CN206168861U - There is not basket silicon wafer cleaning machine tool hand - Google Patents
There is not basket silicon wafer cleaning machine tool hand Download PDFInfo
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- CN206168861U CN206168861U CN201621195488.9U CN201621195488U CN206168861U CN 206168861 U CN206168861 U CN 206168861U CN 201621195488 U CN201621195488 U CN 201621195488U CN 206168861 U CN206168861 U CN 206168861U
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- hand
- silicon chip
- wafer cleaning
- fixture
- basket
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 94
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 94
- 239000010703 silicon Substances 0.000 title claims abstract description 94
- 238000004140 cleaning Methods 0.000 title claims abstract description 57
- 239000010453 quartz Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000000903 blocking effect Effects 0.000 claims abstract 2
- 238000005096 rolling process Methods 0.000 claims description 13
- 210000002421 cell wall Anatomy 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 230000033001 locomotion Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 description 18
- 239000012530 fluid Substances 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a there is not basket silicon wafer cleaning machine tool hand, belongs to silicon chip cleaning equipment field. Pressing from both sides tight drive division including being used for the drive to hold the relative pivoted of side arm in hand, holding the side arm in hand and articulate on the longitudinal movement frame, hold the side arm bottom in hand and be equipped with the mounting, it has a plurality of fixed slots that are used for blocking the silicon chip to open on the mounting. The mounting that this scheme was made through the quartz presss from both sides tight fixing silicon wafer for the silicon chip is more abundant contacting with the washing liquid in the cleaning process, and the quartzy mounting of making is extremely difficult and sour or the alkali solution reaction, thus the difficult washing liquid that pollutes, and practiced thrift manufacturing cost greatly. And pressing from both sides when getting the silicon chip, reducing the manual work and inserted the step of the basket of flowers with the silicon chip, the operating time that has significantly reduced has improved work efficiency.
Description
Technical field
The utility model is related to Wafer Cleaning apparatus field, more particularly to a kind of without basket Wafer Cleaning machinery hand.
Background technology
When existing cleaning machine is typically using there is blue formula cleaning, i.e. cleaning silicon chip, first have to silicon chip to put the gaily decorated basket, Ran Houfang into
Enter cleaning machine, then the manipulator crawl gaily decorated basket of cleaning machine carries out soda acid or organic washing together with the gaily decorated basket.Such as notification number
For the Chinese utility model patent of 204441264U discloses a kind of silicon chip frock gaily decorated basket transfer device, need silicon when in use
Piece is inserted in the gaily decorated basket one by one, and is fixed, then immerses cleaning in acid or aqueous slkali by the mechanical arm gripping gaily decorated basket.Waste
Time, operating efficiency is relatively low, and silicon chip, mounted in basket the inside, silicon chip is larger with basket contact area, the edge contacted with the gaily decorated basket
Part does not wash clean clearly, influences product quality.
Utility model content
The purpose of this utility model is to provide a kind of without basket Wafer Cleaning machinery hand, directly clipping silicon chip can be carried out clearly
Wash, save the plenty of time, improve the operating efficiency of Wafer Cleaning.
Above-mentioned purpose of the present utility model technical scheme is that：One kind is without basket silicon wafer cleaner
Tool hand, including erecting bed and on erecting bed and can be along the mounting bracket of erecting bed transverse shifting, mounting bracket includes that connection is installed
The transverse shifting frame of platform and, also vertically move frame including can laterally move that frame vertically moves, vertically move frame and be provided with machine
Tool hand, manipulator includes that two hands being oppositely arranged grab side arm, also including being driven for the clamping for driving hand to grab side arm relative rotation
Dynamic portion, hand is grabbed side arm and is hinged on and vertically moves on frame, and hand is grabbed side arm bottom and is provided with fixture, is provided with fixture some for card
The firmly fixing groove of silicon chip.
By using above-mentioned technical proposal, transverse shifting frame is moved when in use so that vertically moving frame alignment will grip
Silicon chip, then control vertically move frame laterally move frame length direction decline, until fixing groove be aligned the silicon chip to be gripped,
Then drive hand to grab side arm using drive division to relatively rotate, and make silicon wafer clamping that fixture will grip in fixing groove, so
Control vertically moves frame and laterally moves the rising of frame length direction afterwards, then controls transverse shifting frame to be moved on erecting bed, until
Robot alignment fills the service sink of acid or aqueous slkali, and control vertically moves frame decline so that in silicon chip immersion service sink.We
The hand of case is grabbed side arm and is provided with fixture, using the fixing groove on fixture come direct clipping silicon chip, and without manually operating silicon
In the piece insertion gaily decorated basket, then grip the gaily decorated basket and carry out Integral cleaning.The plenty of time is saved, the operating efficiency of Wafer Cleaning is improve.
Preferably, fixture is cylinder, and fixing groove is the annular groove being opened on fixture cylindrical side, fixing groove
Bottom land is parallel with the cylindrical side of fixture.
By using above-mentioned technical proposal, when silicon chip fixture is clamped, due to the place acid being in contact with fixture
Or aqueous slkali is difficult soaking and washing, so the contact area between silicon chip and fixture is the smaller the better, in the prior art with flower
Basket holds silicon chip, and the area that the gaily decorated basket is in contact with silicon chip is big so that silicon chip and gaily decorated basket touching position cannot fully with acid or alkali
Solution is in contact, so that portion cleaning is difficult on silicon chip.In this programme fixture for cylinder, and fixing groove groove
Bottom is parallel with the cylindrical side of cylindrical fixture so that fixing groove when the silicon chip to be cleaned is clamped, silicon chip side with it is solid
The bottom land touching position of groove is determined for linear contact lay, so as to reduce the contact area between silicon chip and fixing groove.So that Wafer Cleaning
More comprehensively, more thoroughly.
Preferably, the V-shaped setting of two cell walls of fixing groove.
By using above-mentioned technical proposal so that fixing groove clamp the silicon chip to be cleaned when, the cell wall and silicon of fixing groove
Be difficult between piece contact so that silicon chip in cleaning process with acid or aqueous slkali be in contact more fully, cleaning is more
Plus thoroughly.
Preferably, thickness of the width of fixing groove bottom land more than silicon chip to be cleaned.
By using above-mentioned technical proposal so that silicon chip when fixture is clamped, the contact between silicon chip and fixture
It is linear contact lay so that during silicon chip is substantially completely immersed in acid or aqueous slkali in cleaning so that Wafer Cleaning is more
Thoroughly.
Preferably, fixture is made up of quartz, and each hand is grabbed and be fixed with side arm two fixtures, four for being oppositely arranged
Fixture is circumferentially distributed, and just tangent with silicon chip to be cleaned.
By using above-mentioned technical proposal, liquid used by present chip production factory is usually the medicine such as strong acid, highly basic, organic
Liquid, the gaily decorated basket typically uses PFA materials, and the gaily decorated basket is used as running stores, and use cost is high, and the cost of each gaily decorated basket even wants thousands of units.
The gaily decorated basket is used as carrier, while it is pollution sources to have again, if the gaily decorated basket chooses improper, easily pollutes liquid, influences product quality, while
Cause liquid waste.And fixture is made of quartz in this programme, although the unit price of quartz is higher than the material for being made the gaily decorated basket
Unit price, but the quartz material required for the hold-down bars of quartz material is few, and service life is significantly larger than the use of the gaily decorated basket
Life-span.So as to greatly reduce the cleaning cost of silicon chip, so as to greatly reduce the production cost of whole manufacturing procedure so that into
The price of product can be lower, but profit is higher.
Because fixture is when silicon chip is captured, the area being in contact with silicon chip is smaller, and silicon chip is maintained stationary state, base
This full frictional force by between silicon chip and fixture, and the contact area between fixture and silicon chip is linear contact lay so that this
The stress of frictional force is larger to the pressure that silicon chip is produced, and the corner part of silicon chip breakage is occurred.Each hand in this programme
Grab and be fixed with side arm two fixtures, four fixtures being oppositely arranged circumferentially are distributed so that silicon chip is in clamped fixation
When, the reaction force of silicon chip self gravitation helps fixture to fix silicon chip so that the power that both sides clamp silicon chip can be with small by one
A bit so that the stiction between silicon chip and the fixture of both sides diminishes, so that the pressure between silicon chip and fixture becomes
It is small so that silicon chip is also less prone to wear and tear in the case where being fixed.
Preferably, fixture is that retainer ring is evenly distributed with cylinder, and cylindrical sidewall, and fixing groove is arranged on fixation
The side of ring, is interval trough between adjacent retainer ring.
By using above-mentioned technical proposal, because silicon chip needs to be fully contacted with acid or aqueous slkali in cleaning, and silicon chip
The impurity on surface can be free near silicon chip with acid or the ion produced during alkali soluble liquid phase reactor, acid around influence silicon chip or
The concentration of alkaline cleaner.Interval trough in this programme causes that the space between adjacent silicon chip is bigger, so that acid or aqueous slkali
It is more easy to be flowed between silicon chip so that silicon chip surface sufficiently can be in contact with acid or aqueous slkali.Acid or aqueous slkali are in flowing
When also can produce convection current with the impurity of newly-generated ionic condition, not only silicon chip surface is washed away, and can also be by
Unnecessary ion is taken away so that the concentration of acid or alkali around silicon chip is maintained at level higher.
Preferably, drive division includes rotary cylinder, and the output end of rotary cylinder is fixed with camshaft, and manipulator includes gripping
Rocking arm, gripping one end is hinged on and vertically moves on frame, and the other end is provided with cam path, and in camshaft insertion cam path, hand is grabbed
Side arm is fixed on the hinged end of gripping rocking arm.
Rotated by using above-mentioned technical proposal, rotary cylinder drive cam shaft, camshaft is rotated in cam path so that
Gripping rocking arm is rotated with the rotation of camshaft on frame is vertically moved, and side arm opposing oscillatory is stressed on both hands in drive so that hand
Grab the silicon wafer clamping that the fixture on side arm will be cleaned.
Preferably, gripping rocking arm and to vertically move and be provided with rolling bearing between frame, jig arm body is arranged with rolling bearing,
One end that jig arm body is set on linear axis is mutually fixed with gripping rocking arm, and the other end is fixedly connected hand and grabs side arm.
By using above-mentioned technical proposal, rolling bearing causes that gripping rocking arm is more easy to be driven rotations, and gripping rocking arm and
Jig arm body is fixed, and jig arm body is also set on rolling bearing.So that gripping rocking arm easily drives jig arm body to rotate, from
And cause that jig arm body band starts to grab side arm rotation.Because camshaft is embedded in cam path, so when camshaft rotates,
The arm of force produced when the place more remote apart from cam path distance rotates on rocking arm is gripped is bigger, so that when clamping silicon chip
Clamping force is bigger so that silicon chip pressed from both sides closer to.Rocking arm is gripped in this programme and is set in the place of rolling bearing in gripping
It is farthest apart from cam path on rocking arm.So this programme clipping silicon chip in cam axle is tighter.
Preferably, the hand being oppositely arranged is connected between grabbing side arm by middle reinforced shaft.
By using above-mentioned technical proposal, due to gripping rocking arm, when rotating, band starts to grab side arm rotation, in order to obtain more
Big clamping force, thus hand grab that side arm does it is more long, and hand more long to grab side arm mechanical strength relatively low, be susceptible to deformation or
Damage.In this programme, some middle reinforced shafts are fixed between relative hand grabs side arm, further enhancing the machine that hand grabs side arm
Tool intensity.
Preferably, hand is fixed with jig arm body and grabs connecting seat, hand is grabbed and be combined with connecting seat hand and grab connection lid, and hand grabs side
Arm is fixed on hand grabs connection and covers, hand grabs connecting seat and hand grab connection cover be arranged with it is some for reinforced shaft in the middle of fixed
Groove.
By using above-mentioned technical proposal, connecting seat is grabbed by hand and hand is grabbed connection lid and is fixed on some middle reinforced shafts
Together, further enhancing the mechanical strength that hand grabs side wall.Also so that the machinery driving efficiency of jig arm body is higher.
In sum, the utility model has the advantages that：
1st, this programme without basket Wafer Cleaning machinery hand when to Wafer Cleaning, reduce and silicon chip manually inserted into the gaily decorated basket
In step, so as to reduce the working time of Wafer Cleaning, improve operating efficiency.
2nd, this programme without basket Wafer Cleaning machinery hand, the fixture for clipping silicon chip is made up of quartz, quartzy pole
It is difficult to be reacted with acid or aqueous slkali so that the service life of the fixture that quartz is made, the considerably longer than service life of the gaily decorated basket.And
Fixture in this programme is difficult the cleaning fluid that pollution acid or aqueous slkali are made, so as to reduce the cost of Wafer Cleaning so that
Wafer Cleaning it is more thorough.
3rd, in this programme using rotary cylinder drive cam shaft so as to control crawl side wall by silicon wafer clamping, and by drive division
It is arranged between two manipulators so that this programme compact conformation, takes up room smaller.
4th, the setting of interval trough so that cleaning fluid can more fully be washed away and cleaning to each silicon chip.
Brief description of the drawings
Fig. 1 is to indicate without the basket Wafer Cleaning machinery integrally-built schematic diagram of hand；
Fig. 2 be represent manipulator dismantle half assembling structure schematic diagram；
Fig. 3 is the schematic diagram for representing the half robot manipulator structure removed in Fig. 2；
Fig. 4 is to represent that hand grabs the schematic diagram of side wall construction；
Fig. 5 is the enlarged drawing of expression drive division work structuring at I in Fig. 1；
Fig. 6 is that II places represent that jig arm body and hand grab the enlarged drawing of side wall attachment structure in Fig. 3；
Fig. 7 is the enlarged drawing of expression anchor structure at III in Fig. 4；
Fig. 8 is the partial schematic diagram for representing anchor structure.
Reference：1st, erecting bed；11st, motor；2nd, mounting bracket；21st, transverse shifting frame；22nd, frame is vertically moved；23rd, pacify
Dress seat；231st, base plate；232nd, pedestal；233rd, linear bearing；3rd, manipulator；31st, hand grabs side wall；311st, middle reinforced shaft；32nd, drive
Dynamic portion；321st, rotary cylinder；322nd, camshaft；3221st, cam；33rd, fixture；34th, fixing groove；35th, retainer ring；36th, it is spaced
Groove；37th, rocking arm is gripped；371st, cam path；38th, rolling bearing；39th, jig arm body；391st, hand grabs connecting seat；392nd, hand grabs connection
Lid；393rd, groove；4th, silicon chip.
Specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Embodiment one：
As shown in figure 1, one kind is without basket Wafer Cleaning machinery hand, including erecting bed 1 and mounting bracket 2.Vertically move frame 22
It is connected on transverse shifting frame 21, and the motion of the in the vertical direction of frame 21 can be laterally moved.Manipulator 3 is fixed on longitudinal shifting
Moving frame 22.
Realize this motion can be cylinder or hydraulic cylinder, and flexible using piston realizes manipulator 3 vertical
The movement in direction.Or using motor 11, feed rod and leading screw transmission come control machinery hand vertical direction motion, it is and mechanical
Hand 3 is done horizontal motion on erecting bed 1 and can be driven by air cylinder driven or motor.
With reference to Fig. 2, mounting bracket 23 also includes being fixed on the mounting seat 23 vertically moved on frame 22, and mounting seat 23 includes being arranged
Pedestal 232 and base plate 231 on frame 22 is vertically moved.Drive division 32 includes rotary cylinder 321 and is connected to rotary cylinder 321
The camshaft 322 of output end.Rotary cylinder 321 is fixed on base plate 231.And pedestal 232 and being vertically moved be provided between frame 22
Linear bearing 233.
Gripping rocking arm 37 one end is set in and vertically moves on frame 22 and be provided with rolling bearing between frame 22 with vertically moving
38, the other end is provided with cam path 371, and by the inlay card of cam 3221 of camshaft 322 in cam path 371.It is right that manipulator 3 includes
Two parts of title, and be separately mounted to vertically move on frame 22 on symmetrically arranged two cylinder bodies of rod.
With reference to Fig. 5, so identical gripping rocking arm 37 in both sides is lived the inlay card of cam 3221 by cam path 371.When return
When 321 drive cam shaft of rotaring cylinder 322 is rotated, band moving cam 3221 is rotated, so that gripping rocking arm 37 carries cam path 371
One end swing.So that one end that gripping rocking arm 37 is set on rolling bearing 38 rotates.
One end that side wall 31 is grabbed in one end that gripping rocking arm 37 rotates with hand is mutually fixed, and hand is grabbed side wall 31 and is also set in
On rolling bearing 38.Hand is grabbed the other end of side wall 31 and is fixed with fixture 33.
With reference to Fig. 4 and Fig. 7, fixture 33 is the fixing groove 34 that some annulars are uniformly provided with cylinder, and the face of cylinder.Gu
The bottom land for determining groove 34 is the groove type to the sunken inside of fixture 33, and the groove arm of fixing groove 34 V-shaped is flared out.
When the gripping band of rocking arm 37 starts to grab the rotation of side wall 31, the hand of both sides is grabbed side wall 31 and is relatively rotated so that fixture 33
The action of gripping close to each other is done, silicon chip 4 is snapped in fixing groove 34.Then manipulator 3 is driven to move and be soaked into silicon chip
In cleaning fluid equipped with acid or aqueous slkali, now silicon chip 4 in addition to the small part of the joint of fixing groove 34, and cleaning fluid
It is fully contacted.
Embodiment two：
As shown in figure 8, one kind is without basket Wafer Cleaning machinery hand, the difference with embodiment one is, equal on fixture 33
Even that some retainer rings 35 are distributed with, fixing groove 34 is in retainer ring 35.Interval trough 36 is provided between adjacent retainer ring 35.
It is spaced at greater between adjacent silicon chip 4 when silicon chip is immersed in cleaning fluid so that cleaning fluid flows, washes away silicon
Piece 4 is more abundant.So that the cleaning of silicon chip 4 is more clean, thorough.
Embodiment three：
A kind of without basket Wafer Cleaning machinery hand with reference to Fig. 3 and Fig. 4, the difference with embodiment one or embodiment two is,
Each hand is grabbed the bottom of side wall 31 and is fixed with two fixtures 33.
Silicon chip 4 is generally circular in cross section, when the fixture 33 of silicon chip 4 is clamped, fixture 33 just with the arc-shaped edges phase of silicon chip 4
Contact.Play supporting silicon chip 4 positioned at a pair of the fixtures 33 compared with bottom, and another pair fixture 33 plays clamping silicon chip
4 effect.
As shown in figure 8, thickness of the slot bottom width of fixing groove 34 more than silicon chip 4.During so that silicon chip being cleaned in cleaning fluid,
Dead angle is less.That cleans is more clean, thorough.
Example IV：
As shown in figure 4, one kind is without basket Wafer Cleaning machinery hand, the difference with embodiment three is that each hand grabs side wall
Some middle reinforced shafts 311 are respectively and fixedly provided with 31.Because the power of the clipping silicon chip 4 of fixture 33 is passed by the rotation of jig arm body 39
Pass, and fixture 33 to grab the turning end of side wall 31 apart from hand more remote, then the arm of force is more long easier clamps silicon chip 4.
When hand grab side wall 31 it is more long when, the intensity that hand grabs side wall 31 is then deteriorated, and is susceptible to curved or fractures.This programme
In middle reinforced shaft 311 make to go smoothly grab side wall 31 intensity it is higher.
Embodiment five：
With reference to Fig. 3 and Fig. 6, a kind of without basket Wafer Cleaning machinery hand, the difference with embodiment one is to grip rocking arm 37
The power for producing is rotated, hand is passed to by jig arm body 39 and is grabbed side wall.Hand grabs connecting seat 391 and hand grabs the relative knot of connection lid 392
It is combined, and relative groove 393 wales middle reinforced shaft 311, are grabbed into connecting seat 391 by hand for recycling bolt and hand grabs company
Lid 392 is connect to be fixed together.Recycle two row's bolts that hand is grabbed into connecting seat 391 to be fixed on jig arm body 39.So as to complete folder
Arm body 39 grabs being connected for side wall 31 with hand.
Hand is grabbed connecting seat 391 and is grabbed with hand and is connected lid 392 and can further enhance the mechanical strength that hand grabs side wall 31.And press from both sides
Arm body 39 further extends the length that hand grabs side wall 31 so that the arm of force of the fixture 33 when silicon chip 4 is stepped up is longer.More hold
Easily silicon chip 4 is clamped.
Embodiment six：
As shown in Fig. 2 one kind is without basket Wafer Cleaning machinery hand, it is to grip rocking arm 37 to be arranged with the difference of embodiment one
On pedestal 232, the side of pedestal 232 is provided with grabs the groove that side wall 31 and jig arm body 39 are passed through and swung for hand.Rolling bearing 38
It is clipped between gripping rocking arm 37 and pedestal 232.
The pedestal 232 of this programme is slided by the driving mechanical hand 3 of linear bearing 233 on frame 22 is vertically moved.So that machine
Tool hand 3 is more flexible.
This specific embodiment is only that, to explanation of the present utility model, it is not to limitation of the present utility model, ability
Field technique personnel can make the modification without creative contribution to the present embodiment as needed after this specification is read, but
As long as all being protected by Patent Law in right of the present utility model.
Claims (10)
1. one kind is without basket Wafer Cleaning machinery hand, including erecting bed（1）With located at erecting bed（1）It is upper and can be along erecting bed（1）
The mounting bracket of transverse shifting（2）, the mounting bracket（2）Including connecting the erecting bed（1）Transverse shifting frame（21）, also include
Can be along the transverse shifting frame（21）What is vertically moved vertically moves frame（22）, it is described to vertically move frame（22）It is provided with manipulator
（3）, the manipulator（3）Two hands including being oppositely arranged grab side arm（31）, it is characterized in that：Also include for driving the hand
Grab side arm（31）The drive division of relative rotation（32）, the hand grabs side arm（31）Frame is vertically moved described in being hinged on（22）On, institute
State hand and grab side arm（31）Bottom is provided with fixture（33）, the fixture（33）On be provided with it is some for blocking silicon chip（4）Consolidate
Determine groove（34）.
2. according to claim 1 without basket Wafer Cleaning machinery hand, it is characterized in that：The fixture（33）It is cylinder
Body, the fixing groove（34）To be opened in the fixture（33）Annular groove on cylindrical side.
3. according to claim 2 without basket Wafer Cleaning machinery hand, it is characterized in that：The fixing groove（34）Two cell walls
V-shaped setting.
4. according to claim 3 without basket Wafer Cleaning machinery hand, it is characterized in that：The fixing groove（34）Bottom land
Width is more than silicon chip to be cleaned（4）Thickness.
5. according to claim 4 without basket Wafer Cleaning machinery hand, it is characterized in that：The fixture（33）For quartz is made
Into each described hand grabs side arm（31）On be fixed with two fixtures（33）, four fixtures being oppositely arranged（33）Circumferentially
Distribution, and just with silicon chip to be cleaned（4）It is tangent.
6. according to claim 1 without basket Wafer Cleaning machinery hand, it is characterized in that：The fixture（33）It is cylinder
Body, and the fixture（33）Retainer ring is evenly distributed with the wall of side（35）, the fixing groove（34）It is arranged on the retainer ring
（35）Side, adjacent retainer ring（35）Between be interval trough（36）.
7. according to claim 1 without basket Wafer Cleaning machinery hand, it is characterized in that：The drive division（32）Including revolution
Cylinder（321）, the rotary cylinder（321）Output end be fixed with camshaft（322）, the manipulator（3）Shaken including gripping
Arm（37）, the gripping rocking arm（37）One end vertically moves frame described in being hinged on（22）On, the other end is provided with cam path（371）,
The camshaft（322）On cam（3221）The insertion cam path（371）Interior, the hand grabs side arm（31）It is fixed on described
Gripping rocking arm（37）Hinged end on.
8. according to claim 7 without basket Wafer Cleaning machinery hand, it is characterized in that：The gripping rocking arm（37）With it is described
Vertically move frame（22）Between be provided with rolling bearing（38）, the rolling bearing（38）On be arranged with jig arm body（39）, it is described
Jig arm body（39）It is set in the rolling bearing（38）On one end and the gripping rocking arm（37）Mutually fixed, the other end is fixed
Connect the hand and grab side arm（31）.
9. according to claim 1 or 8 without basket Wafer Cleaning machinery hand, it is characterized in that：The hand being oppositely arranged is grabbed
Side arm（31）Between by middle reinforced shaft（311）It is connected.
10. according to claim 9 without basket Wafer Cleaning machinery hand, it is characterized in that：The jig arm body（39）It is upper solid
Surely hand grabs connecting seat（391）, the hand grabs connecting seat（391）On be combined with hand grab connection lid（392）, the hand grabs side arm
（31）It is fixed on the hand and grabs connection lid（392）On, the hand grabs connecting seat（391）Grabbed with hand and be connected lid（392）On symmetrically set
Have some for fixing the middle reinforced shaft（311）Groove（393）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195488.9U CN206168861U (en) | 2016-10-28 | 2016-10-28 | There is not basket silicon wafer cleaning machine tool hand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195488.9U CN206168861U (en) | 2016-10-28 | 2016-10-28 | There is not basket silicon wafer cleaning machine tool hand |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206168861U true CN206168861U (en) | 2017-05-17 |
Family
ID=58681331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621195488.9U Active CN206168861U (en) | 2016-10-28 | 2016-10-28 | There is not basket silicon wafer cleaning machine tool hand |
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| Country | Link |
|---|---|
| CN (1) | CN206168861U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108039331A (en) * | 2017-11-30 | 2018-05-15 | 北京南轩兴达电子科技有限公司 | A kind of full-automatic silicon wafer cleaning machine |
| CN108376668A (en) * | 2018-02-26 | 2018-08-07 | 上海提牛机电设备有限公司 | A kind of silicon chip clamping jaw and wafer clamping device |
| CN110634779A (en) * | 2019-09-19 | 2019-12-31 | 上海提牛机电设备有限公司 | A wafer grabbing mechanism |
| CN114030091A (en) * | 2021-11-25 | 2022-02-11 | 上海提牛机电设备有限公司 | gripping device |
| CN114769199A (en) * | 2022-04-22 | 2022-07-22 | 福建北电新材料科技有限公司 | Wafer cleaning method and apparatus |
| CN115070743A (en) * | 2022-08-18 | 2022-09-20 | 智程半导体设备科技(昆山)有限公司 | Semiconductor equipment mechanical arm |
| CN120060980A (en) * | 2025-04-25 | 2025-05-30 | 龙门实验室 | Monocrystalline silicon sample corrosion device |
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2016
- 2016-10-28 CN CN201621195488.9U patent/CN206168861U/en active Active
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| CN108039331B (en) * | 2017-11-30 | 2020-08-25 | 北京南轩兴达电子科技有限公司 | Full-automatic silicon wafer cleaning machine |
| CN108376668A (en) * | 2018-02-26 | 2018-08-07 | 上海提牛机电设备有限公司 | A kind of silicon chip clamping jaw and wafer clamping device |
| CN110634779A (en) * | 2019-09-19 | 2019-12-31 | 上海提牛机电设备有限公司 | A wafer grabbing mechanism |
| CN114030091A (en) * | 2021-11-25 | 2022-02-11 | 上海提牛机电设备有限公司 | gripping device |
| CN114769199A (en) * | 2022-04-22 | 2022-07-22 | 福建北电新材料科技有限公司 | Wafer cleaning method and apparatus |
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| CN120060980A (en) * | 2025-04-25 | 2025-05-30 | 龙门实验室 | Monocrystalline silicon sample corrosion device |
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