CN205810778U - 吸附装置 - Google Patents
吸附装置 Download PDFInfo
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- CN205810778U CN205810778U CN201620741625.8U CN201620741625U CN205810778U CN 205810778 U CN205810778 U CN 205810778U CN 201620741625 U CN201620741625 U CN 201620741625U CN 205810778 U CN205810778 U CN 205810778U
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- platform
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000003463 adsorbent Substances 0.000 claims 19
- 238000010521 absorption reaction Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 238000006073 displacement reaction Methods 0.000 claims 2
- 239000000741 silica gel Substances 0.000 claims 2
- 229910002027 silica gel Inorganic materials 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (19)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620741625.8U CN205810778U (zh) | 2016-07-14 | 2016-07-14 | 吸附装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620741625.8U CN205810778U (zh) | 2016-07-14 | 2016-07-14 | 吸附装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205810778U true CN205810778U (zh) | 2016-12-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620741625.8U Active CN205810778U (zh) | 2016-07-14 | 2016-07-14 | 吸附装置 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205810778U (zh) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257904A (zh) * | 2016-12-28 | 2018-07-06 | 林彦全 | 连接吸嘴的组装结构 |
| CN108638644A (zh) * | 2018-05-16 | 2018-10-12 | 郑州云海信息技术有限公司 | 一种真空支附座 |
| CN108735586A (zh) * | 2017-06-30 | 2018-11-02 | 上海微电子装备(集团)股份有限公司 | 一种抽真空装置及抽真空方法 |
| WO2018205635A1 (zh) * | 2017-05-08 | 2018-11-15 | 苏州精濑光电有限公司 | 柔性基板的承载装置及承载方法 |
-
2016
- 2016-07-14 CN CN201620741625.8U patent/CN205810778U/zh active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257904A (zh) * | 2016-12-28 | 2018-07-06 | 林彦全 | 连接吸嘴的组装结构 |
| CN108257904B (zh) * | 2016-12-28 | 2021-10-22 | 林彦全 | 连接吸嘴的组装结构 |
| WO2018205635A1 (zh) * | 2017-05-08 | 2018-11-15 | 苏州精濑光电有限公司 | 柔性基板的承载装置及承载方法 |
| CN108735586A (zh) * | 2017-06-30 | 2018-11-02 | 上海微电子装备(集团)股份有限公司 | 一种抽真空装置及抽真空方法 |
| CN108735586B (zh) * | 2017-06-30 | 2021-05-28 | 上海微电子装备(集团)股份有限公司 | 一种抽真空装置及抽真空方法 |
| US11664228B2 (en) | 2017-06-30 | 2023-05-30 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Vacuumizing device and vacuumizing method for bonding substrate |
| CN108638644A (zh) * | 2018-05-16 | 2018-10-12 | 郑州云海信息技术有限公司 | 一种真空支附座 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170330 Address after: San Jose, California, 2528 hole Road, No. 12 Patentee after: Zeta Instruments Inc Address before: Hsinchu city road three No. 38 3F-2 Patentee before: Wu Zhenwei |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171116 Address after: American California Patentee after: KLA-Tencor Corporation Address before: San Jose, California, 2528 hole Road, No. 12 Patentee before: Zeta Instruments Inc |
|
| TR01 | Transfer of patent right |