CN200944728Y - Screening arrangement and electronic product using the same - Google Patents
Screening arrangement and electronic product using the same Download PDFInfo
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- CN200944728Y CN200944728Y CN 200620017754 CN200620017754U CN200944728Y CN 200944728 Y CN200944728 Y CN 200944728Y CN 200620017754 CN200620017754 CN 200620017754 CN 200620017754 U CN200620017754 U CN 200620017754U CN 200944728 Y CN200944728 Y CN 200944728Y
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Abstract
一种屏蔽装置,包括一个屏蔽壳体、一个屏蔽架、一个第一导电体及一个支撑架。屏蔽壳体包括一个外表面、多个挡止部及多个定位部,所述挡止部与所述定位部分别凸露于所述外表面。屏蔽架安装于所述屏蔽壳体的前端,并包括一个本体、多个弹片和多个收容孔,所述弹片分别凸露于所述本体的内表面,所述收容孔贯穿所述本体并收容所述定位部。第一导电体安装于屏蔽架的外侧。支撑架安装于所述屏蔽壳体的前端并抵靠所述屏蔽架。支撑架包括多个支撑部及一个支撑体,所述支撑部从所述支撑体弯折而成,所述屏蔽壳体的挡止部抵靠其中一支撑部,所述支撑部用于支撑所述第一导电体。因第一导电体使屏蔽装置与机箱前板之间无缝隙,从而能有效屏蔽电磁干扰。
A shielding device includes a shielding shell, a shielding frame, a first conductor and a supporting frame. The shielding shell includes an outer surface, a plurality of stopping parts and a plurality of positioning parts, and the stopping parts and the positioning parts respectively protrude from the outer surface. The shielding frame is installed on the front end of the shielding shell, and includes a body, a plurality of elastic pieces and a plurality of receiving holes, the elastic pieces respectively protrude from the inner surface of the body, and the receiving holes penetrate the body and accommodate The positioning part. The first conductor is installed on the outside of the shield frame. The supporting frame is installed on the front end of the shielding shell and leans against the shielding frame. The support frame includes a plurality of support parts and a support body, the support part is bent from the support body, the stop part of the shielding shell is against one of the support parts, and the support part is used to support the the first conductor. Due to the first conductor, there is no gap between the shielding device and the front plate of the chassis, thereby effectively shielding electromagnetic interference.
Description
技术领域technical field
本实用新型涉及一种屏蔽装置,特别涉及一种能有效屏蔽电磁干扰的屏蔽装置。The utility model relates to a shielding device, in particular to a shielding device capable of effectively shielding electromagnetic interference.
背景技术Background technique
在光通信系统中,收发模组提供电界面与光数据链路间的双向数据传输。收发模组可接收电信号,并将其转换为相应的光信号后在光网络中传输;同时收发模组也可接收光信号,并将其转换为电信号后传输到电界面。In the optical communication system, the transceiver module provides bidirectional data transmission between the electrical interface and the optical data link. The transceiver module can receive electrical signals, convert them into corresponding optical signals and transmit them in the optical network; at the same time, the transceiver module can also receive optical signals, convert them into electrical signals and transmit them to the electrical interface.
在现有技术中,收发模组安装在主机、输入/输出系统、外围设备或交换机的印刷电路板上。收发模组插接于一个安装在印刷电路板上的金属壳体中,所述金属壳体一般包括两平行侧壁、矩形顶板、矩形底板、前端及后端,其易于相互连接,且容易安装于印刷电路板上,用于消除静电积累并作为电磁屏蔽壳体。收发模组壳体先与印刷电路板结合后,再将结合后的整体安装于机箱内,并且收发模组壳体的前端插入至机箱前板的开口中。此种收发模组壳体虽然可屏蔽掉大部分的电磁干扰,但其前端开口、其前端与机箱前板之间及其后端与电路板之间仍会泄漏少量电磁波,以致不能有效屏蔽电磁干扰。In the prior art, the transceiver module is installed on the printed circuit board of the host computer, input/output system, peripheral device or switch. The transceiver module is plugged into a metal shell mounted on a printed circuit board. The metal shell generally includes two parallel side walls, a rectangular top plate, a rectangular bottom plate, a front end and a rear end, which are easy to connect to each other and easy to install On printed circuit boards, used to eliminate static electricity accumulation and as an electromagnetic shielding case. After the transceiver module casing is combined with the printed circuit board, the combined whole is installed in the chassis, and the front end of the transceiver module casing is inserted into the opening of the front panel of the chassis. Although this kind of transceiver module housing can shield most of the electromagnetic interference, a small amount of electromagnetic waves will still leak from the front opening, between the front end and the front panel of the chassis, and between the rear end and the circuit board, so that it cannot effectively shield electromagnetic waves. interference.
实用新型内容Utility model content
为解决上述现有技术存在的不足,有必要提供一种能有效屏蔽电磁干扰的屏蔽装置。In order to solve the above-mentioned deficiencies in the prior art, it is necessary to provide a shielding device capable of effectively shielding electromagnetic interference.
另需提供一种具有上述屏蔽装置的电子产品。It is also necessary to provide an electronic product with the above-mentioned shielding device.
一种屏蔽装置,包括一个屏蔽壳体、一个屏蔽架、一个第一导电体及一个支撑架。屏蔽壳体包括一个外表面、多个挡止部及多个定位部,所述挡止部与所述定位部分别凸露于所述外表面。屏蔽架安装于所述屏蔽壳体的前端,并包括一个本体、多个弹片和多个收容孔,所述弹片分别凸露于所述本体的内表面,所述收容孔贯穿所述本体并收容所述定位部。第一导电体安装于屏蔽架的外侧。支撑架安装于所述屏蔽壳体的前端并抵靠所述屏蔽架。支撑架包括多个支撑部及一个支撑体,所述支撑部从所述支撑体弯折而成,所述屏蔽壳体的挡止部抵靠其中一支撑部,所述支撑部用于支撑所述第一导电体。A shielding device includes a shielding shell, a shielding frame, a first conductor and a supporting frame. The shielding shell includes an outer surface, a plurality of stopping parts and a plurality of positioning parts, and the stopping parts and the positioning parts respectively protrude from the outer surface. The shielding frame is installed on the front end of the shielding shell, and includes a body, a plurality of elastic pieces and a plurality of receiving holes, the elastic pieces respectively protrude from the inner surface of the body, and the receiving holes penetrate the body and accommodate The positioning part. The first conductor is installed on the outside of the shield frame. The supporting frame is installed on the front end of the shielding shell and leans against the shielding frame. The support frame includes a plurality of support parts and a support body, the support part is bent from the support body, the stop part of the shielding shell is against one of the support parts, and the support part is used to support the the first conductor.
一种电子产品,包括一电路板、一屏蔽装置及一机箱。机箱包括一前板,屏蔽装置的前端装于所述前板。屏蔽装置包括一个安装于电路板上的屏蔽壳体、一个屏蔽架及一个支撑架、一个第一导电体及一第二导电体。第一导电体安装于屏蔽架的外侧。第二导电体安装于所述屏蔽壳体的后端并抵靠所述后壁和所述侧壁。屏蔽壳体包括一个外表面、多个挡止部及多个定位部,所述挡止部与所述定位部分别凸露于所述外表面。屏蔽架安装于所述屏蔽壳体的前端,并包括一个本体、多个弹片和多个收容孔,所述弹片分别凸露于所述本体的内表面,所述收容孔贯穿所述本体并收容所述定位部。支撑架安装于所述屏蔽壳体的前端并抵靠所述屏蔽架。支撑架包括多个支撑部及一个支撑体,所述支撑部从所述支撑体弯折而成,所述屏蔽壳体的挡止部抵靠其中一支撑部,所述支撑部用于支撑所述第一导电体。An electronic product includes a circuit board, a shielding device and a case. The case includes a front panel on which the front end of the shielding device is mounted. The shielding device includes a shielding casing installed on the circuit board, a shielding frame and a supporting frame, a first conductor and a second conductor. The first conductor is installed on the outside of the shield frame. The second conductor is installed at the rear end of the shielding case and abuts against the rear wall and the side wall. The shielding shell includes an outer surface, a plurality of stopping parts and a plurality of positioning parts, and the stopping parts and the positioning parts respectively protrude from the outer surface. The shielding frame is installed on the front end of the shielding shell, and includes a body, a plurality of elastic pieces and a plurality of receiving holes, the elastic pieces respectively protrude from the inner surface of the body, and the receiving holes penetrate the body and accommodate The positioning part. The supporting frame is installed on the front end of the shielding shell and leans against the shielding frame. The support frame includes a plurality of support parts and a support body, the support part is bent from the support body, the stop part of the shielding shell is against one of the support parts, and the support part is used to support the the first conductor.
因屏蔽装置包括第一导电体,当屏蔽装置安装到机箱前板时,屏蔽装置与前板之间就不会有缝隙,从而机箱外的其它电子组件产生的电磁波不会干扰机箱内的电子组件。同时,机箱内的电子组件产生的电磁波也不会干扰机箱外的电子组件。Because the shielding device includes a first conductor, when the shielding device is installed on the front panel of the case, there will be no gap between the shielding device and the front board, so that electromagnetic waves generated by other electronic components outside the case will not interfere with the electronic components inside the case . At the same time, the electromagnetic waves generated by the electronic components inside the case will not interfere with the electronic components outside the case.
附图说明Description of drawings
下面参照附图结合实施例对本实用新型作进一步的描述。The utility model will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
图1是本实用新型实施方式中屏蔽装置的立体分解图。Fig. 1 is a three-dimensional exploded view of a shielding device in an embodiment of the present invention.
图2是图1中屏蔽壳体的立体仰视图。Fig. 2 is a three-dimensional bottom view of the shielding case in Fig. 1 .
图3是图1中屏蔽壳体、第一导电体及支撑架的立体组装图。FIG. 3 is a three-dimensional assembly view of the shielding shell, the first conductor and the support frame in FIG. 1 .
图4是本实用新型实施方式中屏蔽装置组装到电路板上的立体组装图。Fig. 4 is a three-dimensional assembly view of the shielding device assembled on the circuit board in the embodiment of the present invention.
图5是图4中的组装体组装到机箱前板的立体组装图。FIG. 5 is a perspective assembly view of the assembly in FIG. 4 assembled to the front panel of the chassis.
具体实施方式Detailed ways
请参照图1和图4,揭示了本新型实施方式的屏蔽装置100。屏蔽装置100安装于一电路板200上,包括一个屏蔽架10、一个第一导电体20、一个支撑架30、一个屏蔽壳体40及一个第二导电体50。Referring to FIG. 1 and FIG. 4 , a
请同时参照图2,屏蔽壳体40为磷青铜或其它金属材质,其大致为一个中空长方体。屏蔽壳体40包括一个顶壁42、一对相互平行并与顶壁42垂直相连的侧壁44、一与顶壁42及所述侧壁44垂直相连的后壁46及一与顶壁42平行并与所述侧壁44垂直相连的底壁48。顶壁42、侧壁44、后壁46及底壁48共同围成一个收容空间400,所述收容空间400用于收容收发模组(未图示)。所述侧壁44的底部分别向电路板200方向延伸多个插脚442,所述插脚442用于将屏蔽壳体40安装于电路板200。在底壁48的后部开设一个开口480,所述开口480与收容空间400连通。安装于电路板200的电连接器(未图示)透过所述开口480与收发模组电性连接。底壁48还包括一个舌片482及一对定位部484,舌片482形成于底壁48的前端中间,定位部484位于舌片482的两侧。Please refer to FIG. 2 at the same time, the
所述屏蔽壳体40还包括一个外表面49、一与外表面49相对的内表面47、多个挡止部424和多个固持部45,所述挡止部424和固持部45分别由内表面47向外表面49冲压而成。挡止部424和固持部45相隔一定的距离且均位于屏蔽壳体40的前端,同时固持部45靠近屏蔽壳体40的前端开口。所述挡止部424位于所述顶壁42,所述固持部45分别位于所述顶壁42、所述侧壁44及所述底壁48,所述挡止部424与所述固持部45凸出的方向相反。The
屏蔽架10为不锈刚或其它金属材质,其安装于屏蔽壳体40的前端。所述屏蔽架10包括一个本体12、多个弹片14及多个收容孔16,所述弹片14分别凸露于所述本体12的内表面。所述收容孔16贯穿所述本体12。所述本体12包括一个顶部122、一对侧部124、一对底部126及一个缺口128,所述侧部124连接所述顶部122及所述底部126。所述缺口128形成于两底部126之间。缺口128的宽度略大于屏蔽壳体40的舌片482的宽度。The
第一导电体20大致为一个中空的长方体,其可套于屏蔽架10的外侧。在本实施方式中,第一导电体20为导电泡棉,且一个表面有导电粘贴剂。第一导电体20包括一个凹陷部22和四个侧壁,所述凹陷部22位于其中一个侧壁的中间。The
支撑架30用于支撑第一导电体20,其安装于屏蔽壳体40的外侧。支撑架30包括一个支撑体32、多个支撑部34及多个焊接部36。支撑体32包括一连接部322、一对相互平行的挟持部324、一对接触部326及一个开口328,挟持部324连接连接部322和接触部326。开口328形成于两接触部326之间,开口328的宽度略大于屏蔽壳体40的舌片482的宽度。所述支撑部34分别从所述连接部322、所述挟持部324及所述接触部326的中间的内表面向外表面垂直弯折而成,并在所述接触部326的两端及两相邻支撑部34之间分别形成所述焊接部36。The support frame 30 is used to support the
第二导电体50为导电材质且有一定的弹性,其安装于屏蔽壳体40的后端并抵靠屏蔽壳体40的后壁46和侧壁44。第二导电体50为一端开口的长方形结构,其内表面52有导电粘贴剂。所述粘贴剂用于将第二导电体50粘贴到屏蔽壳体40的后端。The
请参照图3至图5,组装时,将屏蔽架10套在屏蔽壳体40的前端,使屏蔽壳体40的固持部45从屏蔽架10的收容孔16中弹出,同时使屏蔽架10的弹片14分别夹持屏蔽壳体40的侧壁44及底壁48的两定位部484。将支撑架30套装到屏蔽壳体40的前端,使屏蔽壳体40挡止部424抵靠支撑架30的支撑部34,且使支撑架30的挟持部324挟持屏蔽壳体40的两侧壁44和屏蔽架10,此时通过点焊在焊接部36处将屏蔽架10、屏蔽壳体40及支撑架30焊接为一体。然后将第一导电体20套装于屏蔽架10的外侧并使第一导电体20的凹陷部22对应屏蔽壳体40的舌片482,且将第一导电体20的一面粘贴到支撑架30的支撑部34,同时通过第二导电体50的内表面52将第二导电体50粘贴到屏蔽壳体40的后端,这样屏蔽架10、屏蔽壳体40、支撑架30、第一导电体20及第二导电体50便组装为屏蔽装置100,将屏蔽壳体40的插脚442安装到电路板200,便可将屏蔽装置100安装到电路板200。然后,将屏蔽装置100和电路板200的组装体安装到机箱前板300中。Please refer to Fig. 3 to Fig. 5, when assembling, put the shielding
因屏蔽架10的内表面凸设有多个弹片14,当收发模组安装到屏蔽壳体40后,收发模组与屏蔽壳体40的内壁之间的缝隙被所述弹片14在屏蔽壳体40的前端开口密封。这样在使用时,组装于屏蔽装置100内的收发模组产生的电磁波不易从屏蔽壳体40的前端开口泄漏出去,同时屏蔽装置100外的电子组件产生的电磁波也不会从屏蔽壳体40的前端开口进入屏蔽壳体40中。Because the inner surface of the
因第二导电体50安装到屏蔽壳体40的后端,这样在使用时,电连接器及收发模组产生的电磁波不会因屏蔽壳体40与电路板间的微小缝隙泄露出去,屏蔽装置100外的其它电子组件产生的电磁波也不易干扰电连接器和收发模组。Because the
请参照图5,因导电泡棉具有较好的弹性,这样当屏蔽装置100安装到机箱前板300时,屏蔽装置100与前板300之间就不会有缝隙,从而机箱外的其它电子组件产生的电磁波不会干扰机箱内的电子组件,同时,机箱内的电子组件产生的电磁波也不会干扰机箱外的电子组件。Please refer to FIG. 5, because the conductive foam has good elasticity, when the
因缺口128使得屏蔽架10具有一定的弹性,从而屏蔽架10极易套装到屏蔽壳体40的前端。Because of the gap 128 , the shielding
因支撑架30具有开口328,从而支撑架30极易向两侧张开,这样支撑架30便极易套装到屏蔽壳体40和屏蔽架10的外侧。Since the support frame 30 has an opening 328 , the support frame 30 can be easily opened to both sides, so that the support frame 30 can be easily fitted to the outside of the shielding
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200620017754 CN200944728Y (en) | 2006-08-16 | 2006-08-16 | Screening arrangement and electronic product using the same |
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| CN 200620017754 CN200944728Y (en) | 2006-08-16 | 2006-08-16 | Screening arrangement and electronic product using the same |
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| CN200944728Y true CN200944728Y (en) | 2007-09-05 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102411410A (en) * | 2010-09-23 | 2012-04-11 | 鸿富锦精密工业(深圳)有限公司 | Computer cabinet |
| CN109219232A (en) * | 2017-07-03 | 2019-01-15 | 印可得株式会社 | The manufacturing method of circuit board, the circuit board with electromagnetic wave shielding function and the flat cable for utilizing the circuit board |
| CN110381715A (en) * | 2018-04-13 | 2019-10-25 | 乾坤科技股份有限公司 | Shielding magnetic device and its manufacturing method |
| US11615905B2 (en) | 2016-04-20 | 2023-03-28 | Vishay Dale Electronics, Llc | Method of making a shielded inductor |
| EP4679962A1 (en) * | 2024-07-09 | 2026-01-14 | Aptiv Technologies AG | Shielding combining press-fit with surface mount compression |
-
2006
- 2006-08-16 CN CN 200620017754 patent/CN200944728Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102411410A (en) * | 2010-09-23 | 2012-04-11 | 鸿富锦精密工业(深圳)有限公司 | Computer cabinet |
| US11615905B2 (en) | 2016-04-20 | 2023-03-28 | Vishay Dale Electronics, Llc | Method of making a shielded inductor |
| CN109219232A (en) * | 2017-07-03 | 2019-01-15 | 印可得株式会社 | The manufacturing method of circuit board, the circuit board with electromagnetic wave shielding function and the flat cable for utilizing the circuit board |
| CN110381715A (en) * | 2018-04-13 | 2019-10-25 | 乾坤科技股份有限公司 | Shielding magnetic device and its manufacturing method |
| CN114615874A (en) * | 2018-04-13 | 2022-06-10 | 乾坤科技股份有限公司 | Shielding magnetic device |
| EP4679962A1 (en) * | 2024-07-09 | 2026-01-14 | Aptiv Technologies AG | Shielding combining press-fit with surface mount compression |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070905 Termination date: 20090916 |