CN206301969U - Usb interface module attachment structure and carrier arrangement - Google Patents

Abstract

The utility model provides a USB interface module connection structure and a carrier device, which relate to the field of USB interfaces. The connection structure of the USB interface module includes a USB interface seat, a first hard printed circuit board, a flexible circuit board and a hard printed circuit main board. The USB interface socket is arranged on the first hard printed circuit board, and the first hard printed circuit board is connected with the hard printed circuit main board through the flexible circuit board. The carrier device adopts the above-mentioned USB interface module connection structure. The connection structure of the USB interface module and the carrier device provided by the utility model use a flexible circuit board to replace the existing cables to realize the connection between the first hard printed circuit board and the hard printed circuit main board, which can effectively ensure USB signal transmission Effect and better EMC performance, and can make the circuit layout structure simpler and tidy, improve the production process level, the connection is simple and reliable, and the cost is low.

Description

USB interface module connection structure and carrier device

technical field

The utility model relates to the field of USB interfaces, in particular to a USB interface module connection structure and a carrier device using the USB interface module connection structure.

Background technique

Usually, the USB interface socket will exist on an independent small board. At this time, this USB small board will be connected to another board through a cable. Using a general-purpose connection cable will affect the USB function and performance, which will affect the To the EMC problem of the system, and the circuit layout in the system is scattered.

Utility model content

The purpose of the utility model is to provide a USB interface module connection structure, which can ensure the USB signal transmission effect and better EMC performance, and can make the circuit layout structure simpler.

Another object of the present invention is to provide a carrier device, which can ensure USB signal transmission effect and better EMC performance, and can make the circuit layout structure simpler.

Embodiments of the utility model are achieved in that:

A USB interface module connection structure, comprising a USB interface seat, a first hard printed circuit board, a flexible circuit board and a hard printed circuit main board, the USB interface seat is arranged on the first hard printed circuit board, the The first hard printed circuit board is connected to the hard printed circuit main board through the flexible circuit board.

Further, in a preferred embodiment of the present invention, the connection structure of the USB interface module further includes a connection board, and the flexible circuit board is connected to the hard printed circuit board through the connection board.

Further, in a preferred embodiment of the present invention, the connecting board is a second hard printed circuit board, and the flexible circuit board connects with the hard printed circuit main board through the second hard printed circuit board connect.

Further, in a preferred embodiment of the present invention, the second hard printed circuit board is welded to the hard printed circuit main board through a stamp hole.

Further, in a preferred embodiment of the present invention, the second hard printed circuit board is provided with a plurality of first half holes, the hard printed circuit main board is provided with a plurality of second half holes, and a plurality of The first half-holes correspond one-to-one to the plurality of second half-holes and are combined to form the stamp holes.

Further, in a preferred embodiment of the present invention, the connection structure of the USB interface module further includes a connector, and the second hard printed circuit board is plugged into the hard printed circuit main board through the connector superior.

Further, in a preferred embodiment of the present utility model, the first hard printed circuit board includes a plurality of first boards, and the first boards are arranged in layers one by one, and every two adjacent layers of the first boards The flexible circuit board is clamped therebetween.

Further, in a preferred embodiment of the present utility model, the second hard printed circuit board includes a plurality of second boards, and the second boards are arranged in layers one by one, and between every two layers of the second boards The flexible circuit board is clamped.

Further, in a preferred embodiment of the present utility model, the connecting board is a flexible circuit board.

A carrier device, comprising an outer shell and a USB interface module connection structure, the USB interface module connection structure comprising a USB interface seat, a first hard printed circuit board, a flexible circuit board and a hard printed circuit main board, the USB interface seat Set on the first hard printed circuit board, the first hard printed circuit board is connected to the hard printed circuit main board through the flexible circuit board, and the first hard printed circuit board is installed on the Outer casing.

The beneficial effects of the USB interface module connection structure and the carrier device provided by the embodiment of the present invention are: the flexible circuit board is used to replace the existing cable to realize the connection between the first hard printed circuit board and the hard printed circuit main board , can effectively improve the USB signal transmission distortion problem in the USB transfer process, improve the EMC problem of the system, ensure the USB signal transmission effect and better EMC performance, and can make the circuit layout structure simpler and tidy, and improve the production process level. The connection is simple and reliable, and the cost is low.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following drawings will be briefly introduced in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention. Therefore, it should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained according to these drawings without creative work.

Fig. 1 is the schematic structural diagram of the connection structure of the USB interface module provided by the first embodiment of the present invention;

Fig. 2 is a schematic cut-away structure diagram of the connection part between the first hard printed circuit board and the flexible circuit board in Fig. 1;

Fig. 3 is a structural schematic diagram of a flexible circuit board of the USB interface module connection structure in Fig. 1;

FIG. 4 is a structural schematic diagram of the bending portion of the flexible circuit board of the USB interface module connection structure in FIG. 1;

Fig. 5 is a schematic cut-away structure diagram of the connection part between the second hard printed circuit board and the flexible circuit board in Fig. 1;

Fig. 6 is a schematic structural view of the second hard printed circuit board of the USB interface module connection structure in Fig. 1;

Fig. 7 is a structural schematic diagram of a hard printed circuit mainboard of the USB interface module connection structure in Fig. 1;

FIG. 8 is a schematic structural diagram of the connection structure of the USB interface module provided by the second embodiment of the present invention.

Icons: 10-USB interface module connection structure; 100-first hard printed circuit board; 110-first board; 130-USB interface seat; 150-fixed hole position; 200-flexible circuit board; 210-upper board; 220 -Middle layer; 230-Lower layer; 240-Calendered copper foil; 250-Back glue; 260-Insulation substrate; 270-Protective film; The second plate; 330-the first half hole; 400-hard printed circuit main board; 410-the second half hole; 500-stamp hole.

detailed description

In order to make the purpose, technical solutions and advantages of the embodiments of the utility model more clear, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described The embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "up", "down", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the conventional orientation of the utility model product during use. The orientation or positional relationship, or the orientation or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, Constructed and operative in a particular orientation and therefore should not be construed as limiting the invention.

In addition, the terms "first", "second", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

In the description of the present utility model, it should also be noted that, unless otherwise clearly stipulated and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, Or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

first embodiment

Please refer to FIG. 1 , this embodiment provides a carrier device (not shown in the figure), and the carrier device includes an outer shell (not shown in the figure) and a USB interface module connection structure 10 . The USB interface module connection structure 10 is installed on the outer casing. Because the carrier device adopts the USB interface module connection structure 10, it can ensure the USB signal transmission effect and better EMC performance, and can make the circuit layout structure simpler. The carrier device can be a drone, camera equipment, etc., as long as it can realize USB transfer.

The USB interface module connection structure 10 includes a USB interface socket (not shown), a first rigid printed circuit board 100 , a flexible circuit board 200 , a second rigid printed circuit board 300 and a rigid printed circuit board 400 . The first rigid printed circuit board 100 is installed on the outer casing, and it can be fixed on the outer casing by screws or other methods. In this embodiment, the USB interface socket is arranged on the first hard printed circuit board 100 . The first rigid printed circuit board 100 is connected to the second rigid printed circuit board 300 through the flexible circuit board 200 , and the second rigid printed circuit board 300 is connected to the rigid printed circuit main board 400 . Thus, a board-to-board connection is formed between the second hard printed circuit board 300 and the hard printed circuit main board 400 , which can ensure better USB signal transmission quality.

Wherein, the connection between the second hard printed circuit board 300 and the hard printed circuit main board 400 can adopt various connection methods to realize board-to-board connection. In this embodiment, the second hard printed circuit board 300 is soldered to the hard printed circuit main board 400 through the stamp hole 500 . Thus forming the board-to-board stamp hole 500 connection mode between the second hard printed circuit board 300 and the hard printed circuit main board 400, which can not only ensure signal integrity and better EMC performance, but also make the connection simple and reliable ,low cost.

It should be noted that, in this embodiment, the second hard printed circuit board 300 is directly welded to the hard printed circuit main board 400 by using the welding method of the stamp hole 500 , and other connection methods may also be used. In other embodiments of the present utility model, the USB interface module connection structure 10 may also include a connector, and the second hard printed circuit board 300 is inserted on the hard printed circuit main board 400 through the connector, instead of using a stamp hole 500 way to connect.

It should be understood that the first hard printed circuit board 100, the second hard printed circuit board 300 and the hard printed circuit main board 400 mentioned in this embodiment are all hard boards, while the flexible circuit board 200 is a soft board. "Hard" and "soft" are relative terms. In this way, the USB interface module connection structure 10 of the soft-rigid board is formed.

In addition, it should be noted that in other embodiments of the present utility model, the second hard printed circuit board 300 can also be cancelled, and the first hard printed circuit board 100 connects the hard printed circuit main board through the flexible circuit board 200 400 connections. In this way, a wire-to-board connection between the flexible circuit board 200 and the hard printed circuit board 400 can be formed, and the entire signal communication link can also be completed.

Please refer to FIG. 2 , the first rigid printed circuit board 100 is connected to the flexible circuit board 200 . In this embodiment, the first rigid printed circuit board 100 includes a plurality of first boards 110 , and the first boards 110 are stacked in sequence, and a flexible circuit board 200 is sandwiched between every two layers of first boards 110 .

It should be understood that the first rigid printed circuit board 100 may have two layers, four layers, six layers or even more layers, and each layer is a first board 110, so the number of the first boards 110 is not specifically limited. The flexible circuit board 200 sandwiched between every two layers of the first board 110 means that every two different layers of the first board 110 is a group, and each group sandwiches a layer of the flexible circuit board 200 . For example, if the first hard printed circuit board 100 has two layers, a layer of flexible circuit board 200 is sandwiched between the two first boards 110; if the first hard printed circuit board 100 has four layers, the first layer and the second layer as a group, the third layer and the fourth layer as a group, a layer of flexible circuit board 200 is sandwiched between the first layer and the second layer, and a layer of flexible circuit board 200 is sandwiched between the third layer and the fourth layer The flexible circuit board 200, then the flexible circuit board 200 has two layers. In this embodiment, the first board 110 preferably has six layers.

In addition, there may be various clamping connection methods between every two layers of the first board 110 and the flexible circuit board 200 . In this embodiment, a layer of flexible circuit board 200 is embedded between every two layers of the first board 110 , and the two first boards 110 are pressed together with the flexible circuit board 200 so that the flexible circuit board 200 is sandwiched therebetween.

The flexible circuit board 200 is used for connecting the first rigid printed circuit board 100 and the second rigid printed circuit board 300 , or connecting the first rigid printed circuit board 100 and the rigid printed circuit board 400 . The flexible circuit board 200 may have one layer, two layers, three layers or more layers, and the number of the flexible circuit board 200 is not specifically limited.

In one embodiment of the present application, the flexible circuit board 200 has three layers, namely an upper layer board 210 , a middle layer board 220 and a lower layer board 230 . The upper layer board 210, the middle layer board 220 and the lower layer board 230 are sequentially stacked and arranged, and one end of the upper layer board 210, the middle layer board 220 and the lower layer board 230 are clamped between each adjacent two layers of the plurality of first boards 110 in sequence. , and the other end is connected to the second hard printed circuit board 300 . It should be understood that the flexible circuit board 200 has three layers, the first hard printed circuit board 100 has six layers, and a layer of flexible circuit board 200 is sandwiched between every two adjacent layers of the six-layer first board 110 . In this way, the signals connecting the first hard printed circuit board 100 and the second hard printed circuit board 300 can be wrapped in the middle layer board 220 of the flexible circuit board 200, while the upper layer board 210 and the lower layer board 230 are all grounded. In this way, a better signal shielding effect can be achieved, and the signal integrity can be optimized.

In addition, the specific structure of each layer of flexible circuit board 200 may be the same or different. Please refer to FIG. 3 , in this embodiment, each layer of the flexible circuit board 200 has the same structure, including rolled copper foil 240 , back glue 250 , insulating substrate 260 and protective film 270 . The rolled copper foil 240 , the adhesive backing 250 , the insulating substrate 260 and the protective film 270 are sequentially laminated and pressed together.

It should be noted that, in an embodiment of the present invention, please refer to FIG. 4 , the flexible circuit board 200 may have a bent portion 280 . That is to say, the flexible circuit board 200 can be bent according to the structure, and the matching structure is more flexible.

Please refer to FIG. 5 , the second rigid printed circuit board 300 is used to connect the flexible circuit board 200 and the rigid printed circuit main board 400 to realize board-to-board connection. In this embodiment, the second hard printed circuit board 300 includes a plurality of second boards 310 , and the second boards 310 are stacked in sequence, and the flexible circuit board 200 is sandwiched between every two layers of second boards 310 .

It should be understood that the second hard printed circuit board 300 is similar to the first hard printed circuit board 100, and the second hard printed circuit board 300 can adopt two layers, four layers, six layers or even more layers, and each layer is a The second plate 310, so the number of the second plate 310 is not specifically limited. The flexible circuit board 200 sandwiched between every two layers of second boards 310 means that two different layers of second boards 310 form a group, and each group sandwiches a layer of flexible circuit board 200 . For example, if the second hard printed circuit board 300 has two layers, a layer of flexible circuit board 200 is sandwiched between the two second boards 310; if the second hard printed circuit board 300 has four layers, the first layer and the second layer as a group, the third layer and the fourth layer as a group, a layer of flexible circuit board 200 is sandwiched between the first layer and the second layer, and a layer of flexible circuit board 200 is sandwiched between the third layer and the fourth layer The flexible circuit board 200, then the flexible circuit board 200 has two layers. In this embodiment, the second hard printed circuit board 300 has six layers. The flexible circuit board 200 has three layers, and the ends of the upper layer board 210, the middle layer board 220 and the lower layer board 230 away from the first hard printed circuit board 100 are clamped between two adjacent layers of a plurality of second boards 310 in sequence. , so as to wrap the signal connecting the first rigid printed circuit board 100 and the second rigid printed circuit board 300 on the middle layer 220 of the flexible circuit board 200 .

In addition, there may be various clamping connection methods between every two layers of the second board 310 and the flexible circuit board 200. In this embodiment, one layer of the flexible circuit board 200 is embedded between every two layers of the second board 310. , and the two layers of the second board 310 are pressed against the flexible circuit board 200 so that the flexible circuit board 200 is sandwiched therebetween.

It should be noted that the second hard printed circuit board 300 can also be a flexible circuit board, that is to say, other flexible circuit boards are used to replace the second hard printed circuit board 300 and connected to the above-mentioned flexible circuit board 200. In this way, It can also be considered that the second hard printed circuit board 300 is eliminated, and the flexible circuit board 200 is extended to connect with the hard printed circuit main board 400 . The above-mentioned second hard printed circuit board 300 and the flexible circuit board replacing the second hard printed circuit board 300 may be collectively referred to as a connection board. Of course, the connecting plate can also adopt other connecting structures.

Please refer to FIG. 6 , where the second rigid printed circuit board 300 is provided with a plurality of first half holes 330 , and the plurality of first half holes 330 are arranged at intervals in sequence. The first half hole 330 is used to form the stamp hole 500 in combination with the corresponding structure on the hard printed circuit board 400 . The shape of the first half hole 330 may be a semicircle, a semiellipse, a zigzag, a rectangle, and the like.

Please refer to FIG. 7 , the hard printed circuit board 400 is a circuit board with any number of layers and USB function. In this embodiment, the hard printed circuit board 400 is provided with a plurality of second half holes 410, and the plurality of second half holes 410 are arranged at intervals in sequence. The plurality of first half-holes 330 correspond to the plurality of second half-holes 410 one by one and are combined to form a stamp hole 500 . Likewise, the shape of the second half hole 410 may be semicircle, semiellipse, zigzag, rectangle and so on. In this way, the stamp hole 500 formed by the combination of the first half holes 330 and the second half holes 410 may be in the shape of a circle, an ellipse, a rhombus, a rectangle, etc., and the shape of the stamp hole 500 is not specifically limited.

In summary, the USB interface module connection structure 10 and the carrier device provided in this embodiment use the flexible circuit board 200 instead of the existing cable to realize the connection between the first hard printed circuit board 100 and the hard printed circuit main board 400. The connection between them can effectively improve the problem of USB signal transmission distortion in the process of USB transfer, improve the EMC problem of the system, ensure the effect of USB signal transmission and better EMC performance, and can make the circuit layout structure simpler and tidy, and improve production level of craftsmanship. Moreover, in this embodiment, by setting the second hard printed circuit board 300 and adopting the board-to-board stamp hole 500 connection method, the integrity of the signal and better EMC performance are further ensured, and the connection is simple and reliable, and the cost is low.

second embodiment

Please refer to Fig. 8, this embodiment provides another kind of carrier device, its basic structure, working principle and technical effect are basically the same as the carrier device provided by the first embodiment, the contents not described in this embodiment can refer to the first embodiment example. The difference between the carrier device provided in this embodiment and the carrier device provided in the first embodiment lies in that the structures of the first hard printed circuit board 100 and the second hard printed circuit board 300 of the USB interface module connection structure 10 are different.

In this embodiment, the first hard printed circuit board 100 is connected to one end of the flexible circuit board 200, the other end of the flexible circuit board 200 is connected to the second hard printed circuit board 300, and the second hard printed circuit board 300 is connected to the hard The printed circuit board 400 is connected.

Wherein, the first hard printed circuit board 100 is provided with a USB interface socket 130 , and the USB interface socket 130 is connected with the flexible circuit board 200 . The first hard printed circuit board 100 is provided with a plurality of fixing holes 150 for connecting with the outer shell of the carrier device, and the positions of the fixing holes 150 can be adjusted freely to match the outer shell. Of course, the first rigid printed circuit board 100 may also be provided with other connection structures to connect with the outer shell.

The second hard printed circuit board 300 is roughly T-shaped, and its free end is provided with a plurality of first half holes 330 arranged at intervals in sequence, and the side of the two shoulders of the T-shape near the free end is also provided with a plurality of holes. The first half holes 330 are arranged at intervals in sequence. The plurality of first half-holes 330 are combined with the corresponding plurality of second half-holes 410 on the hard printed circuit board 400 to form a stamp hole 500 . In this way, the board-to-board stamp hole 500 welding method is adopted between the second hard printed circuit board 300 and the hard printed circuit main board 400. This connection method can not only ensure signal integrity and better EMC performance, but also Make the connection simple, reliable and low cost.

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. a kind of usb interface module attachment structure, including USB interface seat, the first rigid polyviyl circuit plate and rigid polyviyl circuit mainboard, Characterized in that, also including flexible PCB, USB interface seat is arranged on the first rigid polyviyl circuit plate, described the One rigid polyviyl circuit plate is connected by the flexible PCB with the rigid polyviyl circuit mainboard.

2. usb interface module attachment structure according to claim 1, it is characterised in that the usb interface module connection knot Structure also includes connecting plate, and the flexible PCB is connected by the connecting plate with the rigid polyviyl circuit mainboard.

3. usb interface module attachment structure according to claim 2, it is characterised in that the connecting plate is the second embossing seal Circuit board processed, the flexible PCB is connected by the second rigid polyviyl circuit plate with the rigid polyviyl circuit mainboard.

4. usb interface module attachment structure according to claim 3, it is characterised in that the second rigid polyviyl circuit plate The rigid polyviyl circuit mainboard is welded in by stamp hole.

5. usb interface module attachment structure according to claim 4, it is characterised in that the second rigid polyviyl circuit plate Be provided with multiple first half bore, the rigid polyviyl circuit mainboard is provided with multiple second half bore, multiple first half bore with it is many Individual second half bore corresponds and combines to form the stamp hole.

6. usb interface module attachment structure according to claim 3, it is characterised in that the usb interface module connection knot Structure also includes connector, and the second rigid polyviyl circuit plate is plugged on the rigid polyviyl circuit mainboard by the connector.

7. the usb interface module attachment structure according to claim any one of 3-6, it is characterised in that first embossing seal Circuit board processed includes multiple first plates, and first plate stacks gradually arrangement, is clamped between the first plate described in per adjacent two layers The flexible PCB.

8. usb interface module attachment structure according to claim 7, it is characterised in that the second rigid polyviyl circuit plate Including multiple second plates, second plate stacks gradually arrangement, and the flexible circuit is clamped between the second plate described in per two-layer Plate.

9. usb interface module attachment structure according to claim 2, it is characterised in that the connecting plate is flexible circuit Plate.

10. a kind of carrier arrangement, including shell body, it is characterised in that the carrier arrangement is also included as claim 1-9 is any Usb interface module attachment structure described in, the first rigid polyviyl circuit plate is installed on the shell body.