CN205303505U - CSP packaging structure and because CSP packaging structure's lamp strip of trilateral light -emitting - Google Patents

Abstract

The utility model discloses a CSP packaging structure with light output from three sides and a light bar based on the CSP packaging structure. The CSP packaging structure with light emitting from three sides includes a flip chip; two opposite sides of the flip chip are packaged with light-shielding glue, and the other two opposite sides and the top surface of the flip chip are packaged with encapsulating glue. A light bar based on CSP packaging includes a substrate and the above-mentioned CSP packaging structure that emits light from three sides. The utility model improves the utilization rate of light and reduces the dark area between two CSP packaging structures.

Description

CSP packaging structure with light from three sides and light bar based on CSP packaging structure

technical field

The utility model discloses a CSP packaging structure and a light bar.

Background technique

For side-entry light source modules such as side-entry panel lights and backlight modules, light-emitting devices such as light bars are usually fixed on the side of the side-entry light source module through clamps, so that the light of the light-emitting devices generally emits from the side. Light is exported through some optics.

For the above-mentioned light source module, the existing common light-emitting devices are mainly used at present, such as the light-emitting device composed of the chip and the fluorescent glue on the packaged chip, and the light-emitting device composed of the chip, the bracket, and the fluorescent glue. To form a light source, generally a plurality of light emitting devices are arranged on a substrate. As shown in Figure 1, for a light emitting device 100 composed of a chip and fluorescent glue, the chip generally has its own light emitting angle. There will be a dark area 300 between the devices, which affects the uniformity of the light output. At the same time, because the light bar is fixed on the side of the light source module by means of a fixture, the fixture can block the light emitted by the light-emitting device to a certain extent, thus wasting the light source corresponding to the fixture. The device emits light. In addition, the light-emitting device emits light to the surroundings, and the light that can be used is mainly the light along the length of the substrate and the light on the top. Other light cannot be well utilized, resulting in low light utilization.

Similarly, if a light-emitting device composed of a chip, a bracket, and fluorescent glue is used, the above-mentioned problems will also exist.

Now, the CSP packaging structure is applied in various fields due to its small size, light weight, and good electrical performance.

The current CSP packaging structure mainly includes a flip chip and a packaging glue packaged on the flip chip, and the packaging glue is fluorescent glue. All sides of the flip chip can emit light. For example, if the CSP package structure is installed on the substrate, light can be emitted from all directions except the bottom surface. For special light sources, the light emitted from some sides cannot be used, resulting in low light utilization.

Contents of the invention

In order to improve the utilization rate of light, the utility model provides a CSP packaging structure with light output from three sides.

In order to improve the utilization rate of light and reduce the dark area between two CSP packaging structures, the utility model provides a light bar based on the CSP packaging structure.

In order to achieve the above purpose, a CSP packaging structure with light emitting from three sides includes a flip chip; two opposite sides of the flip chip are packaged with light blocking glue, and the other two opposite sides and the top surface of the flip chip are packaged with packaging glue.

In the above packaging structure, since the two opposite sides are provided with light blocking glue, the CSP packaging structure of this structure has only two opposite sides and the top surface to emit light, and the angle of light emission on the side of the flip chip is large. Therefore, the structure of the utility model is adopted. The angle of light on both sides of the encapsulation glue is large, and the range of dark areas on both sides of the encapsulation glue is significantly reduced. In addition, the light-blocking glue has a reflective effect on light, and the light on the two opposite sides can be absorbed by the light-blocking glue. Reflecting out makes the light output from three sides more uniform. Since the light-blocking glue blocks the light corresponding to the fixture, the loss of light emitted by the light-emitting device is avoided, and the utilization rate of light is also improved.

Further, the encapsulating glue is fluorescent glue.

Further, an encapsulation glue is encapsulated between two opposite sides of the flip chip and the light-shielding glue, and the encapsulation glue covers the side and top surface of the flip chip. Since the encapsulation adhesive is also provided between the flip chip and the light-shielding adhesive, the light emitted from the side of the flip-chip can excite the light generated by the encapsulation adhesive and be reflected by the light-shielding adhesive, thereby improving the light extraction efficiency.

Further, the flip chip includes a flip chip body and electrodes arranged at the bottom of the flip chip body; the lower surface of the encapsulant on the side is higher than the lower surface of the electrode, and the lower surface of the light blocking glue is higher than the lower surface of the electrode. Since the lower surface of the encapsulation glue and the light-shielding glue is higher than the bottom surface of the electrode, there is a gap between the lower surface of the encapsulation glue and the light-shielding glue and the substrate during the process of fixing the CSP packaging structure with light emitting from three sides on the substrate. Therefore, Even if the packaging glue and the light blocking glue have downward burrs, it will not affect the close contact between the electrode of the flip chip and the substrate. In addition, if the packaging glue and the light blocking glue are heated and expanded, the bottom of the packaging glue and the light blocking glue will also give its Therefore, the void ratio between the three-sided CSP packaging structure and the substrate is reduced, and the burrs in the packaging glue and light-shielding glue cutting, as well as the heating of the flip-chip electrode and the substrate during the welding process, solve the problem of flip chip and substrate. The unreliable electrical connection between the substrates makes the connection between the flip chip and the substrate more firm.

Further, the top surface of the light-blocking glue is flush with the encapsulation glue on the top surface, so as to avoid affecting the light angle due to the fact that the light-blocking glue is higher than the encapsulation glue.

In order to achieve the above-mentioned second purpose, a light bar based on a CSP packaging structure includes a substrate, and the substrate is provided with more than two CSP packaging structures that emit light from three sides, and the CSP packaging structure that emits light from three sides includes a flip chip; flip chip The two opposite sides of the flip-chip are packaged with light-shielding glue, and the other two opposite sides and the top surface of the flip chip are packaged with encapsulation glue.

In the above packaging structure, since the two opposite sides are provided with light-shielding glue, the CSP packaging structure of this structure only emits light from three sides of the two opposite sides and the top surface. The side is perpendicular to the length direction of the substrate, and the light emitting angle of the side of the flip-chip is large, so that the range of dark areas between adjacent two or three CSP packaging structures that emit light is significantly reduced. The two sides of the glue have a large light angle, and the light-blocking glue has a reflective effect on light. The light-blocking glue can reflect the light from two opposite sides, making the three sides of the light more uniform and improving the utilization rate of light.

Further, an encapsulation glue is encapsulated between two opposite sides of the flip chip and the light-shielding glue, and the encapsulation glue covers the side and top surface of the flip chip. Since the encapsulation adhesive is also provided between the flip chip and the light-shielding adhesive, the light emitted from the side of the flip-chip can excite the light generated by the encapsulation adhesive and be reflected by the light-shielding adhesive, thereby improving the light extraction efficiency.

Further, the flip chip includes a flip chip body and electrodes arranged at the bottom of the flip chip body; the lower surface of the encapsulant on the side is higher than the lower surface of the electrode, and the lower surface of the light blocking glue is higher than the lower surface of the electrode. Since the lower surface of the encapsulation glue and the light-shielding glue is higher than the bottom surface of the electrode, there is a gap between the lower surface of the encapsulation glue and the light-shielding glue and the substrate during the process of fixing the CSP packaging structure with light emitting from three sides on the substrate. Therefore, Even if the packaging glue and the light blocking glue have downward burrs, it will not affect the close contact between the electrode of the flip chip and the substrate. In addition, if the packaging glue and the light blocking glue are heated and expanded, the bottom of the packaging glue and the light blocking glue will also give its Therefore, the void ratio between the three-sided CSP packaging structure and the substrate is reduced, and the burrs in the packaging glue and light-shielding glue cutting, as well as the heating of the flip-chip electrode and the substrate during the welding process, solve the problem of flip chip and substrate. The unreliable electrical connection between the substrates makes the connection between the flip chip and the substrate more firm.

Further, the top surface of the light-blocking glue is flush with the encapsulation glue on the top surface, so as to avoid affecting the light angle due to the fact that the light-blocking glue is higher than the encapsulation glue.

Further, barrier strips are respectively provided on both sides of the substrate, and the CSP packaging structure emitting light from three sides is located in the barrier strips. The light blocking strip has the function of blocking light, so that the light output of the light strip is more concentrated and uniform.

Description of drawings

Figure 1 is a schematic diagram of the prior art.

FIG. 2 is a cross-sectional view of a CSP package structure that emits light from three sides.

FIG. 3 is a cross-sectional view of B-B in FIG. 7 of the CSP package structure with light output from three sides.

FIG. 4 is a schematic diagram of another structure of a CSP packaging structure that emits light from three sides.

FIG. 5 is a schematic diagram of a third structure of a CSP packaging structure that emits light from three sides.

FIG. 6 is a schematic diagram of a fourth structure of a CSP packaging structure that emits light from three sides.

Fig. 7 is a sectional view of C-C in Fig. 2 .

FIG. 8 is a schematic diagram of installing a CSP package structure emitting light from three sides on a substrate.

Fig. 9 is a D-D sectional view of a light bar based on a CSP package structure.

Fig. 10 is a top view of a light bar based on a CSP package structure.

detailed description

The utility model will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

Example 1.

As shown in FIG. 2 , FIG. 3 and FIG. 7 , the three-sided CSP packaging structure includes a flip chip 1 , and the flip chip 1 includes a flip chip body 11 and an electrode 12 disposed at the bottom of the flip chip body 11 .

Two opposite sides of the flip-chip body 11 are packaged with light-blocking glue 2 , which is white glue. This light-blocking glue absorbs less light and has a reflective effect on light. The other two opposite sides and the top surface of the flip-chip body 11 are packaged with encapsulating glue 3 , which is fluorescent glue.

As shown in FIG. 2 and FIG. 3 , the lower surface of the encapsulant on the side is higher than the lower surface of the electrode 12 , and the lower surface of the light-blocking glue 2 is higher than the lower surface of the electrode 12 . As shown in Figure 8, since the lower surfaces of the packaging glue 3 and the light-shielding glue 2 are higher than the lower surface of the electrode 12, during the process of fixing the CSP packaging structure with light from three sides on the substrate 10, the packaging glue 3 and the light-shielding glue 2 2. There is a gap between the lower surface and the substrate 10. Therefore, even if the packaging glue 3 and the light-shielding glue 2 have downward burrs, it will not affect the close contact between the electrodes of the flip chip 1 and the substrate 10. In addition, if the packaging glue 3 and the light-shielding glue 2 are thermally expanded, and the encapsulation glue 3 and the light-shielding glue 2 are also provided with space for expansion. Therefore, the void rate of the CSP packaging structure with three-sided light emitting and the substrate 10 is reduced, and the encapsulation glue 3, There are burrs in the cutting of the light-shielding adhesive 2 and the heating of the electrodes of the flip chip and the substrate 10 during welding leads to unreliable electrical connection between the flip chip and the substrate 10, making the connection between the flip chip 1 and the substrate 10 more firm.

As shown in FIG. 3 , the top surface of the light blocking glue 2 is flush with the encapsulation glue on the top surface. Avoid affecting the light exit angle due to the fact that the light blocking glue 2 is higher than the encapsulation glue.

As shown in FIG. 4 , the encapsulation glue on the top surface covers a part of the light-shielding glue 2 to reduce yellow light appearing above the light-shielding glue 2 .

As shown in FIG. 5 , the encapsulation adhesive on the top surface can completely cover the flip chip and the light-shielding adhesive 2 .

As shown in Figure 6, an encapsulation adhesive 3 is provided between the two opposite sides of the light-shielding adhesive 2 and the flip-chip 1, and the encapsulation adhesive 3 is coated on the side and the top surface of the flip-chip. An encapsulating adhesive 3 is also provided between the adhesives 2, so that the light emitted from the side of the flip-chip excites the encapsulating adhesive to generate light that is reflected by the light-blocking adhesive, thereby improving the light extraction efficiency.

In this embodiment, since two opposite sides are provided with light-shielding glue 2, therefore, the CSP packaging structure of this structure only has two opposite sides and three sides of the top surface to emit light, and the angle of light emission on the side of the flip chip 1 is large. The new structure makes the light emitting angle of the two sides of the encapsulation glue larger, and the light blocking glue 3 has a reflective effect on light, and the light blocking glue 2 can reflect the light from the two opposite sides, making the light emitting from the three sides more uniform , the range of the dark area on both sides with the encapsulant 3 is obviously reduced, and the utilization rate of light is also improved.

Example 2.

As shown in FIG. 9 and FIG. 10 , the light bar based on the CSP package structure includes a substrate 10 on which there are more than two CSP package structures 100 that emit light from three sides. Both sides of the substrate 10 are respectively provided with barrier bars 101, and the CSP packaging structure 100 emitting light from three sides is located in the barrier bars 101, so that the light output of the light bar is more concentrated and uniform.

As shown in Fig. 2, Fig. 3 and Fig. 7, the CSP packaging structure of three-sided light emission includes a flip chip 1, and the flip chip 1 includes a flip chip body 11 and an electrode 12 arranged at the bottom of the flip chip body 11, and the electrode 12 is connected to the bottom of the flip chip body 11. The circuit layers of the substrate are electrically connected.

Two opposite sides of the flip-chip body 11 are packaged with light-blocking glue 2 , which is white glue. This light-blocking glue absorbs less light and has a reflective effect on light. The other two opposite sides and the top surface of the flip-chip body 11 are packaged with encapsulating glue 3 , which is fluorescent glue. The two sides with encapsulant are perpendicular to the long side of the substrate 10 , which is the normal direction.

As shown in FIG. 2 and FIG. 3 , the lower surface of the encapsulant on the side is higher than the lower surface of the electrode 12 , and the lower surface of the light-blocking glue 2 is higher than the lower surface of the electrode 12 . As shown in FIG. 9 , since the lower surfaces of the encapsulating glue 3 and the light-shielding glue 2 are higher than the lower surfaces of the electrodes 12, during the process of fixing the CSP packaging structure with three-sided light emission on the substrate 10, the encapsulating glue 3 and the light-shielding glue 2 2. There is a gap between the lower surface and the substrate 10. Therefore, even if the packaging glue 3 and the light-shielding glue 2 have downward burrs, it will not affect the close contact between the electrodes of the flip chip 1 and the substrate 10. In addition, if the packaging glue 3 and the light-shielding glue 2 are thermally expanded, and the encapsulation glue 3 and the light-shielding glue 2 are also provided with room for expansion. Therefore, the void ratio of the CSP packaging structure with three-sided light emission and the substrate 10 is reduced, and the encapsulation glue 3, There are burrs in the cutting of the light-shielding adhesive 2 and the heating of the electrodes of the flip chip and the substrate 10 during welding leads to unreliable electrical connection between the flip chip and the substrate 10, making the connection between the flip chip 1 and the substrate 10 more firm.

As shown in FIG. 3 , the top surface of the light blocking glue 2 is flush with the encapsulation glue on the top surface. Avoid affecting the light exit angle due to the fact that the light blocking glue 2 is higher than the encapsulation glue.

As shown in FIG. 4 , the encapsulation glue on the top surface covers a part of the light-shielding glue 2 to reduce yellow light appearing above the light-shielding glue 2 .

As shown in FIG. 5 , the encapsulation adhesive on the top surface can completely cover the flip chip and the light-shielding adhesive 2 .

As shown in Figure 6, an encapsulation adhesive 3 is provided between the two opposite sides of the light-shielding adhesive 2 and the flip-chip 1, and the encapsulation adhesive 3 is coated on the side and the top surface of the flip-chip. An encapsulating adhesive 3 is also provided between the adhesives 2, so that the light emitted from the side of the flip-chip excites the encapsulating adhesive to generate light that is reflected by the light-blocking adhesive, thereby improving the light extraction efficiency.

In this embodiment, since the light-blocking adhesive 2 is provided on two opposite sides, the CSP package structure 100 of this structure only emits light from three sides on the two opposite sides and the top surface. , the two sides with encapsulation glue 3 are perpendicular to the length direction of substrate 10, and the light exit angle of flip chip 1 side is large, therefore, adopt the structure of the present utility model, as shown in Figure 9, make the two sides with encapsulation glue The light-emitting angle is large, and the light-blocking glue 2 has a reflective effect on light. The light-blocking glue 2 can reflect the light from two opposite sides, making the light emitting from three sides more uniform, and allowing two or three adjacent sides to emit light. The range of the dark area between the lights is significantly reduced, which makes the light output of the entire light bar more uniform and improves the utilization rate of light.

Claims (10)

1. three faces go out a CSP encapsulating structure for light, including flip chip; It is characterized in that: the two relative side of flip chip is packaged with the glue that is in the light, the other two relative side of flip chip and end face are packaged with packaging plastic.

2. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: described packaging plastic is fluorescent glue.

3. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip.

4. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion; The lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode.

5. three faces according to claim 1 go out the CSP encapsulating structure of light, it is characterised in that: the end face of the glue that is in the light is concordant with the packaging plastic of end face.

6. based on a lamp bar for CSP encapsulating structure, including substrate, it is characterised in that: being provided with three faces of more than two on substrate and go out the CSP encapsulating structure of light, three faces go out the CSP encapsulating structure of light and include flip chip; The two relative side of flip chip is packaged with the glue that is in the light, and the other two relative side of flip chip and end face are packaged with packaging plastic.

7. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: described flip chip two relative side and be in the light between glue and be packaged with packaging plastic, packaging plastic is coated on side and the end face of flip chip.

8. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: flip chip includes flip chip body and is located at the electrode of flip chip body bottom portion; The lower surface of packaging plastic on the side is higher than the lower surface of electrode, and the lower surface of the glue that is in the light is higher than the lower surface of electrode.

9. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: the end face of the glue that is in the light is concordant with the packaging plastic of end face.

10. the lamp bar based on CSP encapsulating structure according to claim 6, it is characterised in that: being respectively provided on two sides with blend stop at substrate, three faces go out the CSP encapsulating structure of light and are positioned at blend stop.