CN206196136U - Solder ball array structure - Google Patents
Solder ball array structure Download PDFInfo
- Publication number
- CN206196136U CN206196136U CN201621195178.7U CN201621195178U CN206196136U CN 206196136 U CN206196136 U CN 206196136U CN 201621195178 U CN201621195178 U CN 201621195178U CN 206196136 U CN206196136 U CN 206196136U
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- Prior art keywords
- soldered ball
- solder ball
- region
- ground
- ball region
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract
The utility model relates to an electronic communication application especially relates to a solder ball array structure. This structure includes that outer solder ball is regional, including a plurality of two -layer solder balls according to appointed interval series arrangement in the outer solder ball region, the structure still includes: the inlayer solder ball is regional and power / ground solder ball is regional, the inlayer solder ball is regional, is located outer solder ball regional with between power / ground solder ball region, and contain a plurality of solder balls according to the sequencing of first assigned position, power / ground solder ball zone bit in the inlayer of structure wherein contains a plurality of solder balls of arranging according to the second assigned position. Consequently, this structure can reduce the BGA fan -out degree of difficulty, reduces the integrality that PCB designed the number of piles, enhanced signal.
Description
Technical field
The utility model is related to electronic communication application field, more particularly to a kind of ball bonded array structure.
Background technology
Welded ball array encapsulates BGA technologies, is to make array soldered ball in the bottom of encapsulation structure base board, as the I/O ends of circuit
With the mutual connection of printed substrate PCB.BGA package technology has become the main flow encapsulation technology of integrated circuit.
As shown in figure 1, array is typically expired in traditional BGA soldered balls arrangement, this BGA size is 13X13mm, the upper tin of BGA
The quantity of ball is 190, and the spacing of tin ball is 0.8mm.Traditional BGA package to be fanned out to form as shown in Figure 2.
But the inventors discovered that traditional BGA soldered balls arrangement architecture there are the following problems：
First, when Fan out are carried out, although the outlet of the row's soldered ball Ball of outermost two can be fanned out to from the top layer of PCB,
Need not punch, but being fanned out to since third layer Ball, must punch and be fanned out to from other layers, the via for so arranging is still
Such as a wall, block backflow plane and enter BGA lower sections, as shown in figure 3, simultaneously excessive via can also increase stray inductance and
Parasitic capacitance, impacts to signal integrity；
Second, from figure 2 it can be seen that being fanned out to that must punch just can be with complete toward the row of mileage the 3rd and the 4th row from outer
Into otherwise can't get out.
Utility model content
The utility model embodiment provides a kind of ball bonded array structure, and difficulty is fanned out to for reducing BGA, reduces PCB design
The number of plies, strengthens the integrality of signal.
A kind of ball bonded array structure, including outer layer soldered ball region, the outer layer soldered ball region include it is multiple according to
The tactic two-layer soldered ball of appointed interval, the structure also includes：
Internal layer soldered ball region and power supply/ground soldered ball region；
The interior-layer layer soldered ball region, between the outer layer soldered ball region and the power supply/ground soldered ball region, and bag
Containing the soldered ball that multiple sorts according to the first specified location；
The power supply/ground soldered ball region is located at the structure innermost layer, wherein being arranged according to the second specified location comprising multiple
The soldered ball of row.
It can be seen that, the ball bonded array structure that the utility model is provided is entirely different with existing structure, and it passes through first and specifies
Position is determined except the soldered ball of outermost two-layer and internal layer power supply/ground soldered ball region puts in order, and this can sequentially ensure outer
Layer soldered ball region can not punch and directly be fanned out to so that get through the passage that backflow plane enters below BGA, reduced hole count
Amount；Simultaneously in the power supply/ground soldered ball region that is formed of soldered ball of the second specified location arrangement so that power supply, can be without
Surrounding is fanned out to, and directly punching enters bus plane and stratum, therefore, the structure can reduce BGA and be fanned out to difficulty, reduce PCB design
The number of plies, strengthens the integrality of signal.
Brief description of the drawings
In order to illustrate more clearly of the utility model or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for technology description is briefly described.
Fig. 1 is BGA soldered balls arrangement architecture schematic diagram in the prior art；
Fig. 2 is BGA fan-out structures schematic diagram in the prior art；
Fig. 3 is the channel design schematic diagram of BGA signals backflow plane in the prior art；
A kind of ball bonded array structure schematic diagram that Fig. 4 is provided for the utility model embodiment：
A kind of fan-out structure schematic diagram of ball bonded array structure that Fig. 5 is provided for the utility model embodiment；
A kind of channel design of the signal backflow plane of ball bonded array structure that Fig. 6 is provided for the utility model embodiment is shown
It is intended to.
Specific embodiment
In order that those skilled in the art more fully understand the technical scheme in the utility model embodiment, and make this reality
With new above-mentioned purpose, feature and advantage can be more obvious understandable, below in conjunction with the accompanying drawings to technical side in the utility model
Case is described in further detail.
The ball bonded array structure that the utility model is provided, entirely different with existing structure, it passes through the first specified location
Determine except the soldered ball of outermost two-layer and internal layer power supply/ground soldered ball region puts in order, and this can sequentially ensure that outer layer is welded
Ball region can not punch and directly be fanned out to so that get through the passage that backflow plane enters below BGA, reduce number of vias；Together
When in the power supply/ground soldered ball region that is formed of soldered ball of the second specified location arrangement so that power supply, can be without around fanning
Go out, directly punching enters bus plane and stratum, therefore, the structure can reduce BGA and be fanned out to difficulty, reduce the PCB design number of plies, increase
The integrality of strong signal.
As shown in figure 4, the ball bonded array structure includes outer layer soldered ball region 41, internal layer soldered ball region 42 and power supply/ground
Soldered ball region 43；
The internal layer soldered ball region 42, between the outer layer soldered ball region 41 and the power supply/ground soldered ball region 43,
And the soldered ball sorted according to the first specified location comprising multiple；
The power supply/ground soldered ball region 43 is located at the structure innermost layer, wherein comprising multiple according to the second specified location
The soldered ball of arrangement.
First specified location refer to not comprising C3, C4, C7, C8, C11, C12, D2, D3, D4, D6, D7, D8, D9,
D11、D12、D13、E4、E10、E11、F3、F11、F12、G3、G12、H2、H3、H12、H13、J2、J3、J12、J13、K3、K12、
L3、L4、L12、M3、M4、M5、M6、M10、M11、M12、N2、N3、N4、N7、N8、N9、N10、N11、N12、N13、P3、P4、P7、
The position of P11.Soldered ball in the internal layer soldered ball region 42 is not located in the first specified location, and particular location is as shown in Figure 4；
Second specified location refers to：E5 to E9, F4 to F10, G4 to G11, H4 to H6, H9 to H11, J4 to J6, J9
To J11, K4 to K11, L5 to L11, M7 to M9.Soldered ball in the power supply/ground soldered ball region 43 is located in the second specified location；
According to the soldered ball of the structural arrangement, the fan-out structure for ultimately forming is as shown in Figure 5；
According to the soldered ball of the structural arrangement, the soldered ball position of first row and second row can not be beaten in outer layer soldered ball region 41
Hole is directly fanned out to, and reserves the ground path into inside BGA for 8, as shown in Figure 6.As can be seen that backflow plane is more complete,
And it is relatively more with the external passage being connected, the impedance of backflow plane can be so reduced, big backflow plane also can be complete to signal
Whole property brings benefit.
In this structure, the passage that backflow plane enters below BGA is got through, number of vias is reduced, while increasing in centre
Power supply and ground soldered ball arrangement so that power supply, can be fanned out to without surrounding, directly punching entrance bus plane and stratum.
Preferably, in order to the need for better meeting and being fanned out to from corner, four be removed in the outer layer soldered ball region 41
The soldered ball at angle, as a result as shown in Figure 4.
In sum, beneficial effect：
The ball bonded array structure that the utility model is provided, entirely different with existing structure, it passes through the first specified location
Determine except the soldered ball of outermost two-layer and internal layer power supply/ground soldered ball region puts in order, and this can sequentially ensure that outer layer is welded
Ball region can not punch and directly be fanned out to so that get through the passage that backflow plane enters below BGA, reduce number of vias；Together
When in the power supply/ground soldered ball region that is formed of soldered ball of the second specified location arrangement so that power supply, can be without around fanning
Go out, directly punching enters bus plane and stratum, therefore, the structure can reduce BGA and be fanned out to difficulty, reduce the PCB design number of plies, increase
The integrality of strong signal.
Preferred embodiment of the present utility model is the foregoing is only, is not used to limit the utility model, it is all at this
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (4)
1. a kind of ball bonded array structure, including outer layer soldered ball region, the outer layer soldered ball region includes multiple according to finger
Determine the two-layer soldered ball of intervening sequences arrangement, it is characterised in that the structure also includes：
Internal layer soldered ball region and power supply/ground soldered ball region；
The internal layer soldered ball region, between the outer layer soldered ball region and the power supply/ground soldered ball region, and comprising multiple
According to the soldered ball that the first specified location sorts；
The power supply/ground soldered ball region is located at the structure innermost layer, wherein arranged according to the second specified location comprising multiple
Soldered ball.
2. ball bonded array structure as claimed in claim 1, it is characterised in that remove and belong to the outer layer soldered ball region and position
In four soldered balls at angle.
3. ball bonded array structure as claimed in claim 1, it is characterised in that line number enters rower with 1 to 15 in the structure
Know, row number is identified with A to T, then first specified location refer to not comprising C3, C4, C7, C8, C11, C12, D2, D3,
D4、D6、D7、D8、D9、D11、D12、D13、E4、E10、E11、F3、F11、F12、G3、G12、H2、H3、H12、H13、J2、J3、
J12、J13、K3、K12、L3、L4、L12、M3、M4、M5、M6、M10、M11、M12、N2、N3、N4、N7、N8、N9、N10、N11、
The position of N12, N13, P3, P4, P7, P11.
4. ball bonded array structure as claimed in claim 1, it is characterised in that line number enters rower with 1 to 15 in the structure
Know, row number is identified with A to T, then second specified location refers to：E5 to E9, F4 to F10, G4 to G11, H4 to H6, H9
To H11, J4 to J6, J9 to J11, K4 to K11, L5 to L11, M7 to M9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195178.7U CN206196136U (en) | 2016-10-31 | 2016-10-31 | Solder ball array structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195178.7U CN206196136U (en) | 2016-10-31 | 2016-10-31 | Solder ball array structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206196136U true CN206196136U (en) | 2017-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621195178.7U Active CN206196136U (en) | 2016-10-31 | 2016-10-31 | Solder ball array structure |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024138552A1 (en) * | 2022-12-29 | 2024-07-04 | 声龙(新加坡)私人有限公司 | Package substrate solder ball layout method and apparatus, and chip and storage medium |
-
2016
- 2016-10-31 CN CN201621195178.7U patent/CN206196136U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024138552A1 (en) * | 2022-12-29 | 2024-07-04 | 声龙(新加坡)私人有限公司 | Package substrate solder ball layout method and apparatus, and chip and storage medium |
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