CN200979680Y - Computer case cooling structure - Google Patents

Abstract

A heat dissipation structure of a computer case with a ventilation channel, wherein the structure is based on a case, wherein a first partition and a second partition are provided on the case, and the first partition has a recessed space, wherein the first partition is provided with a plurality of through slots, and furthermore, the second partition is provided with a plurality of air inlets, and the positions of the air inlets and the through slots of the first partition are staggered with each other, and finally, at least one fan is provided on the back and the top of the case respectively, whereby the outside air enters the recessed space through the plurality of air inlets, and then is drawn into the case by the fan on the first partition for air cooling and heat dissipation, and finally is drawn out of the case through the fans on the top and the back of the case, so that in addition to achieving the heat dissipation effect, it also has the advantage of being silent.

Description

Computer case cooling structure

technical field

The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure arranged on a computer case.

Background technique

Due to the continuous lightening of electronic products, coupled with the influence of new materials and technological advancements, the heat generated by electronic components during operation is considerable. The demand for heat dissipation is also increasing day by day, so how to ensure the normal operation of electronic components, the heat dissipation performance has become a considerable key.

Especially inside the host computer, because the host computer is composed of many different electronic components assembled in the same case, including the main board, power supply and hard disk, etc., the above-mentioned components will generate a large amount of heat during operation, so the existing The most common method of technology is to install the fan directly on the heat-generating electronic components, and the air around the electronic components will flow rapidly through the rotation of the fan blades, and at the same time, the heat source generated by the electronic components will be taken away to achieve heat dissipation of the electronic components. effect.

Although the fan is a simple and fast cooling device for the inside of the computer case, generally speaking, the heat dissipation effect of the fan only exists on the surface in contact with the electronic components, and in addition, multiple cooling fans inside the computer case work at the same time. However, the internal space of the computer case is narrow, and the heat source cannot be effectively discharged outside, resulting in a temperature rise effect inside the case. Under the vicious cycle of heat source accumulation, the temperature inside the case cannot be kept within the normal range, which affects the entire computer. The operation of the host computer.

In order to solve the above-mentioned problem of the internal temperature rise of the case, the later prior art adopts the installation of fans at the bottom and back of the case, and utilizes the principle of rising hot air, except that the rotation of the bottom fan introduces external cold air into the case. Heat exchange is generated, and at the same time, the internal hot air is drawn outwards through the fan on the back to reduce the temperature rise inside the chassis.

However, although the above-mentioned method helps to reduce the temperature inside the computer case, the temperature is controlled in a normal range to ensure the operation of the main computer, but because the fan arranged at the bottom of the case is hindered by its position design, the air intake of the fan The efficiency is not good, and it is impossible to generate a large amount of air flow into the inside of the chassis to produce air cooling and heat dissipation. In addition, the fan located at the bottom of the chassis is likely to directly extract the outside air during operation and generate a lot of noise. It is also easy to cause The strong vibration of the case causes unstable operation of the electronic components inside the case, all of which are unsatisfactory in the heat dissipation design.

Contents of the invention

The purpose of this utility model is to provide a computer case heat dissipation structure with an air flow channel. By setting a double-layer air intake structure on the computer case and cooperating with the fan function on the case, in addition to quickly introducing the outside air into the case In addition to the internal heat dissipation, it can also reduce the noise generated by the fan.

In order to achieve the above-mentioned purpose, the utility model provides a cooling structure for a computer case. On the inner side of the second partition, there is an inwardly recessed recessed space on the first partition, and at least one penetration groove is provided on the first partition, and on the second partition At least one air inlet is arranged on the top, and at least one fan is arranged on the case surface of the case. In this way, after the outside air enters the recessed space through multiple air inlets, it is drawn into the inside of the chassis by the fan on the first partition for air cooling and heat dissipation, and finally is drawn out of the chassis by the fans on the top and back of the chassis, in addition to achieving heat dissipation. In addition to the function, it has the advantage of being quiet.

Description of drawings

Fig. 1 is the exploded schematic view of the three-dimensional structure of the utility model;

Fig. 2 is the three-dimensional structural combination drawing of the present utility model;

Fig. 3 is a schematic sectional view of the operation of the utility model;

Fig. 4 is the structural representation of another embodiment of the utility model;

Fig. 5 is a structural schematic diagram of another embodiment of the present invention.

Explanation of reference numerals: chassis 1; first partition 11; recessed space 111; penetration slot 112; second partition 12; air inlet 121;

Detailed ways

Please refer to Fig. 1 and Fig. 2, which are respectively a three-dimensional structure exploded schematic diagram and a three-dimensional combination diagram of the present utility model. It can be seen that the heat dissipation structure of the computer case is based on the computer case 1, and the bottom of the case 1 has a first A partition 11 and a second partition 12, wherein the first partition 11 has an inwardly recessed recessed space 111, and at least one penetrating groove 112 is provided on the surface of the first partition 11. In the embodiment, there are two, and one of the penetrating grooves 112 corresponds to the bottom of the power supply unit 20, and the second partition 12 is located below the first partition 11 and is connected to the bottom of the chassis 1, and at the same time At least one air inlet 121 is provided on the second partition 12, in this embodiment there are two, and the position of the air inlet 121 is staggered from the penetration groove 112 on the first partition 11. In addition, the The second partition 12 is further connected with a slide plate 13, the slide 13 is provided with at least one filter screen 131, two in this embodiment, and the position of the filter screen 131 corresponds to the position of the second partition 12. The air inlet 121 is used to prevent foreign matter from entering the chassis 1; in addition, at least one fan 2 is provided on the top panel of the chassis 1, two of them in this embodiment, and on the back panel of the chassis 1 There is also at least one fan 2 on the top; the complete picture of the combination is shown in FIG. 2 .

Please refer to Fig. 3, which is a schematic cross-sectional view of the operation of the present utility model. It can be seen that after the second partition 12 is assembled on the bottom of the cabinet 1, the cabinet 1 is lifted up and formed on the first partition 11 at the same time. The recessed space 111 forms a substantial flow channel under the clamping of the first partition 11 and the second partition 12, when the outside air naturally flows in through the air inlet 121 of the second partition 12 (the direction of the arrow is the direction of air flow ), while passing through the filter screen 131 and entering into the recessed space 111, and the fan 2 on the top and back of the cabinet 1 generates forced air flow inside the cabinet 1 through the operation of its fan blades, and at the same time Drive the air flowing in the recessed space 111 into the chassis 1 through the penetration groove 112 on the first partition 11, and exchange heat with the action heat generated by the multiple electronic components installed inside the chassis 1, and finally The air that has absorbed heat is exhausted to the outside of the chassis 1 through the fans 2 provided on the top and back of the chassis 1 to increase the heat dissipation inside the chassis 1 .

Please refer to Fig. 4, which is another embodiment of the present utility model. It can be seen that the penetration groove 112 provided by the first partition 11 on the cabinet 1 can also be equipped with a fan 2 (one is shown in this icon) , through the action of the fan 2 arranged on the first partition 11, the air entering the recessed space 111 from the air inlet 121 of the second partition 12 is subjected to the forced convection generated by the fan 2, and the air enters the inside of the chassis 1 and is connected with the The heat generated inside is exchanged, and finally the air that has absorbed the heat is drawn out of the inside of the case 1 by the fan 2 arranged on the top and back of the case 1. In this way, in addition to providing the inside of the entire computer case 1 In addition to the effect of air cooling and heat dissipation, through the design of the recessed space 111, the fan 2 arranged on the penetration groove 112 can reduce the sound generated by the air directly hitting the fan 2 while drawing air, so as to achieve a quiet effect Effect.

Please refer to Fig. 5, which is another embodiment of the present utility model, the above-mentioned first partition 11 and the second partition 12 are arranged outside the bottom position of the chassis 1, and as shown in this embodiment, the first The partition 11 and the second partition 12 are arranged on both sides of the cabinet 1; as shown in the figure, there is a recessed space 111 on the first partition 11, and the first partition 11 is close to the bottom edge. Open at least one penetration groove 112 on the position, two in the present embodiment, install fan 2 respectively on two penetration grooves 112 simultaneously; Connected with the chassis 1, at least one air inlet 121 is provided on the second partition 12 near the bottom edge, in this embodiment, there are two, and the position of the air inlet 121 is the same as that of the first partition 11. The positions of the penetration slots 112 are staggered from each other. In addition, the air inlet 121 is provided with a filter screen 3 to prevent foreign matter from entering the inside of the chassis 1; finally, at least one fan 2 is provided on the top and back of the chassis 1. In the embodiment, two fans 2 are arranged on the top, and one fan 2 is arranged on the back; thereby, when the outside air enters the recessed space 111 formed by the first partition 11 from the air inlet 121 through natural convection, the recessed space 111 is formed. The space 111 forms a substantial air flow channel, and then the forced convection generated by the fan 2 on the first partition 12 allows the air to enter the interior of the chassis 1 and perform air cooling with the multiple electronic components inside the chassis 1 Finally, through the forced convection of the fans 2 on the top and back of the chassis 1, the air that has absorbed the heat source is drawn out of the chassis 1 to achieve the cooling efficiency inside the chassis 1.

The above-mentioned implementation mode is a preferred implementation example, and should not limit the implementation scope of the present utility model. If the equivalent changes or modifications made according to the claims of the utility model and the contents of the description, all should fall under the scope of the utility model. The scope covered by the above-mentioned patents.

Claims (14)

1. A computer case heat dissipation structure, in order to provide the heat dissipation of the electronic components inside the case, it is characterized in that, comprising: The chassis has a first partition and a second partition, the first partition is located inside the second partition, and there is an inwardly recessed recessed space on the first partition , and at least one penetration slot is provided on the first partition, at least one air inlet is provided on the second partition, and at least one fan is provided on the case surface of the case. 2. The heat dissipation structure of the computer case as claimed in claim 1, wherein the first partition and the second partition are located at the bottom of the case. 3. The computer case heat dissipation structure according to claim 1 or 2, wherein a slide plate is further provided on the second partition, and at least one filter screen is provided on the slide plate, and the position of the filter screen corresponds to the position of the inlet tuyere. 4. The cooling structure for a computer case according to claim 1 or 2, wherein the penetration slots on the first partition are offset from the air inlets on the second partition. 5. The heat dissipation structure of a computer case as claimed in claim 1 or 2, wherein a power supply unit is provided inside the case, and a plurality of penetrating slots are provided on the first partition, wherein the position of one penetrating slot corresponds to the bottom of the power supply unit described above. 6. The cooling structure for a computer case according to claim 1 or 2, wherein fans are respectively provided in the penetration slots. 7. The heat dissipation structure of the computer case according to claim 5, wherein the plurality of penetration slots are respectively provided with fans. 8. The heat dissipation structure of a computer case as claimed in claim 1, wherein the first partition and the second partition are located at a side of the case. 9. The heat dissipation structure of a computer case according to claim 1 or 8, wherein the penetration groove of the first partition and the air inlet of the second partition are provided at the bottom of the side. 10 . The heat dissipation structure of the computer case according to claim 8 , wherein the positions of the penetration slots of the first partition and the air inlets of the second partition are offset from each other. 11 . 11. The heat dissipation structure of the computer case according to claim 8, wherein the penetrating slot on the first partition is provided with a fan. 12. The heat dissipation structure of the computer case according to claim 1 or 8, wherein the air inlet of the second partition is provided with a filter screen. 13. The cooling structure of the computer case according to claim 1, wherein the case has a plurality of fans, and the fans are respectively arranged on the top and the back of the case. 14. The heat dissipation structure of the computer case according to claim 13, wherein the penetration slot on the first partition is provided with a fan.

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