: at above-mentioned the deficiencies in the prior art, a kind of printed circuit board (PCB) dielectric structure is provided, it is to utilize epoxy resin and glass fabric to do to add aluminium sheet in the single or multiple lift printed circuit board (PCB) of insulation, the thermal diffusivity, aluminium sheet that utilizes aluminium sheet after anode treatment insulating properties and the stability of aluminium sheet as individual layer, multilayer or increase the intermediate wood of laminar substrate.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of printed circuit board (PCB) dielectric structure, it comprises at least one conductive layer, also comprise at least one aluminium matter heat dissipating layer, one insulating radiation layer, and the bonding glue-line of an insulating radiation, this aluminium matter heat dissipating layer has several vias, this insulating radiation layer is the heat dissipating layer of the surface of this aluminium matter heat dissipating layer through the anode treatment gained, the bonding glue-line of this insulating radiation is close to the surface of this aluminium matter heat dissipating layer, this conductive layer is positioned at this aluminium matter heat dissipating layer periphery, and joins by this insulating radiation adhesive-layer and aluminium matter heat dissipating layer.
As described above, the utility model printed circuit board (PCB) dielectric structure, implementation step is as follows, at first aluminium sheet is holed in advance according to required via position, the preboring aperture needs big than the finished product aperture, again aluminium sheet tabulation surface anode is handled and formed the aluminium oxide epithelium as the insulating radiation layer, coat adhesion glue afterwards on the surface of aluminium sheet or place the bonding sheet made from adhesion glue (PREPREG), as the bonding glue-line of the insulating radiation of usefulness bonding between each laminate, solidify adhesion with hot pressing mode at last and finish this novel circuit board of application, if circuit board is multilayer or increases laminate and then repeat aforementioned implementation step to finish multilayer or layer increased circuit board that above step can utilize known printed circuit board (PCB) process apparatus to finish fully.
Compared with prior art, the utlity model has following advantage:
1. multiple heat dissipation insulation protection promotes proof voltage and heat conductivity.
2. use blending together of inorganic and organic material, effectively reduce thermal coefficient of expansion, lower the reliability problem that the hole wall be full of cracks causes.
3. comprehensive anode treatment protection metallic heat radiating plate exempts from processing procedure and environment damage.
4. need not significantly to change processing procedure or change equipment.
5. environmental protection is current, can effectively reduce the not Recyclable of manufacture process, (thickness is that 0.15mm～0.25mm) is the regular size of inner layer of printed-circuit board plate to the used consumptive material Aluminum cover of boring processing procedure, so the recyclable aluminium matter heat dissipating layer that utilizes this case more effectively reduces material cost 20%～40% and reduces generation of waste.
Description of drawings:
Fig. 1 a is the embodiment that the utility model is applied in two layer printed circuit boards;
Fig. 1 b is the sectional side view of Fig. 1 a illustrated embodiment;
Fig. 2 a is the embodiment that the utility model is applied in four layer printed circuit boards;
Fig. 2 b is the sectional side view of Fig. 2 a illustrated embodiment;
Fig. 2 c is the sectional side view of the other direction of Fig. 2 a illustrated embodiment;
Fig. 3 a is that the utility model is applied in the embodiment that increases layer printed circuit board;
Fig. 3 b is the sectional side view of Fig. 3 a illustrated embodiment.
Label declaration:
The bonding glue-line 12 of conductive layer 111,112 insulating radiations
The bonding glue-line 22 of conductive layer 211,212,213,214 insulating radiations
The bonding glue-line 32 of conductive layer 311,312 insulating radiations
Embodiment:
The utility model can fully be understood by following embodiment explanation, makes the people who knows present technique to finish according to this, and right enforcement of the present utility model is not can be limited it by following example to implement kenel.
See also shown in Figure 1ly, be first embodiment of the present utility model, this embodiment is the embodiment that is applied in two layer printed circuit boards.Can see that in this embodiment this printed circuit board (PCB) dielectric structure includes two conductive layers 111,112, it is made of Copper Foil or aluminium foil layer; The bonding glue-line 12 of one insulating radiation, it is not have basic filler with resin and thermal conductivity to mix, it can cooperate product and process requirement to be made into for increasing layer coating the adhesion glue kenel used with filling perforation and the impregnation glass type bonding sheet (PREPREG) of multilayer board press fitting, its adhesion glue composition can be general general with epoxy resin, phenolic resins, poly-inferior acyl ammonia resin, poly-maple ether resin, silicon oxidation resin, iron not dragon and mylar etc. and inorganic filler as SiO
2, Al
2O
3, Al (OH)
3, BN, arbitrary organic-inorganic composite of insulation of tools such as AlN and high-termal conductivity; One insulating radiation layer 13, it is the aluminium oxide epithelium through anode treatment, thickness range is 1 μ m～20 μ m; The aluminium sheet that one heat conduction is used is called above each layer structure such as aluminium matter heat dissipating layer 14 grades and forms.
See also shown in Figure 2ly, be second embodiment of the present utility model, this embodiment is applied in the embodiment of four layer printed circuit boards for this case.Can see that in this embodiment this printed circuit board (PCB) dielectric structure includes four layers of conductive layer 211,212,213 and 214, it is made of Copper Foil or aluminium foil layer; The bonding glue-line 22 of one insulating radiation, it is not have basic filler with resin and thermal conductivity to mix, it can cooperate product and process requirement to be made into for increasing layer coating the adhesion glue kenel used with filling perforation and the impregnation glass type bonding sheet (PREPREG) of multilayer board press fitting, its adhesion glue composition can be general general with epoxy resin, phenolic resins, poly-inferior acyl ammonia resin, poly-maple ether resin, silicon oxidation resin, iron not dragon and mylar etc. and inorganic filler as SiO
2, Al
2O
3, Al (OH)
3, BN, arbitrary organic-inorganic composite of insulation of tools such as AlN and high-termal conductivity; One insulating radiation layer 23, it is the aluminium oxide epithelium through anode treatment, thickness range is 1 μ m～20 μ m; The aluminium sheet that one heat conduction is used is called above each layer structure such as aluminium matter heat dissipating layer 24 grades and forms.
See also shown in Figure 3ly, be the 3rd embodiment of the present utility model, this embodiment increases the embodiment of layer printed circuit board for this case is applied in.Can see in this embodiment that this printed circuit board (PCB) dielectric structure includes increases layer conductive layer 311,312, and it is made of Copper Foil or aluminium foil layer; The bonding glue-line 32 of one insulating radiation, it is to mix with resin and thermal conductivity inorganic filler, it can cooperate product and process requirement to be made into for increasing layer coating the adhesion glue kenel used with filling perforation and the impregnation glass type bonding sheet (PREPREG) of multilayer board press fitting, its adhesion glue composition can be general general with epoxy resin, phenolic resins, poly-inferior acyl ammonia resin, poly-maple ether resin, silicon oxidation resin, iron not dragon and mylar etc. and inorganic filler as SiO
2, Al
2O
3, Al (OH)
3, BN, arbitrary organic-inorganic composite of insulation of tools such as AlN and high-termal conductivity; One insulating radiation layer 33, it is the aluminium oxide epithelium through anode treatment, thickness range is 1 μ m～20 μ m; The aluminium sheet that one heat conduction is used is called above each layer structure such as aluminium matter heat dissipating layer 34 grades and forms.
This printed circuit board (PCB) dielectric structure, implementation step is as follows, at first aluminium sheet (aluminium matter heat dissipating layer 34) is holed in advance according to required via position, the preboring aperture needs big than the finished product aperture, again aluminium sheet (aluminium matter heat dissipating layer 34) tabulation surface anode is handled and formed the aluminium oxide epithelium as insulating radiation layer 33, coat adhesion glue on the surface of aluminium sheet (aluminium matter heat dissipating layer 34) more afterwards or place the bonding glue-line 32 of insulating radiation of the bonding sheet (PREPREG) made with adhesion glue bonding usefulness between as each laminate, solidify adhesion with hot pressing mode at last and finish the circuit board of using this novel printed circuit board dielectric structure.
In addition, circuit board is multilayer or increases laminate and then repeat aforementioned implementation step to finish multilayer or layer increased circuit board that above step can utilize known printed circuit board (PCB) process apparatus to finish fully.
As mentioned above, when electronic building brick is installed in conductive layer 311,312 on the printed circuit board (PCB) dielectric structure of the present utility model, heat energy can be by the bonding glue-line 32 of insulating radiation as heat conducting medium, with thermal energy conduction to aluminium matter heat dissipating layer 34, heat energy is absorbed and can sees through aluminium sheet average mark source of heat release, and reaches the purpose of quick heat radiating.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620166145 CN200994224Y (en) | 2006-12-15 | 2006-12-15 | Printed circuit board medium structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620166145 CN200994224Y (en) | 2006-12-15 | 2006-12-15 | Printed circuit board medium structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200994224Y true CN200994224Y (en) | 2007-12-19 |
Family
ID=38947295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620166145 Expired - Fee Related CN200994224Y (en) | 2006-12-15 | 2006-12-15 | Printed circuit board medium structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200994224Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN103582289A (en) * | 2012-08-08 | 2014-02-12 | 三星电机株式会社 | Metal heat radiation substrate and manufacturing method thereof |
| CN107622986A (en) * | 2017-10-11 | 2018-01-23 | 扬州虹扬科技发展有限公司 | The encapsulating structure and method for packing for the rectifier bridge that a kind of high heat conduction, high withstand voltage insulate |
-
2006
- 2006-12-15 CN CN 200620166145 patent/CN200994224Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582289A (en) * | 2012-08-08 | 2014-02-12 | 三星电机株式会社 | Metal heat radiation substrate and manufacturing method thereof |
| CN103037670A (en) * | 2012-12-07 | 2013-04-10 | 陕西千山航空电子有限责任公司 | Heat radiating process method for printed-circuit board |
| CN107622986A (en) * | 2017-10-11 | 2018-01-23 | 扬州虹扬科技发展有限公司 | The encapsulating structure and method for packing for the rectifier bridge that a kind of high heat conduction, high withstand voltage insulate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: CO-PATENTEE TO: LV XINXIONG JIAN TAIWEN CHEN JIEXIU ^ |
|
| CU01 | Correction of utility model |
Correction item: Co-patentee Correct: Lv Xinxiong|Jian Taiwen|Chen Jiexiu Number: 51 Page: The title page Volume: 23 |
|
| CU03 | Publication of corrected utility model |
Correction item: Co-patentee Correct: Lv Xinxiong|Jian Taiwen|Chen Jiexiu Number: 51 Volume: 23 |
|
| ERR | Gazette correction |
Free format text: CORRECT: CO-PATENTEE; FROM: NONE ^ TO: LV XINXIONG JIAN TAIWEN CHEN JIEXIU ^ |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071219 Termination date: 20121215 |