CN207818556U - A cooling element and IGBT module - Google Patents

Abstract

This disclosure relates to a kind of heat dissipation element, which includes heat radiator body and thermal column, and the heat radiator body is aluminium silicon-carbon heat radiator body；One end of the thermal column is fixed on by layer on the downside surface of the aluminium silicon-carbon heat radiator body, and the other end of the thermal column is free end.The disclosure additionally provides a kind of IGBT modules, which includes IGBT circuit boards and heat dissipation element as described above.Pass through above-mentioned technical proposal, thermal column is welded on by layer in aluminium silicon-carbon heat radiator body by the disclosure, while ensureing heat dissipation effect, need not be integrally formed to form thermal column, thus the demoulding loss for greatly reducing integrated mould, extends the service life of integrated mould.

Description

A cooling element and IGBT module

technical field

The present disclosure relates to the technical field of heat sinks, and in particular, to a heat dissipation element and an IGBT module.

Background technique

IGBT (Insulated Gate Bipolar Transistor) is a composite fully-controlled voltage-driven power semiconductor device composed of a bipolar transistor and an insulated gate field effect transistor, and is widely used in various electronic devices. With the development of high-current electronic equipment such as frequency converters, higher requirements are put forward for the performance of IGBT chips. IGBT chips withstand higher currents, and the heat generated during their work continues to increase. Therefore, cooling elements are needed to accelerate heat dissipation.

In the existing IGBT heat dissipation components, the heat dissipation columns are often provided through integral molding to increase the heat dissipation area and enhance the heat dissipation capability. However, the preparation of the integrally formed heat dissipation column has a high loss on the integrally formed mold, and the service life of the mold is very short.

Utility model content

The purpose of the present disclosure is to provide a heat dissipation element, which has a good heat dissipation effect and does not need to form a heat dissipation column through integral molding.

In order to achieve the above purpose, the present disclosure provides a heat dissipation element, the heat dissipation element includes a heat dissipation body and a heat dissipation column, the heat dissipation body is an AlSiC heat dissipation body; one end of the heat dissipation column is fixed on the AlSi On the lower surface of the carbon heat dissipation body, the other end of the heat dissipation column is a free end.

Optionally, there are multiple heat dissipation columns; the heat dissipation columns are at least one of copper columns, aluminum columns, aluminum alloy columns, and aluminum copper-clad columns.

Optionally, the draft angle β of the heat dissipation column is 0 degrees to 4 degrees, the height of the heat dissipation column is 5 to 10 mm, the cross section of the heat dissipation column is circular, and the cross section of the heat dissipation column is The diameter is 2-6mm.

Optionally, there are multiple heat dissipation columns, the distance between two adjacent heat dissipation columns is 0.4 millimeters to 1.1 millimeters, and the draft angle β of the heat dissipation columns is 0 degrees to 2 degrees.

Optionally, the heat dissipation columns are multiple groups of heat dissipation columns, and the multiple groups of heat dissipation columns are arranged at intervals along the length direction of the AlSiC heat dissipation body, and the multiple groups of heat dissipation columns include The heat dissipation columns of the first subgroup and the heat dissipation columns of the second subgroup arranged alternately in the length direction (5). The heat dissipation columns of the first subgroup and the heat dissipation columns of the second subgroup all include A plurality of heat dissipation columns arranged at intervals in the width direction of the carbon heat dissipation body.

Optionally, the solder layer is a Pb-based solder layer or a Sn-based solder layer; the thickness of the solder layer is 0.01 mm to 0.5 mm; the solder layer is distributed between the heat dissipation column and the aluminum-silicon-carbon heat dissipation body Bonded area and continuous solder layer.

Optionally, the solder layer is a PbSn solder layer, a PbSnAg solder layer, a SnAg solder layer or a SnSb solder layer.

Optionally, the aluminum-silicon-carbon heat dissipation body includes a silicon carbide porous framework and aluminum bonded inside the silicon carbide porous framework integrally formed by aluminizing.

Optionally, there is a plating layer between the aluminum silicon carbon heat dissipation body and the solder layer, and the plating layer is at least one of a nickel plating layer, a nickel gold plating layer and a copper plating layer.

Optionally, the thickness of the coating is 3-30 microns.

Optionally, the heat dissipation element also includes a ceramic aluminum-clad heat conductor, and one or more ceramic aluminum-clad heat conductors are integrally formed on the aluminum-silicon-carbon heat dissipation body, and the heat dissipation column and the ceramic aluminum-clad heat conductor are integrally formed. The heat conductors are respectively arranged on two opposite surfaces of the AlSiC heat dissipation body.

Optionally, the ceramic aluminum-clad heat conductor includes a ceramic insulating plate and a first aluminum layer and a second aluminum layer disposed on two opposite surfaces of the ceramic insulating plate, and the ceramic insulating plate passes through the The first aluminum layer is integrally connected to the aluminum silicon carbon heat dissipation body; the ceramic insulating plate isolates the second aluminum layer from the first aluminum layer, and the second aluminum layer and the aluminum Silicon carbon heat dissipation body isolation.

Optionally, the surface of the AlSiC heat dissipation body connected to the first aluminum layer is a flat surface.

Optionally, one or more grooves are opened on the AlSiC heat dissipation body, and the ceramic aluminum-clad heat conductor is embedded in the grooves.

Optionally, the upper surface of the second aluminum layer and the upper surface of the AlSiC heat dissipation body other than the groove form a flat surface.

Optionally, the surface opposite to the connecting surface of the second aluminum layer and the ceramic insulating board is integrally connected with a copper layer, and the thickness of the copper layer is 0.2-0.6 mm.

Optionally, one or more grooves are opened on the AlSiC heat dissipation body, and the ceramic aluminum-clad heat conductor is embedded in the grooves.

Optionally, the upper surface of the copper layer and the upper surface of the AlSiC heat dissipation body other than the groove form a flat surface.

Optionally, the ceramic insulating plate is an alumina ceramic plate, a toughened alumina ceramic plate, an aluminum nitride ceramic plate or a silicon nitride ceramic plate; the first aluminum layer and the second aluminum layer are pure aluminum layer and/or aluminum alloy layer.

Optionally, the thickness of the first aluminum layer is 0.02-0.15 mm, the thickness of the ceramic insulating plate is 0.25-1 mm, and the thickness of the second aluminum layer is 0.02-1.0 mm.

On the other hand, the present disclosure also provides an IGBT module, the IGBT module includes an IGBT circuit board and the heat dissipation element as described above.

Through the above technical solution, the present disclosure welds the heat dissipation column on the aluminum silicon carbon heat dissipation body through the welding layer. While ensuring the heat dissipation effect, it does not need to be integrally formed to form the heat dissipation column, thereby greatly reducing the demoulding of the integral molding mold loss, prolonging the life of the one-piece mold.

Other features and advantages of the present disclosure will be described in detail in the detailed description that follows.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the description, together with the following specific embodiments, are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the attached picture:

Fig. 1 is a cross-sectional view of a heat dissipation element without a ceramic aluminum-clad heat conductor.

Fig. 2 is a cross-sectional view of a heat dissipation element with a convexly bonded ceramic aluminum-clad heat conductor.

Fig. 3 is a cross-sectional view of a heat dissipation element with an embedded ceramic aluminum-clad heat conductor.

Fig. 4 is a bottom view of the heat dissipation element.

Fig. 5 is a cross-sectional view of a heat dissipation element with a convexly bonded ceramic aluminum-clad heat conductor.

Explanation of reference signs

1 Aluminum silicon carbon heat sink body 2 Ceramic insulation board

3 First aluminum layer 4 Second aluminum layer

5 Heat dissipation post 6 Solder layer

7 Slot 8 First Subgroup

9 second subgroup

Detailed ways

Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

In the present disclosure, the used orientation words such as "up, down, left, and right" generally refer to the directions shown in the plane of FIG. 1 unless stated otherwise.

On the one hand, the present disclosure provides a heat dissipation element, the heat dissipation element includes a heat dissipation body and a heat dissipation column 5, the heat dissipation body is an AlSiC heat dissipation body 1; one end of the heat dissipation column 5 is fixed on the On the lower surface of the AlSiC heat dissipation body 1 , the other end of the heat dissipation column 5 is a free end.

Wherein, the welding layer 6 can be formed between the AlSiC heat dissipation body 1 and the heat dissipation column 5 by adding solder and performing welding treatment. The welding process does not require a mold, and the heat dissipation column 5 and the AlSiC heat dissipation body 1 can be assembled through a guide plate, and a graphite pressure plate is used to press the guide plate so that the heat dissipation column 5 is close to the AlSiC Dissipate heat from the main body 1, and then perform welding. The welding treatment can be carried out in a welding furnace under reducing or inert atmosphere, and the welding temperature can be 270-395°C.

Optionally, there are multiple heat dissipation columns 5; the heat dissipation columns 5 are at least one of copper columns, aluminum columns, aluminum alloy columns, and aluminum copper-clad columns. In order to enhance the effect of heat dissipation and heat conduction, it is preferable that the heat dissipation column 5 is a copper column.

Optionally, the draft angle β of the cooling column 5 is 0°-4°. Such an arrangement helps to separate the heat dissipation column from the guide plate after welding. In order to further enhance the heat dissipation effect, preferably, the draft angle β of the heat dissipation column 5 is 0°-2°.

Optionally, the height of the cooling column 5 is 5-10 mm. By reasonably setting the height of the heat dissipation column 5 , the heat dissipation effect of the heat dissipation column 5 can be easily ensured.

Optionally, the cross section of the heat dissipation column 5 is circular and the average diameter of the cross section of the heat dissipation column 5 is 2-6 mm. By reasonably setting the average diameter of the cross section of the heat dissipation column 5 , the heat dissipation effect of the heat dissipation column 5 can be easily ensured. Wherein, when the draft angle β is not 0, the average diameter is the average value of the diameter of the free end of the cooling post 5 and the diameter of the welding section connecting the cooling post 5 and the solder layer 6 .

Optionally, there are multiple heat dissipation columns 5 , and the distance between two adjacent heat dissipation columns 5 is 0.4 mm to 1.1 mm. Such an arrangement can reduce the mutual interference between two adjacent cooling columns 5 at least to a certain extent, thereby ensuring the normal heat exchange of each cooling column 5 .

Optionally, as shown in FIG. 4, the heat dissipation columns 5 are multiple groups of heat dissipation columns 5, and the multiple groups of heat dissipation columns 5 are arranged at intervals along the length direction of the AlSiC heat dissipation body 1. The multiple groups of heat dissipation columns 5 includes the heat dissipation columns 5 of the first subgroup 8 and the heat dissipation columns 5 of the second subgroup 9 arranged alternately along the length direction of the AlSiC heat dissipation body 1, and the heat dissipation columns 5 of the first subgroup 8 and the heat dissipation columns 5 of the second subgroup 9 The heat dissipation pillars 5 of the second subgroup 9 each include a plurality of heat dissipation pillars 5 arranged at intervals along the width direction of the AlSiC heat dissipation body 1 . Wherein, the cooling columns 5 of the adjacent first subgroup 8 and the cooling columns 5 of the second subgroup 9 may be alternately arranged. It can be understood that the alternate arrangement of the heat dissipation columns 5 of the first subgroup 8 and the heat dissipation columns 5 of the second subgroup 9 can make the distribution of the plurality of heat dissipation columns 5 on the AlSiC heat dissipation body 1 reasonable, and can The heat exchange capacity of the cooling column 5 is guaranteed.

Optionally, the solder layer 6 is a Pb-based solder layer or a Sn-based solder layer. Selecting the Pb-based solder layer and the Sn-based solder layer has the advantage of being easy to solder and process.

Optionally, the solder layer 6 is a PbSn solder layer, a PbSnAg solder layer, a SnAg solder layer or a SnSb solder layer.

Optionally, the thickness of the solder layer 6 is 0.01mm˜0.5mm. Setting such a thickness is beneficial to saving materials, improving welding strength and heat conduction effect.

Optionally, the welding layer is distributed in the area where the heat dissipation column (5) is combined with the AlSiC heat dissipation body (1) and is a continuous welding layer.

Optionally, the AlSiC heat dissipation body 1 includes a silicon carbide porous skeleton and aluminum bonded inside the silicon carbide porous skeleton integrally formed by aluminizing. The aluminum filled in the silicon carbide porous skeleton can be filled in the silicon carbide porous skeleton by integral molding; the aluminum-silicon-carbon heat dissipation body can also be prepared by powder metallurgy: firstly, silicon carbide particles are prepared, and the silicon carbide The particles are mixed with aluminum powder in a certain proportion, and then the aluminum silicon carbon heat dissipation body is prepared through cold pressing, hot pressing, annealing and heat preservation; the aluminum filled in the silicon carbide porous skeleton can enhance the structural strength and connection strength of the heat dissipation body .

Optionally, there is a plating layer between the AlSiC heat dissipation body 1 and the solder layer 6 . The coating is beneficial to increase the strength of the welding layer.

Optionally, the plating layer is at least one of nickel plating, nickel gold plating and copper plating. Selecting the plating layer as at least one of the nickel plating layer, the nickel gold plating layer and the copper plating layer is conducive to the formation of the plating layer and to increasing the strength of the soldering layer.

Optionally, the thickness of the coating is 3-30 microns.

Optionally, the heat dissipation element also includes a ceramic aluminum-coated heat conductor, and one or more ceramic aluminum-coated heat conductors are integrally formed on the aluminum-silicon-carbon heat dissipation body 1, and the heat dissipation column 5 and the ceramic The aluminum-coated heat conductors are respectively arranged on two opposite surfaces of the AlSiC heat dissipation body 1 .

Optionally, the ceramic aluminum-clad heat conductor includes a ceramic insulating plate 2 and a first aluminum layer 3 and a second aluminum layer 4 disposed on two opposite surfaces of the ceramic insulating plate 2, and the ceramic insulating The plate 2 is integrally connected to the AlSiC heat dissipation body 1 through the first aluminum layer 3; the ceramic insulating plate 2 isolates the second aluminum layer 4 from the first aluminum layer 3, and The second aluminum layer 4 is isolated from the AlSiC heat dissipation body 1 . The first aluminum layer 3 is integrally formed to connect the heat dissipation body 1 and the ceramic insulating plate 2, and there are no voids or cracks between the layers, which can improve the strength, pressure resistance and heat dissipation efficiency of the heat dissipation element, and prolong the service life.

Optionally, the surface where the AlSiC heat dissipation body 1 is connected to the first aluminum layer 3 is a flat surface. That is, the AlSiC heat dissipation body 1 forms a convex combination with the ceramic aluminum-clad heat conductor. The formed flat surface can be used to stick the film during the subsequent etching, so that the film does not break, and the etching is performed according to the preset to improve the accuracy of the etching.

Optionally, one or more grooves 7 are opened on the AlSiC heat dissipation body 1 , and the ceramic aluminum-clad heat conductor is embedded in the grooves 7 . Wherein, the operation of opening one or more grooves 7 on the heat dissipation body 1 can be realized by a numerical control machine tool CNC. Putting the ceramic aluminum-coated heat conductor into the groove 7 of the aluminum-silicon-carbon heat dissipation body 1 can make the thickness of the aluminum layer of the ceramic aluminum-coated heat conductor easy to control when integrally formed, and the surface of the integrally formed heat dissipation element is smooth; When the surface of the above-mentioned heat dissipation element is etched, the edge of the film is not easily broken, which is convenient for circuit etching according to the expected design.

Optionally, the upper surface of the second aluminum layer 4 and the upper surface of the AlSiC heat dissipation body 1 other than the groove 7 form a flat surface. That is, the AlSiC heat dissipation body 1 forms an embedded combination with the ceramic aluminum-clad heat conductor. The formed flat surface can be used to stick the film during the subsequent etching, so that the film does not break, and the etching is performed according to the preset to improve the accuracy of the etching.

Optionally, the opposite surface of the connecting surface of the second aluminum layer 4 and the ceramic insulating board 2 is integrally connected with a copper layer, and the thickness of the copper layer is 0.2-0.6 mm. Adding the copper layer 8 forms a ceramic copper-clad aluminum heat conductor, which is beneficial to heat conduction and improves the support of the ceramic aluminum-copper heat conductor for electrical components, improves the structural strength of the ceramic aluminum-copper heat conductor, and prolongs the service life.

Optionally, one or more grooves 7 are opened on the AlSiC heat dissipation body 1 , and the ceramic aluminum-clad heat conductor connected with the copper layer 8 is embedded in the grooves 7 .

Optionally, the upper surface of the copper layer forms a flat surface with the upper surface of the AlSiC heat dissipation body 1 other than the groove 7 . The formed flat surface can be used to stick the film during the subsequent etching, so that the film does not break, and the etching is performed according to the preset to improve the accuracy of the etching.

Optionally, the ceramic insulating plate 2 is an alumina ceramic plate, a toughened alumina ceramic plate, an aluminum nitride ceramic plate or a silicon nitride ceramic plate; the first aluminum layer 3 and the second aluminum layer 4 It is pure aluminum layer and/or aluminum alloy layer. Both the aluminum layer and the aluminum alloy layer can meet the heat conduction design of the heat dissipation element, and the hardness of the aluminum layer and the aluminum alloy layer is lower, and the thermal shock resistance is better. The ceramic insulating board 2 of the above material has a lower density and a higher High hardness is conducive to prolonging the service life.

Optionally, the thickness of the first aluminum layer 3 is 0.02-0.15 mm, the thickness of the ceramic insulating plate 2 is 0.25-1 mm, and the thickness of the second aluminum layer 4 is 0.02-1.0 mm. The use of the aluminum layer and the ceramic insulating plate 2 of the above-mentioned thickness may improve the efficiency and structural strength of the ceramic aluminum-clad heat conductor, and prolong the service life.

On the other hand, the present disclosure also provides an IGBT module, the IGBT module includes an IGBT circuit board and the heat dissipation element as described above.

The heat dissipation element of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.

As shown in Figure 1, the heat dissipation element includes an AlSiC heat dissipation body 1 and a heat dissipation column 5; the thickness of the AlSiC heat dissipation body 1 is 4.5mm, the length is 215mm, and the width is 110mm, and the AlSiC The surface of the heat dissipation body 1 is plated with a nickel-plated layer; 368 heat dissipation columns 5 are welded on the surface of one side of the AlSiC heat dissipation body 1 through a solder layer 6, and the solder layer 6 is a PbSn solder layer.

The length of the heat dissipation column 5 is 8mm, and the thickness of the welding layer 6 is 0.2mm; one end of the heat dissipation column 5 with a diameter of 4mm is welded to the aluminum silicon carbon heat dissipation body through the welding layer 6, and the other end with a diameter of 3mm is Free end; the outer surface of the cooling column 5 is in contact with the cooling liquid, and transfers the heat generated by the operation of the IGBT to the cooling liquid.

As shown in Figure 2, the heat dissipation element includes a ceramic aluminum-coated heat conductor, an aluminum silicon carbon heat dissipation body 1 and a heat dissipation column 5; the thickness of the aluminum silicon carbon heat dissipation body is 4.5mm, the length is 215mm, and the width is 110mm, and The surface of the aluminum-silicon-carbon heat dissipation body 1 is plated with a copper-plated layer; the heat dissipation column 5 and the ceramic aluminum-coated heat conductor are respectively arranged on two opposite surfaces of the aluminum-silicon-carbon heat dissipation body; The carbon heat dissipation body and the ceramic aluminum-clad heat conductor, and the aluminum-silicon-carbon heat dissipation body and the heat dissipation column 5 are all connected to a flat surface; the ceramic aluminum-clad heat conductor or the ceramic copper-clad aluminum heat conductor is 2, and the 2 heat conductors The distance between them is 6.9 mm; the number of the heat dissipation columns 5 is 368 to meet the heat dissipation requirements, and the heat dissipation columns 5 are welded on the AlSiC heat dissipation body 1 through the solder layer 6, and the solder layer 6 is a PbSnAg solder layer.

The ceramic aluminum-clad heat conductor includes a ceramic insulating plate 2 with a thickness of 0.32 mm, a first aluminum layer 3 with a thickness of 0.1 mm and a first aluminum layer 3 with a thickness of 0.5 mm arranged on the opposite two surfaces of the ceramic insulating plate 2. The second aluminum layer 4, the ceramic insulating plate 2 isolates the second aluminum layer 4 from the first aluminum layer 3; the first aluminum layer 3 is integrally connected to the aluminum silicon carbon heat dissipation body to improve the ceramic coating The connection strength between the aluminum heat conductor and the aluminum silicon carbon heat dissipation body; the first aluminum layer 3, the second aluminum layer 4 and the insulating ceramic plate 2 are also integrally formed. The second aluminum layer 4 of the ceramic aluminum-clad heat conductor can be etched to form an IGBT circuit board. The ceramic aluminum-clad heat conductor supports the IGBT chip and produces heat conduction and insulation effects to ensure the safety of the IGBT module.

The length of the heat dissipation column 5 is 8mm, and the thickness of the solder layer 6 is 0.2mm; one end of the heat dissipation column 5 with a diameter of 4mm is fixedly connected with the AlSiC heat dissipation body, and the other end with a diameter of 3mm is a free end; The outer surface of the cooling column 5 is in contact with the cooling liquid, and transfers the heat generated by the IGBT operation to the cooling liquid.

As shown in Figure 3, the heat dissipation element includes a ceramic aluminum-coated heat conductor, an aluminum-silicon-carbon heat dissipation body 1 and a heat dissipation column 5, and the surface of the aluminum-silicon-carbon heat dissipation body 1 is plated with a nickel-plated layer; The heat dissipation body 1 has a thickness of 4.5mm, a length of 215mm, and a width of 110mm; the aluminum-silicon-carbon heat dissipation body is provided with three grooves 7 with a depth of 0.92mm, a length of 67mm, and a width of 61mm through a CNC machine tool, and the grooves 7 are connected to each other. The distance between them is 6.9mm, and the ceramic aluminum-coated heat conductor is embedded in the groove 7; the 368 heat dissipation columns 5 are welded on the aluminum-silicon-carbon heat dissipation body 1 through the solder layer 6 and embedded in the ceramic aluminum-coated heat conductor. On the opposite surface of the side surface, the solder layer 6 is a SnAg solder layer; the surface connecting the AlSiC heat dissipation body 1 with the heat dissipation column 5 is a flat surface.

The ceramic aluminum-clad heat conductor includes a ceramic insulating plate 2 with a thickness of 0.32 mm, a length of 67 mm, and a width of 61 mm, and a first aluminum plate with a thickness of 0.1 mm arranged on the two opposite surfaces of the ceramic insulating plate 2. layer 3 and a second aluminum layer 4 with a thickness of 0.5mm, the ceramic insulating plate 2 isolates the second aluminum layer 4 from the first aluminum layer 3, and there is a gap between the second aluminum layer 4 and the groove The interval of 1mm; the first aluminum layer 3 is integrally connected to the AlSiC heat dissipation body 1, so that the joint surface of the AlSiC heat dissipation body 1 and the first aluminum layer 3 forms an aluminum impregnated layer to improve the ceramic aluminum-coated heat conductor and The connection strength of the aluminum silicon carbon heat dissipation body 1; the first aluminum layer 3, the second aluminum layer 4 and the insulating ceramic plate 2 are also integrally formed. The second aluminum layer 4 of the ceramic aluminum-clad heat conductor can be etched to form an IGBT circuit board. The ceramic aluminum-clad heat conductor supports the IGBT chip and produces heat conduction and insulation effects to ensure the safety of the IGBT module.

The length of the heat dissipation column 5 is 8 mm, and the thickness of the solder layer 6 is 0.2 mm; one end of the heat dissipation column 5 with a diameter of 4 mm is welded to the aluminum silicon carbon heat dissipation body 1 through the solder layer 6, and the other end with a diameter of 3 mm is a free end; the outer surface of the cooling column 5 is in contact with the cooling liquid, and transfers the heat generated by the operation of the IGBT to the cooling liquid.

The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure. These simple modifications all belong to the protection scope of the present disclosure.

In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner if there is no contradiction. The combination method will not be described separately.

In addition, various implementations of the present disclosure can also be combined in any way, as long as they do not violate the idea of the present disclosure, they should also be regarded as the content disclosed in the present disclosure.

Claims (21)

1. a kind of heat dissipation element, which is characterized in that the heat dissipation element includes heat radiator body and thermal column (5), the heat radiator body For aluminium silicon-carbon heat radiator body (1)；One end of the thermal column (5) is fixed on the aluminium silicon-carbon heat radiator body (1) by layer (6) Downside surface on, the other end of the thermal column (5) is free end.

2. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) is multiple；The thermal column (5) it is that copper post, aluminium column, aluminium alloy column and aluminium cover at least one of copper post.

3. heat dissipation element according to claim 1, which is characterized in that the draft angle β of the thermal column (5) is 0 degree~4 The height of degree, the thermal column (5) is 5~10 millimeters, and the cross section of the thermal column (5) is the round and described thermal column (5) Cross section average diameter be 2~6 millimeters.

4. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) be it is multiple, it is two neighboring described The distance of thermal column (5) is 0.4 millimeter~1.1 millimeters, and the draft angle β of the thermal column (5) is 0 degree~2 degree.

5. heat dissipation element according to claim 1, which is characterized in that the thermal column (5) is multigroup thermal column (5), institute It states multigroup thermal column (5) along the length direction interval of the aluminium silicon-carbon heat radiator body (1) to be arranged, multigroup thermal column (5) packet Include the thermal column (5) and the second subgroup of the first subgroup for being arranged alternately along the length direction of the aluminium silicon-carbon heat radiator body (1) Include along the aluminium silicon in thermal column (5), the thermal column (5) of first subgroup and the thermal column (5) of second subgroup The spaced multiple thermal columns (5) of width direction of carbon heat radiator body (1).

6. heat dissipation element according to claim 1, which is characterized in that the layer (6) is Pb bases layer or Sn base layers； The thickness of the layer (6) is 0.01mm~0.5mm；The layer is distributed in the thermal column (5) and radiates with the aluminium silicon-carbon Ontology (1) combine region and be continuous layer.

7. heat dissipation element according to claim 1, which is characterized in that the layer (6) is PbSn layers, PbSnAg welderings Layer, SnAg layers or SnSb layers.

8. heat dissipation element according to claim 1, which is characterized in that the aluminium silicon-carbon heat radiator body (1) includes silicon carbide Stephanoporate framework and by the integrally formed combination of aluminising the silicon carbide porous skeletal internal aluminium.

9. heat dissipation element according to claim 1, which is characterized in that the aluminium silicon-carbon heat radiator body (1) and the layer (6) it is at least one of nickel coating, nickel plating layer gold and copper plate also to have coating, the coating between.

10. heat dissipation element according to claim 9, which is characterized in that the thickness of the coating is 3~30 microns.

11. the heat dissipation element according to any one of claim 1~10, which is characterized in that the heat dissipation element further includes Ceramics cover aluminium heat carrier, one or more ceramics are combined on the aluminium silicon-carbon heat radiator body (1) with being integrally formed cover aluminium Heat carrier, the thermal column (5) cover aluminium heat carrier with the ceramics and are separately positioned on the opposite of the aluminium silicon-carbon heat radiator body (1) Two surfaces on.

12. heat dissipation element according to claim 11, which is characterized in that it includes ceramic insulation that the ceramics, which cover aluminium heat carrier, Plate (2) and the first aluminium layer (3) being set on two opposite surfaces of the Ceramic insulator (2) and the second aluminium layer (4), and And the Ceramic insulator (2) is connected to the aluminium silicon-carbon heat radiator body (1) with being integrally formed by first aluminium layer (3) On；The Ceramic insulator (2) is isolated by second aluminium layer (4) with first aluminium layer (3), and second aluminium layer (4) It is isolated with the aluminium silicon-carbon heat radiator body (1).

13. heat dissipation element according to claim 12, which is characterized in that the aluminium silicon-carbon heat radiator body (1) and described the The surface that one aluminium layer (3) is connected is flat surface.

14. heat dissipation element according to claim 12, which is characterized in that offered on the aluminium silicon-carbon heat radiator body (1) One or more slots (7), the ceramics cover aluminium heat carrier and are embedded in the slot (7).

15. heat dissipation element according to claim 14, which is characterized in that the upper surface of second aluminium layer (4) with it is described Upper surface other than the slot (7) of aluminium silicon-carbon heat radiator body (1) forms flat surface.

16. heat dissipation element according to claim 12, which is characterized in that second aluminium layer (4) and Ceramic insulator (2) The apparent surface of connection surface is connected with layers of copper (8) with being also integrally formed, and the thickness of the layers of copper (8) is 0.2~0.6mm.

17. heat dissipation element according to claim 16, which is characterized in that offered on the aluminium silicon-carbon heat radiator body (1) One or more slots (7), the ceramics cover aluminium heat carrier and are embedded in the slot (7).

18. heat dissipation element according to claim 17, which is characterized in that the upper surface of the layers of copper is dissipated with the aluminium silicon-carbon Upper surface other than the slot (7) of hot ontology (1) forms flat surface.

19. heat dissipation element according to claim 12, which is characterized in that the Ceramic insulator (2) is aluminium oxide ceramics Plate, reinforced alumina ceramic plate, al nitride ceramic board or silicon nitride ceramic plate；First aluminium layer (3) and second aluminium layer (4) it is aluminum layer and/or aluminium alloy layer.

20. heat dissipation element according to claim 12, which is characterized in that the thickness of first aluminium layer (3) be 0.02~ The thickness of 0.15mm, the Ceramic insulator (2) are 0.25~1mm, and the thickness of second aluminium layer (4) is 0.02~1.0mm.

21. a kind of IGBT modules, which is characterized in that the IGBT modules include arbitrary in IGBT circuit boards and claim 1~20 Heat dissipation element described in one.