CN209216035U - 一种具有液冷装置的伺服系统 - Google Patents
一种具有液冷装置的伺服系统 Download PDFInfo
- Publication number
- CN209216035U CN209216035U CN201920164455.5U CN201920164455U CN209216035U CN 209216035 U CN209216035 U CN 209216035U CN 201920164455 U CN201920164455 U CN 201920164455U CN 209216035 U CN209216035 U CN 209216035U
- Authority
- CN
- China
- Prior art keywords
- liquid
- liquid cooling
- cooling device
- water
- servo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920164455.5U CN209216035U (zh) | 2019-01-30 | 2019-01-30 | 一种具有液冷装置的伺服系统 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920164455.5U CN209216035U (zh) | 2019-01-30 | 2019-01-30 | 一种具有液冷装置的伺服系统 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209216035U true CN209216035U (zh) | 2019-08-06 |
Family
ID=67467772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920164455.5U Active CN209216035U (zh) | 2019-01-30 | 2019-01-30 | 一种具有液冷装置的伺服系统 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209216035U (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109683691A (zh) * | 2019-01-30 | 2019-04-26 | 深圳市研派科技有限公司 | 一种具有液冷装置的伺服系统 |
| CN110568911A (zh) * | 2019-09-05 | 2019-12-13 | 英业达科技有限公司 | 服务器 |
| CN112911905A (zh) * | 2021-02-04 | 2021-06-04 | 华南理工大学 | 一种机柜式服务器间接冷板式液冷防漏系统及控制方法 |
-
2019
- 2019-01-30 CN CN201920164455.5U patent/CN209216035U/zh active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109683691A (zh) * | 2019-01-30 | 2019-04-26 | 深圳市研派科技有限公司 | 一种具有液冷装置的伺服系统 |
| CN110568911A (zh) * | 2019-09-05 | 2019-12-13 | 英业达科技有限公司 | 服务器 |
| CN112911905A (zh) * | 2021-02-04 | 2021-06-04 | 华南理工大学 | 一种机柜式服务器间接冷板式液冷防漏系统及控制方法 |
| CN112911905B (zh) * | 2021-02-04 | 2022-05-24 | 华南理工大学 | 一种机柜式服务器间接冷板式液冷防漏系统及控制方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12124394B2 (en) | Modular mass storage system | |
| EP4049112B1 (en) | Immersion cooling infrastructure module having compute device form factor | |
| US8724322B2 (en) | Targeted liquid cooling for a system | |
| US8320121B2 (en) | Cooling high performance computer systems | |
| JP6866816B2 (ja) | 液浸サーバ | |
| EP1763978B1 (en) | Liquid cooling system including hot-swappable components | |
| CN209216035U (zh) | 一种具有液冷装置的伺服系统 | |
| JP3163213U (ja) | 液体浸漬冷却システム | |
| US20080017355A1 (en) | Case for a liquid submersion cooled electronic device | |
| TW202102101A (zh) | 可機架安裝之浸入式冷卻系統 | |
| US20070268669A1 (en) | Circuit board assembly for a liquid submersion cooled electronic device | |
| US10375863B2 (en) | Liquid cooled chassis | |
| CN103890692A (zh) | 冷却单元 | |
| CN102037426A (zh) | 一种用于液体浸没式冷却阵列式连接的电子装置的箱体和支架系统 | |
| US8787013B1 (en) | Carrier with adjustable heat removal elements | |
| JP2013509638A (ja) | ブレード・エンクロージャ用の熱バスバー | |
| US8144458B2 (en) | Component layout in an enclosure | |
| WO2025246578A1 (zh) | 服务器及机柜系统 | |
| TWI683612B (zh) | 具有液冷裝置之伺服系統 | |
| US20240365502A1 (en) | Immersion cooling using cooling containers for an electronic device | |
| CN211267493U (zh) | 一种一体机及其高效散热机柜 | |
| WO2020155266A1 (zh) | 一种具有液冷装置的伺服系统 | |
| CN115568153B (zh) | 服务器 | |
| CN216927538U (zh) | 3u4节点服务器机箱 | |
| CN203241864U (zh) | 电脑主机及其机箱 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 B03 / B04 / B05, 15 / F, Yicheng Huanzhi center, the intersection of Renmin Road and Bayi Road, Jinglong community, Longhua street, Longhua District, Shenzhen, Guangdong Patentee after: Shenzhen angpai Technology Co.,Ltd. Address before: A707, 7th floor, block a, Yinxing hi tech Industrial Park, No. 1301 Guanlan street, Guanlan street, Longhua New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN APALTEK Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518000, Building 2, Huaqiao City Chuangxiang Building, North Station Community, Minzhi Street, Longhua District, Shenzhen City, Guangdong Province, China 2907-2908 Patentee after: Shenzhen Angpai Technology Co.,Ltd. Country or region after: China Address before: Guangdong Province Shenzhen City Longhua District Longhua Street Jinglong Community Renmin Road and Bayi Road Interchange Yicheng Huanzhi Center Building 2 15th Floor B03/B04/B05 Patentee before: Shenzhen angpai Technology Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |