CN208271201U - A kind of fingerprint mould group - Google Patents
A kind of fingerprint mould group Download PDFInfo
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- CN208271201U CN208271201U CN201820852081.1U CN201820852081U CN208271201U CN 208271201 U CN208271201 U CN 208271201U CN 201820852081 U CN201820852081 U CN 201820852081U CN 208271201 U CN208271201 U CN 208271201U
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- flexible circuit
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- fingerprint
- mould group
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Abstract
本申请涉及指纹识别领域，公开了一种指纹模组。指纹模组包括：盖板、柔性电路板及指纹识别传感器，指纹识别传感器设置在盖板及柔性电路板之间；指纹传感器与柔性电路板电性连接；盖板朝向柔性电路板的一面包括第一区域及第二区域，第二区域为指纹识别传感器对应的区域；第一区域上涂覆有导电层，导电层与柔性电路板电性连接。本申请实施例在第一区域上涂覆导电层，当手指按压盖板时，手指与导电层之间就会形成感应电容，电容的变化会触使柔性电路板唤醒指纹识别传感器。由此可见，本申请实施例中，当手指按压盖板时，指纹识别传感器才会进入工作状态，这有助于降低指纹模组的功耗，满足当前移动终端对低功耗指纹模组设计的需求。
The application relates to the field of fingerprint identification, and discloses a fingerprint module. The fingerprint module includes: a cover plate, a flexible circuit board, and a fingerprint identification sensor. The fingerprint identification sensor is arranged between the cover plate and the flexible circuit board; the fingerprint sensor is electrically connected to the flexible circuit board; the side of the cover plate facing the flexible circuit board includes a second The first area and the second area, the second area is the area corresponding to the fingerprint recognition sensor; the first area is coated with a conductive layer, and the conductive layer is electrically connected with the flexible circuit board. In the embodiment of the present application, a conductive layer is coated on the first area. When a finger presses the cover, an inductive capacitance is formed between the finger and the conductive layer. The change in capacitance will trigger the flexible circuit board to wake up the fingerprint recognition sensor. It can be seen that in the embodiment of the present application, when the finger presses the cover, the fingerprint recognition sensor will enter the working state, which helps to reduce the power consumption of the fingerprint module and meets the requirements of the current mobile terminal for low-power fingerprint module design. demand.
Description
Technical field
This application involves fingerprint recognition field, in particular to a kind of fingerprint mould group.
Background technique
With the fast development of the development of biometric sensor, especially fingerprint Identification sensor, fingerprint recognition sensing
Device is widely used in the fields such as mobile terminal, smart home, automotive electronics.But with the mobile end of employing fingerprint identification sensor
The technology innovation at end, the also increasingly diversification of the function of fingerprint mould group.Under the premise of guaranteeing excellent fingerprint recognition performance, use
Requirement of the family to the power consumption of fingerprint mould group is also higher and higher, this brings more challenges to the structure design of fingerprint mould group.
(1 represents cover board to the structure of existing fingerprint mould group in figure, and 2 represent fingerprint Identification sensor, and 3 represent as shown in Figure 1
Refer to flexible circuit board, 4 represent stiffening plate), in order to detect user's operation in time, the fingerprint mould group of this structure needs one
Straight in running order, this will obviously additionally increase power consumption, be unable to satisfy current mobile terminal to low-power consumption fingerprint module design
Demand.
Utility model content
The application section Example is designed to provide a kind of fingerprint mould group, reduces the power consumption of fingerprint mould group, to meet
Demand of the current mobile terminal to low-power consumption fingerprint module design.
The embodiment of the present application provides a kind of fingerprint mould group, comprising: cover board, flexible circuit board and fingerprint Identification sensor,
The fingerprint Identification sensor is arranged between the cover board and the flexible circuit board；The fingerprint sensor and the flexibility
Circuit board is electrically connected；The one side of the cover board towards the flexible circuit board includes first area and second area, and described
Two regions are the corresponding region of the fingerprint Identification sensor；On the first area be coated with conductive layer, the conductive layer with
The flexible circuit board is electrically connected.
The embodiment of the present application in terms of existing technologies, conductive coating on the first region, when finger presses cover clamp
When, it just will form inductance capacitance between finger and conductive layer, the variation of capacitor, which can touch, makes flexible circuit board wake up fingerprint recognition biography
Sensor.That is, when finger does not press cover clamp, fingerprint Identification sensor can be at dormant state in the embodiment of the present application,
When finger presses cover clamp, fingerprint Identification sensor can just enter working condition, this facilitates the power consumption for reducing fingerprint mould group, with
Meets the needs of current mobile terminal is to low-power consumption fingerprint module design.
In addition, being additionally provided with the non-conductive ink layer for covering the first area and the second area on the cover board；Institute
The non-conductive ink layer of the conductive layer coated on the first area is stated towards in the one side of the flexible circuit board.It is arranged non-
Conductive ink layer can indicate the position of fingerprint mould group.
In addition, the conductive layer is also coated on the second area；The conductive layer towards the flexible circuit board one
Non-conductive ink layer is also coated on face, and the non-conductive ink layer at least covers the conductive layer of the second area.
The specific set-up mode of another kind of conductive layer and non-conductive ink layer is provided.
In addition, the fingerprint mould group further includes a lantern ring, the cover board, the flexible circuit board and the fingerprint recognition are passed
Sensor is embedded in the hollowed out area of the lantern ring.The one kind for providing cover board, flexible circuit board and fingerprint Identification sensor is specific
Position is set.
In addition, the ring wall of the lantern ring extends a step to the hollowed out area, the step is set around the ring wall
It sets；The cover board is fixed on the step.The step for being surrounded on ring wall is set, and is fixed on cover board on step, is conducive to
Waterproof and dustproof, light leakage, to preferably protect the components such as flexible circuit board and fingerprint Identification sensor.
In addition, being reserved with gap between the cover board and the ring wall.The conductive layer being beneficial to prevent on cover board and outside
Conducting forms short circuit.
In addition, one end of the flexible circuit board extends towards the direction of the cover board, bending part is formed；The bending part with
The conductive layer is electrically connected.
In addition, the bending part is between the step and the cover board.
In addition, being additionally provided with a notch on the ring wall of the lantern ring, the other end of the flexible circuit board passed through described lack
Mouth extends to the external of the lantern ring.
In addition, the conductive layer is conductive ink layer or ITO conductive glass layer.
Detailed description of the invention
One or more embodiments are illustrated by the picture in corresponding attached drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element in attached drawing with same reference numbers label are expressed as similar element, remove
Non- to have special statement, composition does not limit the figure in attached drawing.
Fig. 1 is the structural schematic diagram of fingerprint mould group according to prior art；
Fig. 2 is a kind of structural schematic diagram according to the fingerprint mould group of the application first embodiment；
Fig. 3 is another structural schematic diagram according to the fingerprint mould group of the application first embodiment；
Fig. 4 is the top view according to the lantern ring of the application second embodiment；
Fig. 5 is the sectional view according to the lantern ring of the application second embodiment；
Fig. 6 is a kind of structural schematic diagram according to the fingerprint mould group of the application second embodiment；
Fig. 7 is another structural schematic diagram according to the fingerprint mould group of the application second embodiment.
Specific embodiment
For the purposes, technical schemes and advantages of the application are more clearly understood, with reference to the accompanying drawings and embodiments, to this
Application section Example is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain
The application is not used to limit the application.
The application first embodiment is related to a kind of fingerprint mould group.As shown in Figure 2,3, which may include cover board 1, refers to
Line identification sensor 2 and flexible circuit board 3, fingerprint Identification sensor 2 are arranged between cover board 1 and flexible circuit board 3.
Specifically, can be connected by the first bonded adhesives 7 (such as DAF glue film) between cover board 1 and fingerprint Identification sensor 2.
It can link together by welding between fingerprint Identification sensor 2 and flexible circuit board 3, to realize that fingerprint recognition passes
The electric connection of sensor 2 and flexible circuit board 3 (Fig. 2,8 in 3 indicate scolding tin).In practical applications, fingerprint Identification sensor 2
Also electrically conductive glue connection, the present embodiment are without limitation between flexible circuit board 3.
In the present embodiment, the one side of cover board 1 towards flexible circuit board 3 includes first area 11 and second area 12, wherein
Second area 12 is the corresponding region of fingerprint Identification sensor 2.Conductive layer 4, conductive layer 4 and flexibility are coated on first area 11
It can be realized and be electrically connected by conducting connecting part 9 (such as conducting resinl, conducting foam) between circuit board 3.In this way, working as user's hand
When referring to by cover clamp 1, inductance capacitance just will form between finger and conductive layer 4, the variation of capacitor, which can touch, calls out flexible circuit board 3
Awake fingerprint Identification sensor 2.It can be seen that in the present embodiment, when finger presses cover clamp 1, fingerprint Identification sensor 2 just can be into
Enter working condition, to significantly reduce the power consumption of fingerprint mould group.It is noted that in practical application, in first area
On 11 when conductive coating 4, conductive layer 4 can cover entire first area 11, and it is soft can also only to cover the correspondence of first area 11
The position of property circuit board 3, the present embodiment are without limitation.
In addition, it is noted that conductive layer 4 can be conductive ink layer or ITO (Indium tin oxide, oxidation
Indium tin) conductive glass layer etc. can be realized the conductive coating of electrical communication, and the present embodiment is without limitation.
Preferably, non-conductive ink layer 5 can be also arranged in the present embodiment in one side of the cover board 1 towards flexible circuit board 3, with
Indicate the position of fingerprint mould group.It in one example, can first setting covering first area 11 and second area 12 on cover board 1
Non-conductive ink layer 5；Again in one side of the non-conductive ink layer 5 towards flexible circuit board 3 of first area 11, conductive coating
4 (referring to fig. 2, Fig. 2 is illustrated by taking the conductive layer 4 only partial region coated on first area 11 as an example), to guarantee to lead
The electric connection of electric layer 4 and flexible circuit board 3.It in another example, can be first in the first area of cover board 1 11 and second area
Conductive coating 4 on 12；Non-conductive ink layer 5 is coated in the one side in conductive layer 4 towards flexible circuit board 3 again, wherein non-to lead
Electric ink layer 5 at least covers the conductive layer 4 of second area, causes signal dry fingerprint Identification sensor 2 to avoid conductive layer 4
It disturbs, and non-conductive ink layer 5 will avoid the join domain (referring to Fig. 3) of conductive layer 4 Yu flexible circuit board 3, to guarantee conductive layer 4
With the electric connection of flexible circuit board 3.
Preferably, one end Chao Gai of flexible circuit board 3 can be made for convenience of the electric connection of conductive layer 4 and flexible circuit board 3
The direction of plate 1 extends, and forms a bending part 31, and the bending part 31 and conductive layer 4 are electrically connected.In practical applications, conductive layer 4
On the position that the corresponding bending part 31 in first area 11 can only be covered.
In addition, also stiffening plate can be arranged in one side of the flexible circuit board 3 away from fingerprint Identification sensor 2 in the present embodiment
6.Stiffening plate 6 can play the role of rigid support to flexible circuit board 3, fingerprint Identification sensor 2, facilitate fingerprint Identification sensor 2
With the welding between flexible circuit board 3.
In the present embodiment, cover board 1 can be glass cover-plate, ceramic cover plate, sapphire cover board or coating (Coating)
Layer；Alternatively, cover board 1 can also use the cover sheet of mobile terminal when fingerprint mould group is applied on mobile terminals.
The embodiment of the present application in terms of existing technologies, conductive coating 4 on the first region, when finger presses cover clamp
When 1, inductance capacitance just will form between finger and conductive layer 4, the variation of capacitor, which can touch, makes flexible circuit board 3 wake up fingerprint recognition
Sensor 2.That is, when finger does not press cover clamp 1, fingerprint Identification sensor 2 can be at suspend mode in the embodiment of the present application
State, when finger presses cover clamp 1, fingerprint Identification sensor 2 can just enter working condition, this helps to reduce fingerprint mould group
Power consumption, to meet the needs of current mobile terminal is to low-power consumption fingerprint module design.
Second embodiment of the present invention is related to a kind of fingerprint mould group.Second embodiment does the structure of fingerprint mould group
It is further improved, mainly the improvement is that: in present embodiment, which further includes a lantern ring 10 (such as Fig. 4,5 institutes
Show), cover board 1, fingerprint Identification sensor 2, flexible circuit board 3 and stiffening plate 6 are respectively positioned in the hollowed out area 101 of lantern ring 10.
As shown in Figure 6,7, the ring wall 102 of lantern ring 10 extends a step 103 to hollowed out area 101, which can ring
It is arranged around ring wall 102.Cover board 1 is fixed on step 103, can be by the second bonded adhesives 13 (as tied between cover board 1 and step 103
Structure glue) connection.It is reserved with gap between cover board 1 and ring wall 102, forms short circuit to prevent conductive layer 4 and turned on outside.Fingerprint recognition
Sensor 2, flexible circuit board 3 and stiffening plate 6 are located in the holding area that step 103 is trapped among.Wherein, flexible circuit board 3
Between step 103 and cover board 1, bending part 31 can be directly overlapped on step 103 bending part 31, can also be with step
Certain gap is reserved between 103, the present embodiment is without limitation.An also settable notch 104, soft on the ring wall of lantern ring 10
Property circuit board 3 the other end (one end opposite with bending part 31) notch 104 can be passed through extended to the external of lantern ring 10.
Present embodiment is for first embodiment, by cover board 1, fingerprint Identification sensor 2, flexible circuit board 3
And stiffening plate 6 is all placed in the hollowed out area 101 of lantern ring 10, and setting is surrounded on the step 103 of ring wall 102, keeps cover board 1 solid
It is scheduled on step 103, fingerprint Identification sensor 2, flexible circuit board 3 and stiffening plate 6 is made to be placed in the accommodating area that step 103 is trapped among
In domain, be conducive to waterproof and dustproof, light leakage, to preferably protect the components such as flexible circuit board 3 and fingerprint Identification sensor；
And the setting of step 103, it can also play the role of insulation and cover sheet 1；Meanwhile the present embodiment can also by lantern ring 10 with
The structure tolerance of other each components controls the thickness of conductive layer 4 and other each layers.
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiments of the present invention,
And in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising cover board, flexible circuit board and fingerprint Identification sensor, the fingerprint are known
Individual sensor is arranged between the cover board and the flexible circuit board；The fingerprint Identification sensor and the flexible circuit board
It is electrically connected；
The one side of the cover board towards the flexible circuit board includes first area and second area, and the second area is described
The corresponding region of fingerprint Identification sensor；Conductive layer, the conductive layer and the flexible circuit are coated on the first area
Plate is electrically connected.
2. fingerprint mould group according to claim 1, which is characterized in that be additionally provided with the covering first area on the cover board
And the non-conductive ink layer of the second area；
The conductive layer is coated on the non-conductive ink layer of the first area towards in the one side of the flexible circuit board.
3. fingerprint mould group according to claim 1, which is characterized in that the conductive layer is also coated on the second area；
The conductive layer is towards being also coated with non-conductive ink layer in the one side of the flexible circuit board, and the non-conductive ink layer is extremely
The conductive layer of the second area is covered less.
4. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes a lantern ring, the lid
Plate, the flexible circuit board and the fingerprint Identification sensor are embedded in the hollowed out area of the lantern ring.
5. fingerprint mould group according to claim 4, which is characterized in that the ring wall of the lantern ring extends to the hollowed out area
A step out, the step are arranged around the ring wall；
The cover board is fixed on the step.
6. fingerprint mould group according to claim 5, which is characterized in that between being reserved between the cover board and the ring wall
Gap.
7. fingerprint mould group according to claim 5, which is characterized in that one end of the flexible circuit board is towards the cover board
Direction extends, and forms bending part；
The bending part and the conductive layer are electrically connected.
8. fingerprint mould group according to claim 7, which is characterized in that the bending part is in the step and the cover board
Between.
9. fingerprint mould group according to claim 7, which is characterized in that be additionally provided with a notch, institute on the ring wall of the lantern ring
The other end for stating flexible circuit board is extended through the notch to the external of the lantern ring.
10. fingerprint mould group according to claim 1, which is characterized in that the conductive layer is that conductive ink layer or ITO are conductive
Glassy layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852081.1U CN208271201U (en) | 2018-06-01 | 2018-06-01 | A kind of fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852081.1U CN208271201U (en) | 2018-06-01 | 2018-06-01 | A kind of fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208271201U true CN208271201U (en) | 2018-12-21 |
Family
ID=64688917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820852081.1U Active CN208271201U (en) | 2018-06-01 | 2018-06-01 | A kind of fingerprint mould group |
Country Status (1)
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| CN (1) | CN208271201U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109819612A (en) * | 2019-01-04 | 2019-05-28 | 华勤通讯技术有限公司 | The shell of electronic product and the installation method of fingerprint mould group |
| CN110741381A (en) * | 2019-03-25 | 2020-01-31 | 深圳市汇顶科技股份有限公司 | Fingerprint identification devices and electronic equipment |
| CN111126351A (en) * | 2020-01-21 | 2020-05-08 | 北京京东方光电科技有限公司 | Fingerprint recognition module |
| CN112883872A (en) * | 2021-02-22 | 2021-06-01 | 业泓科技(成都)有限公司 | Identify sensing structure, fingerprint identification module and terminal |
| CN117011899A (en) * | 2023-08-03 | 2023-11-07 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint identification device and electronic equipment |
| CN117211597A (en) * | 2023-09-19 | 2023-12-12 | 业泓科技(成都)有限公司 | Intelligent door lock |
-
2018
- 2018-06-01 CN CN201820852081.1U patent/CN208271201U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109819612A (en) * | 2019-01-04 | 2019-05-28 | 华勤通讯技术有限公司 | The shell of electronic product and the installation method of fingerprint mould group |
| CN110741381A (en) * | 2019-03-25 | 2020-01-31 | 深圳市汇顶科技股份有限公司 | Fingerprint identification devices and electronic equipment |
| US11373436B2 (en) | 2019-03-25 | 2022-06-28 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
| CN111126351A (en) * | 2020-01-21 | 2020-05-08 | 北京京东方光电科技有限公司 | Fingerprint recognition module |
| CN111126351B (en) * | 2020-01-21 | 2024-02-09 | 北京京东方光电科技有限公司 | Fingerprint recognition module |
| CN112883872A (en) * | 2021-02-22 | 2021-06-01 | 业泓科技(成都)有限公司 | Identify sensing structure, fingerprint identification module and terminal |
| CN112883872B (en) * | 2021-02-22 | 2023-11-07 | 业泓科技(成都)有限公司 | Identification sensing structure, fingerprint identification module and terminal |
| CN117011899A (en) * | 2023-08-03 | 2023-11-07 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint identification device and electronic equipment |
| CN117011899B (en) * | 2023-08-03 | 2025-07-04 | 汇科(新加坡)控股私人有限公司 | Ultrasonic fingerprint identification device and electronic equipment |
| CN117211597A (en) * | 2023-09-19 | 2023-12-12 | 业泓科技(成都)有限公司 | Intelligent door lock |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20251010 Address after: 116222 Pukou Town, Pulandian City, Dalian City, Liaoning Province Patentee after: Song Min Country or region after: China Patentee after: Wang Xinwen Address before: 13 / F, block B, Tengfei Industrial Building, Futian Free Trade Zone, Shenzhen, Guangdong 518045 Patentee before: SHENZHEN GOODIX TECHNOLOGY Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20251105 Address after: 116081 Liaoning Province Dalian City Shahekou District Xinghai Jiatianxia Building 2 No. 1 1-2 floors public building Patentee after: Dalian Pincheng Technology Co.,Ltd. Country or region after: China Address before: 116222 Pukou Town, Pulandian City, Dalian City, Liaoning Province Patentee before: Song Min Country or region before: China Patentee before: Wang Xinwen |