CN206907736U - A kind of processing chamber and semiconductor processing equipment - Google Patents
A kind of processing chamber and semiconductor processing equipment Download PDFInfo
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- CN206907736U CN206907736U CN201720593819.2U CN201720593819U CN206907736U CN 206907736 U CN206907736 U CN 206907736U CN 201720593819 U CN201720593819 U CN 201720593819U CN 206907736 U CN206907736 U CN 206907736U
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- plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 102
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 94
- 238000007872 degassing Methods 0.000 claims abstract description 18
- 238000009826 distribution Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 230000001105 regulatory effect Effects 0.000 claims description 31
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 239000007789 gas Substances 0.000 description 154
- 238000005516 engineering process Methods 0.000 description 6
- 238000005240 physical vapour deposition Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005281 excited state Effects 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- -1 be that is to say Chemical compound 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- Battery Electrode And Active Subsutance (AREA)
Abstract
The utility model provides a kind of processing chamber and semiconductor processing equipment.Processing chamber of the present utility model is used to carry out degassing and prerinse to chip, including：Cavity, battery lead plate, the thermal source for being arranged at cavity inner top, the pedestal for being arranged at cavity inner bottom part；Wherein, pedestal and thermal source are oppositely arranged, and battery lead plate is rotatable；Gas distribution channel is provided with battery lead plate；When battery lead plate is rotated to the top of pedestal, process gas is delivered to the top of pedestal through gas distribution channel, and pre-cleaning processes are carried out to chip；When battery lead plate is rotated away from the top of pedestal, connects thermal source and degassing technique is carried out to chip.Semiconductor processing equipment of the present utility model includes processing chamber of the present utility model.Processing chamber of the present utility model, when carrying out prerinse, process gas is fed directly to the top of pedestal by battery lead plate, process gas utilization rate is high；And the path length of process gas arrival chip is consistent so that energy of plasma is uniform, and prewashed effect is good.
Description
Technical field
Plasma apparatus field is the utility model is related to, more particularly, to a kind of processing chamber and semiconductor processes
Equipment.
Background technology
Plasma apparatus is widely used in the manufacturing fields such as semiconductor, solar cell, FPD.Common etc.
Gas ions equipment includes capacitance coupling plasma (CapacitivelyCoupled Plasma, CCP), inductively coupled plasma
Body (InductivelyCoupled Plasma, ICP) and Ecr plasma (ElectronCyclotron
Resonance, ECR) etc. type apparatus for processing plasma.These plasma apparatus generally can plasma etching,
Physical vapour deposition (PVD) (Physical Vapor Deposition, PVD), chemical vapor deposition (Chemical Vapor
Deposition, CVD) and enhancing chemical vapor deposition (Plasma Enhanced Chemical Vapor
Deposition, PECVD) etc. use in processing technology.
Plasma apparatus using when need to use substantial amounts of gas, how to optimize the method for supplying of gas turns into this area
The technical barrier of urgent need to resolve.
By taking physical vapour deposition (PVD) processing technology as an example, the technique is the conventional process technology of microelectronic, e.g., for adding
Copper interconnection layer in work integrated circuit.Making copper interconnection layer mainly includes degassing, prerinse, Ta (N) depositions and Cu depositions etc.
Step.Wherein, degassing technique is heated generally by thermal source to chip, and gas is removed after vacuumizing.Prewashed purpose
It is to before deposited metal film, remove pollutant, groove and the perforation on for example, surface of the pending workpiece of chip
The residue of bottom.Common pre-cleaning processes, refer to excite the process gas such as such as Ar (argon gas), He (helium) for plasma
Body, acted on using the chemical reaction and physical bombardment of plasma, wafer surface is handled.In the prior art, physics
Vapor deposition apparatus will go gas chamber and pre-cleaning cavity to be integrated into a processing chamber, as shown in figure 1, the processing chamber includes
Cavity 1 ', garage 2 ', pedestal 3 ', battery lead plate 4 ' and rotating mechanism 6 ', cavity 1 ' are connected with garage 2 ', and pedestal 3 ' is located at chamber
Body 1 ' is interior, and chip 7 ' is placed on the surface of pedestal 3 '.Pedestal 3 ' electrically connects with radio-frequency power supply (not shown).In cavity 1 '
Air inlet 11 ' and gas outlet 12 ' are provided with, air inlet 11 ' is arranged in the side wall of cavity 1 ', and gas outlet 12 ' is also associated with
Vavuum pump；In addition, heating bulb 13 ' is additionally provided with the top of cavity 1 '.
When carrying out prerinse, battery lead plate 4 ' is rotated into cavity 1 ', relative with the chip 7 ' on pedestal 3 ', process gas
Body enters cavity 1 ' from air inlet.In the presence of the voltage that process gas is formed between electric pole plate 4 ' and pedestal 3 ', quilt
Excite as plasma, the surface of plasma bombardment chip 7 ', realize the prerinse to chip 7 ', arrow is process gas in figure
Flow path signal of the body in processing cavity.When carrying out degassing, electric pole plate 4 ' is rotated into garage 2 ', connects heating lamp
Bubble 13 ', is heated, while vavuum pump pumps gas therein, realizes degassing technique to chip 7 '.
Conventionally, as cavity roof is provided with heating bulb 13 ', air inlet can not be set on cavity roof
Mouthful, therefore air inlet 11 ' is provided with the side wall of cavity, but there are the following problems for side wall air inlet：Process gas is easily true
Empty pump is taken away from gas outlet 12 ', and only part enters between pedestal and battery lead plate, and utilization rate is not high；And process gas is from chamber
Air inlet 11 ' in the side wall of body 1 ' enters cavity 1 ', and it is inconsistent to reach the path length on the pending surface of chip 7 ', causes to swash
Energy of plasma is uneven caused by hair, directly influences prewashed effect.
Utility model content
The utility model provides a kind of processing chamber and a kind of semiconductor processing equipment, solve at least and deposits in the prior art
Process gas due to the uneven technical problem of the not high and caused energy of plasma of utilization rate caused by the air inlet of side.
According to one side of the present utility model, there is provided a kind of processing chamber, the processing chamber are used to carry out chip
Degassing and prerinse, the chamber include：Cavity, battery lead plate, the thermal source for being arranged at the cavity inner top, it is arranged at the chamber
The pedestal of internal bottom；Wherein, the pedestal and the thermal source are oppositely arranged, and the battery lead plate is rotatable；
Gas distribution channel is provided with the battery lead plate；When the battery lead plate is rotated to the top of the pedestal, process gas
Body is delivered to the top of the pedestal through the gas distribution channel, and pre-cleaning processes are carried out to chip；When the battery lead plate rotate from
When opening the top of the pedestal, connect the thermal source and degassing technique is carried out to chip.
Alternatively, battery lead plate main body is included according to processing chamber of the present utility model, the battery lead plate；
The battery lead plate main body is provided with air inlet, gas channel and gas outlet；
The process gas is inputted from the air inlet, and after flowing through the gas channel, institute is delivered to from the gas outlet
State the top of pedestal.
Alternatively, according to processing chamber of the present utility model, the battery lead plate main body is disc；
The air inlet is arranged in the side wall of the battery lead plate main body through-thickness；
The gas outlet is arranged on the battery lead plate main body surface relative with the pedestal；
The gas channel is arranged on the inside of the battery lead plate main body, and the gas channel connect the air inlet and
The gas outlet.
Alternatively, electrode even flow plate is also included according to processing chamber of the present utility model, the battery lead plate, the electrode is even
Uniform flow hole is provided with flowing plate；
The electrode even flow plate is arranged at the lower section of the battery lead plate main body；
Uniform flow chamber is formed between the electrode even flow plate and the battery lead plate main body, the process gas is from the gas outlet
Into the uniform flow chamber, and the top of the pedestal is delivered to through the uniform flow chamber by the uniform flow hole.
Alternatively, according to processing chamber of the present utility model, the battery lead plate also includes regulating part, and the regulating part is set
Between the battery lead plate main body and the electrode even flow plate, for adjust the battery lead plate main body and the electrode even flow plate it
Between distance；
The battery lead plate main body, the regulating part and the electrode even flow plate form the uniform flow chamber；
Alternatively, connecting shaft and rotating mechanism are also included according to processing chamber of the present utility model, the processing chamber；
One end of the connecting shaft is fixedly connected with the battery lead plate, and the other end is connected with the rotating mechanism, the rotation
Rotation mechanism drives the connecting shaft to drive the battery lead plate rotation；
The first inlet channel is provided with the connecting shaft, the process gas is delivered to institute through first inlet channel
State battery lead plate.
Alternatively, oscillating cylinder, shaft coupling and rotation are included according to processing chamber of the present utility model, the rotating mechanism
Axle, wherein,
The oscillating cylinder is connected by the shaft coupling with one end of the rotary shaft, the other end of the rotary shaft with
The connection axis connection, the oscillating cylinder drive the rotary shaft to drive the connecting shaft to rotate；
The second inlet channel is provided with the rotary shaft, second inlet channel connects with first inlet channel
It is logical.
Alternatively, air inlet pipe is also included according to processing chamber of the present utility model, the chamber, the air inlet pipe is arranged on
The outside of the rotating mechanism simultaneously connects with second inlet channel；
The process gas inputs first inlet channel after flowing through second inlet channel from the air inlet pipe.
Alternatively, according to processing chamber of the present utility model, the connecting shaft is located in the cavity and passes through the chamber
The bottom wall of body, the rotating mechanism are located at outside the bottom wall of the cavity；
Level(l)ing mechanism is additionally provided between the bottom wall and the rotating mechanism, the level(l)ing mechanism is used for
Adjust the levelness of the battery lead plate.
Alternatively, multiple adjusting rods and connection are included according to processing chamber of the present utility model, the level(l)ing mechanism
Plate, wherein,
The connecting plate is arranged between the bottom wall and the rotating mechanism, and is connected with the rotating mechanism；
The connecting shaft passes through the connecting plate, and the connecting plate has at regular intervals with the bottom wall；
One end of the adjusting rod is fixedly connected with the bottom wall, and the other end passes through the connecting plate, and it is through described
The adjustable length of connecting plate；
The length of the connecting plate is passed through by adjusting the adjusting rod, adjusts the levelness of the connecting plate, the tune
Section strip moves the rotating mechanism and the perpendicularity of the connecting shaft is adjusted, so as to realize the levelness to the battery lead plate
It is adjusted.
Alternatively, telescoping tube is also included according to processing chamber of the present utility model, the level(l)ing mechanism；
The telescoping tube is sheathed on outside the connecting shaft, and its first end is tightly connected with the bottom wall, the second end and institute
State connecting plate sealed connection.
Alternatively, the first sub- cavity and the second sub- cavity are included according to processing chamber of the present utility model, the cavity, its
In,
The second sub- cavity is arranged on the described first sub- cavity wall, and is connected with the described first sub- cavity；Wherein,
The pedestal is arranged in the described first sub- cavity；The battery lead plate can the described first sub- cavity and the second sub- cavity it
Between rotate；
When the battery lead plate is rotated into the described first sub- cavity, the battery lead plate is relative with the pedestal, with to crystalline substance
Piece carries out pre-cleaning processes；
When the battery lead plate is rotated into the described second sub- cavity, the battery lead plate leaves the top of the pedestal, with
Degassing technique is carried out to chip.
According to another aspect of the present utility model, there is provided a kind of semiconductor processing equipment, including it is described in the utility model
Processing chamber.
Beneficial effect：
Process gas is fed directly to the top of pedestal, process gas by battery lead plate by processing chamber of the present utility model
Directly it will not be taken away by vavuum pump, it is not necessary to keep the excited state of plasma, work by supplementing substantial amounts of process gas
Skill gas will not lose, and the path length that the Worker's Stadium gas enters between battery lead plate and pedestal is consistent so that process gas
Energy of plasma caused by exciting is uniform, improves the stability of plasma so that prewashed effect is more preferable.
Semiconductor processing equipment of the present utility model, including processing chamber of the present utility model, due to gas transmission in battery lead plate
The setting of passage, process gas utilization rate and plasma stability are improved, so as to improve prewashed effect.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing process chamber cross-sectional figure；
Fig. 2 is a kind of profile of the processing chamber of embodiment of the utility model；
Fig. 3 is a kind of profile of the battery lead plate of embodiment of the utility model；
Fig. 4 is the utility model a kind of battery lead plate, connecting shaft, rotating mechanism and the air inlet pipe of the processing chamber of embodiment
The stereogram of connection；
Fig. 5 is the utility model a kind of battery lead plate, connecting shaft, rotating mechanism and the air inlet pipe of the processing chamber of embodiment
The profile of connection；
Fig. 6 is a kind of profile of the battery lead plate of embodiment of the utility model；
Fig. 7 is a kind of profile of the level(l)ing mechanism of embodiment of the utility model；
Wherein, reference is：
Cavity -1 ', air inlet -11 ', gas outlet -12 ', garage -2 ', pedestal -3 ', battery lead plate -4 ', rotating mechanism -6 ',
Chip -7 ', heating bulb -13 '；
Sub- cavity -12 of the sub- cavity -11, the second of cavity -1, the first, pedestal -2, battery lead plate -3, battery lead plate main body -31, air inlet
Mouth -311, gas channel -312, gas outlet -313, electrode even flow plate -32, uniform flow hole -321, uniform flow chamber -33, regulating part -34,
Connecting shaft -4, the first inlet channel -41, rotating mechanism -5, oscillating cylinder -51, shaft coupling -52, rotary shaft -53, the second air inlet
Passage -531, air inlet pipe -6, level(l)ing mechanism -7, adjusting rod -71, connecting plate -72, telescoping tube -73, chip -8.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：It is unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is unlimited
The scope of the utility model processed.
The description only actually at least one exemplary embodiment is illustrative to be never used as to this practicality below
New and its application or any restrictions used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The utility model provides a kind of processing chamber, and processing chamber is used to carry out degassing and prerinse, chamber to chip
Including：Cavity, battery lead plate, the thermal source for being arranged at cavity inner top, the pedestal for being arranged at cavity inner bottom part；Wherein, pedestal and heat
Source is oppositely arranged, and battery lead plate is rotatable；Gas distribution channel is provided with battery lead plate；When battery lead plate is rotated to the top of pedestal, work
Skill gas is delivered to the top of pedestal through gas distribution channel, and pre-cleaning processes are carried out to chip；When battery lead plate is rotated away from pedestal
During top, connect thermal source and degassing technique is carried out to chip.
As shown in Figures 2 to 7, the processing chamber includes：Cavity 1, the pedestal 2 and battery lead plate for being arranged at the bottom of cavity 1
3.Generally, pedestal 2 is arranged in cavity 1, and pedestal 2 is radio frequency pedestal, be that is to say, pedestal 2 is provided with and electrically connected with radio-frequency power supply
Battery lead plate, or pedestal 2 directly electrically connected with radio-frequency power supply, and battery lead plate 3 is also attached with power supply, when battery lead plate is rotated
To pedestal top when, process gas is delivered to above pedestal by gas distribution channel, process gas pedestal 2 and battery lead plate 3 it
Between be activated into plasma in the presence of the voltage that is formed, prerinse is realized to chip 8.
Gas distribution channel is provided with battery lead plate 3, for the flowing of process gas, process gas is directly defeated through gas distribution channel
The top of pedestal 2 is delivered to, plasma is activated between pedestal 2 and battery lead plate 3, to carry out prerinse to chip 8.
As shown in Figure 2, arrow is the signal of the flow path of process gas in the figure, and process gas is defeated by battery lead plate 3
Deliver to the top of pedestal 2.Under the voltage effect formed between pedestal 2 and battery lead plate 3, process gas is in pedestal 2 and battery lead plate 3
Between be activated into plasma.The surface of plasma bombardment chip 8, realize the prerinse to chip 8.
Process gas is fed directly to pedestal 2 by processing chamber of the present utility model by the gas distribution channel in battery lead plate 3
Top, process gas directly will not take away by vavuum pump, it is not necessary to keep plasma by supplementing substantial amounts of process gas
The excited state of body, process gas do not lose, and improve the utilization rate of process gas.In addition, the gas distribution channel by battery lead plate 3
The path length that the process gas of output reaches chip 8 is consistent, makes process gas excite caused energy of plasma uniform, etc.
Gas ions are stable, improve prewashed effect.
According to a kind of embodiment of the utility model processing chamber, battery lead plate includes battery lead plate main body；Battery lead plate main body
It is provided with air inlet, gas channel and gas outlet；Process gas inputs from air inlet, defeated from gas outlet after flowing through gas channel
Deliver to the top of pedestal.
In the above-described embodiment, air inlet, gas channel and the gas outlet set on battery lead plate belongs to gas distribution channel, goes out
Gas port is arranged on the one side of battery lead plate main body face pedestal, can realize process gas being fed directly to battery lead plate and pedestal phase
To space.
According to a kind of embodiment of the utility model processing chamber, battery lead plate main body is disc；Air inlet is arranged at
In the side wall of battery lead plate main body through-thickness；Gas outlet is arranged on the battery lead plate main body surface relative with pedestal；Air-flow leads to
Road is arranged on the inside of battery lead plate main body, and gas channel connection air inlet and gas outlet.
Specifically, referring to figs. 2 and 3 shown, battery lead plate 3 includes battery lead plate main body 31, and the shape of battery lead plate main body 31 is excellent
Choosing has a certain thickness disc shape, can also from rectangle disk shape, elliptical shape or other can use
Shape.Battery lead plate main body 31 is provided with air inlet 311, gas channel 312 and gas outlet 313.When it is implemented, source of the gas can be direct
It is connected with air inlet 311, by the gas channel 312 of process gas input electrode plate 3, pedestal 2 is delivered to from gas outlet 313
Top.So, air inlet is arranged in the side wall of battery lead plate, and gas outlet is arranged on the surface with pedestal face of battery lead plate,
Realize top air inlet.Solve in the prior art because heating bulb is arranged on cavity roof, block and set on upper roof
Put air inlet, it is impossible to the problem of realizing top air inlet.
The quantity and position of air inlet 311 and gas outlet 313 can be selected flexibly according to the actual requirements.For example, air inlet
311 and the length direction that is separately positioned on battery lead plate main body 31 of gas outlet 313 both ends on；In another example air inlet 311 is positioned at electricity
On the wall of the thickness direction of pole plate main body 31, gas outlet 313 is located on the wall of the length direction of battery lead plate main body 31.
Process gas is inputted from air inlet 311, and after flowing through gas channel 312, the upper of pedestal 2 is delivered to from gas outlet 313
Side.Gas channel 312 can be the passage between air inlet 311 and gas outlet 313；Or gas channel 312 can be electrode
Cavity-like structure in plate main body 31, the gas channel 312 of cavity-like structure are advantageous to improve the uniformity of process gas output and steady
It is qualitative.
Shape, quantity and the set location of gas outlet 313 can flexibly be set.For example, gas outlet 313 is circular or square
Shape；In another example the quantity of gas outlet 313 is for one or two or more；For another example when battery lead plate main body 31 has disc
During structure, gas outlet 313 is located at the center position of the end face of the circular discs, especially, when battery lead plate main body 31 has circle
During dish structure, radial direction extension of the gas channel 312 along circular discs.
By taking the battery lead plate 3 shown in Fig. 3 as an example.In this embodiment, the section shape of battery lead plate main body 31 is rectangle.Enter
Gas port 311 is located on the broadside of the rectangle, and gas outlet 313 is located at the central spot of the long side of the rectangle.Gas channel 312 certainly should
One broadside of rectangle extends to another broadside.
When the quantity of gas outlet 313 is arranged to one, gas outlet 313 is located at the center of battery lead plate main body 31.This set
Mode is advantageous to improve the uniformity and stability of the process gas flowed out from gas outlet 313.
According to the another embodiment of the utility model processing chamber, battery lead plate also includes electrode even flow plate, and electrode is even
Uniform flow hole is provided with flowing plate；Electrode even flow plate is arranged at the lower section of battery lead plate main body；Electrode even flow plate and battery lead plate main body it
Between formed uniform flow chamber, process gas enters uniform flow chamber from gas outlet, and is delivered to the top of pedestal by uniform flow hole through uniform flow chamber.
Battery lead plate 3 according to Fig. 2 and Fig. 3 also includes electrode even flow plate 32, and the shape of electrode even flow plate 32 can basis
Actual demand is set.For example, electrode even flow plate 32 is circular slab or rectangular slab etc..
Electrode even flow plate 32 is arranged at the lower section of battery lead plate main body 31.Here, " lower section " refers to the neighbour of battery lead plate main body 31
The side of the end face of nearly pedestal 2.Generally, the shape of electrode even flow plate 32 can match with the shape of battery lead plate main body 31.For example,
When battery lead plate main body 31 is disc shape, electrode even flow plate 32 is circular slab.
Electrode even flow plate 32 links together with battery lead plate main body 31.Between electrode even flow plate 32 and battery lead plate main body 31
Connection can be realized by modes such as welding or bolt connections.It should be noted that work as battery lead plate main body 31 and electrode even flow plate 32
, can be in the He of battery lead plate main body 31 in order to improve the air-tightness of plasma apparatus admission gear when being bolted together
The junction of electrode even flow plate 32 sets the seal of for example, sealing ring.
Enter between electrode even flow plate 32 and battery lead plate main body 31 formed with uniform flow chamber 33, process gas from gas outlet 313
Uniform flow chamber 33, and the top of pedestal 2 is delivered to through uniform flow chamber 33, to improve the equal of the process gas for the top for being delivered to pedestal 2
Even property.
Uniform flow chamber 33 is made up of battery lead plate main body 31 and electrode even flow plate 32.When it is implemented, can be by battery lead plate master
Set on body 311 and/or electrode even flow plate 32 raised so that have necessarily between battery lead plate main body 31 and electrode even flow plate 32
Space, so as to form uniform flow chamber 33 between battery lead plate main body 31 and electrode even flow plate 32.Or can be in the He of battery lead plate main body 31
Support member is set between electrode even flow plate 32, the support member can separate battery lead plate main body 311 and electrode even flow plate 32
Come, so as to form uniform flow chamber 33 between battery lead plate main body 31 and electrode even flow plate 32.
Gas outlet 313 is connected with uniform flow chamber 33, and electrode even flow plate 32 is provided with uniform flow hole 3, and uniform flow hole 321 can be by technique
Gas is delivered to the top of pedestal from uniform flow chamber 33.
In use, process gas enters the gas channel 312 of battery lead plate main body 31 from air inlet 311, then from gas outlet 313
Into uniform flow chamber 33, then battery lead plate 3 is flowed out in the uniform flow hole 321 of self-electrode even flow plate, so that process gas is delivered into pedestal 2
Top.
The shape and quantity in uniform flow hole 321 can be set according to the actual requirements.For example, uniform flow hole 321 is circular port or rectangle
Hole.In another example the quantity in uniform flow hole 321 is multiple, multiple uniform flow holes 321 are evenly distributed on electrode even flow plate 32.It is above-mentioned
" being uniformly distributed " may be, for example, that multiple uniform flow holes 321 are arranged in array, or, multiple uniform flow holes 321 are arranged in concentric circles
Cloth.Preferably, multiple uniform flow holes 321 are provided with electrode even flow plate 32, multiple uniform flow holes 321 are advantageous to improve battery lead plate 3
The uniformity and stability of supply.
Multiple uniform flow holes 321 are preferably evenly distributed on electrode even flow plate 32.Here, " being uniformly distributed " may be, for example, more
Individual uniform flow hole 321 is arranged in array；Or multiple uniform flow holes 321 are arranged in concentric circles；Or multiple uniform flow holes 321
The radial arrangement centered on the geometric center of electrode even flow plate 32.Further, the preferred 0.5mm- in the aperture in uniform flow hole 321
1mm。
According to the another embodiment of the utility model processing chamber, battery lead plate also includes regulating part, and regulating part is set
Between battery lead plate main body and electrode even flow plate, for adjusting the distance between battery lead plate main body and electrode even flow plate；Battery lead plate
Main body, regulating part and electrode even flow plate form uniform flow chamber.
According to Fig. 3 and Fig. 5, it can be seen that battery lead plate 3 also includes regulating part 34, and regulating part 34 is used to adjust electrode
The distance between plate main body 31 and electrode even flow plate 32, to adjust the distance between electrode even flow plate 32 and pedestal 2.
Regulating part 34 is between battery lead plate main body 31 and electrode even flow plate 32, regulating part 34 and battery lead plate main body 31 and electricity
Pole even flow plate 32 is connected.Connection between battery lead plate main body 31 and regulating part 34 can be real by modes such as welding or bolt connections
It is existing.Connection between electrode even flow plate 32 and regulating part 34 can be realized by modes such as welding or bolt connections.
It should be noted that when battery lead plate main body 31 and electrode even flow plate 32 are linked together by bolt and regulating part 34
When, can be in battery lead plate main body 31 and the junction of regulating part 34, and electrode even flow plate in order to improve the air-tightness of processing chamber
32 set the seal of for example, sealing ring with the junction of regulating part 4.The preferred cyclic structure of shape and structure of regulating part 34,
It is that regulating part 34 is regulation ring.Uniform flow chamber 33 is made up of battery lead plate main body 31, regulating part 34 and electrode even flow plate 32.
It is to be detachably connected between battery lead plate main body 31 and electrode even flow plate 32 and regulating part 34.That is, battery lead plate main body
Connection between 31 and regulating part 34 is to be detachably connected；Connection between electrode even flow plate 32 and regulating part 34 is detachably to connect
Connect.Above-mentioned be detachably connected the mode such as can be bolted or snap connection and realize.
By changing the regulating part 34 of different-thickness or shape, the volume or shape of uniform flow chamber 33 can be changed.In addition, pass through
The regulating part 34 of different-thickness is changed, the distance between lower surface and pedestal 2 of battery lead plate 3 can be changed, so as to adjust prerinse
Effect.Moreover, for different process requirements, can be by changing regulating part 4, to reduce the cost of processing chamber.
According to a kind of embodiment of the utility model processing chamber, processing chamber also includes connecting shaft and rotating mechanism；
One end of connecting shaft is fixedly connected with battery lead plate, and the other end is connected with rotating mechanism, rotating mechanism drive connection axle band moving electrode
Plate rotates；The first inlet channel is provided with connecting shaft, process gas is delivered to battery lead plate through the first inlet channel.
According to Fig. 2, processing chamber also includes connecting shaft 4 and rotating mechanism 5, first end and the battery lead plate 3 of connecting shaft 4
It is connected, the second end of connecting shaft 4 is connected with rotating mechanism 5.Battery lead plate 3 can be by outside on the outer surface of battery lead plate main body 31
The boss of extension is connected with connecting shaft 4.Or battery lead plate 3 can pass through the end phase in battery lead plate main body 31 with connecting shaft 4
The groove matched somebody with somebody is connected with connecting shaft 4.
Connection between battery lead plate 3 and connecting shaft 4 can be realized by modes such as welding or bolt connections.It should be noted that
It is,, can be in battery lead plate in order to improve the air-tightness of processing chamber when together with battery lead plate 3 being bolted with connecting shaft 4
3 and connecting shaft 4 junction set for example, sealing ring seal.In addition, in order to more easily by battery lead plate 3 and connecting shaft
4 link together, and the connection component for including screw, spring washer and plain washer can be used.
Rotating mechanism 5 is connected with connecting shaft 4.Rotating mechanism 5 controls connecting shaft 4 to rotate, so as to drive battery lead plate 3
Rotation is to the top of pedestal 2, or the top for driving battery lead plate 3 to leave pedestal 2.Usual rotating mechanism includes can drive connection axle
4 driving elements rotated.Above-mentioned driving element may be, for example, DDR (direct drive rotation) motor.
The first inlet channel is provided with connecting shaft, process gas is delivered to battery lead plate through the first inlet channel, therefore can
So that the air inlet for the gas being delivered in battery lead plate is arranged in connecting shaft, air inlet is drawn, facilitates air inlet.
According to a kind of embodiment of the present utility model, rotating mechanism 5 includes oscillating cylinder 51, shaft coupling 52 and rotary shaft
53.The first end of rotary shaft 53 is connected with connecting shaft 4.Second end of oscillating cylinder 51 and rotary shaft 53 is connected to by shaft coupling 52
Together.Connection between shaft coupling 52 and oscillating cylinder 51 and rotary shaft 53 can be realized by mode well known in the art, this reality
This is not limited further with new.Rotary shaft 53 is connected with connecting shaft 4.Rotary shaft 53 can pass through weldering with connecting shaft 4
The mode such as connect or be integrally formed to link together.
Oscillating cylinder 51 drives rotary shaft 53 to rotate, to cause rotary shaft 53 to drive connecting shaft 4 to rotate.Oscillating cylinder 51 is logical
Crossing shaft coupling 52 drives rotary shaft 53 to make reciprocating rotating motion in the range of certain angle, and rotary shaft 53 drives and the phase of connecting shaft 4
The battery lead plate 3 of connection rotates, and so as to which battery lead plate 3 is rotated to the top of pedestal 2, or drives battery lead plate 3 to leave the upper of pedestal 2
Side, the rotational angle of oscillating cylinder 51 is selected, can control the rotational angle of battery lead plate 3.
The first inlet channel 41 is provided with connecting shaft 4, process gas is delivered to battery lead plate 3 through the first inlet channel 41.Can
Selection of land, the first inlet channel 41 are connected with air inlet 311.Connecting shaft 4 can play a part of source of the gas being connected with battery lead plate.This
Outside, connecting shaft 5 may also function as the effect of support battery lead plate 3.
When it is implemented, process gas enters the gas of battery lead plate main body 31 by the first inlet channel 41 from air inlet 311
Circulation road 312, then enter uniform flow chamber 33 from gas outlet 313, then battery lead plate 3 is flowed out in the uniform flow hole 321 of self-electrode even flow plate 32,
Realize supply function.
The second inlet channel 531 is provided with rotary shaft 53, the second inlet channel 531 connects with the first inlet channel 41.
Further, processing chamber of the present utility model also includes air inlet pipe 6, and air inlet pipe 6 can be selected metal bellows, enter
Tracheae 6 connects with the second inlet channel 531.Alternatively, air inlet pipe 6 can be connected with rotary shaft 53, and process gas is inputted
Second inlet channel 531.Process gas is inputted the second inlet channel 531 by air inlet pipe 6, and then process gas leads to from the second air inlet
After road 531 enters the first inlet channel 41, battery lead plate 3 is entered back into.When rotary shaft 53 rotates, air inlet pipe 6 can followed by rotation
The rotation of axle 53 and mobile or dilatation.
According to a kind of embodiment of processing chamber of the present utility model, connecting shaft is within the cavity and passes through the bottom of cavity
Wall, rotating mechanism are located at outside the bottom wall of cavity；Level(l)ing mechanism is additionally provided between bottom wall and rotating mechanism, level is adjusted
Section mechanism is used for the levelness for adjusting battery lead plate.
Level(l)ing mechanism is set in the utility model, adjusts the levelness of battery lead plate, so as to be adjusted on pedestal
The path length of the gas of side is more homogeneous, so that the plasma of ionization is more uniform.
Further, level(l)ing mechanism preferably includes multiple adjusting rods and connecting plate, wherein, connecting plate is arranged at bottom wall
It is connected between rotating mechanism, and with rotating mechanism；Connecting shaft passes through connecting plate, and connecting plate has at regular intervals with bottom wall；Adjust
One end of pole is fixedly connected with bottom wall, and the other end passes through connecting plate, and it passes through the adjustable length of connecting plate；By adjusting
Pole passes through the length of connecting plate, adjusts the levelness of connecting plate, and adjustable plate drives rotating mechanism to enter the perpendicularity of connecting shaft
Row regulation, so as to realize that the levelness to battery lead plate is adjusted.Level(l)ing mechanism further preferably includes telescoping tube；Flexible pipe sleeve
Outside connecting shaft, and its first end is tightly connected with bottom wall, and the second end is tightly connected with connecting plate.
As shown in fig. 7, level(l)ing mechanism 7 of the present utility model includes multiple adjusting rods 71 and connecting plate 72.Connecting plate
72 are arranged at the lower section of the bottom wall of cavity 1, and have between bottom wall at regular intervals.Connecting shaft 4 passes through connecting plate 72, connecting shaft
4 rotate in the connecting shaft via of connecting plate 72.It should be noted that in order to improve the air-tightness of processing chamber, can connect
The seal of for example, sealing ring is set between axle 4 and connecting plate 72.
Rotating mechanism 5 is arranged on side of the connecting plate 72 away from bottom wall, and is connected with connecting plate 72, the both ends of adjusting rod 71
It is connected respectively with the bottom wall and connecting plate 72 of cavity 1, the position that connecting plate 72 is arranged on adjusting rod 71 is adjustable, that is, wears
Cross the adjustable length of the adjusting rod 71 of connecting plate；Connection between the bottom wall of adjusting rod 71 and cavity 1 can pass through welding or screw thread
Connection is realized.Connection between adjusting rod 71 and connecting plate 72 can be connected through a screw thread or raised and groove cooperation is realized.
The position that connecting plate 72 is arranged on adjusting rod 71 is adjustable, and so, the levelness of connecting plate 72 is adjustable, so as to
Connecting plate 72 is set to drive the adjustment of the perpendicularity of rotating mechanism 5, rotating mechanism 5 drives the adjustment of the perpendicularity of connecting shaft 4, so as to
Drive the regulation of the levelness of battery lead plate 3.
Level(l)ing mechanism 7 further preferably includes telescoping tube 73, and telescoping tube 73 is set in outside connecting shaft 4, and the two of telescoping tube 73
Bottom wall and connecting plate 72 respectively with cavity 1 is held to be tightly connected.Telescoping tube 73 is flexible, is flexible pipe, can be in certain limit
Interior dilatation, so as to more easily adjust the level of battery lead plate 3.Sealing between telescoping tube 73 and cavity 1 and connecting plate 72
Connection can ensure the vacuum requirement of cavity 1.
According to a kind of embodiment of the present utility model, cavity includes the first sub- cavity and the second sub- cavity, wherein, second
Sub- cavity is arranged on the first sub- cavity wall, and is connected with the first sub- cavity；Wherein, pedestal is arranged in the first sub- cavity；
Battery lead plate can rotate between the first sub- cavity and the second sub- cavity；When battery lead plate is rotated into the first sub- cavity, battery lead plate
It is relative with pedestal, to carry out pre-cleaning processes to chip；When battery lead plate is rotated into the second sub- cavity, battery lead plate leaves described
The top of pedestal, to carry out degassing technique to chip.
According to Fig. 2, cavity 1 includes the first sub- 11 and second sub- cavity 12 of cavity, the first sub- of cavity 11 and second
Cavity 12 is connected, and the second sub- cavity 12 is arranged in the first sub- side wall of cavity 11, and pedestal 2 is arranged in the first sub- cavity 11,
Battery lead plate 3 can be rotated to the first sub- 11 and second sub- cavity 12 of cavity, when battery lead plate 3 is rotated into the first sub- cavity 11, electricity
Pole plate 3 is relative with pedestal 2, carries out pre-cleaning processes, and now, battery lead plate 3 is relative with the chip 8 of for example, chip on pedestal 2.
When battery lead plate 3 is rotated into the second sub- cavity 12, battery lead plate 3 leaves the top of pedestal 2, can carry out degassing work
Skill, now, battery lead plate 3 stagger with the chip 8 on pedestal 2, and the second sub- cavity 12 exists preferably in the form of garage, generally, the
One sub- cavity 11 is provided with the opening being connected with vavuum pump, when carrying out degassing technique, connects thermal source and connects vavuum pump.
Below, by taking the specific embodiment shown in Fig. 5 as an example, processing chamber of the present utility model is illustrated：
As shown in figure 5, processing chamber includes cavity 1, pedestal 2, battery lead plate 3, connecting shaft 4, rotating mechanism 5, the and of air inlet pipe 6
Level(l)ing mechanism 7.Cavity 1 includes the first sub- 11 and second sub- cavity 12 of cavity, the first sub- 11 and second sub- cavity 12 of cavity
It is connected, and the second sub- cavity 12 is arranged in the first sub- side wall of cavity 11, pedestal 2 is arranged in the first sub- cavity 11, electrode
Plate 3 has disc shape, and it includes battery lead plate main body 31, electrode even flow plate 32, uniform flow chamber 33 and regulating part 4, wherein, electrode
Plate main body 31 is provided with air inlet 311, gas channel 312 and gas outlet 313.Air inlet 311 is arranged at battery lead plate main body 31
On the wall of through-thickness, gas outlet 313 is arranged on the surface relative with pedestal 2 of battery lead plate main body 31, and gas outlet 313
In the center of battery lead plate main body 31, the quantity of gas outlet 313 is one, and multiple uniform flow holes 321 are provided with electrode even flow plate 32.
Regulating part 34 is between battery lead plate main body 31 and electrode even flow plate 32, regulating part 34 and battery lead plate main body 31 and electrode even flow plate
32 are connected, and uniform flow chamber 33 is made up of battery lead plate main body 31, regulating part 34 and electrode even flow plate 32.Connecting shaft 4 and the phase of battery lead plate 3
Connection, connecting shaft 4 is interior to be provided with the first inlet channel 41, and the first inlet channel 41 is connected with air inlet 311, and rotating mechanism 5 wraps
Oscillating cylinder 51, shaft coupling 52 and rotary shaft 53 are included, shaft coupling 52 links together oscillating cylinder 51 and rotary shaft 53, rotation
Axle 53 is connected with connecting shaft 4.The second inlet channel 531 is provided with rotary shaft 53, the second inlet channel 531 leads to the first air inlet
Road 41 is connected, oscillating cylinder 51 drive rotary shaft 53 rotate, with cause rotary shaft 53 drive connecting shaft 4 rotate, air inlet pipe 6 with
Rotary shaft 53 is connected, and process gas is inputted into the second inlet channel 531.
The transmission path of process gas is as follows：
Process gas enters the second inlet channel 531 from air inlet pipe 6, and then process gas enters from the second inlet channel 531
After entering the first inlet channel 41, battery lead plate 3 is entered back into, in battery lead plate 3, process gas enters battery lead plate master from air inlet 311
The gas channel 312 of body 31, then enter uniform flow chamber 33 from gas outlet 313, then the uniform flow hole 321 of self-electrode even flow plate 32 is flowed out
Battery lead plate 3, so as to which process gas is transported to the top of pedestal 2.
Oscillating cylinder 51 drives rotary shaft 53 to make reciprocating rotating motion in the range of certain angle by shaft coupling 52, rotates
Axle 53 drives the battery lead plate 3 being connected with connecting shaft 4 to rotate.
When battery lead plate 3 is rotated into the first sub- cavity 11, battery lead plate 3 and pedestal 2 are relative, and process gas is from gas distribution channel
It is delivered to above pedestal, is ionized and chip is bombarded for plasma, plasma, realize pre-cleaning processes；Work as electrode
When plate 3 is rotated into the second sub- cavity 12, battery lead plate 3 leaves the top of pedestal 2, connects thermal source and chip is heated, and beat
Drive vavuum pump to vacuumize cavity, realize the degassing technique to chip.
The utility model additionally provides the process cavity in a kind of semiconductor processing equipment, including any of the above-described middle embodiment
Room.
Semiconductor processing equipment of the present utility model includes the processing chamber of utility model, of the present utility model utilizing
When processing chamber carries out prerinse, process gas is fed directly to the top of pedestal 2 by battery lead plate 3, process gas will not
Directly taken away by vavuum pump, it is not necessary to keep the excited state of plasma, process gas by supplementing substantial amounts of process gas
Body does not lose, and the stability of plasma is high.In addition, pass through the chip 8 on the process gas that battery lead plate 3 exports to motor seat 2
Path length it is consistent so that process gas excite caused by energy of plasma it is uniform, semiconductor processing equipment is prewashed
Effect is good.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above merely to illustrate, rather than in order to limit the scope of the utility model.This
Field it is to be understood by the skilled artisans that can not depart from the scope of the utility model and spirit in the case of, to above example
Modify.The scope of the utility model is defined by the following claims.
Claims (13)
1. a kind of processing chamber, the processing chamber is used to include chip progress degassing and prerinse, the chamber：Cavity,
Battery lead plate, the thermal source for being arranged at the cavity inner top, the pedestal for being arranged at the cavity inner bottom part；Wherein, the pedestal and
The thermal source is oppositely arranged, and the battery lead plate is rotatable；Characterized in that,
Gas distribution channel is provided with the battery lead plate；When the battery lead plate is rotated to the top of the pedestal, process gas warp
The gas distribution channel is delivered to the top of the pedestal, and pre-cleaning processes are carried out to chip；When the battery lead plate is rotated away from institute
When stating the top of pedestal, connect the thermal source and degassing technique is carried out to chip.
2. processing chamber according to claim 1, it is characterised in that the battery lead plate includes battery lead plate main body；
The battery lead plate main body is provided with air inlet, gas channel and gas outlet；
The process gas is inputted from the air inlet, and after flowing through the gas channel, the base is delivered to from the gas outlet
The top of seat.
3. processing chamber according to claim 2, it is characterised in that the battery lead plate main body is disc；
The air inlet is arranged in the side wall of the battery lead plate main body through-thickness；
The gas outlet is arranged on the battery lead plate main body surface relative with the pedestal；
The gas channel is arranged on the inside of the battery lead plate main body, and the gas channel connects the air inlet and described
Gas outlet.
4. processing chamber according to claim 2, it is characterised in that the battery lead plate also includes electrode even flow plate, described
Uniform flow hole is provided with electrode even flow plate；
The electrode even flow plate is arranged at the lower section of the battery lead plate main body；
Uniform flow chamber is formed between the electrode even flow plate and the battery lead plate main body, the process gas enters from the gas outlet
The uniform flow chamber, and the top of the pedestal is delivered to through the uniform flow chamber by the uniform flow hole.
5. processing chamber according to claim 4, it is characterised in that the battery lead plate also includes regulating part, the regulation
Part is arranged between the battery lead plate main body and the electrode even flow plate, even for adjusting the battery lead plate main body and the electrode
The distance between flowing plate；
The battery lead plate main body, the regulating part and the electrode even flow plate form the uniform flow chamber.
6. according to the processing chamber described in claim any one of 1-5, it is characterised in that the processing chamber also includes connecting shaft
And rotating mechanism；
One end of the connecting shaft is fixedly connected with the battery lead plate, and the other end is connected with the rotating mechanism, the whirler
Structure drives the connecting shaft to drive the battery lead plate rotation；
The first inlet channel is provided with the connecting shaft, the process gas is delivered to the electricity through first inlet channel
Pole plate.
7. processing chamber according to claim 6, it is characterised in that the rotating mechanism includes oscillating cylinder, shaft coupling
And rotary shaft, wherein,
The oscillating cylinder is connected by the shaft coupling with one end of the rotary shaft, the other end of the rotary shaft with it is described
Axis connection is connected, the oscillating cylinder drives the rotary shaft to drive the connecting shaft to rotate；
The second inlet channel is provided with the rotary shaft, second inlet channel connects with first inlet channel.
8. processing chamber according to claim 7, it is characterised in that the chamber also includes air inlet pipe, the air inlet pipe
It is arranged on the outside of the rotating mechanism and is connected with second inlet channel；
The process gas inputs first inlet channel after flowing through second inlet channel from the air inlet pipe.
9. processing chamber according to claim 6, it is characterised in that the connecting shaft is located in the cavity and passes through institute
The bottom wall of cavity is stated, the rotating mechanism is located at outside the bottom wall of the cavity；
Level(l)ing mechanism is additionally provided between the bottom wall and the rotating mechanism, the level(l)ing mechanism is used to adjust
The levelness of the battery lead plate.
10. processing chamber according to claim 9, it is characterised in that the level(l)ing mechanism includes multiple adjusting rods
And connecting plate, wherein,
The connecting plate is arranged between the bottom wall and the rotating mechanism, and is connected with the rotating mechanism；
The connecting shaft passes through the connecting plate, and the connecting plate has at regular intervals with the bottom wall；
One end of the adjusting rod is fixedly connected with the bottom wall, and the other end passes through the connecting plate, and it passes through the connection
The adjustable length of plate；
The length of the connecting plate is passed through by adjusting the adjusting rod, adjusts the levelness of the connecting plate, the adjustable plate
Drive the rotating mechanism that the perpendicularity of the connecting shaft is adjusted, so as to realize the levelness progress to the battery lead plate
Regulation.
11. processing chamber according to claim 10, it is characterised in that the level(l)ing mechanism also includes telescoping tube；
The telescoping tube is sheathed on outside the connecting shaft, and its first end is tightly connected with the bottom wall, the second end and the company
Fishplate bar is tightly connected.
12. processing chamber according to claim 6, it is characterised in that the cavity includes the first sub- cavity and the second son
Cavity, wherein,
The second sub- cavity is arranged on the described first sub- cavity wall, and is connected with the described first sub- cavity；Wherein, it is described
Pedestal is arranged in the described first sub- cavity；The battery lead plate can revolve between the described first sub- cavity and the second sub- cavity
Turn；
When the battery lead plate is rotated into the described first sub- cavity, the battery lead plate is relative with the pedestal, to enter to chip
Row pre-cleaning processes；
When the battery lead plate is rotated into the described second sub- cavity, the battery lead plate leaves the top of the pedestal, with to crystalline substance
Piece carries out degassing technique.
13. a kind of semiconductor processing equipment, it is characterised in that including the processing chamber described in claim any one of 1-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720593819.2U CN206907736U (en) | 2017-05-25 | 2017-05-25 | A kind of processing chamber and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720593819.2U CN206907736U (en) | 2017-05-25 | 2017-05-25 | A kind of processing chamber and semiconductor processing equipment |
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| CN206907736U true CN206907736U (en) | 2018-01-19 |
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ID=61288179
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| CN201720593819.2U Active CN206907736U (en) | 2017-05-25 | 2017-05-25 | A kind of processing chamber and semiconductor processing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962713A (en) * | 2017-05-25 | 2018-12-07 | 北京北方华创微电子装备有限公司 | A kind of processing chamber and semiconductor processing equipment |
| CN110484895A (en) * | 2018-05-14 | 2019-11-22 | 北京北方华创微电子装备有限公司 | Chamber combination and reaction chamber |
-
2017
- 2017-05-25 CN CN201720593819.2U patent/CN206907736U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962713A (en) * | 2017-05-25 | 2018-12-07 | 北京北方华创微电子装备有限公司 | A kind of processing chamber and semiconductor processing equipment |
| CN108962713B (en) * | 2017-05-25 | 2020-10-16 | 北京北方华创微电子装备有限公司 | A process chamber and semiconductor processing equipment |
| CN110484895A (en) * | 2018-05-14 | 2019-11-22 | 北京北方华创微电子装备有限公司 | Chamber combination and reaction chamber |
| CN110484895B (en) * | 2018-05-14 | 2021-01-08 | 北京北方华创微电子装备有限公司 | Chamber assembly and reaction chamber |
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