CN207903587U - The receiving mechanism of semiconductor test braid all-in-one machine - Google Patents

Abstract

The utility model discloses a material receiving mechanism of a semiconductor test braiding integrated machine, which comprises a material receiving support plate and an installation base plate, the material receiving support plate is fixed and installed on the installation base plate workbench through bolts, and the installation base plate workbench There is also a receiving balance wheel on the top, and the receiving balance wheel shaft of the receiving balance wheel passes through the installation base plate and is connected with the output shaft of the receiving motor on the back of the installation base plate. sensor and stop sensor. In the utility model, when the stop sensor detects it, the receiving motor stops rotating, and the receiving balance wheel returns to the initial position through its own gravity. Pull up and repeat like this, at this time the carrier belt is not subjected to a large external force and will not be pulled and deformed; in addition, the design of the receiving pallet can facilitate the operator to check.

Description

The material receiving mechanism of the semiconductor test braiding machine

technical field

The utility model relates to the technical field of tape carrying equipment, in particular to a material receiving mechanism of a semiconductor testing and braiding integrated machine.

Background technique

Carrier tape refers to a strip-shaped product used in the field of electronic packaging. It has a specific thickness, and is equidistantly distributed along its length direction for holding electronic components and positioning holes for index positioning. Used with the cover tape, the electronic components such as resistors, capacitors, transistors, and diodes are carried and stored in the pocket of the carrier tape, and the cover tape is sealed on the top of the carrier tape to form a closed package, which is used to protect the electronic components during transportation However, with the precision and miniaturization of electronic components, electronic packaging materials are becoming narrower and narrower, and the production requirements for carrier tapes are also getting higher and higher. The currently used carrier tape receiving mechanism is inconvenient for visual inspection, and the carrier tape may be pulled and deformed, resulting in more dismantling by customers. Therefore, it is necessary to improve the existing material receiving device.

Utility model content

The purpose of this utility model is to provide a material receiving mechanism of a semiconductor testing and braiding machine to solve the problems raised in the above-mentioned background technology.

In order to achieve the above purpose, the utility model provides the following technical solutions: a material receiving mechanism of a semiconductor test braiding machine, including a material receiving pallet and an installation base plate, and the material receiving pallet is fixed and installed on the installation base plate workbench by bolts Above, the receiving balance wheel is also arranged on the workbench of the installation base plate, the receiving balance wheel shaft of the receiving material balance wheel passes through the installation base plate and is connected with the output shaft of the receiving motor on the back of the installation base plate, and the receiving material balance wheel shaft A start sensor and a stop sensor are respectively arranged near the shaft center.

Preferably, the receiving pallet is horizontally arranged on the installation base plate, one end of the receiving pallet protrudes a quarter of the length of the installation base plate, and the other end of the receiving pallet is located above the receiving balance wheel.

Preferably, the start sensor and the stop sensor are respectively electrically connected to the rewinding motor, and the start sensor, the stop sensor and the rewinding motor are all connected to a power source.

Preferably, a receiving shaft is arranged on the left side of the receiving motor, and the receiving shaft is fixedly installed on the back of the installation base, and the receiving motor and the receiving shaft are connected by a receiving belt.

Preferably, the model of the start sensor and the stop sensor is MC-441 position sensor.

Compared with the prior art, the beneficial effects of the utility model are as follows:

The utility model provides a material receiving mechanism of a semiconductor testing and braiding integrated machine. A start sensor and a stop sensor are installed at the axis of the material receiving balance wheel shaft. When the stop sensor is detected, the material receiving motor stops rotating, and the material receiving pendulum The wheel returns to the initial position by its own gravity, and when the start sensor detects it, the rewinding motor starts to move, and the rewinding balance wheel is pulled up again, and so on. At this time, the carrier belt is not subjected to a large external force, and no Pulling deformation has a certain protective effect on the pulling deformation of the carrier tape; in addition, the design of the receiving pallet can facilitate the inspection of the operator.

Description of drawings

Fig. 1 is a structural schematic diagram of the receiving mechanism of the semiconductor testing and braiding machine of the present invention.

In the figure: 1. Receiving pallet; 2. Installation bottom plate; 3. Receiving balance wheel; 4. Receiving balance wheel shaft; 5. Start sensor; 6. Stop sensor; 7. Receiving motor; 8. Receiving Material belt; 9. Receiving shaft.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figure 1, the utility model provides a technical solution: a material receiving mechanism of a semiconductor test braiding machine, including a material receiving pallet 1 and an installation base plate 2, and the material receiving pallet 1 is fixed and installed on the On the installation base plate 2 workbench, the receiving balance wheel 3 is also arranged on the installation base plate 2 work table, and the receiving balance wheel shaft 4 of the receiving material balance wheel 3 passes through the receiving base plate 2 and the installation base plate 2 back. The output shaft of the motor 7 is connected, and the receiving balance wheel shaft 4 is respectively provided with a start sensor 5 and a stop sensor 6 near the center of the axis. The material receiving pallet 1 is horizontally arranged on the installation base plate 2, one end of the material receiving pallet 1 extends out a quarter of the length of the installation base plate 2, and the other end of the material receiving pallet 1 is located on the receiving balance wheel 3 above.

The start sensor 5 and the stop sensor 6 are respectively electrically connected to the receiving motor 7, and the start sensor 5, the stop sensor 6, and the receiving motor 7 form a whole and are connected to the power supply. The left side of the receiving motor 7 is provided with a receiving shaft 9, and the receiving shaft 9 is fixedly installed on the back of the installation base plate 2, and the receiving motor 7 and the receiving shaft 9 are connected by a receiving belt 8. The model of described start sensor 5 and stop sensor 6 is MC-441 position sensor.

When the equipment is working, put the carrier tape flat on the receiving pallet 1, which is convenient for the operator to check in real time. After the carrier tape passes the receiving pallet 1, it passes through the receiving balance wheel 3. When the receiving motor 7 rotates to tighten the carrier tape , will pull the receiving balance wheel 3 inward, and the axis of the receiving balance wheel shaft 4 is equipped with a start sensor 5 and a stop sensor 6. When the stop sensor 6 detects it, the material receiving motor 7 stops rotating, and the receiving motor 7 The material balance wheel 3 returns to the initial position by its own gravity, and when the start sensor 5 detects at the same time, the material receiving motor 7 starts to move, and the material receiving balance wheel 3 is pulled up again, and so on. Large external force, no pulling deformation.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (5)

1. a kind of receiving mechanism of semiconductor test braid all-in-one machine, including rewinding supporting plate (1), mounting base (2), feature exists In the rewinding supporting plate (1) is mounted by means of bolts on mounting base (2) workbench, mounting base (2) workbench On be additionally provided with rewinding balance wheel (3), the rewinding balancing arbor (4) of the rewinding balance wheel (3) passes through mounting base (2) and mounting base (2) rewinding motor (7) output shaft at back is connected, and the rewinding balancing arbor (4) is respectively equipped with start feeling close to axis part and answers Device (5) and stopping inductor (6).

2. the receiving mechanism of semiconductor test braid all-in-one machine according to claim 1, which is characterized in that the rewinding support Plate (1) is horizontally set on mounting base (2), and the length of mounting base (2) a quarter is stretched out in described rewinding supporting plate (1) one end Degree, rewinding supporting plate (1) other end are located above rewinding balance wheel (3).

3. the receiving mechanism of semiconductor test braid all-in-one machine according to claim 1, which is characterized in that the start feeling It answers device (5) and stops inductor (6) and rewinding motor (7) is electrically connected, the priming inductor (5) stops inductor (6) It is connected with power supply with rewinding motor (7).

4. the receiving mechanism of semiconductor test braid all-in-one machine according to claim 1, which is characterized in that the rewinding horse Setting collecting shaft (9), the collecting shaft (9) are fixedly mounted on mounting base (2) back, the rewinding motor (7) on the left of up to (7) It is connected by rewinding belt (8) with collecting shaft (9).

5. the receiving mechanism of semiconductor test braid all-in-one machine according to claim 1 or 3, which is characterized in that described to open Dynamic inductor (5) and the model MC-441 position sensors for stopping inductor (6).