CN209168059U - Touch panel and touch sensor tape - Google Patents

Abstract

The utility model discloses a touch panel and touch sensor winding, wherein this touch panel contains base plate, catalysis layer, peripheral lead wire, mark, first cover and second cover. The catalyst layer is arranged on the peripheral area of the substrate, the peripheral lead is arranged on the catalyst layer, and the peripheral lead is provided with a side wall and an upper surface; the mark is arranged on the catalytic layer and is provided with a side wall and an upper surface. The first cover covers the upper surface of the peripheral lead, and the second cover covers the upper surface of the mark, wherein the first cover and the second cover comprise metal nanowires. A method for manufacturing a touch sensor tape and a touch panel is also provided.

Description

Touch Panel and Touch Sensor Tape

technical field

The utility model relates to a touch panel and a touch sensor tape.

Background technique

In recent years, transparent conductors can simultaneously allow light to pass through and provide proper conductivity, so they are often used in many display or touch related devices. Generally speaking, the transparent conductor can be various metal oxides, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Cadmium Tin Oxide (CTO) or aluminum doped oxide Zinc (Aluminum-doped Zinc Oxide, AZO). However, these metal oxide films cannot meet the flexibility requirements of display devices. Therefore, a variety of flexible transparent conductors have been developed, for example, transparent conductors made of materials such as nanowires.

However, there are still many problems to be solved in the process technology of the nanowires. For example, the touch panel uses a metal layer to make the leads in the peripheral area. Traditionally, the metal is sputtered on the entire surface of the substrate, and then according to the pattern Remove the unnecessary part of the metal, and the touch panel occupies the largest area is the visible area, so in the process of removing the metal set in the visible area, a large amount of metal is removed, leaving only a small part of the metal composition Leads in the perimeter area. Therefore, it is one of the important issues how to reduce the part where the metal is removed in the process, so as to control the manufacturing cost.

Furthermore, when using nanowires to make touch electrodes, an alignment error area needs to be reserved when the nanowires and the leads of the surrounding area are aligned. The width of the alignment error area is larger, especially in the Roll to Roll process, the deformation of the substrate causes the size of the alignment error area to be enlarged (such as 150 μm), so that the minimum width of the peripheral area is only 2.5mm, so Can't meet the narrow bezel requirements of the display.

Utility model content

In some embodiments of the present invention, the metal material is selectively disposed on a specific position of the substrate to control the amount of metal used, thereby controlling the manufacturing cost.

In some embodiments of the present invention, the peripheral leads are designed to be covered by at least the first covering formed by metal nanowires and the markings are covered by at least the first covering formed by metal nanowires, so as to avoid unnecessary The effect of the alignment error area during alignment is reserved to form peripheral leads with a smaller width, thereby meeting the requirements of a narrow frame. In addition, in some embodiments of the present invention, a new tape-and-tape structure of the touch sensor and a new manufacturing method are proposed, thus resulting in a touch panel structure different from that of the past.

According to some embodiments of the present invention, a touch panel is characterized by comprising: a substrate, wherein the substrate has a display area and a peripheral area; a catalytic layer disposed in the peripheral area; a plurality of peripheral leads , arranged on the catalytic layer, each of the peripheral leads has a side wall and an upper surface; a plurality of marks are arranged on the catalytic layer, each of the marks has a side wall and an upper surface; a plurality of A first cover and a plurality of second covers, the first covers cover the upper surface of the peripheral leads, the second covers cover the upper surface of the marks, each of the first covers The cover and each of the second covers include metal nanowires, the peripheral leads, the marks, the first covers and the second covers are disposed on the peripheral area of the substrate; and a touch The control sensing electrodes are arranged in the display area of the substrate, and the touch sensing electrodes are electrically connected to the peripheral leads.

In some embodiments of the present invention, the catalytic layer is an insulating layer, and the insulating layer is filled with catalytic particles.

In some embodiments of the present invention, the particles are nanoparticles.

In some embodiments of the present invention, it further comprises: a film layer covering the touch sensing electrode, the catalytic layer exposed in the non-conductive region of the peripheral region, the first coverings and the first coverings. Two coverings.

In some embodiments of the present invention, it further includes non-conductive areas respectively disposed in the display area and the peripheral area.

In some embodiments of the present invention, the non-conductive region has a filling layer made of the same material as the film layer.

In some embodiments of the present invention, each of the first covers has a side surface, and the side surface and the sidewalls of the peripheral leads are a common etching surface.

In some embodiments of the present invention, each of the second covers has a side surface, and the side surface and the sidewall of the marks are a common etching surface.

In some embodiments of the present invention, the metal nanowires do not exist on the sidewalls of the peripheral leads and the sidewalls of the marks.

In some embodiments of the present invention, the markers include docking alignment markers.

In some embodiments of the present invention, the width of the peripheral leads is 5 μm-20 μm, and the distance between the adjacent peripheral leads is 5 μm-20 μm.

In some embodiments of the present invention, the peripheral leads and the markers are made of metal materials; the touch sensing electrodes include metal nanowires.

In some embodiments of the present invention, the resistance between adjacent peripheral leads among the peripheral leads is greater than 1×10 ³ ohms, and the leakage current between adjacent peripheral leads among the peripheral leads is less than 1× 10 ^-6 amps.

According to some embodiments of the present invention, a touch sensor tape is characterized by comprising: a substrate, wherein a plurality of touch panels and removal areas other than the touch panels are disposed on the substrate, each of which is Some of the touch panels include: a display area, a peripheral area, a plurality of peripheral leads, a plurality of first covers, and a touch sensing electrode, wherein a catalytic layer is disposed in the peripheral area and the removal area; the The peripheral leads are disposed on the catalytic layer, each of the peripheral leads has a sidewall and an upper surface; the first coverings cover the upper surface of the peripheral leads, the peripheral leads and the first a cover is arranged on the peripheral area of each of the touch panels; and a touch sensing electrode is arranged on the display area of each of the touch panels, and the touch sensing electrode is electrically connected to the peripheral leads; A plurality of marks, disposed on the catalytic layer, each of the marks having a side wall and an upper surface; and a plurality of second coverings, the second coverings covering the upper surface of the marks, wherein each The first covers and each of the second covers include metal nanowires.

In some embodiments of the present invention, the catalytic layer is an insulating layer, and the insulating layer is filled with catalytic particles.

In some embodiments of the present invention, the particles are nanoparticles.

In some embodiments of the present invention, it further comprises: a film layer covering the touch sensing electrode, the catalytic layer, the first coverings and the second coverings.

In some embodiments of the present invention, it further includes non-conductive areas respectively disposed in the display area and the peripheral area.

In some embodiments of the present invention, the non-conductive region has a filling layer made of the same material as the film layer.

In some embodiments of the present invention, each of the first covers has a side surface, and the side surface and the sidewalls of the peripheral leads are a common etching surface.

In some embodiments of the present invention, each of the second covers has a side surface, and the side surface and the sidewall of the marks are a common etching surface.

In some embodiments of the present invention, the metal nanowires do not exist on the sidewalls of the peripheral lead and the sidewall of the mark.

In some embodiments of the present invention, the marks include a docking alignment mark disposed on the peripheral area of each of the touch panels, or a cutting alignment mark disposed between adjacent touch panels. , or an alignment mark, orientation mark, dimension mark or number/text mark arranged on the substrate.

In some embodiments of the present invention, the width of the peripheral leads is 5 μm-20 μm, and the distance between the adjacent peripheral leads is 5 μm-20 μm.

In some embodiments of the present invention, the peripheral leads and the markers are made of metal materials; the touch sensing electrodes include metal nanowires.

Description of drawings

1A to 1C are schematic diagrams of steps of a manufacturing method of a touch panel according to some embodiments of the present invention.

FIG. 2 is a schematic top view of a touch panel according to some embodiments of the present invention.

FIG. 2A is a schematic cross-sectional view along line A-A of FIG. 2 .

FIG. 2B is a schematic cross-sectional view along line B-B of FIG. 2 .

3 is a schematic top view of a touch panel and a flexible circuit board assembled according to some embodiments of the present invention.

FIG. 4A is a schematic cross-sectional view of a variation of the line A-A of FIG. 2 .

FIG. 4B is a schematic cross-sectional view of a variation of the line B-B of FIG. 2 .

5 is a schematic top view of a touch panel according to another embodiment of the present invention.

FIG. 5A is a schematic cross-sectional view along line A-A of FIG. 5 .

6 is a schematic cross-sectional view of a touch panel according to another embodiment of the present invention.

FIG. 6A is a schematic cross-sectional view along line A-A of FIG. 6 .

7 is a schematic diagram of a touch sensor tape according to an embodiment of the present invention.

Description of reference numbers:

100: Touch Panel

110: Substrate

120: Peripheral lead

122: Sidewall

124: upper surface

140: Mark

142: Sidewall

144: Upper surface

130: film layer

136: Non-conductive area

140: Metal Nanowires

160: Shielded wire

170: Flexible circuit board

180: Catalytic Layer

ML: metal layer

NWL: Metal Nanowire Layer

VA: Display area

PA: Surrounding area

BA: junction area

CA: removal area

TE1: the first touch electrode

TE2: Second touch electrode

TE: Touch Electrode

C1: First Cover

C1L: Side

C2: Second Cover

C2L: Side

C3: Third Cover

D1: first direction

D2: second direction

Detailed ways

Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some conventional structures and components will be shown in a simple schematic manner in the drawings.

As used herein, "about", "approximately" or "approximately" generally means that the index value is within twenty percent of the error or range, preferably within ten percent, more preferably within within five percent. Unless explicitly stated in the text, the numerical values mentioned are considered as approximations, that is, with errors or ranges such as "about", "approximately" or "approximately".

Please refer to FIG. 2 , which is a schematic top view of the touch panel 100 according to some embodiments of the present invention. The touch panel 100 includes a substrate 110 , a peripheral lead 120 , a mark 140 , a first cover C1 , a second cover C2 , a catalytic layer 180 and a touch sensing electrode TE. The above-mentioned peripheral lead 120 , the mark 140 , the first cover The number of C1 , the second cover C2 and the touch sensing electrode TE may be one or more, and the numbers drawn in the following specific embodiments and drawings are for illustration only, and do not limit the present invention. Referring to FIG. 2 , the substrate 110 has a display area VA and a peripheral area PA, and the peripheral area PA is disposed on the side of the display area VA. upper and lower sides), but in other embodiments, the peripheral area PA may be an L-shaped area disposed on the left and lower sides of the display area VA. As also shown in FIG. 2 , the catalytic layer 180 of this embodiment is disposed in the peripheral area, and there are eight groups of peripheral leads 120 and a first cover C1 corresponding to the peripheral leads 120 disposed in the peripheral area PA of the substrate 110; The control sensing electrode TE is disposed in the display area VA of the substrate 110 . In this embodiment, the metal material required for the peripheral lead 120 and the mark 140 is formed only in the peripheral area PA and not in the display area VA by using the catalytic layer 180 , so the cost of using a large amount of metal materials in the conventional technology can be greatly reduced.

In this embodiment, two sets of marks 140 and a second cover C2 corresponding to the marks 140 are disposed on the peripheral area PA of the substrate 110 , and the first cover C1 and the second cover C2 are respectively disposed on the peripheral lead 120 . The upper surface 122 and the upper surface 144 of the mark 140 can form the upper and lower layers of materials at predetermined positions without alignment, so it can reduce or avoid the need to set the alignment error area in the process, so as to reduce the PA in the peripheral area. , and then meet the narrow border requirements of the display.

Specifically, referring to FIGS. 1A to 1C , the touch panel in the embodiment of the present invention can be fabricated as follows: First, a substrate 110 is provided, which has a predefined peripheral area PA and a display area VA. Next, a catalytic layer 180 is formed on the peripheral area PA (as shown in FIG. 1A ); next, a metal layer ML is formed on the catalytic layer 180 (as shown in FIG. 1B ); then a metal nanowires layer NWL is formed on the peripheral area PA and display Area VA (as shown in FIG. 1C ); then patterning is performed to form the first cover C1 , the second cover C2 , the peripheral leads 120 and the marks 140 . A more detailed description will be given below.

Please refer to FIG. 1A , the catalyst layer 180 is mainly used to catalyze the deposition of the metal layer ML, so it can also be called an activation layer; in one embodiment, the catalyst layer 180 can be formed by printing, such as letterpress printing or gravure printing. It is printed on the peripheral area PA of the substrate 110 in a manner, but not limited thereto. The catalytic layer 180 is an insulating layer or an insulating layer filled with catalytic particles. For example, the catalytic layer 180 can be acrylic resin or epoxy resin, which can be filled with nano-conductive particles or catalytic nanoparticles. In other words, the above-mentioned particles are dispersed in the resin layer, and make the catalyst layer 180 exhibit overall insulation. In one embodiment, the nanoparticles are palladium nanoparticles, copper/palladium nanoparticles, etc., and the thickness of the catalyst layer 180 is less than about 1 μm, such as about 1 μm to about 10 nm.

Referring to FIG. 1B , the catalyst layer 180 can be used to form a metal layer ML, which can be patterned to become the peripheral lead 120 and the mark 140 . In detail, in some embodiments of the present invention, the peripheral lead 120 and the marker 140 may be formed of metal with better conductivity, preferably a single-layer metal structure, such as a silver layer, a copper layer, etc.; or a multi-layer conductive layer. Structures, such as molybdenum/aluminum/molybdenum, copper/nickel, titanium/aluminum/titanium, molybdenum/chromium, etc., the above-mentioned metal structures are preferably opaque, such as visible light (such as wavelengths between 400nm-700nm) light penetration Transmission is less than about 90%.

In this embodiment, the copper layer is deposited on the catalyst layer 180 by electroless plating; and since there is no catalyst layer 180 in the display area VA, the copper layer is only deposited on the peripheral area PA. Electroless plating is to reduce the metal ions in the plating solution to metal under the catalysis of a metal catalyst with the help of a suitable reducing agent without an applied current, and plate it on the surface. This process is called electroless plating. It is chemical plating or autocatalytic plating. Therefore, the metal layer ML of this embodiment can also be called an electroless plating layer, an electroless plating layer or an autocatalytic plating layer. Specifically, for example, a plating solution whose main component is copper sulfate can be used, and its composition can be, but is not limited to, copper sulfate (copper sulfate) with a concentration of 5 g/L, and ethylenediaminetetraacetic acid (ethylenediaminetetraacetic acid) with a concentration of 12 g/L. acid), formaldehyde with a concentration of 5 g/L, pH of electroless copper plating solution adjusted to about 11 to 13 with sodium hydroxide (sodiμm hydroxide), bath temperature of about 50 to 70°C, reaction time of immersion The duration is 1 to 5 minutes; during the electroless plating reaction, the copper material can nucleate on the catalytic layer 180 with catalyzing/activating ability, and then the copper film continues to grow by the self-catalysis of copper.

Next, referring to FIG. 1C , a metal nanowires layer NWL including at least metal nanowires, such as a silver nanowires layer, a gold nanowires layer or a copper nanowires layer, is formed. The layers are coated on the peripheral area PA and the display area VA; the part of the metal nanowire layer NWL in the display area VA is formed on the substrate 110 , and the part in the peripheral area PA is formed on the metal layer ML. The specific method in this embodiment is as follows: forming a dispersion liquid or ink containing metal nanowires on the substrate 110 by a coating method, and drying the metal nanowires to cover the substrate 110 and the aforementioned metal layer ML The surface is formed into a metal nanowire layer disposed on the substrate 110 and the aforementioned metal layer ML. After the above-mentioned curing/drying step, the solvent and other substances are volatilized, and the metal nanowires are randomly distributed on the surface of the substrate 110 and the aforementioned metal layer ML; The metal nanowire layer NWL is formed on the surface of the aforementioned metal layer ML without falling off, and the metal nanowires can be in contact with each other to provide a continuous current path, thereby forming a conductive network.

In the embodiment of the present invention, the above-mentioned dispersion liquid may be water, alcohol, ketone, ether, hydrocarbon or aromatic solvent (benzene, toluene, xylene, etc.); the above-mentioned dispersion liquid may also contain additives, interface active agents or Binders such as carboxymethyl cellulose (CMC), 2-hydroxyethyl Cellulose (HEC), hydroxypropyl methylcellulose (HPMC), sulfonates, sulfuric acid esters, disulfonates, sulfosuccinates, phosphates, or fluorosurfactants, among others. The dispersion liquid or slurry containing metal nanowires can be formed on the surface of the substrate 110 and the aforementioned metal layer ML in any way, such as but not limited to: screen printing, nozzle coating, roller coating and other processes; In one embodiment, a roll-to-roll (RTR) process may be used to apply the dispersion or slurry containing the metal nanowires on the surfaces of the continuously supplied substrate 110 and the aforementioned metal layer ML.

As used herein, "metal nanowires" is a collective term that refers to a collection of metal wires comprising a plurality of elemental metals, metal alloys or metal compounds (including metal oxides), wherein the metal nanowires contained therein are Quantity does not affect the protection scope claimed by the present invention; and at least one cross-sectional dimension (ie, the diameter of the cross-section) of a single metal nanowire is less than about 500 nm, preferably less than about 100 nm, and more preferably less than about 50 nm; and the present invention The new metal nanostructures, called "wires", mainly have high aspect ratios, for example, between about 10 and 100,000. ) can be greater than about 10, preferably greater than about 50, and more preferably greater than about 100; the metal nanowires can be any metal, including but not limited to silver, gold, copper, nickel, and gold-plated silver. Other terms, such as silk, fiber, tube, etc., which also have the above-mentioned dimensions and high aspect ratio, are also covered by the present invention.

Next, patterning is performed. In one embodiment, an etchant capable of etching the metal nanowire layer NWL and the metal layer ML at the same time is used to form the first cover C1, the second cover C2, the peripheral leads 120 and the Mark 140. This embodiment may specifically include the following steps: first, exposing/developing a photosensitive material (eg, photoresist) (ie, a well-known lithography process) to define the pattern of the peripheral lines 120 and the marks 140 in the peripheral area PA; then, performing etching , to fabricate the first cover C1 and the second cover C2 composed of the metal nanowire layer NWL and the peripheral circuit 120 composed of the metal layer ML on the peripheral area PA (please refer to FIG. 2 , FIG. 2A and FIG. 2B).

According to a specific embodiment, when the metal nanowire layer NWL is a nano-silver layer, and the metal layer ML is a copper layer, the etching solution can be used to etch copper and silver, for example, the main component of the etching solution is H ₃ PO ₄ (the ratio is about 5% to 15%) and _HNO3 (ratio of about 55% to 70%) to remove copper and silver materials in the same process. In another specific embodiment, additives, such as an etching selectivity adjuster, can be added to the main component of the etching solution to adjust the rate of etching copper and silver; for example, the main component can be H ₃ PO ₄ (about 5% to 15%) and HNO ₃ (about 55% to 70%) with about 5% to 10% of Benzotriazole (BTA) to solve the problem of copper over-etching.

In the patterning step, it may further include: simultaneously patterning the metal nanowire layer NWL in the display area VA. In other words, the metal nanowire layer NWL of the display area VA can be patterned using the aforementioned etching solution to form the touch sensing electrodes TE of this embodiment in the display area VA, and the touch sensing electrodes TE can be electrically connected to the peripheral leads 120 . Specifically, the touch sensing electrode TE can also be a metal nanowires layer including at least metal nanowires. That is, after the patterning step, the metal nanowire layer NWL forms a touch sensing electrode in the display area VA TE, and the first cover C1 is formed in the peripheral area PA, so the touch sensing electrode TE can achieve electrical connection with the peripheral lead 120 through the contact of the first cover C1 with the peripheral lead 120 for signal transmission. The metal nanowire layer NWL also forms a second cover C2 in the peripheral area PA, which is disposed on the upper surface 144 of the mark 140. The mark 140 can be widely interpreted as a non-electrical function pattern, but not limited to this . In some embodiments of the present invention, the peripheral lead 120 and the mark 140 can be made of the same metal layer ML (ie, both are made of the same metal material, such as the aforementioned electroless copper plating layer); the touch sensing electrode TE . The first cover C1 and the second cover C2 can be made of the same metal nanowire layer NWL.

In a variant embodiment, the metal nanowire layers NWL located in the display area VA and the peripheral area PA can be patterned by different etching steps (ie, using different etching solutions).

FIG. 2 shows a schematic top view of the touch panel 100 according to an embodiment of the present invention, and FIGS. 2A and 2B are cross-sectional views taken along lines A-A and B-B of FIG. 2 , respectively. Please refer to FIG. 2A first. As shown in FIG. 2A , the peripheral lead 120 and the mark 140 are both disposed on the catalytic layer 180 . The first cover C1 and the second cover C2 are respectively formed to cover the upper surface 124 and Upper surface 144 of marking 140 . In some embodiments of the present invention, the metal nanowires may be nanosilver wires. For the convenience of description, the cross section of the peripheral lead 120 and the mark 140 is a quadrilateral (for example, the rectangle drawn in FIG. 1A ), but the side wall 122 and the upper surface 124 of the peripheral lead 120 and the side wall 142 and the upper surface of the mark 140 The structure type or quantity of the surface 144 can be changed according to practical applications, and is not limited by the text and drawings herein.

In this embodiment, the mark 140 is disposed on the bonding area BA of the peripheral area PA, which is a docking alignment mark, that is, a step of connecting an external circuit board, such as the flexible circuit board 170 to the touch panel 100 . (ie, the bonding step) is used to align the flexible circuit board 170 and the touch panel 100 with a mark (please refer to FIG. 2 ). However, the present invention does not limit the placement position or function of the mark 140. For example, the mark 140 may be any inspection mark, pattern or mark required in the process, which is within the scope of the present invention. The indicia 140 may have any possible shape, such as a circle, a quadrangle, a cross, an L-shape, a T-shape, and the like. On the other hand, the portion of the peripheral lead 120 extending to the bonding area BA may also be referred to as a bonding section. Similar to the previous embodiment, the upper surface of the bonding section in the bonding area BA is also covered by the first cover C1. cover.

As shown in FIG. 2A and FIG. 2B , in the peripheral area PA, a non-conductive area 136 is formed between adjacent peripheral leads 120 to electrically block adjacent peripheral leads 120 and avoid short circuits. That is, there are non-conductive regions 136 between the sidewalls 122 of adjacent peripheral leads 120 , and in this embodiment, the non-conductive regions 136 are gaps to isolate the adjacent peripheral leads 120 . In the step of disposing the first cover C1 on the peripheral lead 120, the above-mentioned gap can be formed by an etching method, so the side wall 122 of the peripheral lead 120 and the side C1L of the first cover C1 are a common etching surface, and Aligned with each other, that is, the sidewall 122 of the peripheral lead 120 and the side C1L of the first cover C1 are formed in the same etching step; similarly, the side wall 142 of the mark 140 and the side C2L of the second cover C2 are a common etching surface and are aligned with each other. In one embodiment, the sidewalls 122 of the peripheral leads 120 and the sidewalls 142 of the marks 140 do not have the metal nanowires present thereon due to the above-mentioned etching step. In more detail, in the bonding area BA shown in FIG. 2A , there is a non-conductive region 136 between adjacent bonding sections, and the sidewalls 122 of the bonding sections and the side surfaces of the first cover C1 C1L is a common etching plane. Furthermore, the peripheral lead 120 and the first cover C1 have the same or similar pattern and size, for example, they are both long and straight, and have the same or similar width; the marking 140 and the second cover C2 also have the same size. Or similar patterns and sizes, such as circles with the same or similar radii, quadrilaterals with the same or similar side lengths, etc., or other identical or similar cross-shaped, L-shaped, T-shaped and other patterns.

As shown in FIG. 2B , in the display area VA, there is a non-conductive area 136 between adjacent touch sensing electrodes TE to electrically block the adjacent touch sensing electrodes TE to avoid short circuits. That is to say, there is a non-conductive region 136 between the sidewalls of adjacent touch sensing electrodes TE, and in this embodiment, the non-conductive region 136 is a gap to isolate the adjacent touch sensing electrodes TE; in one implementation For example, the above-mentioned etching method can be used to form the gaps between adjacent touch sensing electrodes TE. In this embodiment, the touch sensing electrodes TE and the first cover C1 can be made of the same metal nanowire layer NWL (such as a nanosilver wire layer), so at the junction of the display area VA and the peripheral area PA, The metal nanowire layer NWL forms a climbing structure, so that the metal nanowire layer NWL can be shaped and cover the upper surface 124 of the peripheral lead 120 to form the first cover C1 .

In some embodiments of the present invention, the first cover C1 and the second cover C2 of the touch panel 100 are respectively disposed on the upper surface 122 of the peripheral lead 120 and the upper surface 144 of the mark 140 , which can reduce or avoid the need for process The requirement for setting the alignment error area in the middle is to reduce the width of the peripheral area PA, thereby achieving the narrow frame requirement of the display. Specifically, the width of the peripheral leads 120 of the touch panel 100 according to some embodiments of the present invention is about 5 μm to 20 μm, and the distance between adjacent peripheral leads 120 is about 5 μm to 20 μm. The width of the peripheral lead 120 is about 3 μm to 20 μm, the distance between adjacent peripheral leads 120 is about 3 μm to 20 μm, and the width of the peripheral area PA can also reach a size of less than about 2 mm, which is reduced by about 2 mm compared to conventional touch panel products. 20% or more of the border size.

In some embodiments of the present invention, when the voltage is 10 volts (V), the resistance between adjacent peripheral leads 120 of the touch panel 100 is greater than 1×10 ³ ohms (Ω), and according to Ohm’s law, The leakage current between adjacent peripheral leads 120 is less than 1× ^{10 −2} ampere (A); The leakage current between the leads 120 is less than 1×10 ⁻⁶ amps; preferably, the resistance between adjacent peripheral leads 120 of the touch panel 100 is greater than 1×10 ⁸ ohms, and the leakage between adjacent peripheral leads 120 is greater than 1×10 8 ohms. The current is less than 1×10 ^-7 amps. Under the condition of a voltage of 20 volts (V), the resistance between adjacent peripheral leads 120 of the touch panel 100 is greater than 1×10 ³ ohms (Ω), and according to Ohm’s law, the leakage between adjacent peripheral leads 120 The current is less than 2×10 ⁻² amperes (A); preferably, the resistance between adjacent peripheral leads 120 of the touch panel 100 is greater than 1×10 ⁷ ohms, and the leakage current between adjacent peripheral leads 120 is less than 2 ×10 ⁻⁶ amps; preferably, the resistance between adjacent peripheral leads 120 of the touch panel 100 is greater than 1×10 ⁸ ohms, and the leakage current between adjacent peripheral leads 120 is less than 2×10 ⁻⁷ amps. In this way, the touch panel of the embodiment of the present invention can achieve good electrical characteristics, so as to improve the touch sensitivity and the like.

FIG. 3 shows the assembled structure of the flexible circuit board 170 and the touch panel 100 after alignment, wherein the electrode pads (not shown) of the flexible circuit board 170 can be made of conductive glue (not shown, such as anisotropic conductive glue) to electrically connect the peripheral leads 120 of the bonding area BA on the substrate 110 . In some embodiments, an opening (not shown) may be opened in the first cover C1 in the bonding area BA to expose the peripheral leads 120, and conductive adhesive (eg, anisotropic conductive adhesive) may be filled into the first cover C1. The opening directly contacts the peripheral lead 120 to form a conductive path. In this embodiment, the touch sensing electrodes TE are arranged in a non-staggered arrangement. For example, the touch sensing electrodes TE are elongated electrodes extending along the first direction D1 and do not intersect with each other. However, in other embodiments, the touch sensing electrodes TE may have appropriate shapes, and should not be This limits the scope of the present invention. In this embodiment, the touch sensing electrode TE adopts a single-layer configuration, wherein the touch position can be obtained by detecting the change of the capacitance value of each touch sensing electrode TE.

In one embodiment, the touch panel 100 may include a film layer 130. FIGS. 4A and 4B are cross-sectional views taken along lines A-A and B-B in FIG. 2 after the film layer 130 is formed in the above-mentioned embodiment, respectively. In one embodiment, the film layer 130 covers the touch panel 100 comprehensively, that is to say, the film layer 130 covers the touch sensing electrodes TE, the first cover C1 and the second cover C2. As shown in FIG. 4A and FIG. 4B , in the peripheral area PA, the film layer 130 covers the first cover C1 and the second cover C2 , and the film layer 130 fills the non-conductive area between the adjacent peripheral leads 120 136, that is to say, there is a filling layer made of the same material as the film layer 130 in the non-conductive area 136 between the adjacent peripheral leads 120, so as to isolate the adjacent peripheral leads 120, and the film layer 130 covers the exposed area. Catalytic layer 180 of non-conductive region 136 . In addition, for a single set of corresponding peripheral leads 120 and the first cover C1, the film layer 130 will surround the single set of upper and lower corresponding peripheral leads 120 and the first cover C1. Specifically, the film layer 130 will Covering and contacting the upper surface of the first cover C1, the side walls 122 of the peripheral leads 120 and the side C1L of the first cover C1; that is, each peripheral lead 120 has a side wall 122 and an upper surface 124, Each first cover C1 has a side C1L, the side C1L and the side wall 122 are aligned with each other and both contact the filling layer (or the film layer 130 ), and the first cover C1 contacts the upper surface 124 of the corresponding peripheral lead 120 . Similarly, for a single set of corresponding marks 140 and the second cover C2, the film layer 130 will surround the single set of up and down corresponding marks 140 and the second cover C2. Specifically, the film layer 130 will cover and the upper surface of the second cover C2, the side wall 142 of the mark 140 and the side C2L of the second cover C2; that is, each mark 140 has a side wall 142 and an upper surface 144, each second The cover C2 has a side C2L, the side C2L and the side wall 142 are aligned with each other and both contact the filling layer (or the film layer 130 ), and each second cover C2 contacts the upper surface 144 of the corresponding mark 140 .

As shown in FIG. 4B , in the display area VA, the film layer 130 covers the touch sensing electrodes TE, and the film layer 130 fills the non-conductive area 136 between adjacent touch sensing electrodes TE, that is, The non-conductive region 136 between adjacent touch sensing electrodes TE has a filling layer made of the same material as the film layer 130, so as to isolate the adjacent touch sensing electrodes TE.

In this embodiment, the composite structure formed by the touch sensing electrodes TE of the display area VA and the film layer 130 preferably has conductivity and light transmittance. -700nm) light transmittance (Transmission) may be greater than about 80%, and the surface resistivity (surface resistance) is between about 10 to 1000 ohm/square (ohm/square); preferably, the visible light ( For example, the transmittance of light with wavelengths ranging from about 400 nm to 700 nm is greater than about 85%, and the surface resistivity is between about 50 and 500 ohm/square.

In some embodiments of the present invention, the film layer 130 may be polyethylene (PE), polypropylene (PP), polyvinyl butyral (PVB), polycarbonate (polycarbonate). ; PC), Acrylonitrile butadienestyrene (ABS), Poly(3,4-ethylenedioxythiophene) (PEDOT), Poly(styrenesulfonic acid) (PSS) or ceramic materials, etc. In one embodiment of the present invention, the film layer 130 may be, but not limited to, the following polymers: polyacrylic resins, such as polymethacrylates (eg, poly(methyl methacrylate)), poly(methyl methacrylate) Acrylates and polyacrylonitrile; polyvinyl alcohol; polyesters (eg, polyethylene terephthalate (PET), polyester naphthalate, and polycarbonate); polymers with high aromaticity, such as Phenolic resin or cresol-formaldehyde, polystyrene, polyvinyltoluene, polyvinylxylene, polyimide, polyamide, polyamideimide, polyetherimide, polysulfide, polysulfone, Polyphenylenes and polyphenyl ethers; polyurethanes (PU); epoxy resins; polyolefins (eg polypropylene, polymethylpentene and cycloolefins); cellulose; silicones and Other silicon-containing polymers (eg, polysesquioxane and polysilanes); polyvinyl chloride (PVC); polyacetate; polynorbornene; synthetic rubbers (eg, ethylene-propylene rubber; EPR) , Styrene-Butadiene Rubber (SBR), ethylene-Propylene-Diene Monomer (EPDM); and fluoropolymers (for example, polyvinylidene fluoride, polytetrafluoroethylene (TFE) or polyhexafluoropropylene); copolymers of fluoro-olefins and hydrocarbon olefins, etc. In other embodiments, silica, mullite, alumina, SiC, carbon fiber, MgO-Al ₂ O ₃ -SiO may be used _2. Inorganic materials such as Al ₂ O ₃ -SiO ₂ or MgO-Al ₂ O ₃ -SiO ₂ -Li ₂ O.

In addition, the above-mentioned film layer 130 can form a composite structure with metal nanowires (such as the first cover C1, the second cover C2 or the touch sensing electrode TE) to have certain specific chemical, mechanical and optical properties, such as providing a first The adhesiveness of the first cover C1, the second cover C2 and the substrate 110, or the better physical mechanical strength, so the film layer 130 may also be called a matrix. On the other hand, some specific polymers are used to make the film layer 130, so that the first cover C1 and the second cover C2 have additional surface protection against scratches and abrasions. In this case, the film layer 130 can be Known as a hardcoat, the use of materials such as polyacrylate, epoxy, polyurethane, polysilane, polysiloxane, poly(silicon-acrylic), etc., can make the first cover C1, the first cover The second cover C2 has higher surface strength to improve scratch resistance. Furthermore, UV stabilizers may be added to the film layer 130 to improve the UV resistance of the first cover C1 and the second cover C2. However, the above is only to illustrate the possibility of other additional functions/names of the film layer 130, and is not intended to limit the present invention. It is worth noting that the drawings herein draw the film layer 130 and the first cover C1 and the second cover C2 as different layer structures, but the polymer used to make the film layer 130 is not cured or pre-cured. The metal nanowires can infiltrate between the metal nanowires to form fillers in the state of being in a state of stagnation. After the polymer is cured, the metal nanowires will be embedded in the film layer 130. That is to say, the present invention does not limit the film layer 130 and the metal nanowire layer NWL. (For example, the structure between the first cover C1, the second cover C2 or the touch sensing electrodes TE).

FIG. 5 is a schematic top view of the touch panel 100 according to some embodiments of the present invention. This embodiment is similar to the embodiment shown in FIG. 2 , and the difference between this embodiment and the embodiment shown in FIG. 2 is mainly that: in this embodiment, the touch sensing electrodes TE adopt a double-layer configuration.

For the convenience of description, the first touch electrode TE1 and the second touch electrode TE2 are used to describe the configuration adopted in this embodiment. Referring to FIG. 5A , as in the previous embodiment, the catalytic layer 180 is disposed in the peripheral area PA and disposed on two opposite surfaces of the substrate 110 ; the first touch electrodes TE1 are formed on one side (the following surface) of the substrate 110 , and the touch electrodes The TE2 is formed on the other side (such as the upper surface) of the substrate 110 to electrically insulate the first touch electrode TE1 and the second touch electrode TE2 from each other; and the peripheral lead 120 connected to the first touch electrode TE1 and covering the The upper first cover C1 and the second cover C2 covered on the mark 140 are formed on the lower surface of the substrate and located on the catalytic layer 180 corresponding to the first touch electrodes TE1 . Similarly, the peripheral lead 120 connected to the second touch electrode TE2, the first cover C1 covering it, and the second cover C2 covering the mark 140 are formed corresponding to the second touch electrode TE2 on the upper surface of the substrate and on the catalytic layer 180 . The first touch electrodes TE1 are a plurality of elongated electrodes arranged along the first direction D1, and the second touch electrodes TE2 are a plurality of elongated electrodes arranged along the second direction D2. The elongated touch sensing electrodes TE1 and the elongated touch sensing electrodes TE2 have different extending directions and are staggered. The first touch sensing electrodes TE1 and the second touch sensing electrodes TE2 are respectively used for transmitting control signals and receiving touch sensing signals. From then on, the touch position can be obtained by detecting the signal change (eg, capacitance change) between the first touch sensing electrode TE1 and the second touch sensing electrode TE2. With this arrangement, the user can perform touch sensing at various points on the substrate 110 . The touch panel 100 of this embodiment may further include a film layer 130, which covers the touch panel 100 comprehensively, that is to say, the film layer 130 is disposed on the upper and lower sides of the substrate 110 and covers the first touch electrode TE1 , the second touch electrode TE2, the first cover C1 and the second cover C2, and the catalytic layers 180 on the upper and lower sides of the substrate 110 are respectively exposed to the non-conductive area 136 of the peripheral area PA, and the film layer 130 is also the same The above-mentioned exposed catalytic layer 180 is covered.

The double-sided touch panel 100 of some embodiments of the present invention can be fabricated in the following manner. For example, the catalytic layer 180 , the metal layer ML and the metal nanowire layer NWL are respectively formed on the opposite sides of the substrate 110 , and then the double-sided touch panel 100 is formed on the opposite sides of the substrate 110 respectively. Processes such as surface exposure and development are performed to form patterned first touch electrodes TE1 , second touch electrodes TE2 , marks 140 and peripheral circuits 120 on two opposite surfaces of the substrate 110 .

In one embodiment, in order to avoid mutual interference between the two opposite sides of the substrate 110 during exposure, light sources with different timings may be used for the exposure process. In another embodiment, the exposure process may be performed using light sources of different wavelengths. In another embodiment, UV blocking particles/UV absorbing particles can be added to the catalytic layers 180 on the opposite sides of the substrate 110 first, whereby the same UV light source can be used to perform a double-sided exposure process for patterning, and the UV blocking particles can be patterned. UV absorbing particles are capable of absorbing a portion of UV light at a specific wavelength (eg, at least 10%, 20%, 25%, or 20%-50% of the total energy), while being substantially transparent at visible wavelengths (eg, 400-700nm) , eg visible light transmission greater than 85% of the total energy. In one embodiment, the UV absorbing particles are the following compounds:

Phenol,2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl) (product name is " 234"), phenol,2,2'-methylene-bis(6-(2H-benzotriazol-2-yl)-4-(1,1,3, 3-tetramethylbutyl)) (product name is " 360"), the addition concentration of UV absorbing particles is about 1% to 5%.

FIG. 6 is a schematic top view of the touch panel 100 according to some embodiments of the present invention. This embodiment is similar to the embodiment of FIG. 2 . The main difference between this embodiment and the embodiment of FIG. 2 is that: in this embodiment, the touch panel 100 further includes a shielded wire 160 disposed in the peripheral area PA, and the shielded wire 160 The upper surface of is covered with a third cover C3. Referring to FIG. 6A , the shielding wire 160 is also located on the catalytic layer 180 , which mainly surrounds the touch sensing electrode TE and the peripheral lead 120 , and the shielding wire 160 extends to the bonding area BA and is electrically connected to the flexible circuit board 170 The shielded wire 160 can shield or eliminate signal interference or electrostatic discharge (Electrostatic Discharge, ESD) protection, especially the small current changes caused by human hands touching the connecting wires around the touch device.

The shielded wire 160 can be made of metal material, preferably refer to the description of the peripheral lead 120 or the mark 140; the third cover C3 is made of metal nanowires, preferably refer to the first cover C1 or the second cover The description of the cover C2 and the specific description of the foregoing embodiments can be applied to the shielded wire 160 and the third cover C3 of this embodiment. In some embodiments of the present invention, the shielded wires 160, the peripheral leads 120 and the markers 140 can be made of the same metal layer ML (that is, the three are made of the same metal material, such as the aforementioned electroless copper plating layer); The control sensing electrode TE, the third cover C3, the first cover C1 and the second cover C2 can be made of the same metal nanowire layer NWL. The touch panel 100 of this embodiment may further include a film layer 130, which covers the touch panel 100 comprehensively, that is to say, the film layer 130 not only covers the first touch electrode TE1, the second touch electrode TE2, the The first cover C1 and the second cover C2 also cover the third cover C3.

In some embodiments, the touch panel 100 described herein can be fabricated by a roll-to-roll process, which uses existing equipment and can be fully automated. Significantly reduces the cost of manufacturing touch panels. The specific process of the roll-to-roll coating is as follows: first, a flexible substrate 110 is selected, and the tape-shaped substrate 110 is installed between two rollers, and the roller is driven by a motor, so that the substrate 110 can be moved along between the two rollers. The action path of the continuous process. For example, the catalyst layer 180 is formed by printing, the metal layer ML is deposited by a plating tank, and the metal nanowire-containing paste is deposited on the surface of the substrate 110 by using a storage tank, a spray device, a brush coating device, and the like. The above steps are used to form the metal nanowire layer NWL, and patterning is performed by using an etching tank or spraying an etching solution. Then, the completed touch panel 100 is rolled out by the roller at the last end of the production line to form a touch sensor tape. As shown in FIG. 7 , a plurality of touch panels 100 can be fabricated on the surface of the substrate 110 of the touch sensor tape after the above process is completed, and the area outside the touch panel 100 is the removal area CA. There may be marks 140 on the surface; in this embodiment, the catalytic layer 180 is disposed on the peripheral area PA and the removal area CA of the touch panel 110 , therefore, the peripheral leads 120 of the touch panel 110 are disposed on the catalytic layer 180 , The markings 140 are also disposed on the catalytic layer 180; the markings 140 may be cutting alignment markings 140A located between the touch panels 100 (ie, the removal area CA), which are mainly used to separate the plurality of touch panels 100 from the The touch sensor tape is cut, cut, etc., to form individual touch panels 100 . Please refer to FIG. 7 . The control panel 100 is divided into individual touch panels 100; the marks 140 can also be alignment marks 140B, orientation marks 140C, dimension marks 140D, and numeral/text marks 140E. For example, the alignment marks 140B can be used for alignment; The direction mark 140C can be used to mark the process direction, such as the MD/TD direction of the substrate 110 ; the dimension mark 140D can be used to mark the ruler; the number/text mark 140E can be used for logos and other designs. In other words, the mark 140 of the present embodiment may include a cutting alignment mark 140A or the above-mentioned other marks 140B to 140E formed between adjacent touch panels 100 (ie, the removal area CA) on the touch sensor web, or It may also include the aforementioned docking alignment marks located in the peripheral area PA of the touch panel 100 or other marks required in the process. Similar to the previous embodiment, the markers 140A to 140E in this embodiment are made of metal materials, and the markers 140A to 140E are disposed on the catalytic layer 180 and the upper surface thereof is covered with a second cover C2. For details, please refer to the foregoing description. The specific content of the example touch panel 100 can also be referred to the above, which will not be repeated here.

The touch sensor roll of this embodiment may further include a film layer 130, which comprehensively covers the uncut touch panel 100 on the touch sensor roll, that is to say, the film layer 130 can cover the touch sensor roll The uncut touch panels 100 are then cut and separated into individual touch panels 100 . Specifically, the film layer 130 may cover the touch sensing electrode TE, the catalytic layer 180 (including the exposed catalytic layer 180 in the peripheral area PA and the removal area CA), the first cover C1 and the second cover C2.

In some embodiments of the present invention, the substrate 110 is preferably a transparent substrate, in detail, it can be a rigid transparent substrate or a flexible transparent substrate, and its material can be selected from glass, acrylic (polymethylmethacrylate; PMMA) ), polyvinyl chloride (polyvinyl Chloride; PVC), polypropylene (polypropylene; PP), polyethylene terephthalate (polyethylene terephthalate; PET), polyethylene naphthalate (polyethylene naphthalate; PEN) , polycarbonate (polycarbonate; PC), polystyrene (polystyrene; PS) and other transparent materials.

In some embodiments of the present invention, the film layer 130 is formed of an insulating material. For example, the material of the film layer 130 may be non-conductive resin or other organic materials. In some embodiments of the present invention, the film layer 130 may be formed by spin coating, spray coating, printing, or the like. In some embodiments, the thickness of the film layer 130 is about 20 nanometers to 10 micrometers, or 50 nanometers to 200 nanometers, or 30 to 100 nanometers. For example, the thickness of the film layer 130 can be about 90 nanometers or 100 nanometers.

A roll-to-roll line can adjust the sequence of multiple coating steps as desired along the motion path of the substrate or can incorporate any number of additional stations as desired. For example, in order to achieve a suitable post-processing process, pressure rollers or plasma equipment can be installed in the production line.

In some embodiments, the formed metal nanowires may be further post-treated to increase their conductivity, which may include process steps such as heating, plasma, corona discharge, UV ozone, pressure, or a combination of the above. For example, after the step of curing to form the metal nanowire layer NWL, a roller may be used to apply pressure thereon. In one embodiment, a pressure of 50 to 3400 psi may be applied to the metal nanowire layer NWL by one or more rollers. Preferably, a pressure of 100 to 1000 psi, 200 to 800 psi or 300 to 500 psi can be applied; and the above step of applying pressure is preferably performed before the step of coating the film layer 130 . In some embodiments, heating and pressure post-processing can be performed simultaneously; in particular, the metal nanowires formed can be subjected to pressure via one or more rollers as described above, and simultaneously heated, such as pressure applied by rollers 10 to 500 psi, preferably 40 to 100 psi; while heating the roller to between about 70°C and 200°C, preferably between about 100°C and 175°C, it can increase the conductivity of the metal nanowires. In some embodiments, the metal nanowires can preferably be exposed to a reducing agent for post-treatment. For example, metal nanowires composed of silver nanowires can preferably be exposed to a silver reducing agent for post-treatment. The silver reducing agent includes hydroboration. compounds, such as sodium borohydride; boron nitrogen compounds, such as dimethylaminoborane (DMAB); or gaseous reducing agents, such as hydrogen ( _H2 ). The exposure time is about 10 seconds to about 30 minutes, preferably about 1 minute to about 10 minutes.

Other details of this embodiment are generally the same as those described in the above-mentioned embodiments, and are not repeated here.

The structures of the different embodiments of the present invention can be referred to each other, and are not limited to the specific embodiments described above.

In some embodiments of the present invention, the metal layer is selectively disposed on a predetermined position on the substrate through the disposition of the catalytic layer, so it is not necessary to coat the metal on the entire surface, thereby achieving the effect of saving the manufacturing cost.

In some embodiments of the present invention, by designing the surrounding leads and/or markings to have the first or second covering formed by metal nanowires, the error space reserved in the alignment process can be avoided, Therefore, the width of the peripheral area can be effectively reduced.

Although the present utility model has been disclosed above in various embodiments, it is not intended to limit the present utility model. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present invention should be determined by the scope of the appended patent application.

Claims (22)

1. A touch panel, characterized in that, comprising: a substrate, wherein the substrate has a display area and a peripheral area; a catalytic layer, arranged in the peripheral area; a plurality of peripheral leads disposed on the catalytic layer, each of the peripheral leads has a sidewall and an upper surface; a plurality of marks, disposed on the catalytic layer, each of the marks has a side wall and an upper surface; A plurality of first covers and a plurality of second covers, the first covers cover the upper surface of the peripheral leads, the second covers cover the upper surface of the marks, each of the The first covering and each of the second coverings include metal nanowires, the peripheral leads, the markings, the first coverings and the second coverings disposed in the peripheral region of the substrate; and A touch sensing electrode is disposed in the display area of the substrate, and the touch sensing electrode is electrically connected to the peripheral leads. 2 . The touch panel of claim 1 , wherein the catalytic layer is an insulating layer, and the insulating layer is filled with catalytic particles. 3 . 3 . The touch panel of claim 2 , wherein the particles are nanoparticles. 4 . 4 . The touch panel of claim 1 , further comprising non-conductive regions respectively disposed in the display region and the peripheral region. 5 . 5 . The touch panel of claim 4 , further comprising: a film layer covering the touch sensing electrode, the catalytic layer exposed in the non-conductive region of the peripheral region, the first a cover and the second covers. 6 . The touch panel of claim 1 , wherein each of the first covers has a side surface, and the side surface and the sidewalls of the peripheral leads are a common etching surface. 7 . 7 . The touch panel of claim 1 , wherein each of the second covers has a side surface, and the side surface and the sidewall of the marks are a common etching surface. 8 . 8 . The touch panel of claim 1 , wherein the marks comprise docking alignment marks. 9 . 9 . The touch panel of claim 1 , wherein a width of the peripheral leads is 5 μm to 20 μm, and a distance between adjacent peripheral leads is 5 μm to 20 μm. 10 . 10 . The touch panel of claim 1 , wherein the peripheral leads and the markings are made of metal material; the touch sensing electrodes comprise the metal nanowires. 11 . 11 . The touch panel of claim 1 , wherein a resistance value between adjacent peripheral leads among the peripheral leads is greater than 1×10 ³ ohms. 12 . 12. A touch sensor tape, characterized in that, comprising: A substrate, wherein a plurality of touch panels and removal areas other than the touch panels are disposed on the substrate, and each of the touch panels includes: a display area, a peripheral area, a plurality of peripheral leads, a plurality of A first cover and a touch sensing electrode, wherein a catalytic layer is disposed on the peripheral area and the removal area; the peripheral leads are disposed on the catalytic layer, and each peripheral lead has a sidewall and an upper surface a surface; the first covers cover the upper surface of the peripheral leads, the peripheral leads and the first covers are disposed in the peripheral area of each of the touch panels; and a touch sensing electrode, disposed in the display area of each of the touch panels, the touch sensing electrodes are electrically connected to the peripheral leads; a plurality of marks disposed on the catalytic layer, each of the marks having a sidewall and an upper surface; and A plurality of second covers, the second covers cover the upper surface of the marks, wherein each of the first covers and each of the second covers include metal nanowires. 13 . The touch sensor tape of claim 12 , wherein the catalytic layer is an insulating layer, and the insulating layer is filled with catalytic particles. 14 . 14. The touch sensor tape of claim 13, wherein the particles are nanoparticles. 15 . The touch sensor tape of claim 12 , further comprising non-conductive regions respectively disposed in the display area and the peripheral area. 16 . 16 . The touch sensor web of claim 15 , further comprising: a film layer covering the touch sensing electrode, the catalytic layer, the first coverings and the second coverings 16 . thing. 17 . The touch sensor tape of claim 12 , wherein each of the first covers has a side surface, and the side surface and the sidewalls of the peripheral leads are a common etched surface. 18 . 18 . The touch sensor tape of claim 12 , wherein each of the second covers has a side surface, and the side surface and the sidewall of the marks are a common etched surface. 19 . 19 . The touch sensor tape according to claim 12 , wherein the marks comprise butt alignment marks disposed in the peripheral area of each of the touch panels, or a mark disposed in the removal area. 20 . Cut registration marks, registration marks, orientation marks, dimension marks or number/text marks. 20 . The touch sensor tape of claim 12 , wherein the width of the peripheral leads is 5 μm to 20 μm, and the distance between adjacent peripheral leads is 5 μm to 20 μm. 21 . 21 . The touch sensor tape of claim 12 , wherein the peripheral leads and the markings are made of metal material; the touch sensing electrodes comprise the metal nanowires. 22 . 22 . The touch sensor tape of claim 12 , wherein a resistance value between adjacent peripheral leads among the peripheral leads is greater than 1×10 ³ ohms. 23 .