CN207731288U - Radio frequency identification module - Google Patents
Radio frequency identification module Download PDFInfo
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- CN207731288U CN207731288U CN201820164897.5U CN201820164897U CN207731288U CN 207731288 U CN207731288 U CN 207731288U CN 201820164897 U CN201820164897 U CN 201820164897U CN 207731288 U CN207731288 U CN 207731288U
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- inductor
- radio frequency
- frequency identification
- identification module
- coil
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000000565 sealant Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000008358 core component Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
技术领域technical field
本实用新型与无线通信装置有关,具体而言是指一种无线射频模块,具有微小化与可自动化生产的优点。The utility model relates to a wireless communication device, specifically a wireless radio frequency module, which has the advantages of miniaturization and automatic production.
背景技术Background technique
随着物联网的兴起,无线射频识别模块获得广泛的应用。目前的无线射频识别模块是利用基板来连接电感器与芯片,但这样的作法会占据较大的体积而不利于微小化,制作工序较为复杂,难以通过自动化生产来提高产能,使得制作成本也不容易降低。With the rise of the Internet of Things, radio frequency identification modules have been widely used. The current radio frequency identification module uses the substrate to connect the inductor and the chip, but this method will occupy a large volume and is not conducive to miniaturization. The production process is relatively complicated, and it is difficult to increase production capacity through automated production, making the production cost low easy to lower.
实用新型内容Utility model content
本实用新型的目的是提供一种无线射频识别模块,具有微小化与可自动化生产的优点。The purpose of the utility model is to provide a radio frequency identification module, which has the advantages of miniaturization and automatic production.
前述无线射频识别模块包含有一芯片与一电感器,该芯片具有两个以上的电子接点,电感器具有一磁芯,一线圈,以及两个电极设置于电感器表面且与线圈电性连接,其中电子接点沿着芯片与电感器连接方向的投影完全落在电极内,芯片直接以电子接点连接于电感器的电极。The aforementioned radio frequency identification module includes a chip and an inductor, the chip has more than two electronic contacts, the inductor has a magnetic core, a coil, and two electrodes are arranged on the surface of the inductor and are electrically connected to the coil, wherein the electronic The projection of the contact point along the connection direction between the chip and the inductor falls completely inside the electrode, and the chip is directly connected to the electrode of the inductor through the electronic contact.
优选地,所述两个以上的电子接点为铜箔、焊垫、锡球或导线架。Preferably, the two or more electronic contacts are copper foils, solder pads, solder balls or lead frames.
优选地,该线圈缠绕于该磁芯,该电感器还具有一封胶体密封该磁芯与该线圈。Preferably, the coil is wound around the magnetic core, and the inductor further has a sealant sealing the magnetic core and the coil.
优选地,所述两个电极设置于该封胶体表面。Preferably, the two electrodes are arranged on the surface of the encapsulant.
优选地,该线圈位于该磁芯内部。Preferably, the coil is located inside the magnetic core.
优选地,所述两个电极沿着平行一第一方向的间距小于或等于相邻两个电子接点沿着平行该第一方向的间距。Preferably, the distance between the two electrodes along a first direction parallel to the first direction is less than or equal to the distance between two adjacent electronic contacts along the first direction parallel.
因此,无线射频识别模块于制造时能够使用贴片机等设备将芯片置放于电感器,再利用表面附着技术(SMT)快速完成芯片与电感器的电性连接,制作程序简易且快速。而且不需要使用任何印刷电路板,有助于微小化且可自动化生产,可以降低材料与制造成本。Therefore, during manufacture of the radio frequency identification module, the chip can be placed on the inductor using a mounter and other equipment, and then the electrical connection between the chip and the inductor can be quickly completed using surface mount technology (SMT). The manufacturing process is simple and fast. Moreover, no printed circuit board is required, which is conducive to miniaturization and automatic production, and can reduce material and manufacturing costs.
附图说明Description of drawings
图1为实施例的立体分解图。Figure 1 is an exploded perspective view of the embodiment.
图2为实施例组装后的剖视图。Fig. 2 is a cross-sectional view of the assembled embodiment.
图3为实施例中芯片底部与电感器顶部的示意图。FIG. 3 is a schematic diagram of the bottom of the chip and the top of the inductor in an embodiment.
附图标记说明:Explanation of reference signs:
10 芯片 11 电子接点10 chips 11 electrical contacts
20 电感器 21 磁芯 22 线圈20 Inductor 21 Core 22 Coil
23 封胶体 24 电极23 Sealant 24 Electrode
W1,W2 间距 A 第一方向W1,W2 Distance A First direction
具体实施方式Detailed ways
为清楚说明本实用新型的具体结构与技术效果,搭配附图说明如后,说明所描述的上下前后左右等方向性描述是为了帮助理解,并非用来限制本实用新型的实施方式。In order to clearly illustrate the specific structure and technical effects of the present utility model, the accompanying drawings are described below. The directional descriptions such as up, down, front, back, left, and right described in the description are intended to help understanding, and are not intended to limit the implementation of the present utility model.
本实用新型所提供实施例为一无线射频识别模块,请参考图1至图 3,其主要由一芯片10与一电感器20所组成,芯片10是利用表面粘着技术直接电性连接于前述电感器20。其中,前述芯片10用来提供信号处理功能,电感器20则作为感应线圈,通过电磁感应来产生感应电流。The embodiment provided by the utility model is a radio frequency identification module, please refer to Fig. 1 to Fig. 3, it is mainly composed of a chip 10 and an inductor 20, the chip 10 is directly electrically connected to the aforementioned inductor by using surface-mounting technology device 20. Wherein, the aforementioned chip 10 is used to provide a signal processing function, and the inductor 20 is used as an induction coil to generate an induced current through electromagnetic induction.
请参考图2与图3,芯片10具有一本体11,以及多个电子接点12 位于本体11的底面所构成。本体11内部设有集成电路,电子接点12可以是铜箔、焊垫、锡球或导线架(LeadFlame)等导电材料所制成,与本体 11内部的集成电路电性连接以作为电子信号传输路径。在本实施例中,前述电子接点12的数量为四个,在其他的实施方式也能够只有2个或2 个以上的电子接点12,即可实现芯片10的功能。如图3所示,前述电子接点12分布于本体11底面的左右两侧,沿着本体11长度方向(可定义为第一方向A)相邻的2个电子接点12之间的间距为W1。Please refer to FIG. 2 and FIG. 3 , the chip 10 has a body 11 and a plurality of electronic contacts 12 are formed on the bottom surface of the body 11 . There is an integrated circuit inside the main body 11, and the electronic contact 12 can be made of conductive materials such as copper foil, solder pad, solder ball or lead frame (Lead Flame), and is electrically connected with the integrated circuit inside the main body 11 as an electronic signal transmission path . In this embodiment, the number of the aforementioned electronic contacts 12 is four, and in other embodiments, there may be only two or more electronic contacts 12 to realize the function of the chip 10 . As shown in FIG. 3 , the aforementioned electronic contacts 12 are distributed on the left and right sides of the bottom surface of the body 11 , and the distance between two adjacent electronic contacts 12 along the length direction of the body 11 (which can be defined as the first direction A) is W1.
请参考图2与图3,电感器20具有一磁芯21、一线圈22缠绕于磁芯21、一封胶体23密封前述磁芯21与线圈22,以及两个电极24设置封胶体23的顶面。前述电极24能够使用导电材料并以印刷、涂布或电镀等方法制成,并且于线圈22的导线电性连接。如图3所示,两个电极 24沿着平行第一方向A之间的间距为W2,间距W2小于或等于间距 W1,使得电子接点12沿着芯片10与电感器20连接方向的投影完全落在所述两个电极24内。Please refer to FIG. 2 and FIG. 3 , the inductor 20 has a magnetic core 21, a coil 22 wound around the magnetic core 21, a sealant 23 to seal the aforementioned magnetic core 21 and the coil 22, and two electrodes 24 are provided on the top of the sealant 23. noodle. The aforementioned electrodes 24 can be made of conductive materials by printing, coating or electroplating, and are electrically connected to the wires of the coil 22 . As shown in FIG. 3 , the distance between the two electrodes 24 along the parallel first direction A is W2, and the distance W2 is less than or equal to the distance W1, so that the projection of the electronic contact 12 along the direction of connecting the chip 10 to the inductor 20 falls completely. within the two electrodes 24 .
本实施例的无线射频识别模块于制造时,能够印刷或涂布导电材料于电极24的预定位置,接着使用贴片机(Surface Mount System)等设备将芯片10的电子接点12自动置放于电感器20的电极24,随后进行回焊 (Reflow)以形成电极24,同时完成芯片10与电感器20的电性连接,制作程序简易且快速。During manufacture of the radio frequency identification module of this embodiment, conductive material can be printed or coated on the predetermined position of the electrode 24, and then the electronic contact 12 of the chip 10 is automatically placed on the inductor by using equipment such as a surface mount system. The electrode 24 of the inductor 20 is then reflowed to form the electrode 24, and at the same time, the electrical connection between the chip 10 and the inductor 20 is completed. The manufacturing process is simple and fast.
值得一提的是,本实用新型所适用的电感器并不以前述实施例为限。磁芯与封胶体也可能利用磁性复合材料而整合为单一磁芯元件,同样将线圈封装于单一磁芯元件的内部。It is worth mentioning that the applicable inductors of the present invention are not limited to the aforementioned embodiments. The magnetic core and the encapsulant may also be integrated into a single magnetic core component by using magnetic composite materials, and the coil is also packaged inside the single magnetic core component.
由前述说明可知,本实用新型所提供的无线射频识别模块能够自动化快速制造,而且不需要另外设置使用印刷电路板(PCB)作为基板,有利于微小化,且进一步降低材料成本。It can be seen from the foregoing description that the radio frequency identification module provided by the present invention can be manufactured automatically and quickly, and does not need to use a printed circuit board (PCB) as a substrate, which is conducive to miniaturization and further reduces material costs.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820164897.5U CN207731288U (en) | 2018-01-31 | 2018-01-31 | Radio frequency identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820164897.5U CN207731288U (en) | 2018-01-31 | 2018-01-31 | Radio frequency identification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207731288U true CN207731288U (en) | 2018-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820164897.5U Expired - Fee Related CN207731288U (en) | 2018-01-31 | 2018-01-31 | Radio frequency identification module |
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| CN (1) | CN207731288U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112023991A (en) * | 2020-07-24 | 2020-12-04 | 中国科学院上海微系统与信息技术研究所 | A single-cell dielectric detection chip |
-
2018
- 2018-01-31 CN CN201820164897.5U patent/CN207731288U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112023991A (en) * | 2020-07-24 | 2020-12-04 | 中国科学院上海微系统与信息技术研究所 | A single-cell dielectric detection chip |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200102 Address after: Room 1603, 16 / F, Jiaxing commercial center, 23-29 Dundas street, Mongkok, Kowloon, China Patentee after: Lianlian Technology Co., Ltd Address before: Nan Touxian Patentee before: Wu Mingzhe |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180814 Termination date: 20210131 |