CN206922900U - Camera module - Google Patents

Abstract

The utility model relates to a camera module, comprising: a circuit board; a photosensitive chip arranged on the circuit board; a packaging body arranged on the circuit board and encapsulating at least part of the structure of the photosensitive chip; an optical filter arranged on the package on the body; the bracket is arranged on the package body and is located at the periphery of the optical filter; and the lens includes a connection part and an optical action part, the connection part is fixedly connected to the bracket, and the photosensitive chip is located between the optical action part and the circuit board between. The above-mentioned camera module sets the optical filter on the package body, and then sets a bracket on the package body to connect the lens. A safe distance can be maintained between the bracket and the optical filter to avoid interference between the bracket and the optical filter. The top surface can provide enough space for fixing and adjusting the balance of the lens, and can also guarantee the imaging function of the camera module under the premise of meeting miniaturization.

Description

camera module

This application claims the priority of the Chinese patent application with application number 201710326790.6 and utility model name "camera module" filed on May 10, 2017.

technical field

The utility model relates to the field of camera technology, in particular to a camera module.

Background technique

In recent years, camera modules used to acquire images have become more and more widely used in personal electronics, automotive, and medical fields. For example, camera modules have become the standard for portable electronic devices such as smartphones and tablet computers. One of the accessories. A camera module applied to a portable electronic device can not only acquire images, but also help the portable electronic device realize functions such as instant video calls. With the development trend of portable electronic devices becoming thinner and lighter and users' requirements for imaging quality of camera modules are getting higher and higher, more stringent requirements are put forward for the overall size of the camera module and the imaging capability of the camera module. That is to say, the development trend of portable electronic devices requires the camera module to further improve and strengthen the imaging capability on the basis of reducing the size.

Utility model content

The utility model aims to provide a camera module with a smaller size.

A camera module, comprising:

circuit board;

The photosensitive chip is arranged on the circuit board;

A package body, which is arranged on the circuit board and encapsulates at least part of the structure of the photosensitive chip;

an optical filter arranged on the package;

a bracket, arranged on the package body and located on the periphery of the optical filter; and

The lens includes a connection part and an optical action part, the connection part is fixedly connected to the bracket, and the photosensitive chip is located between the optical action part and the circuit board.

In one of the embodiments, the outer wall of the packaging body is substantially aligned with the outer wall of the bracket. The outer wall surface of the package body is aligned with the outer wall surface of the bracket, which can prevent the two from occupying more space, and is beneficial to the miniaturization of the camera module.

In one embodiment, the outer edge of the connecting portion is substantially aligned with the outer wall of the bracket. The outer edge of the connecting part of the lens is aligned with the outer wall of the bracket, so the bracket will not occupy the space outside the lens outline, that is to say, the setting of the bracket will not increase the camera module's space in the vertical direction of the optical axis of the photosensitive chip. size.

In one of the embodiments, the connecting part is directly bonded to the top surface of the bracket by glue. There are no other physical components between the connecting part of the lens and the bracket except for the colloid used to form the connection, which can help the miniaturization of the camera module.

In one embodiment, the width for forming the colloid on the top surface of the support is 0.28-0.53 mm. The above-mentioned width can stably install the lens, and at the same time facilitates the miniaturization of the camera module.

In one embodiment, the width of the bottom surface of the bracket is 0.35-0.4 mm. The above-mentioned width design can take into account both the stability of the bracket on the package and the convenience of installing the optical filter on the package.

In one of the embodiments, any part of the bracket is below the connecting portion of the lens. Any part of the bracket is below the connection part of the lens, that is, the bracket does not occupy the space in the same height direction as the lens, so setting the bracket will not cause the camera module to be in the vertical direction of the optical axis of the optical action part. increase in size.

In one of the embodiments, there is a distance between the filter and the bracket. The distance between the filter and the bracket can ensure that the filter and the bracket do not affect each other during the setting process. On the premise that the filter and the bracket are installed on the package, they can still play their corresponding functions. At the same time, the bracket provides There is room for setting and adjusting the lens.

In one of the embodiments, at least one position of the bracket, the width of the top surface of the bracket is greater than the width of the bottom surface of the bracket. The width of the top surface of the bracket is larger than the width of the bottom surface of the bracket, so that the top surface has a larger area for setting the colloid for bonding the lens.

In one of the embodiments, the optical filter is bonded to the top surface of the package by glue, and the glue width between the optical filter and the top surface of the package is 0.24-0.5 mm. The above glue width can be used to install the optical filter stably without affecting the installation of the bracket, and will not cause glue overflow to prevent contamination of other components.

In one of the embodiments, the packaging body encapsulates the peripheral edges of the photosensitive chip on the circuit board. The encapsulation of the edge portion of the photosensitive chip by the packaging body can ensure the reliability of the connection between the photosensitive chip and the circuit board, and avoid damage and damage to the connection between the photosensitive chip and the circuit board during the production process.

In one embodiment, the middle part of the photosensitive chip forms a photosensitive area, and the distance between the bottom of the inner wall of the package and the edge of the photosensitive area of the photosensitive chip is 0.16-0.18 mm. The setting of the above distance enables the camera module to achieve a better balance between miniaturization and imaging quality.

In one embodiment, the package body has a height of 0.36-0.46 mm. The above-mentioned height design can satisfy the packaging requirement and miniaturization design at the same time.

In one embodiment, the width of the top surface of the package is 0.69-1.74 mm. The above-mentioned width design of the top surface can not only meet the requirement of a stable support, but also take into account the miniaturization design of the camera module.

In one embodiment, the photosensitive chip is electrically connected to the circuit board through wires, and the wires are wrapped by the packaging body.

A camera module, comprising:

a circuit board having circuitry and electronic components on it;

A package body wraps the electronic components, and a cavity is provided in the package body;

A photosensitive chip is electrically connected to the circuit, the edge part of the photosensitive chip is wrapped by the package body, and the middle part of the photosensitive chip is placed in the cavity;

an optical filter arranged on the package and closing the cavity;

a bracket disposed on the package and located on the periphery of the optical filter; and

The lens is directly fixed on the top surface of the bracket and any part of the lens is located above the bracket.

The above-mentioned camera module sets the optical filter on the package body, and then sets a bracket on the package body to connect the lens. A safe distance can be maintained between the bracket and the optical filter to avoid interference between the bracket and the optical filter. The top surface can provide enough space for fixing and aligning the optical axis of the lens, and can also ensure the imaging function of the camera module under the premise of meeting miniaturization.

Description of drawings

Fig. 1 is a schematic cross-sectional view of a camera module provided by an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view from another direction of the structure shown in FIG. 1 .

detailed description

As shown in FIGS. 1 and 2 , a camera module provided by an embodiment of the present invention includes a circuit board 10 , a photosensitive chip 20 , a package 30 , a lens 40 , a filter 50 and a bracket 60 .

The circuit board 10 may be a printed circuit board. In some embodiments, the circuit board 10 may be a flexible circuit board, or a part of the area may be flexible and bendable. Circuits are formed on the circuit board 10 , and these circuits are electrically connected to other components in the electronic equipment (such as mobile terminals such as mobile phones) where the camera module is applied. As shown in FIG. 2 , in some embodiments, the circuit board 10 includes two substrates 101 , 102 and a flexible member 103 connecting the two substrates 101 , 102 . The substrates 101 , 102 have greater rigidity than the flexible member 103 . Components such as the photosensitive chip 20 , the package body 30 , the lens 40 , the bracket 60 and the filter 50 are arranged on one of the substrates 101 . An electronic component 104 may also be disposed on another substrate 102, and the electronic component 104 may be a resistor, a capacitor, a diode, a triode, a potentiometer, a relay or a driver. It can be understood that, as shown in FIG. 1 , electronic components 104 may also be disposed on the substrate 101 , and the electronic components 104 may be resistors, capacitors, diodes, triodes, potentiometers, relays or drivers. A reinforcing glue 105 may also be provided at the joint between the flexible member 103 and the substrate 101 to strengthen the structural strength of the flexible member 103 and prevent the connection between the flexible member 103 and the substrate 101 from breaking or breaking.

The photosensitive chip 20 is disposed on the circuit board 10 . The photosensitive chip 20 is electrically connected to the circuit on the circuit board 10 . The upper surface of the photosensitive chip 20 is away from the circuit board 10, the lower surface is bonded to the circuit board 10, and the upper surface has a photosensitive area 201 in the middle to receive light signals. 10 transmitted to an external image processing device or image storage device. The upper surface also has a non-photosensitive area 203 at the edge. The photosensitive chip 20 is electrically connected to the circuit board 10 through a wire 202 , specifically, one end of the wire 202 is connected to a contact on the edge of the photosensitive chip 20 , and the other end of the wire 202 is connected to a corresponding contact on the circuit board 10 . In some other embodiments, the photosensitive chip 20 can also be directly electrically connected to the contacts on the circuit board 10 through soldering without using the wire 202 .

The package body 30 is disposed on the circuit board 10 and encapsulates at least part of the structure of the photosensitive chip 20 on the circuit board 10 . The package body 30 is used to protect the connection between the photosensitive chip 20 and the circuit board 10 from outside intrusion during the manufacturing and distribution links, so as to ensure the reliability of the connection between the photosensitive chip 20 and the circuit board 10 . In one embodiment, the packaging body 30 encapsulates the peripheral edges of the photosensitive chip 20 on the circuit board 10 . In the mass production process, the photosensitive chip 20 is fixedly connected to the large-scale circuit board 10 first, and then the package body 30 is formed, and then the large-scale circuit board 10 is divided to form independent units. Due to the protection of the package body 30, the separation process can avoid The electrical connection between the photosensitive chip 20 and the circuit board 10 is damaged.

In an embodiment where the electrical connection between the photosensitive chip 20 and the circuit board 10 is formed by wires 202 , the wires 202 may be wrapped by the package body 30 .

The electronic components 104 disposed on the circuit board 10 can also be wrapped by the packaging body 30 .

The package body 30 is annular and has an outer wall 301 , a top surface 302 and an inner wall 303 connected in sequence. It can be understood that the outer wall 301 , the top surface 302 and the inner wall 303 are all annular. In one embodiment, the package body 30 has a square frame structure, and the outer wall surface 301 , the top surface 302 and the inner wall surface 303 each include four parts connected end to end in sequence. Each part of the outer wall surface 301 is substantially vertical, that is, perpendicular to the horizontal plane. Except for the part corresponding to the substrate 102 among the four parts of the outer wall surface 301, the other three parts are approximately flush with the corresponding side walls of the substrate 101, so that the package body 30 and the circuit board 10 can occupy a small space. change.

The top surface 302 is roughly parallel to the horizontal plane, and the top surface 302 is used for carrying the filter 50 and the bracket 60 . In some embodiments, the width of the top surface 302 is greater than the cross-sectional width of the support 60 , so that the top surface 302 can carry the optical filter 50 in addition to the support 60 .

A cavity 304 is formed around the inner wall surface 303 . The middle part of the photosensitive chip 20 is placed in the cavity 304 , and the photosensitive region 201 is formed in the middle part, thus exposed in the cavity 304 to receive external light signals. Edges of the photosensitive chip 20 are wrapped by the packaging body 30 . The inner wall surface 303 is inclined toward the outer wall surface 301 from the direction of the circuit board 20 toward the direction of the top surface 302 , so that the cavity 304 has a structure that is larger at the top and smaller at the bottom.

The filter 50 is disposed on the package body 30 . For example, the edge region of the bottom surface of the optical filter 50 can be adhered to the top surface 302 of the package body 30 by means of glue. The filter 50 closes the cavity 304 . The filter 50 can filter part of light, such as infrared light, from the light signal transmitted by the lens 40 . The filtered optical signal is then received by the photosensitive chip 20 .

The bracket 60 is disposed on the package body 30 and located on the periphery of the optical filter 50 . There is a distance between the bracket 60 and the filter 50 . This distance can ensure that the forming of the filter 50 and the bracket 60 will not interfere with each other. During the production process, the optical filter 50 can be fixed on the package body 30 first, and then the bracket 60 can be provided. Both the optical filter 50 and the bracket 60 can be connected to the top surface 302 of the package body 30 by means of bonding. Keeping the distance between the bracket 60 and the filter 50 can prevent the impact of glue overflowing and covering the filter 50 during the process of fixing the bracket 60 .

The outline of the bracket 60 is similar to the outline of the package body 30 , and also has a ring structure as a whole. In one embodiment, it may be a square frame structure. The cross-sectional shape of the bracket 60 can be rectangular, or approximately rectangular, and the bracket 60 has a bottom surface 601 , a top surface 602 , an outer wall surface 603 and an inner wall surface 604 . The bottom surface 601 is arranged opposite to the top surface 602 , the outer wall surface 603 and the inner wall surface 604 are arranged opposite to each other, and the bottom surface 601 connects the bottom end of the outer wall surface 603 and the bottom end of the inner wall surface 604 . The top surface 602 connects the top end of the outer wall surface 603 and the top end of the inner wall surface 604 .

In one embodiment, the outer wall 603 of the bracket 60 is roughly aligned with the outer wall 301 of the package 30 , so the bracket 60 does not occupy too much space, which is beneficial to the miniaturization of the camera module. The inner wall surface 604 of the bracket 60 is disposed in the middle area of the top surface 302 of the package body 30 , thus the top surface 302 of the package body 30 still has a space for carrying the optical filter 50 .

The lens 40 is directly fixedly connected to the top surface 602 of the bracket 60 . The external light signal is received by the photosensitive chip 20 through the focusing of the lens 40 . In one embodiment, the lens 40 includes an integrally formed connection part 41 and an optical function part 42 , wherein the connection part 41 is fixedly connected to the bracket 60 . In a specific embodiment, the connecting portion 41 is directly bonded to the top surface 602 of the bracket 60 through glue 401 . Since the optical filter 50 is arranged on the package body 30, if the lens 40 is also directly connected to the package body 30, a larger package body 30 must be provided to meet the connection area of the lens 40, which is not conducive to the miniaturization of the camera module. change. Therefore, by setting the bracket 60 additionally, the connection surface with the lens 40 is formed on the top surface 602 of the bracket 60, and because it is staggered with the filter 50 in the height direction, the process of fixing the lens 40 will not affect the filter. The sheet 50 and the top surface 602 of the bracket 60 can provide a more free setting space to calibrate the optical axis of the lens 40 to ensure a better optical receiving effect of the image sensor chip 20 . For example, the optical function part 42 focuses the light signal, and the optical function part 42 has an optical axis I, and the optical axis I is aligned with the center of the photosensitive chip 20 . In order to ensure that the optical axis I is aligned with the center of the photosensitive chip 20, it may be necessary to adjust the amount of glue 401 during the fixed connection process, and adjust the amount of glue on the top surface 602 of the bracket 60 than adjust on the top surface 302 of the package body 30. The amount of glue has less risk, because the top surface 302 of the package body 30 is also connected to the optical filter 50 , and the influence on the optical filter 50 needs to be avoided when adjusting the amount of glue.

In one embodiment, as shown in FIG. 2, at least one position of the bracket 60, the width of the top surface 602 of the bracket 60 is greater than the width of the bottom surface 601 of the bracket 60, so that the top surface of the bracket 60 can be 602 has a larger colloid placement space, which can be used to adjust the installation orientation of the balance lens 40 to ensure the optical effect of the lens 40 .

In some embodiments, the connecting part 41 and the optically active part 42 of the lens 40 can also be formed separately. For example, the connecting part 41 can be made of non-transparent material, and the connecting part 41 is in the shape of a cylinder with an optical path channel inside. The optical action part 42 is made of transparent material, for example, may include one or more lenses. After the connection part 41 is manufactured, the optical action part 42 is loaded into the optical path channel formed by the connection part 41 .

Further, the outer edge of the connecting portion 41 is roughly aligned with the outer wall surface 603 of the bracket 60 , thereby reducing the volume occupied by the bracket 60 and the lens 40 .

A gap 43 is formed between the optical active part 42 and the bracket 60 through the connecting part 41 . The gap 43 communicates with the cavity 304 formed by the package body 30 .

In one embodiment, any part of the lens 40 is located above the bracket 60 . In other words, any part of the bracket 60 is below the connecting portion 41 of the lens 40 . The arrangement of the bracket 60 will not increase the size of the camera module in the direction perpendicular to the optical axis of the optical active part.

In the process of making the above-mentioned camera module, a plurality of photosensitive chips 20 are first fixed on a large circuit board 10 to form a plurality of packages 30, and then an optical filter 50 and a bracket 60 are arranged on each package 30, and then the The large circuit board 10 is cut to form independent units, and finally the lens 40 is fixed on the bracket 60 of the independent unit. This manufacturing process can protect the photosensitive chip 20 by means of the filter 50 to prevent the photosensitive chip 20 from being polluted.

In one embodiment, the width W1 of the top surface 302 of the package body 30 is 0.69-1.74 mm, preferably 1.65 mm. The width W1 of the top surface 302 refers to the distance from the edge of the top surface 302 connected with the outer wall 301 to the edge of the top surface 302 connected with the inner wall 303 . The top surface 302 is used to carry the bracket 60. Although the increase of the width W1 of the top surface 302 can increase the contact surface of the bearing bracket 60, thereby improving the installation stability of the bracket 60, but too large a width W1 will increase the camera module. The overall volume cannot realize miniaturization design. The design of the width W1 of the top surface 302 can not only meet the requirements of the stable bracket 60, but also take into account the miniaturization design of the camera module.

In one embodiment, the height H1 of the package body 30 is 0.36-0.46 mm, preferably 0.41 mm. The height H1 of the package body 30 refers to the vertical distance from the edge connecting the outer surface 301 and the circuit board 10 to the edge connecting the outer surface 301 and the top surface 302 . The height H1 of the package body 30 should not only consider that at least part of the structure of the photosensitive chip 20 and other electronic components on the circuit board 10 can be packaged, but also consider that the volume of the camera module will not be increased in the direction of the optical axis I. The above-mentioned design of the height H1 can satisfy the packaging requirement and the miniaturization design at the same time.

All the photosensitive regions 201 of the photosensitive chip 20 are exposed in the cavity 304 . In one embodiment, the distance L1 between the bottom of the inner wall surface 303 of the package body 30 and the edge of the photosensitive area 201 of the photosensitive chip 20 is 0.16-0.18 mm, preferably 0.17 mm. If the distance L1 from the bottom of the inner wall surface 303 of the package body 30 to the photosensitive area 201 of the photosensitive chip 20 is too small, the risk of foreign matter such as packaging resin falling onto the photosensitive area 201 of the photosensitive chip 20 during the packaging process increases, and the Foreign matter on the region 201 will affect the effect of the photosensitive region 201 receiving incident light, thereby affecting the image quality. If the distance L1 from the bottom of the inner wall surface 303 of the package body 30 to the photosensitive area 201 of the photosensitive chip 20 is too large, on the one hand, the volume of the camera module will increase, which is not conducive to miniaturization; There is more stray light in the non-photosensitive area 203, which affects the imaging quality. The above setting of the distance L1 allows the camera module to achieve a better balance between miniaturization and imaging quality.

In one embodiment, the diameter d of the circumscribed circle formed by the point where the outermost periphery of the lens 40 is located is 7.5 mm. As shown in FIG. 1 , the outermost point of the lens 40 is located at the outermost periphery of the connecting portion 41 . The height H2 of the lens 40 is 7.25 mm. The height H2 of the lens 40 refers to the distance between the horizontal plane where the bottommost end of the connecting part 41 is located and the horizontal plane where the uppermost end of the optical function part 42 is located.

In one embodiment, the width W2 for forming the colloid 401 on the top surface 602 of the bracket 60 is 0.28-0.53 mm. If the width W2 for forming the colloid 401 on the top surface 602 of the bracket 60 is too small, the colloid 401 cannot stabilize the lens 40 . However, if the width W2 for forming the colloid 401 on the top surface 602 of the bracket 60 is too large, the overall volume of the camera module will increase, which is not conducive to miniaturization. The above-mentioned width W2 can stably install the lens 40 , and at the same time facilitates miniaturization of the camera module. In some embodiments, the above-mentioned width W2 is the same as the width of the top surface 602 , while in some other embodiments, the above-mentioned width W2 is smaller than the width of the top surface 602 . For example, the width of the connection portion 41 of the lens 40 is inconsistent everywhere, so the width corresponding to the top surface 602 of the bracket 60 that needs to form the colloid 401 is also different. At this time, the width of the part of the top surface 602 can be greater than the width W2 of the colloid 401. .

The width W3 of the bottom surface 601 of the bracket 60 is 0.35-0.4 mm. The width W3 of the bottom surface 601 is used to enable the bracket 60 to be firmly mounted on the package body 30 . If the width W3 is too small, it will affect the installation stability of the bracket 60 , and if the width W3 is too large, it will affect the installation of other components, such as the installation of the optical filter 50 on the package body 30 . The design of the above-mentioned width W3 can take into account both the stability of the mounting of the bracket 60 on the package body 30 and the convenience of installing the optical filter 50 on the package body 30 .

The height H3 of the bracket 60 , that is, the distance between the bottom surface 601 and the top surface 602 of the bracket 60 in one embodiment, is 0.41 mm. The bracket 60 has a certain height H3 so that the installation of the optical filter 50 and the installation of the lens 40 are staggered in the direction of the optical axis I, that is, the height direction of the camera module, so as to avoid mutual interference between the two installation processes. If the height H3 is too small , this effect cannot be realized, and if the height H3 is too large, it is not conducive to the miniaturization of the camera module in the direction of the optical axis I. The setting of the above-mentioned height H3 can meet the installation requirements of the optical filter 50 and the lens 40 without interfering with each other, and can also achieve miniaturization of the camera module.

In one embodiment, the thickness T of the filter 50 is 0.3mm. The aforementioned thickness T setting of the filter 50 can meet the requirement of light transmittance. The adhesive width W4 between the optical filter 50 and the top surface 302 of the package 30 is 0.24-0.5 mm, preferably 0.4 mm. If the glue width W4 is too small, it will be difficult to install the optical filter 50 stably; if the glue width W4 is too large, it will affect the installation of the bracket 60 on the package body 30; Glue overflows on one side of the bracket 60 or on the side of the photosensitive chip 20 , causing contamination of the bracket 60 or the photosensitive chip 20 . The above glue width W4 can stably install the optical filter 50 without affecting the installation of the bracket 60 and avoiding overflow of glue to avoid contamination of other components.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the utility model, and the description thereof is relatively specific and detailed, but it should not be understood as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (16)

1. A camera module, characterized in that it comprises: circuit board; The photosensitive chip is arranged on the circuit board; A package body, which is arranged on the circuit board and encapsulates at least part of the structure of the photosensitive chip; an optical filter arranged on the package; a bracket, arranged on the package body and located on the periphery of the optical filter; and The lens includes a connection part and an optical action part, the connection part is fixedly connected to the bracket, and the photosensitive chip is located between the optical action part and the circuit board. 2 . The camera module according to claim 1 , wherein the outer wall of the package is substantially aligned with the outer wall of the bracket. 3 . 3 . The camera module according to claim 1 , wherein the outer edge of the connecting portion is roughly aligned with the outer wall of the bracket. 4 . 4 . The camera module according to claim 1 , wherein the connection part is directly bonded to the top surface of the bracket by glue. 5 . The camera module according to claim 4 , wherein the width of the colloid formed on the top surface of the support is 0.28-0.53 mm. 6 . The camera module according to claim 1 , wherein the width of the bottom surface of the support is 0.35-0.4 mm. 7. The camera module according to claim 1, wherein any part of the bracket is below the connecting portion of the lens. 8. The camera module according to claim 1, wherein at least one position of the bracket, the width of the top surface of the bracket is greater than the width of the bottom surface of the bracket. 9. The camera module according to claim 1, wherein there is a distance between the filter and the bracket. 10. The camera module according to claim 1, wherein the optical filter is bonded to the top surface of the package by colloid, and the attachment of the optical filter to the top surface of the package is The glue width is 0.24-0.5mm. 11 . The camera module according to claim 1 , wherein the encapsulating body encapsulates peripheral edge portions of the photosensitive chip on a circuit board. 11 . 12. The camera module according to claim 11, wherein the middle part of the photosensitive chip forms a photosensitive area, and the bottom end of the inner wall surface of the package body and the edge of the photosensitive area of the photosensitive chip The distance is 0.16 ~ 0.18mm. 13. The camera module according to claim 1, wherein the package has a height of 0.36-0.46mm. 14. The camera module according to claim 1, wherein the width of the top surface of the package is 0.69-1.74mm. 15. The camera module according to claim 1, wherein the photosensitive chip is electrically connected to the circuit board through wires, and the wires are wrapped by the package. 16. A camera module, characterized in that it comprises: a circuit board having circuitry and electronic components on it; A package body wraps the electronic components, and a cavity is provided in the package body; A photosensitive chip is electrically connected to the circuit, the edge part of the photosensitive chip is wrapped by the package body, and the middle part of the photosensitive chip is placed in the cavity; an optical filter arranged on the package and closing the cavity; a bracket disposed on the package and located on the periphery of the optical filter; and The lens is directly fixed on the top surface of the bracket and any part of the lens is located above the bracket.