CN205817104U - A kind of laser process equipment removing thin film or coating - Google Patents
A kind of laser process equipment removing thin film or coating Download PDFInfo
- Publication number
- CN205817104U CN205817104U CN201620660086.5U CN201620660086U CN205817104U CN 205817104 U CN205817104 U CN 205817104U CN 201620660086 U CN201620660086 U CN 201620660086U CN 205817104 U CN205817104 U CN 205817104U
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- 238000000576 coating method Methods 0.000 title claims abstract description 79
- 239000011248 coating agent Substances 0.000 title claims abstract description 77
- 239000010409 thin film Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title abstract description 11
- 239000010408 film Substances 0.000 claims description 72
- 238000012545 processing Methods 0.000 claims description 26
- 238000003754 machining Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
A kind of laser process equipment removing thin film or coating disclosed in this utility model, comprising: laser instrument, controls the industrial computer of described laser instrument, and be sequentially provided with along laser emitting direction expand device, galvanometer and lens combination；Wherein, it is additionally provided with one on described industrial computer and detects laser power detector after thin film or coating outgoing, the performance number that industrial computer obtains according to power detector in real time, be calculated the thickness of thin film or coating, adjust laser parameter in real time, make laser the most accurately remove thin film or coating.Removal thin film of the present utility model or the laser process equipment of coating, by measuring thin film or the thickness of coating in real time, according to thickness adjusted laser parameter so that it is reaches optimum removal effect, fast accurate.
Description
Technical Field
The utility model belongs to the technical field of the film removal technique and specifically relates to an adopt laser to get rid of laser beam machining equipment of film or coating.
Background
Process requirements for film or coating removal are often encountered during processing, such as creating a mark by removing a portion of the film or coating; certain properties of the workpiece (such as electrical conductivity, insulation, light transmission, etc.) are achieved by removing portions of the film or coating; or the film or the coating is coated for the functions of protection and the like in the processing process, and the film or the coating needs to be removed after certain procedures are finished. Because the film or coating is generally thin and has strong adhesion, the efficient and accurate removal is difficult to realize by adopting the traditional mechanical means. The laser processing technology solves the problem to a certain extent, but because the thickness of the film or the coating is difficult to measure accurately or the film is not uniform, the thickness of each place is difficult to ensure to be consistent, and the film or the coating is difficult to remove efficiently and accurately.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a get rid of laser beam machining equipment of film or coating, it has solved present technical problem who is difficult to high-efficient accurate the getting rid of to product surface coating or film.
In order to achieve the above purpose, the utility model provides a technical scheme does:
the utility model discloses a get rid of laser beam machining equipment of film or coating, it includes: the laser device comprises a laser, an industrial personal computer for controlling the laser device, and a beam expanding device, a vibrating mirror and a lens system which are sequentially arranged along the laser emitting direction; the industrial personal computer is also provided with a power detector for detecting the laser emitted from the film or the coating in real time, calculates the thickness of the film or the coating according to the power value obtained by the power detector, and adjusts laser parameters in real time to enable the laser to rapidly and accurately remove the film or the coating.
The device comprises a workpiece to be machined, an X-Y platform and a control system, wherein the X-Y platform is used for placing the workpiece to be machined, and the X-Y platform drives the workpiece to be machined to move so as to finish the removal of a surface film or a coating of the workpiece to be machined.
The laser device is characterized in that a power detector is further arranged inside the laser device and used for detecting the power of laser emitted by the laser device in real time and transmitting the power value to the industrial personal computer.
Wherein, industrial computer adjustment laser instrument's laser parameter include: emergent laser power, laser frequency, galvanometer scanning speed, platform moving speed and processing times.
Compared with the prior art, the utility model discloses a get rid of laser beam machining equipment of film or coating, through the thickness of real-time measurement film or coating, according to thickness adjustment laser parameter, make it reach the optimum effect of getting rid of, it is quick accurate.
Drawings
Fig. 1 is a block diagram of a laser processing apparatus for removing a thin film or a coating according to the present invention.
Fig. 2 is a flow chart of the laser processing method for removing a thin film or a coating according to the present invention.
Fig. 3 is a schematic diagram illustrating the principle of obtaining the thickness value of the laser processing method for removing a thin film or a coating according to the present invention.
Detailed Description
The invention will be further elucidated with reference to the drawing.
Referring to fig. 2, in the present embodiment, a laser processing method for removing a film or a coating is disclosed, which includes the following steps:
a first step S1, measuring and obtaining a thickness value of the film or the coating; the thickness of the film or the coating at different positions is obtained in real time by means of measurement and the like;
a second step S2, adjusting laser parameters according to the thickness obtained in the first step; adjusting laser parameters in the step, wherein the parameters comprise laser emergent laser power, laser frequency, galvanometer scanning speed, platform moving speed, processing times and the like, and are carried out according to the thickness;
and a third step S3, turning on the laser, repeating the first step S1 and the second step S2, and scanning the laser on the surface of the film or coating until the film or coating is removed. Because the thickness of the film or coating is not uniform, the steps of detecting the thickness and adjusting the parameters need to be repeated continuously in the whole removing process.
Wherein, because the detecting and adjusting process needs to be repeated in real time when the thicknesses are inconsistent, for some thicker films or coatings, before performing the first step S1, the method further includes: and presetting a certain thickness value as a detection reference, adopting uniform laser parameters, preliminarily removing the film or the coating, detecting a feedback signal in real time until the thickness of the film or the coating reaches a preset value, and then adjusting processing parameters according to the preset value to perform fine processing. Namely, the whole film or coating on the surface of the sample is rapidly and preliminarily removed by adopting higher power until a preset value is reached, so that the problems of long removal time and low efficiency caused by repeated detection and adjustment are avoided.
More specifically, there are two applications for thin film removal: firstly, the thickness of the film is obtained before or in the middle of processing through negative feedback information, and processing parameters are set according to the thickness of the film to finish processing; secondly, a negative feedback value is preset, the negative feedback value corresponds to the thickness of the rest film, high-power rapid machining is firstly carried out during actual machining, a negative feedback signal is detected in real time, and when the measured negative feedback signal value is consistent with a preset value, machining parameters are adjusted to finish final fine machining.
The thickness value in the first step may be obtained in the following two ways, please refer to the schematic diagram of the laser ablation principle simulation in fig. 3 for description of the detection principle:
in fig. 3: 1 an incident beam, 2 a transmission medium (typically air), 3 a film or coating, and 4 an outgoing beam. Refractive index n in a known medium 21And refractive index n of the film layer or coating 32Under the conditions of (1) is selected. In addition, the reflectivity and absorption at each film or coating interface for a selected wavelength of light beam is known.
The type of the probe beam used for obtaining the thickness value in the first step may be from a laser light source used for processing, or may be a light source with any wavelength, that is, may be other non-laser light sources.
The power P of the incident beam is transmitted through the transmission medium 2 to the interface between the medium 2 and the film or coating 3, which is designated as interface A, where the reflectivity of interface A is R1The transmitted beam power is (1-R)1) And P. The outgoing beam has a propagation distance L in the film layer or coating 3 until reaching an interface B between the bottom of the film layer or coating 3 and other medium, wherein the reflectivity of the interface B is R2The intensity of the reflected beam is (1-R)1)R2Pexp (-al), a being the absorption coefficient of the light beam within the film or coating 3.
The reflected beam is transmitted again over a distance L to an interface C between the top of the film or coating 3 and the transmission medium 2, where the interface C has a reflectivity R3The energy of the emergent beam is (1-R)1)R2(1-R3)Pexp(-2αL)。
The power ratio r of the outgoing beam to the incoming beam;
the relationship between the transmission distance L and the thickness t of the film or coating is:
the power P of the incident beam and the power P' of the emergent laser beam can be directly obtained through a power detector, so that the thickness t of the film or the coating can be directly calculated.
As a result of the above analysis of the operating principle, the first mode includes the following steps:
firstly, measuring the power P of an incident beam before entering the film or the coating and the power P' of an emergent beam after being refracted from the film or the coating by using a power detector;
secondly, calculating the power ratio r of the emergent beam to the incident beam: wherein,R1is the incident surface reflectance, R, of an incident beam2Reflectivity of reflecting surfaces, R, being films or coatings3The reflectivity of an emergent surface of an emergent beam, L is the transmission distance of the beam in the film or the coating;
thirdly, calculating a thickness value t according to the L value obtained in the second step,where θ is the incident angle of the incident beam, n1Is the refractive index of an air medium, n2Is the refractive index of the film or coating.
The second acquisition mode, which selects dual-wavelength laser for processing and respectively calculates the power ratio of the dual-wavelength, includes the following steps:
firstly, selecting a dual-wavelength light source, and respectively obtaining the outgoing power and incident power ratio r of the dual-wavelength light beam, which is respectively recorded as r1And r2(ii) a The absorption coefficients of the light beams with two wavelengths in the film or the coating are respectively alpha1And alpha2(ii) a In the second step, the reflectivities of the selected two wavelengths are similar when they are close, therebyThus, the L value can be obtained, and the thickness value t is further calculated;
referring to fig. 1, the present embodiment further discloses a laser processing apparatus for removing a film or a coating by using the laser processing method for removing a film or a coating, which includes: the laser device comprises a laser device 2, an industrial personal computer 1 for controlling the laser device 2, and a beam expanding device 3, a galvanometer and a lens system 4 which are sequentially arranged along the laser emitting direction; the industrial personal computer is also provided with a power detector for detecting the light beam in real time after the light beam is emitted from the film or the coating; and 5, the industrial personal computer calculates the thickness of the film or the coating according to the power value obtained by the power detector, and adjusts laser parameters in real time to enable the laser to quickly and accurately remove the film or the coating.
The device also comprises an X-Y platform 6 for placing the workpiece to be machined, wherein the X-Y platform 6 drives the workpiece to be machined to move so as to finish the removal of the surface film or coating of the workpiece to be machined.
Preferably, a power detector is further arranged inside the laser 2, and the power detector is used for detecting the power of laser emitted by the laser in real time and transmitting the power value to the industrial personal computer.
Wherein, industrial computer 1 adjustment laser instrument's laser parameter include: emergent laser power, laser frequency, galvanometer scanning speed, platform moving speed and processing times.
More specifically, in the processing process, a fixed angle theta is formed between a laser beam and a workpiece to be processed, wherein the power of the incident beam can be measured by a real-time monitoring module in a laser; the emergent beam power can be obtained by monitoring the emergent beam power in real time through an external power detector. The whole workpiece to be machined or the desired area can be machined by the movement of the X-Y table 6 during the machining process.
Laser 2 emergent laser is transmitted to galvanometer and lens system 4 through beam expanding device 3, confirms angle theta between incident laser beam and the generation machined part through changing the processing position, realizes treating whole waiting to machined part through the removal of platform in the course of working. And a power detection device is arranged in the laser, the laser power emitted by the laser can be displayed on the computer interface of the industrial personal computer in real time, the power P of a light beam incident to a workpiece to be processed can be calculated through an attenuation relation, and a laser power detection device is arranged on a laser platform, so that the power P' of the light beam emitted through the film layer or the coating can be monitored in real time and can be displayed on the computer interface of the industrial personal computer.
The thickness of the film or coating can be obtained by selecting a dual-wavelength laser and the wavelength λ of the two laser beams1≈λ2Then the power ratio r of the two laser beams can be measured1And r2According toCalculating the laser transmission distance L according toThe thickness t of the film layer can be calculated. If the thickness of the film layer or the coating is not uniform, the thickness of the film layer or the coating at different positions can be tested according to the position of the incident light beam, and then the measurement result can be used for testingThe required laser processing parameters are selected to more uniformly, cleanly and accurately remove the film layer or coating.
In more detail, a relationship between the laser processing parameters and the thickness of the film layer or the coating is established, and appropriate laser processing parameters are selected according to the relationship and the thickness of the film layer or the coating which is currently measured.
If the film or coating is thin, removal can be accomplished in one pass, and if thicker, multiple passes can be made.
Under the condition that the film layer or the coating is thick, high-power laser can be selected for preliminary and rapid removal, the feedback signal is detected in real time until the thickness of the film or the coating reaches a preset value, and then the processing parameters are adjusted according to the preset value to carry out fine processing.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the embodiments of the present invention, and those skilled in the art can easily make various changes and modifications according to the main concept and spirit of the present invention, so that the protection scope of the present invention shall be subject to the protection scope claimed in the claims.
Claims (4)
1. A laser machining apparatus for removing a thin film or coating, comprising: the laser device comprises a laser, an industrial personal computer for controlling the laser device, and a beam expanding device, a vibrating mirror and a lens system which are sequentially arranged along the laser emitting direction; the industrial personal computer is also provided with a power detector for detecting the laser emitted from the film or the coating in real time, calculates the thickness of the film or the coating according to the power value obtained by the power detector, and adjusts laser parameters in real time to enable the laser to rapidly and accurately remove the film or the coating.
2. The laser processing apparatus for removing film or coating of claim 1, further comprising an X-Y platform for placing the workpiece to be processed, wherein the X-Y platform drives the workpiece to be processed to move, thereby removing the film or coating on the surface of the workpiece to be processed.
3. The laser processing apparatus for removing thin film or coating of claim 1, wherein a power detector is further disposed inside the laser, and the power detector is configured to detect the power of the laser emitted from the laser in real time and transmit the power to the industrial personal computer.
4. The laser machining apparatus for removing a thin film or coating of claim 1, wherein the laser machining parameters adjustable on the industrial personal computer include: emergent laser power, laser frequency, galvanometer scanning speed, platform moving speed and processing times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620660086.5U CN205817104U (en) | 2016-06-28 | 2016-06-28 | A kind of laser process equipment removing thin film or coating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620660086.5U CN205817104U (en) | 2016-06-28 | 2016-06-28 | A kind of laser process equipment removing thin film or coating |
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| CN205817104U true CN205817104U (en) | 2016-12-21 |
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| CN201620660086.5U Expired - Fee Related CN205817104U (en) | 2016-06-28 | 2016-06-28 | A kind of laser process equipment removing thin film or coating |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106077956A (en) * | 2016-06-28 | 2016-11-09 | 深圳英诺激光科技有限公司 | A kind of remove thin film or the laser processing of coating and equipment |
| CN107214420A (en) * | 2017-07-14 | 2017-09-29 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107214418A (en) * | 2017-07-14 | 2017-09-29 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107378258A (en) * | 2017-07-14 | 2017-11-24 | 中国科学院微电子研究所 | Method and system for laser processing wafer |
| CN108942403A (en) * | 2018-06-26 | 2018-12-07 | 北京理工大学 | A kind of processing method of accurate control lens thickness |
| CN116038131A (en) * | 2023-02-13 | 2023-05-02 | 株洲特装智能装备有限公司 | Method and equipment for removing surface coating of cemented carbide tool by pulse laser |
| CN119187896A (en) * | 2024-10-14 | 2024-12-27 | 伯恩光学(惠州)有限公司 | A method for laser engraving the coating edge of film-coated glass |
-
2016
- 2016-06-28 CN CN201620660086.5U patent/CN205817104U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018000586A1 (en) * | 2016-06-28 | 2018-01-04 | 深圳英诺激光科技有限公司 | Laser processing method and device for removing thin film or coating |
| CN106077956B (en) * | 2016-06-28 | 2018-02-23 | 英诺激光科技股份有限公司 | A kind of laser processing and equipment for removing film or coating |
| WO2018000974A1 (en) * | 2016-06-28 | 2018-01-04 | 英诺激光科技股份有限公司 | Laser processing method and device for removing thin film or coating |
| CN106077956A (en) * | 2016-06-28 | 2016-11-09 | 深圳英诺激光科技有限公司 | A kind of remove thin film or the laser processing of coating and equipment |
| CN107378258A (en) * | 2017-07-14 | 2017-11-24 | 中国科学院微电子研究所 | Method and system for laser processing wafer |
| CN107214418A (en) * | 2017-07-14 | 2017-09-29 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107214420A (en) * | 2017-07-14 | 2017-09-29 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107214418B (en) * | 2017-07-14 | 2018-10-23 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107214420B (en) * | 2017-07-14 | 2018-11-09 | 中国科学院微电子研究所 | Method and device for laser processing wafer |
| CN107378258B (en) * | 2017-07-14 | 2019-02-12 | 中国科学院微电子研究所 | Method and system for laser processing wafers |
| CN108942403A (en) * | 2018-06-26 | 2018-12-07 | 北京理工大学 | A kind of processing method of accurate control lens thickness |
| CN116038131A (en) * | 2023-02-13 | 2023-05-02 | 株洲特装智能装备有限公司 | Method and equipment for removing surface coating of cemented carbide tool by pulse laser |
| CN119187896A (en) * | 2024-10-14 | 2024-12-27 | 伯恩光学(惠州)有限公司 | A method for laser engraving the coating edge of film-coated glass |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee after: Innovo laser Polytron Technologies Inc Address before: 518000 Shenzhen, Nanshan District science and Technology Park, North District, Long Hill Road, No. two, No. 8, Qing Guang photoelectric building, the Office (305) Patentee before: Shenzhen Inno Laser Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161221 Termination date: 20180628 |