CN205200700U - Ultra -thin saw bit of brazing - Google Patents

Abstract

The utility model discloses an ultra-thin brazing saw blade. The abrasive grain layer of the saw blade is on the thin edge portion of the base body, and the tip of the portion of the abrasive grain layer on the ring end face of the thin edge portion is exposed from the end face of the middle portion of the base body. This actually removes the abrasive grains in the middle part of the matrix, and increases the grain size of the abrasive grains on the thin edge, so that the width of the incision after the thermal expansion of the abrasive grain layer in the cutting operation is larger than that of the middle part of the matrix. Large, so that the slit will not clamp the middle part of the base body, which avoids the middle part of the base body being stuck in the slit and the secondary cutting of the slit by the middle part, thus solving the problem of excessive slit in the cutting operation in the prior art. It is a big problem, and it also speeds up the cutting process and improves the efficiency.

Description

An ultra-thin brazed saw blade

technical field

The utility model relates to an ultra-thin brazing saw blade.

Background technique

At present, there are many thin saw blades and ultra-thin brazed saw blades in the commercially available cutting saw blades, but because of the thickness of the matrix itself of these saw blades plus the thickness of the abrasive layer on the edge, the thickness of the edge of the entire saw blade It is relatively large, so when cutting the workpiece, the incision of the traditional thin saw blade and ultra-thin brazed saw blade on the workpiece is still relatively large, so that the cutting loss of the workpiece will increase during the cutting operation, and the cost of the cutting operation will increase. Efficiency will also decrease accordingly.

Chinese patent document CN203778882U (announcement date is August 20, 2014) discloses a "multifunctional brazed diamond saw blade", which includes a disc-shaped substrate, and the edge of the substrate has a thin edge part that is thinner than the middle part. And the first abrasive grain layer is brazed and fixed on the thin edge part, and the position inside the first abrasive grain layer is brazed and fixed with the second abrasive grain layer on the end surface of the substrate, and the abrasive grains of the first abrasive grain layer The grain size is smaller than that of the second abrasive grain layer, so that in the cutting operation, the first abrasive grain layer first cuts on the workpiece, and the second abrasive grain layer polishes and removes the cut part. However, due to the thermal stress in the cutting operation of the workpiece, the cut cut by the first abrasive grain layer will clamp the position where the second abrasive grain layer is located, which not only increases the power required for the cutting operation, but also increases energy consumption; and If the secondary cutting operation is carried out through the second abrasive grain layer in the thermally expanded kerf, the cutting accuracy of the workpiece will be reduced, the kerf will also increase accordingly, and the heat accumulated in the middle of the substrate will also increase significantly. , so that the efficiency and accuracy of cutting operations are reduced. At the same time, because the cutting operation of this kind of cutting saw blade needs to rely on the joint action of the first and second abrasive grain layers to achieve, so in the actual cutting operation, the first and second abrasive grain layers will be lost simultaneously in the cutting operation, which makes the Cutting saw blades also suffer from a short service life.

Utility model content

The purpose of the utility model is to provide an ultra-thin brazed saw blade, aiming at solving the problem of too large cutting in the prior art.

In order to achieve the above object, the technical scheme of the ultra-thin brazing saw blade in the utility model is as follows:

The ultra-thin brazed saw blade includes a disc-shaped substrate and a brazed and fixed abrasive grain layer on it. The edge of the substrate has a thinner part that is thinner than the middle part, and the abrasive grain layer is on the thinner part of the substrate. The tip of the portion of the grain bed that is on the ring end face of the thin-edged portion is exposed from the end face of the middle portion of the substrate.

The height of the abrasive grains in the abrasive grain layer from the root to the tip is 0.6-0.7mm, and the thickness difference between the ring end surface of the thin edge part of the base body and the end surface of the middle part is 0.15-0.17mm.

The abrasive grains are diamond single grains with a grain size of 30/40.

The difference in thickness between the end faces of the two rings of the thin side portion of the base body and the corresponding end faces of the middle portion is equal.

The drop between the thin side portion and the end face of the middle portion is equal to the thickness of the solder layer between the abrasive grain layer and the thin wall portion.

The thickness of the solder layer is equal to 25% to 30% of the grain size of the abrasive grains, and the edge height of the abrasive grains exposed from the solder layer is equal to 75% to 70% of the grain diameter.

The substrate is a metal disc.

In the utility model, the abrasive grain layer of the saw blade is located on the thin edge part of the base body, and the tip of the part of the abrasive grain layer on the ring end face of the thin edge part is exposed from the end face of the middle part of the base body. This actually removes the abrasive grains in the middle part of the matrix, and increases the grain size of the abrasive grains on the thin edge part, so that the width of the incision cut by the abrasive grain layer in the cutting operation is larger than that of the middle part of the matrix after thermal expansion. Large, so that the slit will not clamp the middle part of the base body, which avoids the middle part of the base body being stuck in the slit and the secondary cutting of the slit by the middle part, thus solving the problem of excessive slits in cutting operations in the prior art. It is a big problem, and it also speeds up the cutting process and improves the efficiency.

Description of drawings

Fig. 1 is the structural representation of saw blade cross-section in the embodiment of the present utility model;

Fig. 2 is a schematic structural view of the matrix in Fig. 1 .

detailed description

Embodiment of the ultra-thin brazed saw blade in the utility model: as shown in Fig. 1 and Fig. 2, the ultra-thin brazed saw blade is a kind of ultra-thin diamond brazed saw blade, which is mainly brazed by the substrate 1 and its upper A fixed abrasive layer is formed. The base body 1 is a disc body made of metal, and the edge of the base body 1 has a thin edge part 2 that is thinner than the middle part 3. The thickness difference between the two ring end faces of the thin edge part 2 and the corresponding end faces of the middle part 3 Both are 0.15-0.17mm. The abrasive grains in the abrasive grain layer 4 are diamond single grains with a grain size of 30/40. The height of the abrasive grains from the root to the tip is 0.6-0.7mm, and the edge height of the abrasive grains is 75% of the single grain. On the thin edge part 2 of the thin edge part 2, the abrasive grain layer 4 is wrapped on the ring end faces and edges of both sides of the thin edge part 2. 3 is exposed. The drop between the thin side part and the end face of the middle part is equal to the thickness of the solder layer between the abrasive grain layer and the thin wall part, and the thickness of the solder layer is equal to 25%~30% of the grain diameter of the abrasive grain, and the abrasive grain from the solder layer The exposed edge height is equal to 75%~70% of the particle diameter.

The main improvement of the ultra-thin brazed saw blade in this embodiment is to reduce the thickness by turning on the two working surfaces of the outer circle of the base body 1, and the height of the turning off matches the height of the abrasive used in the saw blade. Although the thin edge part 2 of the base body 1 is very thin, the thickness of the working layer of the saw blade is actually increased a lot with the addition of the abrasive layer on both sides of the base body 1 . For example, the height of a 30/40 diamond single particle is 0.6-0.7mm, and the brazed diamond tool requires that the abrasive edge height is 75% of the single particle, then the working layer of the substrate 1 can be turned down by 0.15-0.17mm, because the saw blade The same height must be removed on both sides, so the thickness of the entire working layer of the saw blade is equivalent to a reduction of 0.3-0.34mm. Through this improvement, the thinning degree of the brazed diamond saw blade can be effectively increased by 10%-15%, so as to achieve a true thin blade saw blade. In use, it does not affect the normal performance of the abrasive as a cutting edge, and can reduce the width of the cutting edge. The direct result is to reduce the loss of the workpiece and improve the efficiency of the saw blade.

In this embodiment, the reduced heights of the ring end surfaces on both sides of the thin edge portion of the base body are the same, but in other embodiments, the reduced heights of the ring end surfaces on both sides of the thin edge portion may also be different.

Claims (7)

1. Ultra-thin brazed saw blade, including a disc-shaped substrate and a brazed and fixed abrasive grain layer on it. The edge of the substrate has a thinner part than the middle part. It is characterized in that the abrasive grain layer is located at the base of the substrate. On the thin edge portion, the tip of the portion of the abrasive grain layer on the annular end surface of the thin edge portion is exposed from the end surface of the middle portion of the base. 2. The ultra-thin brazed saw blade according to claim 1, characterized in that, the height of the abrasive grains of the abrasive grain layer from the root to the tip is 0.6-0.7 mm, and the distance from the ring end face of the thin edge part of the substrate to the middle part is 0.6-0.7 mm. The thickness difference between the end faces is 0.15-0.17mm. 3. The ultra-thin brazed saw blade according to claim 2, characterized in that the abrasive grains are diamond single grains with a grain size of 30/40. 4. The ultra-thin brazed saw blade according to claim 1, 2 or 3, characterized in that the thickness difference between the two ring end faces of the thin edge portion of the base body and the corresponding end faces of the middle portion is equal. 5. The ultra-thin brazing saw blade according to claim 1, 2 or 3, characterized in that, the drop between the thin edge part and the end face of the middle part is equal to that of the solder layer between the abrasive grain layer and the thin wall part thickness. 6. The ultra-thin brazed saw blade according to claim 5, wherein the thickness of the solder layer is equal to 25% to 30% of the grain size of the abrasive grains, and the edge height of the abrasive grains exposed from the solder layer is equal to 75% of the grain diameter. %~70%. 7. The ultra-thin brazed saw blade according to claim 1, 2 or 3, characterized in that the substrate is a metal disc.