CN205266009U - A high-density circuit board with heat dissipation net - Google Patents

Abstract

The utility model relates to the technical field of high-density circuit boards, and specifically refers to a high-density circuit board with a heat dissipation network. It includes N layers of substrates, N is an integer greater than 2, the N layers of substrates are stacked in sequence, and a heat dissipation grid is provided between two adjacent substrates; a plurality of bridging copper rods are pierced through the N layers of substrates. The utility model has a reasonable structure, and through the warp and weft grid lines woven with high-molecular polyester, air passages are generated between the substrates to improve the heat dissipation performance and reduce the working temperature of the circuit board; the substrate itself improves the wiring accuracy through stacking etching, and the substrate layers are connected and fixed by the bridging copper rods, which strengthens the structural strength and connection reliability of the circuit board.

Description

A high-density circuit board with heat dissipation net

technical field

The utility model relates to the technical field of high-density circuit boards, in particular to a high-density circuit board with a cooling net.

Background technique

At present, the functions of various electronic products are becoming more and more comprehensive, multi-functional, and complex, and the design of electronic products is becoming lighter, thinner, shorter, and smaller; resulting in a contradiction between the miniaturization and weight reduction of circuit boards and the loading requirements of electronic components. As a result, higher requirements are put forward for the high-density and high-integration design of the circuit board. In order to improve the carrying capacity of the circuit board, multi-layer circuits are usually superimposed on the surface of the circuit board to increase the density of the circuit. The multi-layer circuits are formed by laser or mechanical drilling at the position of the interlayer interconnection. Dielectric holes, and then in the dielectric holes An electrically conductive plating layer is formed on it. The processing method of this kind of printed circuit board is complicated, the number of circuit boards is large, the working temperature is high, and it is easy to cause deformation and cause line failure; , the production cycle is long, the process is complicated, and the line accuracy of multiple layer etching is difficult to guarantee, and the reject rate is high. Therefore it is necessary to improve and enhance the present technology.

Contents of the invention

The purpose of the utility model is to provide a high-density circuit board with a heat dissipation net with reasonable structure, convenient processing, good heat dissipation, stable and reliable, aiming at the defects and deficiencies of the prior art.

In order to achieve the above object, the utility model adopts the following technical solutions:

A high-density circuit board with a heat dissipation net described in the utility model includes N-layer substrates, where N is an integer greater than 2, and the N-layer substrates are stacked in sequence, and there are two adjacent substrates. A heat dissipation grid; a number of bridging copper rods are pierced on the N-layer substrate.

According to the above scheme, several layers of wiring layers are provided on both sides of the substrate, and an insulating layer is provided between the adjacent wiring layers on the same surface; There is a cooling grid.

According to the above scheme, the substrate and the wiring layers and insulating layers on both sides are in an integrated structure, and the substrate is provided with deposition holes penetrating through the wiring layers and insulating layers on both sides. An electroplating layer connected to the wiring layer is provided between the rod and the deposition hole.

According to the above solution, the heat dissipation grid includes a number of warp lines arranged at equal intervals along the longitudinal direction and a number of weft lines arranged at equal intervals along the horizontal direction, and the number of weft lines passes through the number of warp lines from above in turn, and the number of weft lines are respectively connected with the number of warp lines to form a One structure.

According to the above solution, the heat dissipation grid is woven from polymer polyester material.

The beneficial effects of the utility model are as follows: the utility model has a reasonable structure, through the warp and weft grid lines woven by high-molecular polyester, an air passage is generated between the substrates to improve the heat dissipation performance and reduce the working temperature of the circuit board; Wiring accuracy, the communication and fixing of the bridging copper rods between the substrate layers strengthen the structural strength and connection reliability of the circuit board.

Description of drawings

Fig. 1 is the overall sectional structural representation of the utility model;

Fig. 2 is a schematic diagram of the enlarged structure of part A in Fig. 1;

Fig. 3 is a schematic diagram of the heat dissipation grid structure of the present invention.

In the picture:

1. Substrate; 2. Bridge copper rod; 3. Heat dissipation grid; 11. Wiring layer; 12. Insulation layer; 13. Deposition hole; 31. Warp; 32. Weft.

detailed description

The technical scheme of the present utility model is described below in conjunction with accompanying drawing and embodiment.

As shown in Figure 1, a high-density circuit board with a heat dissipation net described in the present invention includes an N-layer substrate 1, where N is an integer greater than 2, and the N-layer substrates 1 are stacked in sequence, and adjacent to each other. A heat dissipation grid 3 is provided between the two substrates 1; a number of bridging copper rods 2 are pierced on the N-layer substrate 1; the number of wirings of the substrates 1 is increased by the lamination method, and the N-layer substrates 1 are superimposed on each other And the substrate 1 and the substrate 1 are separated from each other by the heat dissipation grid 3, so as to improve the heat dissipation channel to improve the heat dissipation performance of the circuit board; the substrate 1 of the N layer is connected to each other and fixed by the bridging copper rod 2, and the circuit on the substrate 1 is connected by the bridging copper rod 2. The copper rod 2 is connected, which means that the circuit board has the advantages of high structural strength, high wiring accuracy and good working stability.

Both sides of the substrate 1 are provided with several layers of wiring layers 11, and an insulating layer 12 is provided between adjacent wiring layers 11 on the same surface; There is a heat dissipation grid 3 between them, and the two sides of the substrate 1 can be superimposed with M layers of wiring layers 11 through the build-up method, and the layers of the wiring layer 11 are drilled by laser or mechanical, and then connected by electroplating, with the heat dissipation grid 3 isolated The final substrate 1 can be independently processed, thereby improving production efficiency and wiring accuracy.

The substrate 1 has an integral structure with the wiring layer 11 and the insulating layer 12 on both sides, and the substrate 1 is provided with a deposition hole 13 penetrating through the wiring layer 11 and the insulating layer 12 on both sides, and the bridging copper rod 2 is penetrated through the deposition hole 13 Inside, and between the bridging copper rod 2 and the deposition hole 13, an electroplating layer connected to the wiring layer 11 is provided.

The heat dissipation grid 3 includes a number of warps 31 arranged at equal intervals in the longitudinal direction and a number of wefts 32 arranged at equidistant intervals in the horizontal direction. The wefts 32 all pass through the warps 31 from above in turn, and the wefts 32 are connected with the warps respectively. 31 are connected in an integrated structure, and several warps 31 are spaced apart from each other to form a grid structure with passages, while several latitudes 32 are spaced apart to form a grid structure with passages. A double-layer bidirectional heat dissipation structure is formed.

The heat dissipation grid 3 is woven from polymer polyester material.

The above is only a preferred embodiment of the utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the utility model patent application scope are all included in the utility model patent application scope .

Claims (5)

1. have a high density circuit board for radiator-grid, comprise the substrate (1) of N layer, N is greater than 2 integer, it is characterized in that:Described N laminar substrate (1) setting that superposes successively, and between adjacent two substrates (1), be equipped with heat radiation grid (3); Described NOn laminar substrate (1), be equipped with some bridge joint copper bars (2).

2. the high density circuit board with radiator-grid according to claim 1, is characterized in that: the two sides of described substrate (1) is equalBe provided with the wiring layer (11) of some layers, between coplanar and adjacent wiring layer (11), be provided with insulating barrier (12); Described adjacent twoBetween individual substrate (1) the outermost wiring layer in inner side (11), be provided with heat radiation grid (3).

3. the high density circuit board with radiator-grid according to claim 2, is characterized in that: described substrate (1) and two sidesWiring layer (11), insulating barrier (12) are integrative-structure, and substrate (1) is provided with and runs through its two sides wiring layer (11), insulating barrier(12) deposition hole (13), described bridge joint copper bar (2) is arranged in deposition hole (13), and bridge joint copper bar (2) and depositionBetween hole (13), be provided with the electrodeposited coating that is communicated with wiring layer (11).

4. the high density circuit board with radiator-grid according to claim 2, is characterized in that: described heat radiation grid (3) comprisesThe parallel (32) that the horizontal equi-spaced apart in the warp (31) that some longitudinally equi-spaced apart arrange and some edges arranges, some parallels (32)All pass successively some warps (31) from top, and some parallels (32) are connected and are integrative-structure respectively with some warps (31).

5. the high density circuit board with radiator-grid according to claim 4, is characterized in that: described heat radiation grid (3) is for highThe braiding of molecule polyester material forms.