CN205726813U - A kind of electronic equipment - Google Patents

Abstract

The utility model provides an electronic device. The electronic equipment includes a power device, a circuit board, a metal heat conduction element and an insulating heat conduction element, a pad is provided on the first surface of the circuit board, and the main welding part of the power device is welded on the pad, and the first surface of the circuit board and A heat conduction path corresponding to the power device is provided between the second surface opposite to the first surface, and the insulating heat conduction member is arranged on the second surface of the circuit board at a position corresponding to the heat conduction path, and forms a heat conduction connection with the power device through the heat conduction path , the metal thermal conductor is in contact with the insulating thermal conductor to form a thermally conductive connection. Through the above method, the utility model enables the electronic equipment to have good heat dissipation performance for power devices.

Description

an electronic device

technical field

The utility model relates to the field of electronic technology, in particular to an electronic device with good heat dissipation performance.

Background technique

In the electronic equipment in the prior art, the power device installed on the circuit board generates a lot of heat during operation. If the electronic equipment cannot diffuse the heat generated by the power device well, it will not only reduce the heat dissipation performance of the power device itself, Moreover, it is very easy to affect the normal operation of the electronic equipment and reduce the working performance of the electronic equipment.

Utility model content

In view of this, the technical problem to be solved by the embodiments of the present utility model is to provide an electronic device with good heat dissipation performance for power devices.

In order to solve the above technical problems, a technical solution adopted by the utility model is to provide an electronic device, including a power device, a circuit board, a metal heat-conducting part and an insulating heat-conducting part, the first surface of the circuit board is provided with a pad, and the power The main welding part of the device is welded on the pad, and a heat conduction path corresponding to the power device is provided between the first surface of the circuit board and the second surface opposite to the first surface, and the insulating heat conduction member is provided on the second surface of the circuit board. The position on the surface corresponds to the heat conduction path, and forms a heat conduction connection with the power device through the heat conduction path, and the metal heat conduction part is in contact with the insulating heat conduction part to form a heat conduction connection.

Wherein, the main welding part of the power device is welded on the pad by solder, and a through hole is provided on the first surface corresponding to the position of the power device, and a solder is provided in the through hole to contact the insulating heat conduction member and the power device, thereby forming a heat conduction path .

Among them, power devices, circuit boards, metal heat conduction parts and insulating heat conduction parts are stacked in sequence.

Wherein, the number of through holes is at least one.

Wherein, the electronic device further includes a casing, which is in contact with the metal heat-conducting element to form a heat-conducting connection.

Wherein, the contact surface of the metal heat conduction element and the shell and the contact surface of the metal heat conduction element and the insulating heat conduction element are arranged opposite to each other.

Wherein, thermally conductive glue is provided between the insulating heat-conducting element and the heat-conducting path, between the insulating heat-conducting element and the metal heat-conducting element, and between the metal heat-conducting element and the housing.

Wherein, the electronic device also includes a fixing part, and the fixing part fixes the circuit board, the insulating heat conducting part and the metal heat conducting part on the casing.

Among them, the fixing parts are screws and studs, the circuit board, the insulating heat conducting part and the metal heat conducting part are respectively provided with through holes, the studs are fixed on the shell and penetrated into the through holes of the metal heat conducting part, and the screws pass through the circuit board and the metal heat conducting part. The through-holes of the insulating thermal conductor lock onto the studs.

Wherein, the insulating and heat-conducting member is an insulating and heat-conducting silica gel sheet.

Through the above-mentioned technical solution, the beneficial effect produced by the embodiment of the present invention is: by setting the through hole on the first surface of the circuit board corresponding to the position of the power device, the power between the first surface and the second surface of the circuit board A heat conduction path corresponding to the power device is provided, and the heat generated by the power device during operation can be directly diffused through the heat conduction path, so that the electronic equipment has good heat dissipation performance for the power device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the appended drawings in the following description The drawings are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings on the premise of not paying creative labor.

Fig. 1 is the sectional view of the preferred embodiment of the utility model electronic equipment;

Fig. 2 is a partially enlarged schematic diagram of the electronic device shown in Fig. 1;

Fig. 3 is a bottom schematic diagram of a preferred embodiment of a circuit board of the electronic device shown in Fig. 1;

FIG. 4 is a top schematic view of a preferred embodiment of a circuit board of the electronic device shown in FIG. 1 .

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below of the present invention are only part of the embodiments of the present invention. rather than all examples. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

FIG. 1 is a cross-sectional view of a preferred embodiment of the electronic device of the present invention, and FIG. 2 is a partially enlarged schematic view of the electronic device shown in FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the electronic device of this embodiment includes a power device 11 , a circuit board 12 , a metal heat conduction element 13 , an insulating heat conduction element 14 , a casing 15 , a fixing element 16 and a heat conduction path O.

In this embodiment, the circuit board 12 , the insulating heat conducting element 14 and the metal heat conducting element 13 are fixed on the housing 15 , and the power device 11 , the circuit board 12 , the metal heat conducting element 13 and the insulating heat conducting element 14 are stacked in sequence.

In this embodiment, the circuit board 12 , the insulating heat-conducting element 14 , and the metal heat-conducting element 13 are sequentially stacked and fixed on the housing 15 of the electronic device preferably through the fixing element 16 . Specifically, preferably, the fixing member 16 is a screw or a stud. Correspondingly, the circuit board 12 , the insulating and heat-conducting member 14 and the metal heat-conducting member 13 are respectively provided with through holes 17 . Wherein, the studs are fixed on the shell 15 and penetrate into the through holes 17 of the metal heat conducting element 13 , and the screws pass through the circuit board 12 and the through holes 17 of the insulating heat conducting element 14 and are locked on the studs. It should be understood that in other embodiments, the circuit board 12 , the insulating heat-conducting element 14 and the metal heat-conducting element 13 may be fixed on the housing 15 in other ways.

FIG. 3 is a bottom schematic view of a preferred embodiment of the circuit board 12 of the electronic device shown in FIG. 1 , and FIG. 4 is a top schematic view of a preferred embodiment of the circuit board 12 of the electronic device shown in FIG. 1 . Referring to Fig. 3 and Fig. 4, pads 111, 112, 113 are arranged on the first surface A of the circuit board 12, and the main welding part of the power device 11, that is, the soldering part with a larger area of the power device 11 except the metal pins. The part is welded on the pad 111 by soldering, and the pins of the power device 11 are soldered on the pads 112 and 113 by soldering. On the first surface A of the circuit board 12, a through hole 18 is arranged at a position corresponding to the power device 11. The through hole 18 is not only arranged on the area corresponding to the pad 111, but also arranged on the bottom surface of the power device 11 opposite to the circuit board 12. in other positions. Further, solder is provided in the through hole 18 to form a heat conduction path O, and the heat conduction path O is respectively in contact with the insulating heat conduction member 14 and the power device 11 to dissipate heat from the power device 11 . Wherein, the number of through holes 18 is at least one, specifically, the number of through holes 18 in the embodiment corresponding to FIG. 3 and FIG. 4 is 56.

The insulating and heat-conducting member 14 is arranged on the second surface B of the circuit board 12 at a position corresponding to the heat-conducting path O, and forms a heat-conducting connection with the power device 11 through the heat-conducting path O, and the metal heat-conducting member 13 is in contact with the insulating and heat-conducting member 14 to form a heat-conducting connect.

The metal heat conducting element 13 is in contact with the housing 15 to form a heat conducting connection. Moreover, the contact surface of the metal heat conduction element 13 and the housing 15 and the contact surface of the metal heat conduction element 13 and the insulating heat conduction element 14 are arranged opposite to each other. In this embodiment, the metal heat conducting element 13 is preferably a strip-shaped aluminum block, and the insulating heat conducting element 14 is preferably an insulating and heat conducting silica gel sheet.

Further, thermally conductive glue (not shown) is provided between the insulating heat conducting element 14 and the heat conducting path O, between the insulating heat conducting element 14 and the metal heat conducting element 13 , and between the metal heat conducting element 13 and the housing 15 . Of course, in other embodiments, other heat-conducting materials, such as heat-conducting Any combination of metals, etc.

To sum up, it can be seen that in this embodiment, by providing through-holes 18 and adding solder into the through-holes 18, a heat conduction device corresponding to the power device 11 is provided between the first surface A and the second surface B of the circuit board 12. The path O can directly dissipate the heat generated by the power device 11 during operation through the heat conduction path O, so that the electronic equipment has good heat dissipation performance for the power device 11 .

The power device 11 mentioned in the full text of the embodiment of the present utility model is an SMT (Surface Mount Technology, Surface Mount Technology) power device. Taking a MOS tube as an example, it is certainly not limited to a MOS tube, and can be any electronic device that needs heat dissipation. device.

Please refer to FIG. 4 again. In the process of reflow soldering the chip components, when the main soldering part of the power device is soldered to the pad 111, the solder can automatically flow into the through hole 18 provided on the pad 111 and the adjacent Other through holes 18, thereby forming a heat conduction path.

Therefore, the utility model is especially suitable for the reflow soldering process. By arranging a plurality of through holes on the main pad and its adjacent areas, during reflow soldering, the solder will be filled in the main soldering portion and the pad while soldering Multiple heat conduction paths are formed in the through holes. Since the second surface of the circuit board is provided with an insulating heat-conducting part at a position corresponding to the heat-conducting path, and a heat-conducting connection is formed with the power device through the heat-conducting path, the metal heat-conducting part is in contact with the insulating heat-conducting part to form a heat-conducting connection, so that it can directly pass through the heat-conducting path The heat generated by power devices is diffused during operation, so that electronic equipment has good heat dissipation performance for power devices.

It should be noted that the directional terms mentioned in the embodiments of the present utility model, such as up, down, relative or corresponding, etc., are only referring to the directions of the attached drawings, and the directional terms are only used to illustrate and not Used to limit the utility model.

Explain again that the above description is only an embodiment of the present utility model, and does not therefore limit the scope of the patent of the present utility model. Any equivalent structure or equivalent process transformation made by using the specification of the utility model and the contents of the accompanying drawings, such as each embodiment The mutual combination of technical features, or direct or indirect application in other related technical fields, are all included in the patent protection scope of the utility model in the same way.

Claims (10)

1. An electronic device, characterized in that it comprises a power device, a circuit board, a metal heat-conducting element and an insulating heat-conducting element, the first surface of the circuit board is provided with a pad, and the main soldering portion of the power device is welded to On the pad, a heat conduction path corresponding to the power device is provided between the first surface of the circuit board and the second surface opposite to the first surface, and the insulating heat conduction member is provided on the circuit board The position corresponding to the heat conduction path on the second surface of the second surface forms a heat conduction connection with the power device through the heat conduction path, and the metal heat conduction element is in contact with the insulating heat conduction element to form a heat conduction connection. 2. The electronic device according to claim 1, wherein the main soldering portion of the power device is welded on the pad by solder, and the first surface is provided at a position corresponding to the power device There are through holes, and solder is provided in the through holes to contact the insulating heat conduction element and the power device, thereby forming the heat conduction path. 3 . The electronic device according to claim 2 , wherein the power device, the circuit board, the metal heat-conducting element and the insulating heat-conducting element are stacked in sequence. 4 . 4. The electronic device according to claim 2, wherein the number of said through holes is at least one. 5 . The electronic device according to claim 1 , further comprising a housing, and the housing is in contact with the metal heat-conducting member to form a heat-conducting connection. 6 . 6 . The electronic device according to claim 5 , wherein the contact surface of the metal heat conduction element and the housing is opposite to the contact surface of the metal heat conduction element and the insulating heat conduction element. 7. The electronic device according to claim 5, characterized in that, between the insulating heat-conducting element and the heat-conducting path, between the insulating heat-conducting element and the metal heat-conducting element, and between the metal heat-conducting element and the heat-conducting element A heat-conducting glue is arranged between the shells. 8. The electronic device according to claim 5, characterized in that, the electronic device further comprises a fixing member, and the fixing member fixes the circuit board, the insulating and heat-conducting member and the metal heat-conducting member on the on the shell. 9. The electronic device according to claim 8, the fixing member is a screw and a stud, the circuit board, the insulating heat conducting member and the metal heat conducting member are respectively provided with through holes, and the stud is fixed on The shell is inserted into the through hole of the metal heat conduction element, and the screw passes through the circuit board and the through hole of the insulating heat conduction element and is locked on the stud. 10. The electronic device according to claim 1, wherein the insulating and heat-conducting member is an insulating and heat-conducting silicone sheet.