CN209296007U - Sensor Assemblies, Inertial Measurement Assemblies and Mobile Devices - Google Patents

Abstract

The utility model discloses a kind of sensor module, inertial measurement cluster and mobile devices.Sensor module includes the first fixing piece, the second fixing piece and the first circuit board equipped at least one sensor module.Second fixing piece is connect with the first fixing piece, second fixing piece is opposite with the first fixing piece and is spaced apart to limit installation space, first circuit board is set to installation space, first circuit board is fixedly connected at least one of the first fixing piece and the second fixing piece, at least partly not parallel with the horizontal plane and out of plumb of first circuit board.Sensor module according to the present utility model, by will at least partly first circuit board be obliquely installed, sensor module on first circuit board can be tilted with horizontal plane, so as to avoid, the vibration in vertical direction or horizontal direction is direct, acts on some sensor module completely, vibration component can be distributed to all directions, so as to be effectively reduced influence of the vibration to the detection accuracy of sensor module.

Description

Sensor Assemblies, Inertial Measurement Assemblies and Mobile Devices

technical field

The utility model relates to the technical field of sensors, in particular to a sensor component, an inertial measurement component and a mobile device.

Background technique

With the development of mobile devices, especially those that require motion control such as automobiles, robots, spacecraft, and unmanned vehicles, the motion accuracy of mobile devices has become one of the main areas of competition for mobile devices. An inertial measurement component is a structural component that can be used to determine the current state of control and operation of a mobile device. The measurement accuracy of inertial measurement components is critical to the control accuracy and operation accuracy of mobile equipment. Inertial measurement components usually include an inertial sensor and a circuit board for connecting the inertial sensor. The inertial sensor can include an integrated multi-axis sensor or multiple single-axis sensors. The inertial sensor can be used to test the acceleration component and angle information of the mobile device.

In the related art, the circuit board is usually installed parallel or perpendicular to the base of the mobile device, so that a single integrated multi-axis sensor is fixed parallel to the base, or multiple single-axis sensors are respectively parallel or perpendicular to the base. Since the mobile device usually generates a large vibration during take-off or landing, the inertial sensor is more sensitive to the vibration. In order to reduce the impact of the vibration environment on the inertial sensor, some mobile devices use a sensor with a larger range and stronger shock resistance, and some mobile devices use a better shock-absorbing device, but these will increase the production cost and design of the mobile device difficulty.

Utility model content

The utility model aims at at least solving one of the technical problems existing in the prior art. Therefore, the utility model is to provide a sensor assembly, which has the advantages of simple structure and high detection accuracy.

The utility model also proposes an inertial measurement component with the above-mentioned sensor component.

The utility model also proposes a mobile device with the above-mentioned sensor assembly.

The sensor assembly according to the embodiment of the present utility model includes: a first fixing piece; a second fixing piece, the second fixing piece is connected with the first fixing piece, and the second fixing piece is connected with the first fixing piece opposite and spaced apart to define an installation space; at least one first circuit board of a sensor module is provided, the first circuit board is arranged in the installation space, the first circuit board is connected with the first fixing member and the At least one of the second fixing members is fixedly connected, and at least a part of the first circuit board is not parallel to and not perpendicular to the horizontal plane.

According to the sensor assembly of the embodiment of the present invention, by setting at least part of the first circuit board obliquely, the sensor module on the first circuit board can be inclined to the horizontal plane, thereby avoiding the direct and complete action of the vibration in the vertical direction or the horizontal direction For a certain sensor module, only part of the vibration component will be transmitted to the sensor module, so that the impact of vibration on the detection accuracy of the sensor module can be effectively reduced, and the performance of the sensor component can be improved. In addition, installing the first circuit board obliquely can also improve the measurement range of the sensor assembly.

According to some embodiments of the present invention, in the first direction of the first circuit board, the first circuit board has opposite first and second ends, from the first end to the second In the direction of the end, the first circuit board is inclined along a second direction, the first direction is parallel to the horizontal plane, and the second direction is perpendicular to the horizontal plane.

In some embodiments of the present invention, the first fixing member includes a first surface, the first surface is located in the installation space, and the first surface is parallel to the first circuit board.

In some embodiments of the present utility model, the first fixing member includes a second surface, the second surface is opposite to the first surface, and the second surface is located outside the installation space, the first The two surfaces are parallel to the horizontal plane.

In some embodiments of the present invention, the second fixing member includes a third surface, the third surface is located in the installation space, and the third surface is parallel to the first circuit board.

In some embodiments of the present invention, the second fixing member includes a fourth surface, the fourth surface is opposite to the third surface, and the fourth surface is located outside the installation space, the first Four surfaces are parallel to said horizontal plane.

According to some embodiments of the present utility model, the sensor assembly further includes a fastener; the first fixing member has a first installation hole, the second fixing member has a second installation hole, and the fastener passes through in the first mounting hole and the second mounting hole.

In some embodiments of the present utility model, a first mounting column is provided on the side of the first fixing member facing the second fixing member; There is a second mounting column, and the second mounting column is opposite to the first mounting column; the first circuit board is sandwiched between the first mounting column and the second mounting column.

In some embodiments of the present utility model, the first installation hole is provided on the first installation column and passes through the first installation column and the first fixing member, and the second installation hole is provided on the second installation column. The fixing piece runs through the second mounting column and the second fixing piece; the first circuit board is provided with a third mounting hole, and the fastener is sequentially passed through the first mounting hole, the third mounting hole holes and the second mounting hole.

In some embodiments of the present utility model, the free end of the second mounting column is provided with a protrusion, the second mounting hole passes through the protrusion, and the protrusion is suitable for passing through the third mounting post. hole.

The inertial measurement assembly according to the embodiment of the present utility model includes: a first bracket; a second bracket, the second bracket is connected to the first bracket, and the second bracket is opposite to the first bracket and arranged at intervals a sensor assembly, the sensor assembly is the sensor assembly as described above, the sensor assembly is located between the first support and the second support, the sensor assembly includes a flexible circuit board and a first connector, the One end of the flexible circuit board is electrically connected to the first circuit board, the other end of the flexible circuit board is located outside the installation space, and the first connector is electrically connected to the other end of the flexible circuit board; A buffer, the first buffer is located between the sensor assembly and the first bracket; a second buffer, the second buffer is located between the sensor assembly and the second bracket; Two circuit boards, the second circuit board is connected to the second bracket, the second circuit board and the sensor assembly are located on both sides of the second bracket, the second circuit board is connected to the first The circuit board is electrically connected, and the second circuit board is provided with a second connector suitable for mating connection with the first connector.

According to the inertial measurement assembly of the embodiment of the present invention, by setting at least part of the first circuit board obliquely, the sensor module on the first circuit board can be inclined to the horizontal plane, thereby avoiding direct and complete vibration in the vertical or horizontal direction. Acting on a certain sensor module, the impact of vibration on the detection accuracy of the sensor module can be effectively reduced, and the performance of the sensor component can be improved, and the measurement range of the sensor component can also be increased. And by arranging the first buffer and the second buffer, the first buffer can buffer the movement between the first bracket and the sensor assembly, and the second buffer can buffer the movement between the second bracket and the sensor assembly, thereby improving The shock absorption performance of the inertial measurement component reduces the probability of the sensor component shaking under the action of an external force, thereby improving the detection accuracy of the sensor component. In addition, the structure of the first bracket and the second bracket can facilitate the installation of the sensor assembly.

A mobile device according to an embodiment of the present invention includes the above-mentioned inertial measurement component.

According to the mobile device according to the embodiment of the present invention, at least part of the first circuit board is arranged obliquely on the mobile device, and the vibration amplitude formed in the vertical direction is large during the take-off, flight and landing of the mobile device, and the first circuit board The sensor module on the board is inclined to the horizontal plane, which can prevent the vibration in the vertical direction from directly acting on the sensor module, and only part of the vibration component will be transmitted to the sensor module, which can effectively reduce the impact of vibration on the detection accuracy of the sensor module, and then can Improving the performance of the sensor component can also increase the measurement range of the sensor component. And by arranging the first buffer and the second buffer, the first buffer can buffer the movement between the first bracket and the sensor assembly, and the second buffer can buffer the movement between the second bracket and the sensor assembly, thereby improving The shock absorption performance of the inertial measurement component reduces the probability of the sensor component shaking under the action of an external force, thereby improving the detection accuracy of the sensor component. In addition, the structure of the first bracket and the second bracket can facilitate the installation of the sensor assembly.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present utility model will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

Fig. 1 is a schematic structural view of a sensor assembly according to an embodiment of the present invention;

Fig. 2 is a structural exploded diagram of a sensor assembly according to an embodiment of the present invention;

Fig. 3 is a schematic structural diagram of an inertial measurement assembly according to an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a mobile device according to an embodiment of the present invention.

Reference signs:

mobile device 1,

inertial measurement unit 10,

sensor assembly 100,

The first fixing part 110, the first installation hole 111, the first installation column 112, the first surface 113, the second surface 114,

The second fixing part 120, the second mounting hole 121, the second mounting column 122, the protrusion 123, the third surface 125, the fourth surface 126,

The first circuit board 130, the sensor module 131, the third mounting hole 133, the flexible circuit board 134, the first connector 135,

Fastener 140,

The first support 200 , the second support 300 , the support column 400 , the first buffer 500 , the second buffer 600 , the second circuit board 700 , and the second connector 710 .

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

As shown in FIG. 1 and FIG. 2 , the sensor assembly 100 according to the embodiment of the present invention includes a first fixing part 110 , a second fixing part 120 and a first circuit board 130 .

Specifically, as shown in FIGS. 1 and 2 , the second fixing member 120 is connected to the first fixing member 110 , and the second fixing member 120 is opposite to and spaced apart from the first fixing member 110 to define an installation space. For example, the second fixing part 120 and the first fixing part 110 may be stacked and arranged at intervals. The first circuit board 130 is disposed in the installation space. It can be understood that the first circuit board 130 is located between the first fixing part 110 and the second fixing part 120 . For example, the first fixing part 110, the first circuit board 130 and the second fixing part 120 can be stacked sequentially, and the first circuit board 130 is sandwiched between the first fixing part 110 and the second fixing part 120 to form a structure similar to "Sandwich" structure. The first circuit board 130 is fixedly connected to at least one of the first fixing part 110 and the second fixing part 120 .

It should be noted that the "fixed connection" mentioned here is that the first circuit board 130 is fixed to the first fixing member 110 and/or the second fixing member 120, and the "fixed connection" may be a non-detachable connection, or It is a detachable connection, for example, the first circuit board 130 is detachably connected to the first fixing member 110 , and the first circuit board 130 is detachably connected to the second fixing member 120 . In addition, "connection" may be a direct connection or an indirect connection.

At least a portion of the first circuit board 130 is non-parallel and non-perpendicular to the horizontal plane. It should be understood that the "horizontal plane" may be a plane formed by relatively completely still water near the first circuit board 130 and a plane parallel to the plane. It can be understood that, a part or all of the areas on the first circuit board 130 form an angle greater than zero and less than ninety degrees with the horizontal plane. The first circuit board 130 is provided with at least one sensor module 131 . For example, the first circuit board 130 is provided with three sensor modules 131, and the three sensor modules 131 are located between the first circuit board 130 and the first fixing member 110, and the three sensor modules 131 can be used to detect the X direction and the Y direction respectively. and the motion state value in the Z direction. As another example, the first circuit board 130 can be provided with a sensor module 131, and the sensor module 131 can detect motion state values in the X direction, the Y direction and the Z direction.

In related technologies, since most aircraft, especially multi-rotor aircraft, have a large horizontal area, the vibration component in the vertical direction of the fuselage will be relatively large, and the flight controller is generally fixed in the horizontal area of the fuselage, so the flight The sensor in the controller used to detect the motion parameters in the vertical direction of the aircraft is greatly affected by the vibration, and the physical quantities collected by the sensor are seriously distorted.

According to the sensor assembly 100 of the embodiment of the present utility model, by setting at least part of the first circuit board 130 obliquely, the sensor module 131 on the first circuit board 130 can be inclined to the horizontal plane, and the vibration in the vertical direction can be shared by the first In the three directions of the three-dimensional coordinates based on the inclined surface on the circuit board 130, the vibration in the vertical direction can be avoided completely and independently affecting the motion parameters in the vertical direction detected by the sensor module 131, and only part of the vibration components will be superimposed on the The motion parameters in the vertical direction detected by the sensor module 131 can effectively reduce the impact of vibration on the detection accuracy of the sensor module 131 in the vertical direction, thereby improving the performance of the sensor assembly 100 . In addition, installing the first circuit board 130 obliquely can also improve the measurement range of the sensor assembly 100 .

As shown in Figures 1 and 2, according to some embodiments of the present utility model, in the first direction of the first circuit board 130, the first circuit board 130 has opposite first ends and second ends, from the first end In the direction to the second end, the first circuit board 130 is inclined along a second direction, the first direction is parallel to the horizontal plane, and the second direction is perpendicular to the horizontal plane. It can be understood that, in a direction from the first end to the second end, the second end gradually moves away from the horizontal plane. For example, the first circuit board 130 is a rectangular flat piece. In the length direction of the first circuit board 130, the first circuit board 130 includes a first end and a second end opposite to each other. The first end is located in a horizontal plane. In the direction to the second end, the first circuit board 130 gradually moves away from the horizontal plane, and the second end is located above the first end. In this way, the inclined setting of the first circuit board 130 can be facilitated, and the vertical motion parameter detected by the sensor module 131 will only be affected by partial vibrations in the vertical direction.

In some embodiments of the present invention, the first circuit board 130 may form an angle greater than zero and less than 60 degrees with the horizontal plane. For example, the included angle between the first circuit board 130 and the horizontal plane may be 30 degrees or 45 degrees. Thus, it is easy to switch between the three-dimensional coordinate system based on the horizontal plane and the three-dimensional coordinate system based on the first circuit board 130, so that the physical quantities in each direction collected by the sensor module 131 can be easily synthesized to obtain The physical quantities of the horizontal and vertical directions of the horizontal plane.

For example, the included angle between the first circuit board 130 and the horizontal plane is 30 degrees, and the inertial acquisition amount detected by the sensor module 131 on the first circuit board 30 based on the three-dimensional coordinate system of the first circuit board 130 is Ax, Ay, Az , then converted to three components based on the three-dimensional coordinate system in the horizontal plane: Ax*cosa+Az*sina, Ay, Az*cosa-Ax*sina.

As shown in Figure 1 and Figure 2, in some embodiments of the present utility model, the first fixing member 110 includes a first surface 113, the first surface 113 is located in the installation space, and the first surface 113 is parallel to the first circuit board 130 . It can be understood that, the surface of the part of the wall surface forming the installation space on the first fixing member 100 is an inclined surface, in other words, the surface of the part of the wall surface forming the installation space on the first fixing member 100 forms an angle greater than zero with the horizontal plane, The surface of the first fixing member 100 configured to form a part of the wall surface of the installation space is adapted to the first circuit board 130 . Thus, the shape of the first fixing member 110 is configured. The first fixing member 110 can be adapted to the first circuit board 130 , so that the installation of the first circuit board 130 can be facilitated and the thickness of the sensor assembly 100 can be reduced.

As shown in Figure 1 and Figure 2, in some embodiments of the present utility model, the first fixing member 110 includes a second surface 114, the second surface 114 is opposite to the first surface 113, and the second surface 114 is located outside the installation space , the second surface 114 is parallel to the horizontal plane. It can be understood that, the surface of the first fixing member 110 away from the first circuit board 130 is parallel to the horizontal plane. Thus, the installation of the first fixing member 110 can be facilitated.

For example, in the length direction of the first circuit board 130, the distance between the first surface 113 and the second surface 114 gradually increases, and in the width direction of the first circuit board 130, the distance between the first surface 113 and the second surface 114 The distance between them is constant. As another example, in the width direction of the first circuit board 130, the distance between the first surface 113 and the second surface 114 gradually increases, and in the length direction of the first circuit board 130, the distance between the first surface 113 and the second surface The distance between 114 is constant.

As shown in Figure 1 and Figure 2, in some embodiments of the present utility model, the second fixing member 120 includes a third surface 125, the third surface 125 is located in the installation space, and the third surface 125 is parallel to the first circuit board 130 . It can be understood that the surface of the part of the wall on the second fixing member 120 that forms the installation space is an inclined surface. In other words, the surface of the part of the wall on the second fixing 120 that forms the installation space forms an angle greater than zero with the horizontal plane. The surface of the second fixing member 120 configured to form a part of the wall surface of the installation space may be adapted to the first circuit board 130 . Thus, the shape of the second fixing member 120 is configured. The second fixing member 120 can be adapted to the first circuit board 130 so as to facilitate the installation of the first circuit board 130 and reduce the thickness of the sensor assembly 100 .

As shown in Figure 1 and Figure 2, in some embodiments of the present utility model, the second fixing member 120 includes a fourth surface 126, the fourth surface 126 is opposite to the third surface 125, and the fourth surface 126 is located outside the installation space , the fourth surface 126 is parallel to the horizontal plane. It can be understood that, the surface of the second fixing member 120 away from the first circuit board 130 is parallel to the horizontal plane. Thus, the installation of the second fixing member 120 can be facilitated.

For example, in the length direction of the first circuit board 130, the distance between the third surface 125 and the fourth surface 126 gradually increases, and in the width direction of the first circuit board 130, the distance between the third surface 125 and the fourth surface 126 The distance between them is constant. As another example, in the width direction of the first circuit board 130, the distance between the third surface 125 and the fourth surface 126 gradually increases, and in the length direction of the first circuit board 130, the distance between the third surface 125 and the fourth surface The distance between 126 is constant.

According to some embodiments of the present invention, the sensor module 131 may be an acceleration sensor or a speed sensor. For example, the sensor module 131 can be an integrated six-axis sensor (three-axis gyroscope and three-axis accelerometer) chip, and the sensor component 100 can be used to measure the running speed and acceleration of the mobile device 1, so that the position and location of the mobile device 1 can be determined. posture, and further motion control can be performed on the mobile device 1 .

As shown in FIG. 2 , according to some embodiments of the present invention, the sensor assembly 100 further includes a fastener 140 . The first fixing member 110 has a first installation hole 111 , the second fixing member 120 has a second installation hole 121 , and the fastener 140 passes through the first installation hole 111 and the second installation hole 121 . For example, the first mounting hole 111 may pass through the first fixing member 110 along the thickness direction of the first fixing member 110, the second mounting hole 121 may be formed as a groove on the second fixing member 120, and the second mounting hole 121 does not penetrate through the first fixing member 110. The second fixing member 120 and the fastener 140 can pass through the first installation hole 111 and one end of the fastener 140 can extend into the second installation hole 121 . As another example, the first installation hole 111 may pass through the first fixing member 110 along the thickness direction of the first fixing member 110, and the second installation hole 121 may pass through the second installation hole 121 along the thickness direction of the second fixing member 120. The fastener 140 may pass through the first installation hole 111 and one end of the fastener 140 may extend into the second installation hole 121 . Therefore, the first fixing part 110 and the second fixing part 120 can be connected by the fastener 140 , the structure is simple and the operation is convenient, so that the installation of the sensor assembly 100 can be simplified.

As shown in FIG. 2 , in some embodiments of the present invention, the fastener 140 may be a threaded fastener. In some embodiments of the present invention, the fastener 140 can be screwed, clamped or interfered connected with the second installation hole 121 . In some embodiments of the present invention, the fastener 140 can be screwed, clipped or interfered connected with the first installation hole 111 . In some embodiments of the present invention, there may be gaps between the fastener 140 and the surrounding wall of the first installation hole 111 , and the end of the fastener 140 away from the second installation hole 121 abuts against the first fixing member 110 .

As shown in Figure 2, in some embodiments of the present utility model, there may be multiple first mounting holes 111, and multiple second mounting holes 121 may be in one-to-one correspondence with multiple first mounting holes 111, fastening There are multiple pieces 140 corresponding to the multiple first installation holes 111 one by one. It should be noted that the "plurality" mentioned here means two or more. For example, there are four first mounting holes 111, the four first mounting holes 111 are arranged at intervals, the number of second mounting holes 121 is four, and the four second mounting holes 121 correspond to the four first mounting holes 111 one by one. Each second mounting hole 121 is opposite to its corresponding first mounting hole 111, and there are four fasteners 140, and each fastener 140 can pass through a second mounting hole 121 and correspond to the second mounting hole 121 The first mounting hole 111. Thus, the connection stability between the first fixing part 110 and the second fixing part 120 can be improved, thereby improving the installation stability of the first circuit board 130 and the sensor module 131 , and further improving the structural stability of the sensor assembly 100 .

As shown in FIGS. 1 and 2 , in some embodiments of the present invention, the first fixing member 110 is provided with a first mounting column 112 on the side facing the second fixing member 120 , and the second fixing member 120 is facing the first fixing member 120 . One side of the component 110 is provided with a second mounting post 122 , the second mounting post 122 is opposite to the first mounting post 112 , and the first circuit board 130 is sandwiched between the first mounting post 112 and the second mounting post 122 . It can be understood that both the first mounting column 112 and the second mounting column 122 are located between the first fixing member 110 and the second fixing member 120, the first installing column 112 is connected with the first fixing member 110, and the second installing column 122 Connected with the second fixing member 120, the end surface of the free end of the first mounting column 112 is opposite to and spaced from the end surface of the free end of the second mounting column 122, and the first circuit board 130 is sandwiched between the end surface of the free end of the first mounting column 112 and Between the end faces of the free ends of the second mounting columns 122 . Thus, the first circuit board 130 can be positioned between the first fixing part 110 and the second fixing part 120 , and the installation and removal of the first circuit board 130 can be facilitated.

During the installation process of the sensor assembly 100, one surface of the first circuit board 130 can be first contacted with the end face of the free end of the second mounting post 122, and then the end face of the free end of the first mounting post 112 can be contacted with the other surface of the first circuit board 130. Contact, so that the first circuit board 130 is interposed between the first mounting column 112 and the second mounting column 122 , and then the first fixing member 110 and the second fixing member 120 are connected by the fastener 140 .

In some embodiments of the present utility model, the end face of the free end of the first mounting column 112 may be a plane or an inclined plane. Further, the first mounting column 112 may be a cylinder, a polygonal column or a polygonal pyramid. In some embodiments of the present invention, the first mounting column 112 is vertically connected to the first fixing member 110 . In some embodiments of the present invention, the configuration of the second mounting post 122 is the same as the shape of the first mounting post 112 .

As shown in FIGS. 1 and 2 , in some embodiments of the present invention, the first mounting hole 111 is located on the first mounting column 112 and runs through the first mounting column 112 and the first fixing member 110 , and the second mounting hole 121 Set on the second fixing part 120 and passing through the second mounting column 122 and the second fixing part 120, the first circuit board 130 is provided with a third mounting hole 133, and the fastener 140 is passed through the first mounting hole 111, the third mounting hole 133 in turn. The installation hole 133 and the second installation hole 121 . Thus, the fastener 140 can connect the first fixing part 110, the second fixing part 120 and the first circuit board 130, thereby improving the installation stability of the first circuit board 130 and simplifying the installation of the first fixing part 110. And the structural setting and connection operation of the second fixing member 120.

As shown in Figure 1 and Figure 2, in some embodiments of the present utility model, the free end of the second installation column 122 is provided with a protrusion 123, the second installation hole 121 runs through the protrusion 123, and the protrusion 123 is suitable for passing through in the third mounting hole 133 . For example, one end of the protrusion 123 is connected to the end face of the free end of the second mounting column 122, and the other end of the protrusion 123 extends toward the first circuit board 130. The protrusion 123 can be passed through the third mounting hole 133, and the fastener 140 The first mounting hole 111 and the second mounting hole 121 can pass through, so that the fastener 140 can be omitted for connecting with the first circuit board 130 .

Further, the outer peripheral wall of the protrusion 123 can be attached to the wall surface of the third installation hole 133 . Thus, the displacement of the first circuit board 130 can be limited, and the first circuit board 130 can be positioned on the protrusion 123 .

As shown in Figure 1 and Figure 2, according to some embodiments of the present invention, the first circuit board 130 can be provided with components, and at least one of the first fixing part 110 and the second fixing part 120 is provided with a avoidance slot. For example, the components and the sensor module 131 can be located on the same surface of the first circuit board 130 , and this surface faces the second fixing member 120 , and the second fixing member 120 is provided with an avoidance groove, and the components can be located in the avoidance groove. Thus, the thickness of the sensor assembly 100 can be reduced.

As shown in Fig. 1 and Fig. 2, in some embodiments of the present invention, there may be multiple avoidance grooves, a part of the plurality of avoidance grooves may be used to accommodate components, and the other part of the plurality of avoidance grooves may be used for The sensor module 131 is accommodated. In some other embodiments of the present utility model, there may be one avoidance groove, and the components and the sensor assembly 100 are both located in the avoidance groove. Thus, the configuration of the sensor assembly 100 can be simplified.

According to some embodiments of the present invention, the first fixing part 110 is a metal block, and the second fixing part 120 is a metal block. Thus, the weight of the sensor assembly 100 can be increased, and the first fixing member 110 and the second fixing member 120 can be used as counterweights of the sensor assembly 100, thereby improving the installation stability of the sensor assembly 100 and preventing the sensor assembly 100 from being subjected to an external force ( Shaking under the action of wind force) will affect the detection accuracy of the sensor module 131.

As shown in FIG. 3 , the inertial measurement assembly 10 according to the embodiment of the present invention includes a first bracket 200 , a second bracket 300 , a sensor assembly 100 , a first buffer 500 , a second buffer 600 and a second circuit board 700 , the sensor assembly 100 is the sensor assembly 100 described above, the second bracket 300 is connected to the first bracket 200 , and the second bracket 300 is opposite to the first bracket 200 and arranged at intervals. For example, at least part of the second bracket 300 may be stacked with the first bracket 200 and arranged at intervals. The sensor assembly 100 is located between the first bracket 200 and the second bracket 300 , the first buffer 500 is located between the sensor assembly 100 and the first bracket 200 , and the second buffer 600 is located between the sensor assembly 100 and the second bracket 300 . The second circuit board 700 is connected to the second bracket 300 , and the second circuit board 700 and the sensor assembly 100 are located on two sides of the second bracket 300 . For example, the first bracket 200 , the first buffer member 500 , the sensor assembly 100 , the second buffer member 600 , the second bracket 300 and the second circuit board 700 may be stacked and arranged sequentially. The second circuit board 700 is electrically connected to the first circuit board 130 .

As shown in FIG. 3 , the sensor assembly 100 may include a flexible circuit board 134 and a first connector 135 , one end of the flexible circuit board 134 is electrically connected to the first circuit board 130 , and the other end of the flexible circuit board 134 is located outside the installation space. The first connector 135 is electrically connected to the other end of the flexible circuit board 134 , and the second circuit board 700 is provided with a second connector 710 suitable for mating with the first connector 135 . Thus, the information detected by the sensor module 131 can be transmitted to the second circuit board 700 through the flexible circuit board 134 . The second circuit board 700 may be provided with a controller, and the controller may store detection information of the sensor module 131 .

According to the inertial measurement assembly 10 of the embodiment of the present invention, by setting at least part of the first circuit board 130 obliquely, the sensor module 131 on the first circuit board 130 can be inclined to the horizontal plane, and the vibration in the vertical direction can be shared by the second In the three directions of the three-dimensional coordinates based on the inclined surface on the circuit board 130, the vibration in the vertical direction can be avoided completely and independently affecting the motion parameters in the vertical direction detected by the sensor module 131, and only part of the vibration components will be superimposed The motion parameters in the vertical direction detected by the sensor module 131 can effectively reduce the impact of vibration on the detection accuracy of the sensor module 131 in the vertical direction, thereby improving the performance of the sensor assembly 100 and improving the performance of the sensor assembly 100. Measurement range.

In addition, by setting the first buffer 500 and the second buffer 600, the first buffer 500 can buffer the movement between the first bracket 200 and the sensor assembly 100, and the second buffer 600 can buffer the second bracket 300 and the sensor assembly. 100, thereby improving the shock absorption performance of the inertial measurement assembly 10, reducing the probability of the sensor assembly 100 shaking under the action of an external force, and further improving the detection accuracy of the sensor assembly 100. In addition, the configurations of the first bracket 200 and the second bracket 300 can facilitate the installation of the sensor assembly 100 .

According to some embodiments of the present invention, the first buffer member 500 may be shock-absorbing cotton, and the second buffer member 600 may be shock-absorbing cotton. The first buffer 500 may be bonded to the sensor assembly 100 , and the second buffer 600 may be bonded to the sensor assembly 100 . For example, the first buffer member 500 may be bonded to the sensor assembly 100 through double-sided tape, and the second buffer member 600 may be bonded to the sensor assembly 100 through double-sided tape. The first buffer member 500 may be bonded to the first bracket 200 , and the second buffer member 600 may be bonded to the second bracket 300 . For example, the first buffer member 500 may be bonded to the first bracket 200 through double-sided tape, and the second buffer member 600 may be bonded to the second bracket 300 through double-sided tape. In some embodiments of the present utility model, the first buffer member 500 may be ring-shaped, and the second buffer member 600 may be ring-shaped.

As shown in FIG. 3 , according to some embodiments of the present utility model, the inertial measurement assembly 10 may also include a plurality of supporting columns 400 arranged at intervals, one end of the supporting columns 400 is connected to the first support 200 , and the other end of the supporting columns 400 Connect with the second bracket 300 . It should be noted that the "multiple" mentioned here means two or more than two, for example, there may be four supporting columns 400, and the four supporting columns 400 are arranged at intervals. The first bracket 200 and the second bracket 300 can be spaced apart by setting four support columns 400 to define an installation cavity for installing the sensor assembly 100 .

As shown in Figure 3, in some embodiments of the present utility model, one end of the support column 400 is connected with the first support 200 by a threaded fastener, and the other end of the support column 400 is connected with the second support 300 by a threaded fastener , the second circuit board 700 is connected to the second bracket 300 through threaded fasteners. For example, the first bracket 200 can be provided with a first threaded hole, and one of the threaded fasteners can be connected with the first threaded hole, the second bracket 300 can be provided with a second threaded hole, and another threaded fastener can be connected with the first threaded hole. The two threaded holes are matched for connection. Thus, the assembly and disassembly of the inertial measurement assembly 10 can be facilitated. In some embodiments of the present invention, the first connector 135 and the second connector 710 can be plugged.

As shown in FIG. 4 , the mobile device 1 according to the embodiment of the present invention includes the above-mentioned inertial measurement component 10 .

According to the mobile device 1 of the embodiment of the present utility model, by setting at least part of the first circuit board 130 obliquely, the sensor module 131 on the first circuit board 130 can be inclined to the horizontal plane, and the vibration in the vertical direction can be shared by the first In the three directions of the three-dimensional coordinates based on the inclined surface on the circuit board 130, the vibration in the vertical direction can be avoided completely and independently affecting the motion parameters in the vertical direction detected by the sensor module 131, and only part of the vibration components will be superimposed on the The motion parameters in the vertical direction detected by the sensor module 131 can effectively reduce the impact of vibration on the detection accuracy of the sensor module 131 in the vertical direction, thereby improving the performance of the sensor assembly 100 and improving the measurement performance of the sensor assembly 100. range, and by setting the first buffer 500 and the second buffer 600, the first buffer 500 can buffer the movement between the first bracket 200 and the sensor assembly 100, and the second buffer 600 can buffer the second bracket 300 and the sensor The movement between the components 100 can improve the shock absorption performance of the inertial measurement component 10 , reduce the probability of the sensor component 100 shaking under the action of external force, and further improve the detection accuracy of the sensor component 100 . In addition, the configurations of the first bracket 200 and the second bracket 300 can facilitate the installation of the sensor assembly 100 .

According to some embodiments of the present utility model, the mobile device 1 may be an unmanned vehicle, an aircraft, a robot, or the like.

In the description of the present utility model, it should be understood that the terms "first" and "second" are only used for descriptive purposes, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the number of indicated technical features . Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present utility model, "plurality" means two or more, unless otherwise specifically defined.

In this utility model, unless otherwise specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection, or integration; it can be mechanical connection, electrical connection, or communication; it can be direct connection or indirect connection through an intermediary, it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first feature and the second feature through an intermediary indirect contact. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structures, materials or features are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications, the scope of the present invention is defined by the claims and their equivalents.

Claims (12)

1. A sensor assembly, characterized in that, comprising: first fixture; a second fixing piece, the second fixing piece is connected to the first fixing piece, the second fixing piece is opposite to and spaced apart from the first fixing piece to define an installation space; A first circuit board provided with at least one sensor module, the first circuit board is arranged in the installation space, and the first circuit board is fixed to at least one of the first fixing member and the second fixing member connected, at least a portion of the first circuit board is non-parallel and non-perpendicular to a horizontal plane. 2. The sensor assembly of claim 1, wherein in a first direction of the first circuit board, the first circuit board has opposite first and second ends, In the direction from the first end to the second end, the first circuit board is inclined in a second direction, The first direction is parallel to the horizontal plane, and the second direction is perpendicular to the horizontal plane. 3. The sensor assembly according to claim 2, wherein the first fixing member comprises a first surface, and the first surface is located in the installation space, The first surface is parallel to the first circuit board. 4. The sensor assembly according to claim 3, wherein the first fixing member includes a second surface, the second surface is opposite to the first surface, and the second surface is located on the mounting surface. Outside the space, the second surface is parallel to the horizontal plane. 5. The sensor assembly according to claim 2, wherein the second fixing member comprises a third surface, the third surface is located in the installation space, The third surface is parallel to the first circuit board. 6. The sensor assembly according to claim 5, wherein the second fixing member includes a fourth surface, the fourth surface is opposite to the third surface, and the fourth surface is located on the mounting surface. Outside the space, the fourth surface is parallel to the horizontal plane. 7. The sensor assembly according to claim 1, further comprising a fastener; The first fixing member has a first installation hole, the second fixing member has a second installation hole, and the fastener passes through the first installation hole and the second installation hole. 8. The sensor assembly according to claim 7, wherein a first mounting post is provided on a side of the first fixing member facing the second fixing member; The second fixing part is provided with a second mounting column on a side facing the first fixing part, and the second mounting column is opposite to the first mounting column; The first circuit board is sandwiched between the first mounting column and the second mounting column. 9. The sensor assembly according to claim 8, wherein the first mounting hole is arranged on the first mounting column and passes through the first mounting column and the first fixing member, and the second mounting hole set on the second fixing part and passing through the second mounting column and the second fixing part; The first circuit board is provided with a third mounting hole, and the fasteners are sequentially passed through the first mounting hole, the third mounting hole and the second mounting hole. 10. The sensor assembly according to claim 9, wherein the free end of the second mounting post is provided with a protrusion, the second mounting hole runs through the protrusion, and the protrusion is suitable for passing through on the third mounting hole. 11. An inertial measurement assembly, comprising: first bracket; a second bracket, the second bracket is connected to the first bracket, and the second bracket is opposite to the first bracket and arranged at intervals; A sensor assembly, the sensor assembly is the sensor assembly according to any one of claims 1-10, the sensor assembly is located between the first support and the second support, and the sensor assembly includes a flexible circuit board and a first connector, one end of the flexible circuit board is electrically connected to the first circuit board, the other end of the flexible circuit board is located outside the installation space, the first connector is connected to the flexible circuit board The other end of the board is electrically connected; a first buffer, the first buffer is located between the sensor assembly and the first bracket; a second buffer, the second buffer is located between the sensor assembly and the second bracket; A second circuit board, the second circuit board is connected to the second bracket, the second circuit board and the sensor assembly are located on both sides of the second bracket, the second circuit board is connected to the first bracket A circuit board is electrically connected, and the second circuit board is provided with a second connector suitable for mating connection with the first connector. 12. A mobile device, comprising the inertial measurement component according to claim 11.