CN207068817U - One kind takes brilliant crystal solidifying apparatus - Google Patents

Abstract

The utility model provides a crystal-fixing device, which includes a crystal-bonding plate, a crystal-bonding material setting table and a dipping pin plate, and the material pieces to be operated are placed on the crystal-bonding material setting table, and also includes a crystal-bonding longitudinal screw rod, Die-bonding vertical slider, Die-bonding vertical motor, Die-bonding vertical screw rod, Die-bonding vertical slider and Die-bonding vertical motor, Die-bonding vertical screw rod is horizontally and vertically arranged above the Die-bonding plate, Die-bonding The vertical slide block is installed on the die-bonding longitudinal screw rod, which rotates under the drive of the die-bonding longitudinal motor and drives the die-bonding vertical slider to move longitudinally, and puts the material on the die-bonding plate and the die-bonding plate by dipping the needle plate The automatic operation between the stations realizes the work of crystal extraction and bonding without manual additional operations, which reduces the labor intensity of operators and greatly improves the efficiency of crystal extraction and bonding.

Description

A kind of crystal extraction and solidification device

technical field

The utility model relates to the field of diode packaging, in particular to a crystal-taking and bonding device.

Background technique

In the packaging process of the diode, it is a very important process to attach the chip between the upper and lower material sheets of the diode. Traditionally, the realization of this process is mostly realized by manual or semi-manual methods. The specific implementation method is: the first worker uses a glue dispenser to dispense glue on the lower material, and then moves the lower material that has been dispensed to the next worker. Sieve the crystal grains (that is, chips) to the dispensing position of the lower material through the shaking plate to complete the crystal bonding, and then move the semi-finished product after the crystal bonding to the next worker, who then uses the glue dispenser on the upper material. Do glue dispensing, and then attach the upper material sheet to the finished product by yourself or others to complete the process of bonding the chip between the upper and lower material sheets of the diode.

Although there are automatic operation equipments in the prior art that can realize the operation of taking out and bonding the crystal, however, it is necessary to manually carry out the operation of picking and placing the tablet or aligning the crystal to be bonded, and the labor intensity of the operator is relatively high, and the work efficiency is low.

Utility model content

The technical problem to be solved by the utility model is: the labor intensity of the operators of the existing crystal extraction and crystal bonding equipment is relatively high and the work efficiency is low. The utility model provides a crystal extraction and crystal bonding device to solve the above problems.

The technical solution adopted by the utility model to solve the technical problem is: a crystal-taking and bonding device, including a crystal-bonding plate, a crystal-bonding material setting table and a dipping needle plate, and the material to be operated is placed on the crystal-bonding material On the stage, it also includes a crystal-bonding vertical screw rod, a crystal-bonding vertical slider, a crystal-bonding vertical motor, a crystal-bonding vertical screw rod, a crystal-bonding vertical slider, and a crystal-bonding vertical motor. Longitudinally and horizontally fixed above the crystal-bonding plate, the crystal-bonding longitudinal slider is installed on the crystal-bonding longitudinal screw, and the crystal-bonding longitudinal screw rotates under the drive of the crystal-bonding longitudinal motor and Drive the crystal-bonding vertical slider to move longitudinally, the crystal-bonding vertical screw rod is mounted on the crystal-bonding vertical slider, and the crystal-bonding vertical slider is mounted on the crystal-bonding vertical screw rod , the crystal-bonding vertical screw rod rotates under the drive of the crystal-bonding vertical motor and drives the crystal-bonding vertical slider to move vertically, and the dipping needle plate is arranged on the crystal-bonding vertical slider on the block.

Further: the crystal removal and crystal bonding device also includes a crystal bonding horizontal screw rod, a crystal bonding horizontal slider and a crystal bonding horizontal motor, the crystal bonding horizontal screw rod is fixedly arranged on the crystal bonding vertical slider, the The crystal-bonding lateral slider is installed on the crystal-bonding lateral screw rod, and the crystal-bonding lateral screw rod rotates under the drive of the crystal-bonding lateral motor and drives the crystal-bonding lateral slider to move laterally. The crystal vertical screw rod is fixedly arranged on the crystal-fixing horizontal slider.

Further: the number of the crystal-bonding boards is two, and the two crystal-bonding boards are arranged horizontally along the transverse direction, and the crystal-taking and crystal-bonding device also includes a board-changing horizontal screw, a board-changing horizontal slider, and a board-changing lateral Motor, the board changing horizontal screw rod is fixedly installed, the board changing horizontal slider is installed on the board changing horizontal screw rod, and the board changing horizontal screw rod is driven by the board changing horizontal motor to rotate and drive The horizontal sliding block for board replacement moves laterally, and the two die-bonding boards are fixedly arranged on the horizontal sliding block for board replacement.

Further: the upper surface of the crystal-bonding table is provided with several air holes, and the several air holes are connected with the vacuum air pipe.

The beneficial effect of the utility model is that a crystal taking and fixing device of the utility model is automatically operated between the crystal fixing plate and the crystal fixing material table by dipping the needle plate, and the work of taking the crystal and fixing the crystal is realized without manual labor Additional operations reduce the labor intensity of operators and greatly improve the efficiency of crystal extraction and bonding.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

Fig. 1, Fig. 2 and Fig. 3 are structural schematic diagrams of an optimal embodiment of a crystal extraction and bonding device of the present invention.

In the figure 1. Die-bonding plate, 2. Die-bonding material table, 3. Dip needle plate, 4. Die-bonding vertical screw, 5. Die-bonding vertical slider, 6. Die-bonding vertical motor, 7. Die-bonding vertical 8. Die-bonding vertical slider, 9. Die-bonding vertical motor, 10. Die-bonding horizontal screw, 11. Die-bonding horizontal slider, 12. Die-bonding horizontal motor, 13. Board replacement horizontal wire Bar, 14, changing plate transverse slide block, 15, changing plate transverse motor.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present utility model, but should not be construed as limiting the present utility model. On the contrary, the embodiments of the present invention include all changes, modifications and equivalents falling within the spirit and scope of the appended claims.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Axial", "Radial", "Circumferential" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention.

In addition, the terms "first", "second", etc. are used for descriptive purposes only, and should not be construed as indicating or implying relative importance. In the description of the present utility model, it should be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or Integratively connected; it can be mechanically or electrically connected; it can be directly connected or indirectly connected through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations. In addition, in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

Any process or method descriptions in flowcharts or otherwise described herein may be understood to represent modules, segments or portions of code comprising one or more executable instructions for implementing specific logical functions or steps of the process , and the scope of preferred embodiments of the invention includes additional implementations in which functions may be performed out of the order shown or discussed, including substantially concurrently or in reverse order depending on the functions involved, which It should be understood by those skilled in the art to which the embodiments of the present invention belong.

As shown in Fig. 1, Fig. 2 and Fig. 3, the utility model provides a crystal-taking and bonding device, which includes a crystal-bonding plate 1, a crystal-bonding table 2 and a needle dipping plate 3, and the material to be operated is placed on the On the said crystal-bonding table 2, it also includes a crystal-bonding vertical screw rod 4, a crystal-bonding vertical slider 5, a crystal-bonding vertical motor 6, a crystal-bonding vertical screw mandrel 7, a crystal-bonding vertical slider 8 and a crystal-bonding Vertical motor 9, the crystal-bonding longitudinal screw rod 4 is horizontally and fixedly arranged above the crystal-bonding plate 1 along the longitudinal direction, and the crystal-bonding vertical slider 5 is installed on the crystal-bonding longitudinal screw rod 4, the The crystal-bonding vertical screw rod 4 rotates under the drive of the crystal-bonding vertical motor 6 and drives the crystal-bonding vertical slider 5 to move longitudinally, and the crystal-bonding vertical screw rod 7 is installed on the crystal-bonding vertical slider 5, the crystal-bonding vertical slider 8 is mounted on the crystal-bonding vertical screw rod 7, and the crystal-bonding vertical screw rod 7 rotates under the drive of the crystal-bonding vertical motor 9 and drives the The crystal-bonding vertical slider 8 moves vertically, and the needle dipping plate 3 is arranged on the crystal-bonding vertical slider 8 . The pin dipping plate 3 can move longitudinally and vertically, so as to accurately pick and place the wafers on the die-bonding plate 1 onto the blanks on the die-bonding table 2 .

The crystal-taking and crystal-fixing device also includes a crystal-bonding transverse screw 10, a crystal-bonding transverse slider 11, and a crystal-bonding transverse motor 12, and the crystal-bonding transverse screw 10 is fixedly arranged on the crystal-bonding longitudinal slider 5, The crystal-bonding lateral slider 11 is mounted on the crystal-bonding lateral screw rod 10, and the crystal-bonding lateral screw rod 10 rotates under the drive of the crystal-bonding lateral motor 12 and drives the crystal-bonding lateral slider 11 Moving laterally, the die-bonding vertical screw rod 7 is fixedly arranged on the die-bonding horizontal slider 11 .

The arrangement density of the wafers on the die-bonding board 1 is very high. At this time, the pin-dipping board 3 can move laterally, so that the dipping-pin board 3 can stagger the crystals in the lateral direction when picking up the crystals. After the crystal extraction is completed at one position on the plate 1, the dipping pin plate 3 can move the wafer along the horizontal distance by one column pitch during the next crystal extraction, so that the crystal extraction operation can be staggered, which can improve the layout utilization of the die bonding plate 1 , reduce the frequency of board replacement of the die-bonding board 1, and improve the efficiency of packaging.

The quantity of described crystal-bonding board 1 is two, and two described crystal-bonding boards 1 are horizontally arranged along the transverse direction, and described crystal taking-out and crystal-bonding device also comprises board-changing horizontal screw rod 13, board-changing horizontal slider 14 and board-changing Transversal motor 15, the board-changing horizontal screw rod 13 is fixedly arranged, the board-changing lateral slider 14 is installed on the board-changing horizontal screw rod 13, and the board-changing horizontal screw rod 13 is mounted on the board-changing lateral motor 15 to rotate and drive the board-changing horizontal slide 14 to move laterally, and the two die-bonding plates 1 are fixedly arranged on the board-changing horizontal slide 14.

The two die-bonding boards 1 are arranged horizontally and can be moved laterally, so that after the wafers on one of the die-bonding boards 1 are exhausted, the other die-bonding board 1 can be switched laterally to the pick-up position of the needle dipping board 3 Dip the needle plate 3 to continue to take the crystal, and at the same time, the operator can replace the die-bonding plate 1 that has been exhausted without stopping the machine, so that continuous production can be realized, and the packaging efficiency can be greatly improved.

Several air holes are provided on the upper surface of the die-bonding table 2, and the several air holes communicate with the vacuum air pipe. Vacuumize the air pipe to carry out vacuum work, and the negative pressure will firmly absorb the material placed on the upper surface of the crystal-bonding table 2, so that the material will not move when the dipping pin plate 3 is performing the crystal dipping operation, ensuring The work of taking crystal and bonding it is carried out.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structures, materials or features are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Inspired by the above ideal embodiment according to the utility model, through the above description content, relevant staff can completely make various changes and modifications within the scope of not deviating from the technical idea of the utility model. The technical scope of this utility model is not limited to the content in the description, but must be determined according to the scope of the claims.

Claims (4)

1. A crystal-taking and bonding device, comprising a crystal-bonding plate (1), a crystal-bonding table (2) and a needle dipping plate (3), and the material to be operated is placed on the crystal-bonding table (2) ), it is characterized in that it also includes a crystal-bonding vertical screw rod (4), a crystal-bonding vertical slider (5), a crystal-bonding vertical motor (6), a crystal-bonding vertical screw rod (7), a crystal-bonding vertical slide block (8) and a crystal-bonding vertical motor (9), the crystal-bonding vertical screw rod (4) is horizontally and vertically fixed above the crystal-bonding plate (1), and the crystal-bonding vertical slider (5 ) is installed on the crystal-bonding longitudinal screw (4), and the crystal-bonding longitudinal screw (4) rotates under the drive of the crystal-bonding longitudinal motor (6) and drives the crystal-bonding longitudinal slider (5 ) moves along the longitudinal direction, the vertical die-bonding screw (7) is mounted on the vertical die-bonding slider (5), and the vertical die-bonding slider (8) is mounted on the On the rod (7), the crystal-bonding vertical screw rod (7) rotates under the drive of the crystal-bonding vertical motor (9) and drives the crystal-bonding vertical slider (8) to move vertically, The needle dipping plate (3) is arranged on the vertical slider (8) for crystal fixation. 2. A crystal extraction and bonding device according to claim 1, characterized in that: the crystal extraction and bonding device also includes a crystal bonding transverse screw (10), a crystal bonding lateral slider (11) and a crystal bonding A transverse motor (12), the crystal-bonding transverse screw rod (10) is fixedly arranged on the crystal-bonding longitudinal slider (5), and the crystal-bonding transverse slider (11) is installed on the crystal-bonding transverse screw rod (10), the crystal-bonding horizontal screw (10) rotates under the drive of the crystal-bonding horizontal motor (12) and drives the crystal-bonding horizontal slider (11) to move laterally, and the crystal-bonding vertical The screw rod (7) is fixedly arranged on the crystal-bonding transverse slider (11). 3. A crystal-taking and bonding device according to claim 2, characterized in that: the number of the crystal-bonding plates (1) is two, and the two crystal-bonding plates (1) are arranged horizontally along the transverse direction, The crystal removal and crystal fixation device also includes a board-changing horizontal screw rod (13), a board-changing horizontal slider (14) and a board-changing horizontal motor (15), the board-changing horizontal screw rod (13) is fixedly set, and the The board changing horizontal slider (14) is installed on the board changing horizontal screw rod (13), and the board changing horizontal screw rod (13) rotates under the drive of the board changing horizontal motor (15) and drives the The board-changing horizontal slider (14) moves laterally, and the two crystal-bonding boards (1) are fixedly arranged on the board-changing horizontal slider (14). 4. A crystal-taking and bonding device according to claim 3, characterized in that: the upper surface of the crystal-bonding table (2) is provided with several air holes, and the several air holes communicate with the vacuum air pipe .