CN205539814U - Display module and display equipment - Google Patents

Abstract

The utility model relates to the field of display technology, and discloses a display module and a display device, so as to improve the convenience of assembling the display module, improve the cooling effect of chips, and further improve the product quality of the display device. The display module includes a display panel, at least one chip-on-chip film, a printed circuit board and a cover plate, wherein: the printed circuit board is located on the back side of the display panel; one end of the chip-on-chip film is connected to the display panel, and the other end is folded toward the display panel The back side of the panel is connected to the printed circuit board, and the part of the chip-on-chip film folded toward the back side of the display panel is packaged with chips; the cover plate is located on the back side of the printed circuit board and covers the printed circuit board, and the cover plate corresponds to each A chip-on-chip is provided with a heat-conducting block in thermal contact with the chip.

Description

A display module and display device

technical field

The utility model relates to the field of display technology, in particular to a display module and a display device.

Background technique

Among flat panel display devices, Thin Film Transistor Liquid Crystal Display (TFT-LCD) has the characteristics of small size, low power consumption, relatively low manufacturing cost and no radiation, and occupies a dominant position in the current flat panel display market. status.

As shown in Fig. 1 and Fig. 2, in the existing TFT-LCD, the chip on film 1 (Chip on Film, COF for short) connects the liquid crystal panel 2 and the printed circuit board 3 and folds from the periphery of the liquid crystal panel 2 to the backlight module. On the back side of the backplane (not shown in the backlight module and the following cover plate), the chip 4 is packaged on the chip-on-film 1, and the fixed cover plate on the backside of the backlight module of the backlight module is opposite to the printed circuit board 3 and chip 4 for cover protection.

With the continuous improvement of consumers' requirements for the image quality of display devices, the amount of system signals and power information processed by the chip is also increasing, and the increase in load capacity will inevitably bring more heat. Therefore, it is necessary to optimize the chip for good heat dissipation. As shown in FIG. 1 and FIG. 2 , a commonly used solution for heat dissipation of the chip 4 in the prior art is: attach a heat dissipation patch 5 covering the chip 4 on the chip-on-chip film 1 , so as to dissipate heat from the chip 4 .

The defect in the prior art is that, since both the COF 1 and the heat dissipation patch 5 have certain flexibility, when the heat dissipation patch 5 is bonded to the COF 1, it is necessary to keep the COF 1 and the heat dissipation patch 5 Flat (as shown by the dotted line in FIG. 2 ), the operation is extremely inconvenient, especially for large-size display modules, the number of chip-on-chip films 1 can generally reach dozens, making the operation cumbersome, time-consuming and labor-intensive. In addition, after the chip-on-film 1 and the heat dissipation patch 5 are bonded, if the heat dissipation patch 5 needs to be removed, the two are easily pulled due to the strong adhesive force, which will cause the chip-on-film 1 and the liquid crystal panel to be disconnected. 2 or the printed circuit board 3 is in poor contact, and if the chip-on-chip film 1 and the heat dissipation patch 5 are not firmly bonded, and a gap is formed between the two, the heat dissipation effect will be greatly reduced.

For non-TFT-LCD display products, such as OLED (Organic Light-Emitting Diode, organic electroluminescent diode) products, the heat dissipation structure of the chip is similar to the above-mentioned form, therefore, there are similar technical problems as above.

Utility model content

The purpose of the embodiments of the present invention is to provide a display module and a display device, so as to improve the convenience of assembling the display module, improve the heat dissipation effect of the chip, and further improve the product quality of the display device.

The embodiment of the utility model provides a display module, including a display panel, at least one COF, a printed circuit board and a cover plate, wherein:

The printed circuit board is located on the backside of the display panel;

One end of the chip-on-film is connected to the display panel, and the other end is folded toward the back of the display panel and connected to the printed circuit board, and the part of the chip-on-film folded toward the back of the display panel is packaged with a chip;

The cover plate is located on the back side of the printed circuit board and covers the printed circuit board, and corresponding to each chip-on-film, the cover plate is provided with a heat conduction block in thermal contact with the chip.

In the technical solution of the embodiment of the utility model, the cover plate is provided with a heat conduction block corresponding to each chip-on-film in thermal contact with the chip, and the heat conduction block can transfer the heat of the chip and disperse the heat of the chip to the cover plate, so that the chip The heat is dissipated step by step to improve the heat dissipation effect of the chip. In addition, since there is no adhesive connection between the heat conduction block and the chip, the assembly of the display module can be simplified, and the poor contact of the circuit caused by disassembling the heat dissipation patch in the prior art can be avoided, thereby improving the product quality of the display device.

Preferably, the heat conduction block is a heat conduction rubber block. The thermally conductive rubber block has a certain degree of elasticity, and can be tightly pressed and contacted with the chip, so as to achieve a better heat conduction and heat dissipation effect on the chip.

Preferably, the cover plate is provided with a notch corresponding to each COF film, and the heat conduction block is interference-fitted in the notch. This structural design is convenient for assembly and disassembly of the heat conduction block and the cover plate, and it is convenient to replace the heat conduction block of a suitable material according to the heat dissipation requirements of the chip.

Preferably, the heat conduction block includes: a first limiting portion and a second limiting portion limited on both sides of the cover plate, and a connecting portion that is interference-fitted with the notch. With this design, the heat conduction block is plugged into the notch, and the assembly and positioning of the heat conduction block and the cover plate is convenient, and the heat conduction block is not easy to come out from the upper and lower sides of the cover plate, so that the assembly of the heat conduction block and the notch is more reliable.

Preferably, the entrance of the notch has a pair of limiting protrusions. With this design, after the heat conduction block is assembled with the notch, it is not easy to come out from the entrance of the notch, so that the assembly of the heat conduction block and the notch is more reliable.

Optionally, the display module further includes a front frame and a metal back shell connected to the front frame, and the display panel, at least one chip-on-chip film, printed circuit board and cover plate are located between the front frame and the metal back shell In between, the heat conduction block is in heat conduction contact with the metal back shell.

Optionally, the display module further includes a front frame and a rear case connected to the front frame, a heat sink is arranged on the inner side of the rear case, and the display panel, at least one chip-on-chip film, a printed circuit board and a cover plate Located between the front frame and the rear shell, the heat conduction block is in heat conduction contact with the heat sink.

Preferably, the heat sink is bonded to the inner surface of the rear shell. The heat sink is bonded to the back shell, which is convenient for assembly and disassembly, and the heat sink of a suitable material can be replaced according to the heat dissipation requirements.

Optionally, the layer structure of the heat sink includes at least one of a graphite layer, a metal layer and a heat dissipation glue layer.

An embodiment of the present utility model also provides a display device, including the display module according to any one of the foregoing technical solutions. The display module of the display device is convenient to assemble, the heat dissipation effect of the chip is better, and the display device has better product quality.

Description of drawings

FIG. 1 is a schematic diagram of a chip heat dissipation structure of a display module in the prior art;

Fig. 2 is a sectional view at B of Fig. 1;

Fig. 3 is an exploded schematic diagram of a display module according to an embodiment of the present invention;

Fig. 4 is a schematic diagram of splitting at C of Fig. 3;

5 is a cross-sectional view of the chip heat dissipation structure of the display module according to the embodiment of the present invention;

FIG. 6 is a schematic diagram of heat conduction at point D in FIG. 5 .

Reference signs:

Part of prior art:

1-chip on film; 2-LCD panel; 3-printed circuit board; 4-chip; 5-heat dissipation patch.

The utility model embodiment part:

11-display panel; 12-COF; 13-printed circuit board; 14-cover plate; 15-chip;

16-heat conduction block; 17-notch; 161-first limiting part; 162-second limiting part; 163-connecting part;

171-limiting protrusion; 18-front frame; 19-rear shell; 20-radiating fin.

detailed description

In order to improve the convenience of assembling the display module, improve the heat dissipation effect of the chip, and further improve the product quality of the display device, the embodiments of the present invention provide a display module and a display device. In order to make the purpose, technical solutions and advantages of the utility model clearer, the following examples are given to further describe the utility model in detail.

As shown in Figure 3 and Figure 5, the display module provided by an embodiment of the present invention includes a display panel 11, at least one chip-on-chip film 12, a printed circuit board 13 and a cover plate 14, wherein:

The printed circuit board 13 is located on the back side of the display panel 11;

One end of the chip-on-film 12 is connected to the display panel 11, and the other end is folded toward the back side of the display panel 11 to be connected to the printed circuit board 13, and the part of the chip-on-film 12 folded toward the back side of the display panel 11 is packaged with a chip 15;

The cover plate 14 is located on the back side of the printed circuit board 13 and covers the printed circuit board 13 , and the cover plate 14 is provided with a heat conduction block 16 corresponding to each chip 12 in thermal contact with the chip 15 .

In the embodiment of the present utility model, "front" can be understood as the side of the component that is close to the viewer when the display device including the display module is in normal use, and "rear" can be understood as the side of the component that is away from the viewer .

The specific type of the display module is not limited, for example, it may be a TFT-LCD display module, an OLED display module, and so on. Taking the display module of TFT-LCD as an example, in addition to the above components, the display module generally includes backlight module, front frame, rear case and other components. The printed circuit board is located on the back of the backplane of the backlight module, and the cover passes The screws are fixed on the back plate and cover the printed circuit board to protect the printed circuit board.

The cover plate 14 is generally made of a metal material with good heat dissipation, preferably an aluminum material with low cost and high thermal conductivity. The shape of the cover plate 14 can be designed according to the shape of the printed circuit board 13 and the heat dissipation area requirements. The specific material type of the heat conduction block 16 is not limited, for example, an aluminum block, a copper block, a heat conduction rubber block and the like can be used. It is preferable to use a heat-conducting rubber block, such as a heat-conducting silica gel block, a heat-conducting silicone rubber block, a heat-conducting silicon rubber block, etc. The heat-conducting rubber block has a certain degree of elasticity and can be tightly pressed and contacted with the chip 15, thereby achieving better heat conduction and heat dissipation for the chip 15 Effect.

In the technical solution of the embodiment of the utility model, the cover plate 14 is provided with a heat conduction block 16 in thermal contact with the chip 15 corresponding to each COF film 12. The heat conduction block 16 can transfer the heat of the chip 15 and disperse the heat of the chip 15 to the cover. on the board 14, so that the heat of the chip 15 is dissipated step by step, and the cooling effect of the chip 15 is improved. In addition, since there is no adhesive connection between the heat conducting block 16 and the chip 15, the assembly of the display module can be simplified, and the poor contact of the circuit caused by disassembling the heat dissipation patch in the prior art can be avoided, thereby improving the product quality of the display device.

Please refer to FIG. 3 and FIG. 4 , in this embodiment, the cover plate 14 is provided with a notch 17 corresponding to each chip-on-film 12 , and the heat conduction block 16 is interference-fitted in the notch 17 . This structural design facilitates assembly and disassembly of the heat conduction block 16 and the cover plate 14 , and facilitates the replacement of the heat conduction block 16 of a suitable material according to the heat dissipation requirements of the chip 15 .

Further, the heat conduction block 16 includes: a first limiting portion 161 and a second limiting portion 162 located on both sides of the cover plate 14 , and a connecting portion 163 that is interference-fitted with the notch 17 . With this design, the heat conduction block 16 is plugged into the notch 17, the assembly and positioning of the heat conduction block 16 and the cover plate 14 is convenient, and the heat conduction block 16 is not easy to come out from the upper and lower sides of the cover plate 14, so that the assembly of the heat conduction block 16 and the notch 17 is easier. reliable.

In addition, a pair of limiting protrusions 171 are provided at the entrance of the notch 17 . With this design, after the heat conduction block 16 is assembled with the notch 17, it is not easy to come out from the entrance of the notch 17, so that the assembly of the heat conduction block 16 and the notch 17 is more reliable.

As shown in Figure 3 and Figure 5, the display module also includes a front frame 18 and a rear case 19 connected to the front frame 18, a heat sink 20 is arranged on the inner side of the rear case 19, a display panel 11, at least one chip-on-chip film 12, The printed circuit board 13 and the cover plate 14 are located between the front frame 18 and the rear shell 19 , and the heat conduction block 16 is in thermal contact with the heat sink 20 . Preferably, the heat sink 20 is bonded to the inner surface of the rear shell 19 . The heat sink 20 is bonded to the rear shell 19, and the assembly and disassembly are relatively convenient, and the heat sink 20 of suitable material or area can be replaced according to heat dissipation requirements. The heat of the chip 15 is dissipated through the heat conduction block 16 and then through the heat sink 20 , so the heat dissipation efficiency is high. Wherein, the specific structural form of the heat sink 20 is not limited, and the layer structure may include at least one of a graphite layer, a metal layer and a heat dissipation adhesive layer. The rear shell 19 is preferably made of metal such as aluminum or aluminum alloy, so as to quickly dissipate the heat transferred by the heat sink to the outside.

As shown in Figure 6, in the cross-sectional direction of the display module, the heat dissipated by the chip 15 is exported through the heat conduction block 16, and then through the heat sink 20 and the metal rear shell 19, and at the same time in the direction parallel to the display panel 11, The heat emitted by the chip 15 is dispersed to the cover plate 14, the heat sink 20 and the metal rear shell 19 through the heat conducting block 16. The heat of the chip 15 is dissipated step by step in multiple directions, and the heat dissipation efficiency is greatly improved compared with the prior art.

As shown in FIG. 1 , when the display module is assembled, first insert each gap 17 of the cover plate 14 into the heat conduction block 16, then fold the COF 12 and the printed circuit board 13 toward the back side of the display panel 11, and then place the The cover plate 14 is fixed on the back side of the display panel 11. At this time, the cover plate 14 covers the printed circuit board 13, and each heat-conducting block 16 is tightly pressed with the corresponding chip 15. Finally, the above-mentioned components are attached to the heat sink 20 The rear case 19 and the front frame 18 are assembled. After the display module is assembled, the chip 15 is pressed tightly with the heat conduction block 16 , and the heat conduction block 16 is in contact with the heat sink 20 .

In other embodiments of the present invention, the display module further includes a front frame and a metal back shell connected to the front frame, and the display panel, at least one chip-on-film, printed circuit board and cover plate are located between the front frame and the metal back shell In between, the heat conduction block is in heat conduction contact with the metal back shell. The heat of the chip is dissipated to the outside world through the heat conduction block, and then through the metal back shell, and the heat dissipation efficiency is relatively high.

The embodiment of the present utility model also provides a display device, including the display module according to any one of the foregoing technical solutions. The display module of the display device is convenient to assemble, the heat dissipation effect of the chip is better, and the display device has better product quality. The specific type of the display device is not limited, for example, it may be a flat-screen TV, a flat-panel display, a tablet computer, electronic paper, and the like.

Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. In this way, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and equivalent technologies thereof, the utility model is also intended to include these modifications and variations.

Claims (10)

1. a display module, it is characterised in that include display floater, at least one chip on film, print Printed circuit board and cover plate, wherein:

Described printed circuit board (PCB) is positioned at the dorsal part of display floater；

Described chip on film one end is connected with display floater, and the other end is folded to dorsal part and the printing electricity of display floater Road plate connects, and described chip on film is folded to the partial encapsulation of display floater dorsal part chip；

Described cover plate is positioned at the dorsal part of printed circuit board (PCB) and hides printed circuit board (PCB), and described cover plate correspondence is each to be covered Brilliant thin film is provided with and the heat-conducting block of chip thermal conductive contact.

Show module the most as claimed in claim 1, it is characterised in that described heat-conducting block is heat conduction blob of viscose.

Show module the most as claimed in claim 1, it is characterised in that the corresponding each flip of described cover plate Thin film is provided with breach, and described heat-conducting block elastic conjunction is in breach.

Show module the most as claimed in claim 3, it is characterised in that described heat-conducting block includes: spacing In the first limiting section and second limiting section of cover plate both sides, and with the connecting portion of breach elastic conjunction.

Show module the most as claimed in claim 3, it is characterised in that the import department of described breach has A pair spacing preiection.

Show module the most as claimed in claim 1, it is characterised in that before described display module also includes Frame and the metal back cover being connected with front frame, described display floater, at least one chip on film, printed circuit Plate and cover plate between described front frame and metal back cover, described heat-conducting block and metal back cover thermal conductive contact.

Show module the most as claimed in claim 1, it is characterised in that before described display module also includes Frame and the back cover being connected with front frame, the inner side of described back cover is provided with fin, described display floater, extremely A few chip on film, printed circuit board (PCB) and cover plate between described front frame and back cover, described heat-conducting block with Heat sink conducts heat contacts.

Show module the most as claimed in claim 7, it is characterised in that described fin is interior with back cover Side surface is bonding.

Show module the most as claimed in claim 7, it is characterised in that the Rotating fields bag of described fin Include at least one in graphite linings, metal level and heat radiation glue-line.

10. a display device, it is characterised in that include the display as described in any one of claim 1～9 Module.