CN200940818Y - LED lamps with high heat dissipation - Google Patents

Abstract

An LED lamp with high heat dissipation includes: a metal heat conducting cover which is hollow and is provided with an opening; a heat dissipation module set in the metal heat conduction cover; a base plate, which is arranged on the heat radiation module; at least one LED arranged on the substrate and positioned in the metal heat conducting cover; the heat generated by the LED is transferred to the substrate, the heat dissipation module and the metal heat conduction cover in sequence and finally dissipated by heat exchange with air. The utility model discloses the heat that produces when the emitting diode in the lamps and lanterns functions can be dispelled to the external world rapidly, can avoid emitting diode to burn out because of the high fever.

Description

LED lamps with high heat dissipation

technical field

The utility model relates to a lamp, in particular to a light-emitting diode lamp with high heat dissipation, which can quickly dissipate the heat generated by a light-emitting diode in the lamp to the outside.

Background technique

Light Emitting Diode (LED) has the advantages of high efficiency, energy saving, small size and environmental protection. Traditional LEDs are widely used in consumer electronics such as indicators, mobile phones, and PDAs, and only generate a small amount of heat during operation. The heat can be quickly dissipated through heat exchange between the electronic product itself and the external environment. Therefore, traditional LEDs have no The problem of poor heat dissipation.

However, LED itself has many advantages such as energy saving, power saving and environmental protection, so that LED develops in the direction of high brightness and high power, so as to prepare to replace incandescent lamps and fluorescent lamps in the future and become the main light source of the next generation. Therefore, how to solve the problems caused by LEDs? With the development of high brightness and high power LED, the problem of high heat is becoming more and more important.

Utility model content

The main technical problem to be solved by the utility model is to overcome the problem of poor heat dissipation of the existing high-power light-emitting diodes, and provide a light-emitting diode lamp with high heat dissipation. The heat generated by the light-emitting diodes in the lamp can be quickly Dissipate to the outside world.

The technical scheme that the utility model solves its technical problem adopts is:

A light-emitting diode lamp with high heat dissipation is characterized in that it includes: a metal heat conduction cover, which is hollow, and an opening is formed on it; a heat dissipation module is arranged in the metal heat conduction cover; The substrate is arranged on the heat dissipation module; at least one light-emitting diode is arranged on the substrate and located in the metal heat conduction cover; wherein, the heat generated by the light-emitting diode is transferred to the substrate, heat dissipation module and A metal heat shield, which eventually dissipates through heat exchange with the air.

In the aforementioned light-emitting diode lamp with high heat dissipation, a relatively open heat dissipation hole is formed through the metal heat conduction cover.

In the above-mentioned light-emitting diode lamp with high heat dissipation, the heat dissipation module includes a heat dissipation plate and a plurality of fins, the outer periphery of the heat dissipation plate is fixed on the inner wall of the metal heat conduction cover, and the fins are fixed on the inner surface of the heat dissipation plate, And protrude radially from the center of the inner surface and arrange in a radial shape as a whole.

In the above-mentioned light-emitting diode lamp with high heat dissipation, a fixed plate opposite to the heat dissipation plate is fixed on the plurality of fins.

In the aforesaid high heat dissipation LED lamp, the outer periphery of the heat dissipation plate is formed with a plurality of contact portions flat against the inner wall of the metal heat conduction cover.

In the LED lamp with high heat dissipation, the heat dissipation module further includes a plurality of heat conduction media, and each heat conduction medium is arranged between each contact portion and the metal heat conduction cover to fill the gap between each contact portion and the metal heat conduction cover.

In the aforementioned light-emitting diode lamp with high heat dissipation, the heat dissipation plate, the fins and the fixing plate of the heat dissipation module are made of metal.

By means of the above-mentioned technical means, the heat dissipation module and the metal heat conduction cover can quickly take away the heat of the LED when the LED is in operation, preventing the LED from being damaged due to high temperature.

The beneficial effect of the utility model is that the heat generated by the light-emitting diodes in the lamp can be rapidly dissipated to the outside.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1 is a three-dimensional appearance schematic diagram of the utility model.

Fig. 2 is a three-dimensional exploded schematic diagram of the utility model.

Fig. 3 is a partial cross-sectional side view of the utility model.

Explanation of symbols in the figure:

10 metal heat conduction cover 11 opening

12 cooling holes 20 cooling modules

21 cooling plate 211 contact part

22 heat conduction medium 23 fins

24 fixed plate 30 base plate

31 transmission line 40 light emitting diode

Detailed ways

Please refer to FIG. 1 , the light-emitting diode lamp with high heat dissipation of the present invention includes: a metal heat-conducting cover 10 , a heat-dissipating module 20 , a substrate 30 and at least one light-emitting diode 40 .

Please refer to FIG. 2 and FIG. 3 , the metal heat conduction cover 10 is hollow, and an opening 11 and a through heat dissipation hole 12 opposite to the opening are formed thereon.

The heat dissipation module 20 is arranged in the metal heat conduction cover 10, and includes a heat dissipation plate 21, a plurality of heat conduction media 22, a plurality of fins 23 and a fixing plate 24; the heat dissipation plate 21 can be made of metal, and its outer periphery is fixed On the inner wall of the metal heat conduction cover 10, and on the outer peripheral edge, there are a plurality of contact parts 211 flatly attached to the inner wall of the metal heat conduction cover 10, wherein several contact parts 211 are fixed with the metal heat conduction cover 10 through bolts; each heat transfer medium 22 They are respectively fixed between each contact portion 211 and the metal heat conduction cover 10 to fill the gap between each contact portion 211 and the metal heat conduction cover 10, so that the heat on the heat dissipation module 20 can be quickly transferred to the metal heat dissipation cover 10. The heat conduction medium 22 can be a heat conduction paste containing silver; the fins 23 can be made of metal, fixed on the inner surface of the heat dissipation plate 21, and protrude radially from the center of the inner surface respectively to form a radial shape as a whole Arrangement; the fixing plate 24 can be made of metal, fixed with all the fins 24 and opposite to the cooling plate 21 .

The substrate 30 is disposed on the heat dissipation module 20 , and may be provided with lines, and a plurality of transmission lines 31 are extended on the lines for connecting with an external power source.

The light emitting diode 40 is disposed on the substrate 30 and located on the metal heat conduction cover 10 , and is connected to the circuit of the substrate 30 .

When the light-emitting diode 40 is in operation, the heat generated is transmitted to the substrate 30, the heat dissipation module 20 and the metal heat conduction cover 10 in sequence, and finally dissipates through heat exchange with the air, and the heat dissipation holes 12 of the metal heat conduction cover 10 can also provide The hot air inside the metal heat conduction cover 10 is naturally convected with the outside air, so as to avoid the accumulation of internal high heat.

By means of the above-mentioned technical means, the heat dissipation module 20 and the metal heat conduction cover 10 can quickly take away the heat of the LED 40 when the LED 40 is in operation, so as to prevent the LED 40 from being damaged due to high temperature.

Claims (7)

1. the led lamp of a tool high-cooling property is characterized in that, includes:

One metal heat-conducting cover is to be hollow form, and is formed with an opening on it;

One heat radiation module is arranged in this metal heat-conducting cover;

One substrate is to be arranged on this heat radiation module;

At least one light emitting diode is arranged on this substrate and is positioned at the metal heat-conducting cover.

2. according to the led lamp of the described tool high-cooling property of claim 1, it is characterized in that running through on the described metal heat-conducting cover louvre that is formed with a relative opening.

3. according to the led lamp of the described tool high-cooling property of claim 2, it is characterized in that described heat radiation module includes a heat sink and plural fin, the outer peripheral edges of this heat sink are fixedly arranged on metal heat-conducting cover inwall, these fins are to be fixedly arranged on the heat sink medial surface, and the radially projection and integral body is a radial arrangement from the center of this medial surface respectively.

4. according to the led lamp of the described tool high-cooling property of claim 3, it is characterized in that being installed with on the described plural fin one with the heat sink plate that is relatively fixed.

5. according to the led lamp of claim 3 or 4 described tool high-cooling properties, it is characterized in that described heat sink outer peripheral edges are formed with plural number and the smooth contact site of metal heat-conducting cover inwall.

6. according to the led lamp of the described tool high-cooling property of claim 5, it is characterized in that described heat radiation module further includes plural heat-conducting medium, each heat-conducting medium is arranged between each contact site and the metal heat-conducting cover to remedy slit between each contact site and metal heat-conducting cover.

7. according to the led lamp of the described tool high-cooling property of claim 6, it is characterized in that heat sink, fin and the fixed head of described heat radiation module made with metal.

Images