CN207201171U - Heat exchange structure of water cooling device - Google Patents

Abstract

A heat exchange structure of a water cooling device comprises: a body, a first chilled wafer; the body having at least a first space and connecting at least a first orifice and at least a second orifice, the first space having a first open side, the first space having a cooling fluid; the first cold-uniform chip has a first cold surface and a first hot surface, the first cold surface is connected with the first open side of the body in a butt joint manner, the first cold-uniform chip seals the first open side of the body, and the first cold-uniform chip directly cools the cooling fluid in the first space, so that the cooling efficiency of the cooling fluid cooled by the water cooling device is further improved.

Description

Heat exchange structure of water cooling device

【Technical field】

A heat exchange structure of a water cooling device, especially a heat exchange structure of a water cooling device that uses a cooling chip as an active cooling interface to cool a heat source.

【Background technique】

The traditional water-cooling device or heat dissipation module for dissipating heat from the heat source is mainly composed of a single or a plurality of heat dissipation units combined with each other. Vapor chambers and heat pipes made of other alloys and other materials are mainly used for heat absorption and heat conduction.

In addition, the water-cooling device also has a structure that dissipates heat from the heat source through water-cooling. This water-cooling method is mainly made of copper or aluminum, stainless steel, titanium or other alloys with better thermal conductivity at the bottom. A heat-conducting bottom plate, and one side of the heat-conducting bottom plate directly contacts the heat source, and the other side of the heat-conducting bottom plate is provided with a plurality of fins or fin columns to increase the heat dissipation area, and the side with the plurality of fins or fin columns is connected to a The main body of the water chamber is correspondingly assembled, and the water containing chamber filled with the cooling fluid of the main body is used to dissipate heat to achieve the effect of heat dissipation.

The water-cooled water-cooling device uses the cooling fluid to cool and take away the heat absorbed by the heat-conducting bottom plate through circulation, and guides the cooling fluid to the external water tank unit for a cooling cycle, and then guides it to the body for another heat exchange cycle, and then To achieve the effect of heat dissipation, but when the heat of the heat source is too high, although the water cooling device provides the heat exchange and cooling work of the heat source, if the cooling fluid that is led to the external cooling is not cooled, it is again guided into the body for heat dissipation. When exchanged, the water-cooling device cannot cool the heat source. Therefore, although the water-cooled water-cooled device has a better heat dissipation effect than the air-cooled water-cooled device, if the cooling fluid responsible for heat exchange is caused If it is not cooled properly during external cooling, it will not be able to reliably cool the heat source.

【Content of utility model】

Therefore, in order to solve the above-mentioned shortcomings of the known technology, the main purpose of the present utility model is to provide a heat exchange structure that can greatly improve the water cooling device.

In order to achieve the above purpose, the utility model provides a heat exchange structure of a water cooling device, comprising: a body, a first cooling chip;

The body has at least one first space and connects at least one first orifice and at least one second orifice, the first space has a first open side, the first space has a cooling fluid; the first The cooling chip has a first cold surface and a first hot surface, the first cold surface is in contact with the first open side of the body, and the first cooling chip closes the first open side of the body.

Through the water tank unit of the utility model that directly combines the cooling fluid with the first cooling chip, the cooling fluid in the water tank unit is directly cooled by the first cold surface of the first cooling chip, and its cooling efficiency is better than that of air cooling The cooling efficiency, can provide better cooling performance.

【Description of drawings】

Fig. 1 is the three-dimensional exploded view of the first embodiment of the heat exchange structure of the water cooling device of the present invention;

Fig. 2 is an exploded sectional view of the first embodiment of the heat exchange structure of the water cooling device of the present invention;

Fig. 3 is the combined sectional view of the second embodiment of the heat exchange structure of the water cooling device of the present invention;

Fig. 4 is a three-dimensional exploded view of the third embodiment of the heat exchange structure of the water cooling device of the present invention;

Fig. 5 is a three-dimensional exploded view of the fourth embodiment of the heat exchange structure of the water cooling device of the present invention;

Fig. 6 is an exploded sectional view of the fifth embodiment of the heat exchange structure of the water cooling device of the present invention;

Description of main symbols:

Heat exchange structure of water cooling device 1

Ontology 11

First Space 111

First longitudinal channel 111a

Second longitudinal channel 111b

The first transverse waterway 111c

Second transverse channel 111d

Third transverse waterway 111e

Fourth transverse waterway 111f

Central Transition Area 111g

The first water storage chamber 111h

Second water storage chamber 111i

first hole 111j

The second hole 111k

first orifice 112

Second orifice 113

first open side 114

second open side 115

The first cooling chip 12

The first cold noodle 121

The first convex body 121a

First hot side 122

The first cooling fins 122a

Second cooling chip 13

The second cold noodle 131

Second convex body 131a

Second hot side 132

Second cooling fins 132a

cooling fluid 2

The first tube body 3

Second tube body 4

The third tube body 5

pump 6

Water block 7

Heat source 8.

【Detailed ways】

The above-mentioned purpose of the utility model and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are three-dimensional decomposition and body dissection views of the first embodiment of the heat exchange structure of the water cooling device of the present invention. As shown in the figure, the heat exchange structure 1 of the water cooling device of the present invention includes: a body 11. A first cooling chip 12;

The body 11 has at least one first space 111 and connects at least one first hole 112 and at least one second hole 113, the first space 111 has a first open side 114, and the first space 111 has cooling fluid 2.

The first cooling chip 12 has a first cold surface 121 and a first hot surface 122, the first cold surface 121 is docked with the first open side 114 of the body 11, and the first cooling chip 12 closes the first open side 114 of the body 11 .

The first space 111 has a plurality of baffles 115 , and the baffles 115 form a plurality of waterways 116 , and the waterways 116 are connected to the aforementioned first orifice 112 and the second orifice 113 .

The main body 11 of this embodiment is a water tank unit of a water cooling device, mainly used as a cooling fluid 2, and this embodiment also discloses a first pipe body 3, a second pipe body 4, a third pipe body 5, and a pump 6 And a water cooling head 7, the body 11 is connected to the pump 6 and the water cooling head 7 through the first and second pipe bodies 3, 4, and the third pipe body 5 is connected to the pump 6 and the water cooling head 7 .

The first cold surface 121 of the first cooling chip 12 can extend a plurality of first protrusions 121a, the first protrusions 121a are either fins or fins, and the first protrusions 121a can increase the cooling fluid 2 The contact area with the first cold surface 121 improves the cooling efficiency.

This embodiment mainly discloses the use state of the water cooling device. When a heat source 8 is deheated, the water cooling head 7 is directly attached to the heat source 8, and then the water cooling head 7 absorbs the heat source 8. The heat generated, and the cooling fluid 2 flowing inside the water cooling head 7 will take the heat away from the water cooling head 7, and then guided by the second pipe body 3 into the inside of the water tank unit (body 11) for cooling, and because the body 11 directly The first space 111 is directly combined with the first cold surface 121 of the first cooling chip 12, and the cooling fluid 2 is directly cooled by the first cold surface 121, and the cooled cooling fluid 2 passes through the first cold surface 121. The tube body 3 flows through the pump 6, and then the pump 6 passes through the third tube body 5 and returns to the water cooling head 7 for a new cooling cycle, whereby the first cooling chip 12 provides low temperature directly to the cooling fluid 2 For cooling, compared with the traditional water tank unit through air cooling, the cooling efficiency is better.

Please refer to Fig. 3, which is a combined cross-sectional view of the second embodiment of the heat exchange structure of the water cooling device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the first space 111 of the body 11 has a plurality of first longitudinal waterways 111a, a plurality of second longitudinal waterways 111b, a first horizontal waterway 111c, a second horizontal waterway 111d and A third transverse waterway 111e, a fourth transverse waterway 111f, a central transition area 111g, a first water storage chamber 111h, and a second water storage chamber 111i.

Both ends of the first longitudinal water channel 111a are respectively connected to the first and second horizontal water channels 111c and the first water storage chamber 111h, and both ends of the second longitudinal water channel 111b are respectively connected to the third and fourth horizontal water channels 111e and 111f and the second water storage chamber 111i, the first, second, third, and fourth transverse water channels 111c, 111d, 111e, 111f are connected to the central transition area 111g, and the first orifice 112 is connected to the first water storage chamber 111h , the second orifice 113 is connected to the second water storage chamber 111i, and the central conversion area 111g is provided with a pump 6 .

The central conversion area 111g has a plurality of first holes 111j and a plurality of second holes 111k, the first hole 111j is connected to the first and second transverse waterways 111c and 111d, and the second hole 111k is connected to the third and fourth transverse waterways 111e , 111f.

The main body 11 of this embodiment is a water tank unit, which is mainly used to provide cooling fluid 2. When the cooling fluid 2 enters the first water storage chamber 111h of the main body 11 through the first orifice 112, it passes through and connects with the first storage chamber. The first longitudinal water channel 111a connected to the water chamber 111h flows to the first and second horizontal water channels 111c and 111d, and is transported to the central transition area 111g after being collected by the first and second horizontal water channels 111c and 111d. The pump 6 in the central conversion area 111g drives the cooling fluid 2 to flow from the third and fourth horizontal channels 111e, 111f to the second vertical channel 111b, and then guides the cooling fluid through the second vertical channel 111b 2 flows to the second water storage chamber 111i, and because the first open side 114 of the first space 111 is butted and closed by the first cold surface 121 of the first cooling chip 12 (refer to FIG. 1 ), the first The cold surface 121 can directly provide the cooling fluid 2 for cooling, which is better than the traditional cooling only through air cooling.

Please refer to Fig. 4, which is a perspective view of the third embodiment of the heat exchange structure of the water-cooling device of the present invention. The difference between this embodiment and the aforementioned first embodiment is that the first thermal surface 122 of the first cooling chip 12 extends a plurality of first heat dissipation fins 122a, and the first heat dissipation fins 122a extended by the first heat surface 122 122a is mainly used for improving the heat dissipation performance of the first cooling chip 12, and a heat dissipation fan (not shown) can also be connected with the first heat dissipation fin 122a relative to the first heat dissipation fin 122a, and the first heat dissipation fin 122a is provided by the heat dissipation fan The effect of forced cooling.

Please refer to Fig. 5, which is a perspective view of the fourth embodiment of the heat exchange structure of the water-cooling device of the present invention. The difference between this embodiment and the aforementioned first embodiment is that a pump 6 is provided in the first space 111 of this embodiment, and the pump 6 can guide the cooling fluid 2 by itself without an additional external pump. This embodiment is the first The space 111 is further provided with a guide channel 111m to make the cooling fluid 2 flow more smoothly.

Please refer to Fig. 6, which is a combined cross-sectional view of the fifth embodiment of the heat exchange structure of the water cooling device of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the aforementioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the aforementioned first embodiment is that the body 11 has a second open side 115 and a second cooling chip 13, and the second cooling chip 13 has a second cold surface 131 and a first cold surface 131. Two hot surfaces 132, the second open side 115 is located on the other side of the first open side 114 of the main body 11, and the second cold surface 131 of the second cooling chip 13 is correspondingly closed to cover the second Open side 115.

The second cold surface 131 of the second cooling chip 13 extends a plurality of second protrusions 131a, and the second protrusions 131a are any one of fins or fins. The second thermal surface 132 of the second cooling chip 13 extends a plurality of second cooling fins 132a.

The utility model mainly directly combines the cold surface of the cooling chip with the effect of direct cooling with the space for storing the cooling fluid in the water tank unit of the water cooling device, and the cooling surface of the cooling chip directly corresponds to the cooling fluid at a low temperature. Direct cooling, giving the cooling fluid the effect of direct cooling, which is more effective than the traditional known cooling efficiency that only circulates and diffuses heat through the water tank unit, effectively increasing the overall cooling performance of the cooling device.

Claims (11)

1. a kind of heat exchange structure of water cooling plant, it is characterised in that include：

One body, there is at least one first space and connect at least one first aperture and at least one second aperture, described first is empty Between there are one the one the first open sides, first space has cooling fluid；

One first cooling wafer, has one first huyashi-chuuka (cold chinese-style noodles) and one first hot face, and first huyashi-chuuka (cold chinese-style noodles) opens with the first of the body Side is docked, and first cooling wafer closes the first open sides of the body.

2. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that the first space tool of the body There are plural first longitudinal direction water channel and plural second longitudinal direction water channel and one first cross channel and one second cross channel and one the 3rd Cross channel and one the 4th cross channel and a central transition zone and one first reservoir chamber and one second reservoir chamber, the first longitudinal direction Water channel both ends connect first and second cross channel and first reservoir chamber respectively, and the second longitudinal direction water channel both ends connect respectively Third and fourth described cross channel and second reservoir chamber are connect, first, second, third and fourth cross channel connects center conversion Area, first aperture connect first reservoir chamber, and second aperture connects second reservoir chamber, and the central transition zone is set There is a pumping.

3. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that there is one first body and one the Two bodys and one the 3rd body and a pumping and a water-cooling head, the body is through first and second body and the pumping and the water cooling Head connection, the 3rd body connect the pumping and the water-cooling head.

4. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that the of first cooling wafer One hot plural first radiating fin of face extension.

5. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that have in first space multiple Number should form plural water channel, the water channel connects foregoing first aperture and second aperture every version every version.

6. the heat exchange structure of water cooling plant according to claim 2, it is characterised in that the central transition zone has multiple Several first holes and plural second hole, first hole connect first and second cross channel, second hole connect this 3rd, four cross channel.

7. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that have one in first space Pumping.

8. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that the body has one second to open Side and one second cooling wafer are put, second cooling wafer has one second huyashi-chuuka (cold chinese-style noodles) and one second hot face, and described second opens Side located at the body the first open sides opposite side, and the second huyashi-chuuka (cold chinese-style noodles) of second cooling wafer correspond to closing cover it is foregoing Second open sides.

9. the heat exchange structure of water cooling plant according to claim 1, it is characterised in that the of first cooling wafer Plural first convex body of one huyashi-chuuka (cold chinese-style noodles) extension, first convex body is fin or fin post any of which.

10. the heat exchange structure of water cooling plant according to claim 8, it is characterised in that second cooling wafer it Plural second convex body of second huyashi-chuuka (cold chinese-style noodles) extension, second convex body is fin or fin post any of which.

11. the heat exchange structure of water cooling plant according to claim 8, it is characterised in that second cooling wafer it Second hot plural second radiating fin of face extension.